HP t505 Assembly instructions

EL-MF877-00 Page 1
Template Revision B
PSG instructions or this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computer
Marketing Name / Model
[List multiple models if applicable.
HP t505 Flexible Thin Client
Purpose: The document is intended fo use by end-of-life ecycle s o t eatment facilities. It p ovides the basic
inst uctions fo the disassembly of HP p oducts to emove components and mate ials equi ing selective t eatment, as
defined by EU di ective 2002/96/EC, Waste Elect ical and Elect onic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below a e classified as equi ing selective t eatment.
1.2 Ente the quantity of items contained within the p oduct which equi e selective t eatment in the ight column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
P inted Ci cuit Boa ds (PCB) o P inted Ci cuit
Assemblies (PCA)
With a su face g eate than 10 sq cm
system boa d, adapto
1
Batte ies All types including standa d alkaline and lithium
coin o button style batte ies system boa d
1
Me cu y-containing components Fo example, me cu y in lamps, display
backlights, scanne lamps, switches, batte ies
0
Liquid C ystal Displays (LCD) with a su face
g eate than 100 sq cm
Includes backg ound illuminated displays with gas
discha ge lamps
0
Cathode Ray Tubes (CRT) 0
Capacito s / condense s (Containing PCB/PCT) 0
Elect olytic Capacito s / Condense s measu ing
g eate than 2.5 cm in diamete o height
adapto 1
Exte nal elect ical cables and co ds adapto 1
Gas Discha ge Lamps 0
Plastics containing B ominated Flame Reta dants
weighing > 25 g ams (not including PCBs o
PCAs al eady listed as a sepa ate item above)
0
Components and pa ts containing tone and ink,
including liquids, semi-liquids (gel/paste) and
tone
Include the ca t idges, p int heads, tubes, vent
chambe s, and se vice stations.
0

EL-MF877-00 Page 2
Template Revision B
PSG instructions or this template are available at EL-MF877-01
Components and waste containing asbestos 0
Components, pa ts and mate ials containing
ef acto y ce amic fibe s
0
Components, pa ts and mate ials containing
adioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the p oduct to a point whe e
components and mate ials equi ing selective t eatment can be emoved.
Tool Description Tool Size (if
applicable)
Phillips Slotted Sc ewd ive
Phillips C oss Sc ewd ive
Diagonal cutting plie (fo Adapto and fan wi ing only)
Saw (fo Adapto only)
Desc iption #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to emove components and mate ials equi ing selective
t eatment:
[System]
1. Remove stand
2. Remove top cove
3. Remove plastic bezels
4. Remove system boa d
5. Remove components of mothe boa d
[Keyboa d]
1. Remove cove
2. Remove bezel on cove
3. Remove LED boa d
4. Remove ubbe sheet
5. Remove flexible PWB
6. Remove plastic standa d of LED boa d
7. Remove metal sheet
8. Remove cable
[Mouse]
1. Remove cove
2. Remove PWB
3. Remove cable
4. Remove wheel
[Adapto ]
1. Remove enclosu e
2. Remove exte nal cable
3. Remove metal shielding
4. Remove inte nal wi es
5. Remove heatsinks
6. Remove capacito (>2.5 cm in height, equi ing selective t eatment)
3.2 Optional G aphic. If the disassembly p ocess is complex, inse t a g aphic illust ation below to identify the items
contained in the p oduct that equi e selective t eatment (with desc iptions and a ows identifying locations)

EL-MF877-00 Page 3
Template Revision B
PSG instructions or this template are available at EL-MF877-01
[System]
1) Remove stand
a）Push the stand by hand b）Lift top cove by hand
2) Remove top cove
10
1
a) Spin off 2 sc ew by C oss
Sc ewd ive
b) Slide the top cove back by hand c) Lift top cove by hand
3) Remove plastic bezels
a) Lift snap by Slotted Sc ewd ive to
disconnect ight side bezel and slide
the ight side bezel back by hand
b) Lift ight side bezel by hand c) Lift snap by Slotted Sc ewd ive to
disconnect left side bezel and slide
the left side bezel back by hand
d) Lift left side bezel by hand e) Lift snap by hand to disconnect
f ont bezel and push f ont bezel
f) Lift f ont bezel by hand

EL-MF877-00 Page 4
Template Revision B
PSG instructions or this template are available at EL-MF877-01
4) Remove system boa d
a) Use C oss Sc ewd ive to spin off
2 sc ews ahead b acket
b) Pull off f ont metal shielding by
hand
c) Lift f ont metal shielding by hand
d) Use C oss Sc ewd ive to spin off
2 sc ews on Parallel port
d) Use C oss Sc ewd ive to spin off
4 sc ews on system boa d
e) Pull out system boa d by hand
d) Lift the system boa d by hand
5) Remove components of mothe boa d
a）Disconnect and pull off Solid
State Disk1 by hand
b）Lift Solid State Disk1 by hand c)P ess batte y hook and pull off RTC
batte y by hand

EL-MF877-00 Page 5
Template Revision B
PSG instructions or this template are available at EL-MF877-01
d) Lift RTC batte y by hand e) P ess DIMM hook and pull off
DIMM by hand
f) Lift DIMM by hand
g) P ess heatsink hook and pull off
heatsink by hand
h) Lift heatsink by hand

EL-MF877-00 Page 6
Template Revision B
PSG instructions for this template are available at EL-MF877-01
[Keyboard]
1) Remove cover
a) Keyboard b) Use Cross Screwdriver to spin off
11 screws on bottom side
c) Lift snap by Slotted Screwdriver to
open enclosure
d) Open the enclosure by hand e) Remove the cover
2) Remove bezel on cover
a) Use Cross Screwdriver to spin off
2 screws on cover back
b) Remove the bezel by hand c) Remove the bezel
3) Remove LED board
a) Location of LED board b) Use Cross Screwdriver to spin off
3 screws on LED board
c) Remove the bracket by hand

EL-MF877-00 Page 7
Template Revision B
PSG instructions for this template are available at EL-MF877-01
d) Use Slotted Screwdriver to
disconnect cable
e) Remove LED board by hand f) Remove LED board
4) Remove rubber sheet
a) Remove rubber sheet by hand
5) Remove flexible PWB
a) Remove flexible PWB
6) Remove plastic standard of LED board
a) Remove plastic standard of LED
board by hand

EL-MF877-00 Page 8
Template Revision B
PSG instructions for this template are available at EL-MF877-01
7) Remove metal sheet
a) Use Cross Screwdriver to spin off
2 screws on enclosure
b) Remove metal sheet by hand
8) Remove cable
a) Remove cable by hand b) Remove cable

EL-MF877-00 Page 9
Template Revision B
PSG instructions for this template are available at EL-MF877-01
[Mouse]
1) Remove cover
a) Mouse b) Use Cross Screwdriver to spin off
1 screws on bottom side
c) Lift snap by hand to open
enclosure
d) Remove the cover
2) Remove PWB
a) Remove PWB by hand
3) Remove cable
a) Disconnect cable by hand

EL-MF877-00 Page 10
Template Revision B
PSG instructions for this template are available at EL-MF877-01
4) Remove wheel
a) Remove wheel by hand b) Remove wheel

EL-MF877-00 Page 11
Template Revision B
PSG instructions for this template are available at EL-MF877-01
[Adaptor]
1) Remove enclosure
a) Power adapter (Delta) b) Remove enclosure by saw c) Open enclosure
2) Remove external cable
a) Use diagonal cutting plier to
disconnect external cable
3) Remove metal shielding
a) Open tapes by hand to remove a
half of metal shielding
b) Use diagonal cutting plier to
disconnect another half of metal
shielding
c) Remove metal shielding
4) Remove internal wires
a) Use diagonal cutting plier to
disconnect wires of Inlet

EL-MF877-00 Page 12
Template Revision B
PSG instructions for this template are available at EL-MF877-01
5) Remove heatsinks
a) Use Slotted Screwdriver to
remove metal clip
b) Use diagonal cutting plier to
disconnect heatsink (1)
c) Use diagonal cutting plier to
disconnect heatsink (2)
6) Remove capacitor (≧ 2.5cm in height, requiring selective treatment)
a) Use diagonal cutting plier to
disconnect capacitor (> 2.5cm in
height)
b) Remove capacitor