HP Omni Pro 110 Installation instructions

EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP Omni Pro 110 PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic
instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as
defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
10
Batteries
All types including standard alkaline and lithium
coin or button style batteries
7
Mercury-containing components
For example, mercury in lamps, display
backlights, scanner lamps, switches, batteries
4
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
1
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or
PCAs already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and
toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0

EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where
components and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screwdriver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:
1) Place the system face down
2) Disassemble hinge cover & access door
3) Disassemble stand
4) Remove ODD&TOP Perf (grill)
5) Disassemble rear cover
6) Disassemble HDD
7) Disassemble CPU&I/O Shielding
8) Disassemble stand support
9) Disassemble CPU H/S
10) Disassemble speaker
11) Unplug cable
12) Disassemble ODD& HDD cable and fan
13) Disassemble WLAN
14) Disassemble INVERTER
15) Disassemble MB and MB Battery
16) Remove CPU & DDR
17) Disassemble power switch card
18) Disassemble webcam & antenna cable
19) Disassemble basepan
20) Disassemble LCD
21) Separate BASE pan& beze
22) Remove CCFLs from panel (up to 4)
23) Remove Battery from MB, KB & Mouse.