HP ProDesk 405 G1 Installation instructions

Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP ProDesk 405 G1 Microtower Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
2
Batteries
All types including standard alkaline and lithium coin
or button style batteries
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
5
External electrical cables and cords
Power cord
1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
system fan 94g,PSU fan 68g
162g
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
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Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
T-15
Micro shear
YN-3
Screw driver
PH1
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove access panel. (see Figure 1-3)
2. Remove front bezel. (see Figure 4)
3. Disconnect cooler cable then remove the cooler from board. (see Figure5-7)
4. Disconnect 24 pin power cable、SATA cable、SATA power cable、CPU power cable. (see Figure 8-11)
5. Remove the ODD and HDD from chassis (see Figure 12-16)
6. Disconnect the MCR cable from board then remove the MCR. (see Figure 17-19)
7. Disconnect system fan cable then remove the system fan from chassis (see Figure 20-22)
8. Disconnect FIO cables and open the cable clip. (see Figure 23-24)
9. Remove the FIO module from chassis. (see Figure 25-26)
10. Disconnect PWR cable then remove it from chassis. (see Figure 27-28)
11. Disconnect speaker cable then remove it from chassis. (see Figure 29-31)
12. Remove the Memory from chassis. (see Figure 32)
13. Remove the battery from the board. (see Figure 33)
14. Remove Mother board from chassis. (see Figure 34-36)
15. Remove the I/O shielding from chassis. (see Figure 37)
16. Remove the PSU from chassis. (see Figure 38&39)
17. Remove the PSU chassis and remove the PSU board.. (see Figure 40-43)
18. Remove the Electrolytic Capacitors from PSU board. (see Figure 44-54)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Figure1 Loose the two screws from access panel
Figure2 Slide the access panel back
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Figure3 Rotate the top of the panel away to remove it
Figure4 Pull the 3 hooks and rotate to remove the front
bezel
Figure5 Disconnect the cooler cable from MB
Figure6 Loose 4 screws from cooler and remove it
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Figure7 Remove the cooler from board
Figure8 Disconnect the SATA cables form board
Figure9 Disconnect the CPU power cable from board
Figure10 Disconnect the 24pin power cable from MB
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Figure11 Disconnect the SATA and power cables from
ODD
Figure12 Loose the ODD screws
Figure13 Remove the ODD from chassis
Figure14 Disconnect the SATA and power cables from
HDD
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Figure15 Loose the HDD screws
Figure16 Remove the HDD form chassis
Figure17 Disconnect the MCR cable from MB
Figure18 Loose the MCR screws
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Figure19 Remove the MCR from chassis
Figure20 Disconnect system fan cable from board
Figure21 Loose 2 screws from system fan
Figure22 Remove the system fan from chassis
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Figure23 Disconnect FIO cable include USB 3.0 , USB 2.0 ,
Audio
Figure24 Open the cable clip
Figure25 Loose the screw of the FIO cable
Figure26 Remove the FIO cable from chassis
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Figure27 Disconnect PWR cable from MB
Figure28 Remove the PWR cable
Figure29 Disconnect speaker cable from board
Figure30 Loose the screw of speaker
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Figure31 Remove the speaker form chassis
Figure32 Push the hooks on both sides and then pick up the
memory
Figure33 Remove the battery from the MB
Figure34 Loose the 6 screws from MB
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Figure35 Loose the 8 screws from MB and remove it
Figure36 Remove MB from chassis
Figure37 Push the I/O shielding to the inside of the chassis
and remove it
Figure38 Loose 4 screws of PSU and remove it
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Figure39 Pull up the PSU and remove it
Figure40 Loose 4 screws from PSU cage and remove it
Figure41 Cut the cable tie
Figure42Disconnect the fan cable from PSU
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Figure43 Loose 4 screws from the PSU PCA and remove it
Figure44 Heat the solder of Electrolytic Capacitors greater
than 2.5cm in diameter or height and remove it
Figure45 Heat the solder of Electrolytic Capacitors greater
than 2.5cm in diameter or height and remove it(Gamay
300W REG PSU-Bestec)
Figure46 Heat the solder of Electrolytic Capacitors greater
than 2.5cm in diameter or height and remove it(Gamay
300W APFC PSU-Chicony)
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Figure47 Heat the solder of Electrolytic Capacitors greater
than 2.5cm in diameter or height and remove it(Gamay
300W REG PSU-Chicony)
Figure48 Heat the solder of Electrolytic Capacitors greater
than 2.5cm in diameter or height and remove it(Gamay
300W APFC PSU-Acbel)
Figure49 Heat the solder of Electrolytic Capacitors greater
than 2.5cm in diameter or height and remove it(Gamay
300W E*6 PSU-Bestec)
Figure50 Heat the solder of Electrolytic Capacitors greater
than 2.5cm in diameter or height and remove it(Gamay
300W E*6 PSU-Acbel))
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PSG instructions for this template are available at EL-MF877-01

Figure51 Heat the solder of Electrolytic Capacitors greater
than 2.5cm in diameter or height and remove it (Gamay
300W REG PSU- Liteon)
Figure52 Heat the solder of Electrolytic Capacitors greater
than 2.5cm in diameter or height and remove it (Gamay
300W APFC PSU-Delta)
Figure53 Heat the solder of Electrolytic Capacitors greater
than 2.5cm in diameter or height and remove it(Gamay
300W REG PSU-Delta)
Figure54 Heat the solder of Electrolytic Capacitors greater
than 2.5cm in diameter or height and remove it(Gamay
300W REG PSU)
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PSG instructions for this template are available at EL-MF877-01

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PSG instructions for this template are available at EL-MF877-01