HP Xw6400 - Workstation - 4 GB RAM Assembly instructions

Product End-of-Life Disassembly Instructions
HP xw6400 Workstation
Product Category: Workstations
Marketing Name / Model
[List multiple models if applicable.]
HP xw6400 Workstation
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA) With a surface greater than 10 sq cm Two in the power supply, one graphics card, and
one system board. (Additional cards may be present
depending on the configuration.)
4
Batteries All types including standard alkaline and lithium coin
or button style batteries 1
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries None
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm Includes background illuminated displays with gas discharge lamps None
Cathode Ray Tubes (CRT) None
Capacitors / condensers (Containing PCB/PCT) None
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height Ten attached to the power supply boards. 10
External electrical cables and cords 1
Gas Discharge Lamps None
Plastics containing Brominated Flame Retardants None
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent chambers, and service stations. None
Components and waste containing asbestos None
Components, parts and materials containing
refractory ceramic fibers None
Components, parts and materials containing
radioactive substances None
EL-MF877-00 Page 1
Template Revision A 438708-001

EL-MF877-00 Page 2
Template Revision A 438708-001
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Torx drivers, screwdriver, diagonal cutter
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
(See instructions below in sections 3.2 and 3.3.)

3.2 Workstation Disassembly Procedures
1. Remove/disengage any security devices that prohibit opening the workstation.
2. Disconnect the power cord from the electrical outlet and then from the workstation.
3. Disconnect all peripheral device cables from the workstation.
4. Remove the access panel. Pull up on the handle 1and lift off the cover 2.
5. Disconnect all internal cables from system board, power supply, and other components.
6. Remove the system battery. Press on the release tab of the battery holder. Rotate the battery
beyond the latch and lift it straight up.
Battery
EL-MF877-00 Page 3
Template Revision A 438708-001

7. Remove the graphics card and any other expansion cards.
If necessary, first remove the PCI Holder for short or tall cards. Lift the holder arm with one
hand, press in on the sides of the holder 1, and rotate it out of the chassis 2.
Short Card Tall Card
Remove the PCI retainer clamp by pressing down on the green snaps and rotating the PCI
retention clamp upward 1. Lift the PCI card out of the chassis 2. (First picture.)
For PCI Express cards (second picture), remove the PCI retainer clamp by pressing down on
the green snaps and rotating the PCI retention clamp upward 1. Remove the power supply
cable (not shown) if required. Then move the PCI slot lever 2to release the card and lift it out
of the chassis 3.
PCI Card PCI Express Card
EL-MF877-00 Page 4
Template Revision A 438708-001

8. Remove the power supply from the chassis. Disconnect or cut electrical connections to the
power supply. Remove the four screws 1securing the power supply to the workstation
chassis. Slide the power supply toward the front, then lift up to remove it from the chassis 2.
9. Remove the system board. Slide the board forward to disengage the mounting standoffs from
the chassis 1. Lift the board out of the chassis 2.
10. Dispose of all removed components according to regulatory requirements.
EL-MF877-00 Page 5
Template Revision A 438708-001

3.3 Power Supply Disassembly Procedures
1. Cut the cable tie at the rear of the unit.
2. Remove the four power supply screws—two on each side of the front.
EL-MF877-00 Page 6
Template Revision A 438708-001

3. Slide the chassis housing from the power supply unit.
4. Remove the four screws from the corners of the first PCB card. Pull the card loose from the
chassis.
EL-MF877-00 Page 7
Template Revision A 438708-001

5. Unplug the connectors that connect the two PCB cards together. Remove the first PCB
card from the chassis.
EL-MF877-00 Page 8
Template Revision A 438708-001

6. Use a diagonal cutter to remove the desired components from both PCB cards. (Note that
some components may need to be unsoldered if a diagonal cutter does not fit between the
component and the PCB card.)
7. Dispose of all removed components according to regulatory requirements.
EL-MF877-00 Page 9
Template Revision A 438708-001