HP Compaq 18 All-in-One Assembly instructions

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PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
Compaq 18 All-in-One PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
MB, Memory,HDD PCA,ODD PCA,Adapter PCA
5
Batteries
All types including standard alkaline and lithium coin
or button style batteries MB
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps panel
1
Cathode Ray Tubes (CRT)
1
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
Adapter
1
External electrical cables and cords
Power cord
1
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0

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Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 crisscross screw driver
2#
Description #2 hexagon screw driver
T15
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Take off rear cover
2. Take off mother board cover
3. Romove all the cables from PCA
4. Take off MB
5. Remove memory from the PCA
6. Remove battery from the PCA
7. Take off speaker from the unit
8. Take off HDD from the unit
9. Take off system fan from the unit
10. Take off convertor board from the unit
11. Take off ODD from the unit
12. Take off button bracket
13. Take off camera from the unit
14. Take off main chassis
15. Take off panel from the unit
16. Open the power adapter by mechanical force.
17.
18.
19.
20.
21.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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1.Take off rear cover
Rotate screw driver to release
the screw and take off the
rear cover.
2.Take off mother board
cover
Rotate screw driver to
release screw and take off
the mother board cover.

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3. Remove all the cables
from PCA.
4.Take off mother board
Rotate screw driver to release
screw and take off mother
board from the unit.

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5. Remove memory from
the PCA.
Pull out memory by
arrowhead.
6. Remove battery from
the PCA.

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7. Take off speaker from
the unit.
Rotate screw driver to
release the screw and take
off speaker from the unit.
8. Take off HDD from the
unit.
8.1: Rotate screw driver to
release screw and remove
HDD cage.
8.2:pull out the HDD by

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arrowhead
8.3: Take off HDD from
HDD cage

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9. Take off system fan
from the unit.
Rotate screw driver to
release screw and remove
system fan from the unit.
10. Take off convertor
board from the unit.
10.1. remove cable from
convertor board
10.2. rotate screw driver to
release convertor board
screw.

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11. Take off ODD from the
unit.
11.1: remove ODD bracket
11.2: pull out the ODD by
arrowhead

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12. Take off the button
bracket.
13. Take off camera by
arrowhead.
14. Take off main chassis
from the unit.