EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove Side cover L (see Figure 1-2)
2. Remove Gfx and CPU cooler (see Figure 3-8)
3. Remove MB (see Figure 7-9)
4. Remove the DIMM,CPU and Battery (see Figure 10-12)
5. Remove the Side cover R (see Figure 13)
6. Remove the Function Board (see Figure 15-16)
7. Remove the HDD (see Figure 17-21)
8. Remove the ODD (see Figure 22-24)
9. Remove the Top base module (see Figure 25-29)
10. Remove the Front bezel module (see Figure 30-33)
11. Remove the Plastic foots (see Figure 34)
12. Remove the Rear gasket (see Figure 35)
13. Remove the Plastic lock (see Figure 36)
14. Remove the Antenna cable (see Figure 37)
15. Remove the Front fan (see Figure 38)
16. Remove the Power supply (see Figure 39)
17. Remove the Plastic side windows (see Figure 40)
18. Remove the LC cooler fan guard (see Figure 41)
19. Remove the LC cooler fan (see Figure 42)
20. Remove the Electrolytic Capacitors from PSU board PS-6301-07HE (300W)(see Figure 43-52)
21. Remove the Electrolytic Capacitors from PSU board PS-8501-2HB (500W)(see Figure 53-63)
22. Remove the Electrolytic Capacitors from PSU board HP P/N: 918590-003 (750W)(see Figure 64-71)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
