HP VR Backpack G2 Manual

Maintenance and Service Guide
HP VR Backpack G2 PC

© Copyright 2019 HP Development Company,
L.P.
Bluetooth is a trademark owned by its
proprietor and used by HP Inc. under license.
Intel and Core are trademarks of Intel
Corporation or its subsidiaries in the U.S.
and/or other countries. Microsoft and Windows
are either registered trademarks or trademarks
of Microsoft Corporation in the United States
and/or other countries. NVIDIA and GeForce are
trademarks and/or registered trademarks of
NVIDIA Corporation in the U.S. and other
countries. AMD is a trademark of Advanced
Micro Devices, Inc. DisplayPort is a trademark
owned by the Video Electronics Standards
Association (VESA) in the United States and
other countries. Miracast is a trademark of the
Wi-Fi Alliance.
The information contained herein is subject to
change without notice. The only warranties for
HP products and services are set forth in the
express warranty statements accompanying
such products and services. Nothing herein
should be construed as constituting an
additional warranty. HP shall not be liable for
technical or editorial errors or omissions
contained herein.
First Edition: May 2019
Document Part Number: L62069-001
Product notice
This maintenance guide describes features that
are common to most models. Some features
may not be available on your computer.
Not all features are available in all editions of
Windows. This computer may require upgraded
and/or separately purchased hardware, drivers
and/or software to take full advantage of
Windows functionality. Go to
http://www.microsoft.com for details.
Software terms
By installing, copying, downloading, or
otherwise using any software product
preinstalled on this computer, you agree to be
bound by the terms of the HP End User License
Agreement (EULA). If you do not accept these
license terms, your sole remedy is to return the
entire unused product (hardware and software)
within 14 days for a full refund subject to the
refund policy of your seller.
For any further information or to request a full
refund of the price of the computer, please
contact your seller.

Safety warning notice
WARNING! To reduce the possibility of heat-related injuries or of overheating the device, do not place the
device directly on your lap or obstruct the device air vents. Use the device only on a hard, at surface. Do not
allow another hard surface, such as an adjoining optional printer, or a soft surface, such as pillows or rugs or
clothing, to block airow. Also, do not allow the AC adapter to contact the skin or a soft surface, such as
pillows or rugs or clothing, during operation. The device and the AC adapter comply with the user-accessible
surface temperature limits dened by applicable safety standards.
iii

iv Safety warning notice

Table of contents
1 Product description ....................................................................................................................................... 1
2 Product features ........................................................................................................................................... 3
Standard conguration features ........................................................................................................................... 3
Top components .................................................................................................................................................... 3
Right (side) components ........................................................................................................................................ 4
Bottom ................................................................................................................................................................... 4
3 Illustrated parts catalog ................................................................................................................................ 5
Computer major components ................................................................................................................................ 5
Miscellaneous parts ............................................................................................................................................... 7
4 Removal and replacement procedures preliminary requirements ...................................................................... 9
Tools required ........................................................................................................................................................ 9
Service considerations ........................................................................................................................................... 9
Plastic parts ......................................................................................................................................... 9
Cables and connectors ........................................................................................................................ 9
Drive handling ................................................................................................................................... 10
Workstation guidelines ..................................................................................................................... 10
Electrostatic discharge information .................................................................................................................... 10
Generating static electricity .............................................................................................................. 11
Preventing electrostatic damage to equipment ............................................................................... 11
Personal grounding methods and equipment .................................................................................. 12
Grounding the work area ................................................................................................................... 12
Recommended materials and equipment ........................................................................................ 12
Packaging and transporting guidelines .............................................................................................................. 13
5 Removal and replacement procedures ........................................................................................................... 14
Component replacement procedures .................................................................................................................. 14
Preparation for disassembly ............................................................................................................. 14
Top cover ........................................................................................................................................... 14
Fans ................................................................................................................................................... 16
Solid state drive ................................................................................................................................. 18
Memory modules ............................................................................................................................... 19
WLAN antenna ................................................................................................................................... 21
WLAN module .................................................................................................................................... 22
v

RTC battery ........................................................................................................................................ 23
Battery ............................................................................................................................................... 24
Heat sink ............................................................................................................................................ 26
Power button board .......................................................................................................................... 27
Battery connector and cable assembly ............................................................................................. 29
System board .................................................................................................................................... 30
Power connector (DC-out) for VR headset ........................................................................................ 33
Power connector (DC-in) and cable ................................................................................................... 35
6 Interpreting system validation diagnostic front panel LEDs and audible codes ................................................. 36
7 Computer Setup (BIOS) and TPM .................................................................................................................... 38
Using Computer Setup ......................................................................................................................................... 38
Starting Computer Setup .................................................................................................................. 38
Navigating and selecting in Computer Setup ................................................................................... 38
Restoring factory settings in Computer Setup ................................................................................. 38
Updating the BIOS ............................................................................................................................. 39
Determining the BIOS version ......................................................................................... 39
Downloading a BIOS update ........................................................................................... 39
Changing the boot order using the f9 prompt .................................................................................. 40
TPM BIOS settings (select products only) ........................................................................................................... 40
8 Using HP PC Hardware Diagnostics (UEFI) ....................................................................................................... 41
Downloading HP PC Hardware Diagnostics (UEFI) to a USB device .................................................................... 41
9 Backing up, restoring, and recovering ........................................................................................................... 43
Creating recovery media and backups ................................................................................................................ 43
Using HP Recovery media (select products only) ............................................................................. 43
Using Windows tools ......................................................................................................................... 44
Using the HP Cloud Recovery Download Tool (select products only) ............................................... 45
Restore and recovery ........................................................................................................................................... 45
Recovering using HP Recovery Manager ........................................................................................... 45
What you need to know before you get started ............................................................. 45
Using the HP Recovery partition (select products only) ................................................. 46
Using HP Recovery media to recover .............................................................................. 47
Changing the computer boot order ................................................................................ 47
Removing the HP Recovery partition (select products only) ......................................... 47
10 Specications ............................................................................................................................................ 48
vi

11 Power cord set requirements ...................................................................................................................... 49
General requirements .......................................................................................................................................... 49
Japanese power cord requirements .................................................................................................................... 49
Country-specic requirements ............................................................................................................................ 50
12 Statement of memory volatility .................................................................................................................. 51
Nonvolatile memory usage ................................................................................................................................. 53
Questions and answers ....................................................................................................................................... 55
13 Recycling .................................................................................................................................................. 57
Index ............................................................................................................................................................. 58
vii

viii

1 Product description
Table 1-1 Product components and their descriptions
Category Description
Product Name HP VR Backpack G2 PC
Processor 8th-generation Intel® Core™ i7-8850H, 2.6 GHz, turbo up to 4.3 GHz, 6 cores, 9 MB SmartCache, L3,
45 W; Intel UHD Graphics 630
Chipset Intel CNL QM370
Graphics NVIDIA® GeForce® RTX 2080 N18E-G3 Graphic Controller
Memory Two memory module slots
DDR4-2666 dual channel support
Supports up to 32 GB of system RAM in the following congurations:
●32 GB
●16 GB
Primary storage Solid-state drives (M.2, PCIe, NVMe, 2280, TLC)
1 TB
512 GB
256 GB
Audio DTS Headphone X
Ethernet Integrated 10/100/1000 NIC (Intel I219LM (VPro) GbE PCIe)
Wireless networking Realtek RTL8822BE 802.11ac 2 × 2 Wi-Fi + Bluetooth® 4.2
Intel 9260 802.11ac 2 × 2 + Bluetooth 5.0 (non-vPro)
Compatible with Miracast® devices
Ports USB 3.1 Type-A (4)
USB 3.1 Type-C (Thunderbolt), power delivery 15 W
Mini DisplayPort™ 1.3 (2)
RJ-45 (network) connector
Audio-out (headphone)/audio-in (microphone) combo jack
Power input connector
Docking connector
Power requirements Battery
4 cell, 36 Wh
AC adapter
330 W Smart PFC, non-slim barrel, 7.4 mm straight
1

Table 1-1 Product components and their descriptions (continued)
Category Description
180 W Smart PFC, non-slim barrel, 7.4 mm straight
Power cord
1.5 m (C13)
Operating system Windows® 10 Pro 64
2 Chapter 1 Product description

2 Product features
Standard conguration features
Features may vary depending on the model. For support assistance and to learn more about the hardware
and software installed on the computer model, run the HP Support Assistant utility.
Top components
Table 2-1 Identifying the top panel components
Item Component
(1) Power button and light
(2) Power connector for headset
(3) USB 3.1 Type-A ports (2)
(4) Mini DisplayPort
(5) Mini DisplayPort
(6) USB Type-C port
(7) Audio out (headphone)/Audio-in (microphone) combo jack
Standard conguration features 3

Right (side) components
Table 2-2 Identifying the right panel components
Item Component
(1) RJ-45 (network) jack
(2) USB 3.1 Type-A ports (2)
(3) Vent
Bottom
Table 2-3 Identifying the bottom components
Item Component
(1) Left battery connector
(2) Left alignment pin connector
(3) Docking connector
(4) Right alignment pin connector
(5) Right battery connector
4 Chapter 2 Product features

3 Illustrated parts catalog
Computer major components
Table 3-1 Identifying computer major components and their part numbers
Item Component Spare part number
(1) Front cover L62394-001
(2) Graphics fan (included in fan kit) L05349-001
(3) Memory fan (included in fan kit) L05349-001
(4) WLAN antenna (includes gasket) L62404-001
(5) Heat sink L62397-001
(6) Battery
8 cell, 73 Wh L65631-001
4 cell, 36 Wh L41691-005
Computer major components 5

Table 3-1 Identifying computer major components and their part numbers (continued)
Item Component Spare part number
(7) Battery connectors and cable assembly L62406-001
(8) Rear antenna, right (included in miscellaneous parts kit) L05775-001
(9) Rear antenna, left (included in miscellaneous parts kit) L05775-001
(10) Power connector (DC in) L05345-001
(11) Power connector (DC out) for VR headset L63398-001
(12) Power button board L63399-001
(13) System board (includes integrated Intel Core i7-8850H processor and thermal grease)
For use in models without the Windows operating system L62393-001
For use in models with the Windows operating system L62393-601
(14) Back cover L62395-001
*Memory modules (DDR4-2666)
16 GB 937438-855
8 GB 937236-855
*Solid-state drive (M.2, PCIe, NVMe, TLC):
1 TB L62399-001
512 GB L62401-001
256 GB L62400-001
*not illustrated
6 Chapter 3 Illustrated parts catalog

Miscellaneous parts
Table 3-2 Miscellaneous part descriptions and part numbers
Component Spare part number
WLAN module
Realtek RTL8822BE 802.11ac 2 × 2 Wi-Fi + Bluetooth 4.2 924813-855
Intel 9260 802.11ac 2 × 2 + Bluetooth 5.0 (non-vPro) L64045-005
Cable kit (includes top cover voodoo lighting cable, battery charger cable, backlit protective tape, power
board cable, ZVR Backpack cable, fan cable and bracket)
L02927-001
HP ZVR Backpack combination cable L20517-001
Battery charger L02934-001
Backpack L62402-001
Docking station L62403-001
Mounting plate with clips with battery holders (includes left and right battery holders) L62408-001
Cable holder L62624-001
Hardware bracket kit (includes power connector in bracket, power connector out bracket, top I/O
bracket, left battery connector bracket, and right battery connector bracket)
L62405-001
Miscellaneous kit (includes right antenna bracket, left antenna bracket, main antenna bracket, and
memory cover)
L05775-001
Rubber kit L05350-001
AC adapter
330 W, Smart, PFC. non-slim, 7.4 mm L01032-850
180 W, Smart, PFC, 7.4 mm L04322-850
Power cord (C13, 1.5 m)
For use in Argentina 401328-016
For use in Australia 100661-016
For use in Brazil 438723-005
For use in Europe 100614-011
For use in India 403440-003
For use in Israel 398062-007
For use in Italy 121565-016
For use in Japan 653326-003
For use in the People’s Republic of China 286496-017
For use in South Africa 187487-008
For use in Switzerland 150304-010
For use in Taiwan 393312-005
For use in Thailand 285052-009
Miscellaneous parts 7

Table 3-2 Miscellaneous part descriptions and part numbers (continued)
Component Spare part number
For use in the United Kingdom 100613-016
Power cord (C13, 1.83 m)
For use in Brazil 438723-001
For use in Europe 100614-009
For use in India 403440-001
For use in Israel 398062-001
For use in Italy 109097-008
For use in Japan 653326-001
For use in the People’s Republic of China 286496-001
For use in South Africa 187487-005
For use in South Korea 231216-001
For use in Switzerland 150304-008
For use in Taiwan 393312-001
For use in the United Kingdom 100613-008
Power cord (C13, 2.5 m)
For use in Argentina 401328-001
For use in Australia 100661-001
8 Chapter 3 Illustrated parts catalog

4 Removal and replacement procedures
preliminary requirements
Tools required
You will need the following tools to complete the removal and replacement procedures:
●Phillips P0 screwdriver
●Torx driver (T10)
●Thin, at and non-conductive prying tool.
IMPORTANT: Use a non-conductive tool. A conductive tool can damage the system board, chassis or
components.
●Needle-nosed pliers or socket driver for system board standos
Service considerations
The following sections include some of the considerations that you must keep in mind during disassembly
and assembly procedures.
NOTE: As you remove each subassembly from the computer, place the subassembly (and all accompanying
screws) away from the work area to prevent damage.
Plastic parts
IMPORTANT: Using excessive force during disassembly and reassembly can damage plastic parts.
Cables and connectors
IMPORTANT: When servicing the computer, be sure that cables are placed in their proper locations during
the reassembly process. Improper cable placement can damage the computer.
Cables must be handled with extreme care to avoid damage. Apply only the tension required to unseat or seat
the cables during removal and insertion. Handle cables by the connector whenever possible. In all cases, avoid
bending, twisting, or tearing cables. Be sure that cables are routed in such a way that they cannot be caught
or snagged by parts being removed or replaced. Handle ex cables with extreme care; these cables tear
easily.
Tools required 9

Drive handling
IMPORTANT: Drives are fragile components that must be handled with care. To prevent damage to the
computer, damage to a drive, or loss of information, observe these precautions:
Before removing or inserting a hard drive, shut down the computer. If you are unsure whether the computer is
o or in Hibernation, turn the computer on, and then shut it down through the operating system.
Before handling a drive, be sure that you are discharged of static electricity. While handling a drive, avoid
touching the connector.
Before removing an optical drive, be sure that a disc is not in the drive and be sure that the optical drive tray is
closed.
Handle drives on surfaces covered with at least one inch of shock-proof foam.
Avoid dropping drives from any height onto any surface.
After removing a hard drive or an optical drive, place it in a static-proof bag.
Avoid exposing an internal hard drive to products that have magnetic elds, such as monitors or speakers.
Avoid exposing a drive to temperature extremes or liquids.
If a drive must be mailed, place the drive in a bubble pack mailer or other suitable form of protective
packaging and label the package “FRAGILE.”
Workstation guidelines
Follow these grounding workstation guidelines:
●Cover the workstation with approved static-shielding material.
●Use a wrist strap connected to a properly grounded work surface and use properly grounded tools and
equipment.
●Use conductive eld service tools, such as cutters, screw drivers, and vacuums.
●When xtures must directly contact dissipative surfaces, use xtures made only of static-safe materials.
●Keep the work area free of nonconductive materials, such as ordinary plastic assembly aids
and Styrofoam.
●Handle ESD-sensitive components, parts, and assemblies by the case or PCM laminate. Handle these
items only at static-free workstations.
●Avoid contact with pins, leads, or circuitry.
●Turn o power and input signals before inserting or removing connectors or test equipment.
Electrostatic discharge information
A sudden discharge of static electricity from your nger or other conductor can destroy static-sensitive
devices or microcircuitry. Often the spark is neither felt nor heard, but damage occurs. An electronic device
exposed to electrostatic discharge (ESD) might not appear to be aected at all and can work perfectly
throughout a normal cycle. The device might function normally for a while, but it has been degraded in the
internal layers, reducing its life expectancy.
Networks built into many integrated circuits provide some protection, but in many cases, the discharge
contains enough power to alter device parameters or melt silicon junctions.
10 Chapter 4 Removal and replacement procedures preliminary requirements

IMPORTANT: To prevent damage to the device when you are removing or installing internal components,
observe these precautions:
Keep components in their electrostatic-safe containers until you are ready to install them.
Before touching an electronic component, discharge static electricity by using the guidelines described in this
section.
Avoid touching pins, leads, and circuitry. Handle electronic components as little as possible.
If you remove a component, place it in an electrostatic-safe container.
Generating static electricity
Note the following:
●Dierent activities generate dierent amounts of static electricity.
●Static electricity increases as humidity decreases.
Table 4-1 Static electricity occurrence based on activity and humidity
Relative humidity
Event 55% 40% 10%
Walking across carpet
Walking across vinyl oor
Motions of bench worker
Removing DIPs from plastic tube
7,500 V
3,000 V
400 V
400 V
15,000 V
5,000 V
800 V
700 V
35,000 V
12,000 V
6,000 V
2,000 V
Removing DIPs from vinyl tray
Removing DIPs from Styrofoam
Removing bubble pack from PCB
Packing PCBs in foam-lined box
2,000 V
3,500 V
7,000 V
5,000 V
4,000 V
5,000 V
20,000 V
11,000 V
11,500 V
14,500 V
26,500 V
21,000 V
Multiple electric components can be packaged together in plastic tubes, trays, or Styrofoam.
NOTE: As little as 700 V can degrade a product.
Preventing electrostatic damage to equipment
Many electronic components are sensitive to ESD. Circuitry design and structure determine the degree of
sensitivity. The following packaging and grounding precautions are necessary to prevent static electricity
damage to electronic components.
●To avoid hand contact, transport products in static-safe containers such as tubes, bags, or boxes.
●Protect all electrostatic parts and assemblies with conductive or approved containers or packaging.
●Keep electrostatic-sensitive parts in their containers until they arrive at static-free stations.
●Place items on a grounded surface before removing them from their container.
●Always be properly grounded when touching a sensitive component or assembly.
Electrostatic discharge information 11

●Avoid contact with pins, leads, or circuitry.
●Place reusable electrostatic-sensitive parts from assemblies in protective packaging or conductive
foam.
Personal grounding methods and equipment
Use the following equipment to prevent static electricity damage to electronic components:
●Wrist straps are exible straps with a maximum of 1 MΩ ±10% resistance in the ground cords. To
provide proper ground, a strap must be worn snug against bare skin. The ground cord must be
connected and t snugly into the banana plug connector on the grounding mat or workstation.
●Heel straps/Toe straps/Boot straps can be used at standing workstations and are compatible with
most types of shoes or boots. On conductive oors or dissipative oor mats, use them on both feet with
a maximum of 1 MΩ ±10% resistance between the operator and ground.
Table 4-2 Static shielding protection levels
Static shielding protection levels
Method Voltage
Antistatic plastic
Carbon-loaded plastic
Metallized laminate
1,500
7,500
15,000
Grounding the work area
To prevent static damage at the work area, use the following precautions:
●Cover the work surface with approved static-dissipative material. Provide a wrist strap connected to the
work surface and properly grounded tools and equipment.
●Use static-dissipative mats, foot straps, or air ionizers to give added protection.
●Handle electrostatic sensitive components, parts, and assemblies by the case or PCB laminate. Handle
them only at static-free work areas.
●Turn o power and input signals before inserting and removing connectors or test equipment.
●Use xtures made of static-safe materials when xtures must directly contact dissipative surfaces.
●Keep work area free of nonconductive materials such as ordinary plastic assembly aids and Styrofoam.
●Use eld service tools, such as cutters, screwdrivers, and vacuums, that are conductive.
Recommended materials and equipment
HP recommends the following materials and equipment to prevent static electricity:
●Antistatic tape
●Antistatic smocks, aprons, or sleeve protectors
●Conductive bins and other assembly or soldering aids
●Conductive foam
●Conductive tabletop workstations with ground cord of 1 MΩ ±10% resistance
●Static-dissipative table or oor mats with hard tie to ground
12 Chapter 4 Removal and replacement procedures preliminary requirements