Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove access panel. (see Figure 1-3)
2. Remove front bezel. (see Figure 4)
3. Disconnect cooler cable then remove the cooler from board. (see Figure5-7)
4. Disconnect 24 pin power cable、SATA cable、SATA power cable、CPU power cable. (see Figure 8-11)
5. Remove the ODD and HDD from chassis (see Figure 12-16)
6. Disconnect the MCR cable from board then remove the MCR. (see Figure 17-19)
7. Disconnect system fan cable then remove the system fan from chassis (see Figure 20-22)
8. Disconnect FIO cables and open the cable clip. (see Figure 23-24)
9. Remove the FIO module from chassis. (see Figure 25-26)
10. Disconnect PWR cable then remove it from chassis. (see Figure 27-28)
11. Disconnect speaker cable then remove it from chassis. (see Figure 29-31)
12. Remove the Memory from chassis. (see Figure 32)
13. Remove the battery from the board. (see Figure 33)
14. Remove Mother board from chassis. (see Figure 34-36)
15. Remove the I/O shielding from chassis. (see Figure 37)
16. Remove the PSU from chassis. (see Figure 38&39)
17. Remove the PSU chassis and remove the PSU board.. (see Figure 40-43)
18. Remove the Electrolytic Capacitors from PSU board. (see Figure 44-54)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Figure1 Loose the two screws from access panel
Figure2 Slide the access panel back
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
