HP xw9400 Installation instructions

Product End-of-Life Disassembly Instructions
HP xw9400 Workstation
Product Category: Workstations
Marketing Name / Model
[List multiple models if applicable.]
HP xw9400 Workstation
- Standard configuration
- Optional liquid cooled configuration
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA) With a surface greater than 10 sq cm. There are two in the power supply, one graphics
card, and one system board. (Additional cards may
be present depending on the configuration.)
4
Batteries All types including standard alkaline and lithium coin
or button style batteries. 1
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries None
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm Includes background illuminated displays with gas discharge lamps. None
Cathode Ray Tubes (CRT) None
Capacitors / condensers (Containing PCB/PCT) None
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height Fifteen attached to the power supply boards. 15
External electrical cables and cords None
Gas Discharge Lamps None
Plastics containing Brominated Flame Retardants None
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent chambers, and service stations. None
Components and waste containing asbestos None
Components, parts and materials containing
refractory ceramic fibers None
Components, parts and materials containing None
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radioactive substances
Liquid Fluid in the liquid cooling unit of the optional
configurations. Yes
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Torx drivers, screwdriver, diagonal cutter
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
(See instructions below in sections 3.2 and 3.3.)

3.2 Workstation Disassembly Procedures
1. Remove/disengage any security devices that prohibit opening the workstation.
2. Disconnect the power cord from the electrical outlet and then from the workstation.
3. Disconnect all peripheral device cables from the workstation.
4. Remove the access panel. Pull up on the handle 1and lift off the cover 2.
5. Disconnect all internal cables from system board, power supply, and other components.
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6. Remove the system battery. On the system board, press on the release tab of the battery
holder. Rotate the battery enough to get beyond the latch, and lift it straight up.
Battery
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7. Remove the graphics card and any other expansion cards.
If necessary, remove PCI holders. For short or tall PCI cards press in on the sides 1of the
holder and rotate it 2out of the chassis.
Short card Tall card
Remove the PCI retainer by pressing down on it, then out 1. Lift the PCI or PCI-X card out of
the chassis 2.
If removing a PCI Express high-end graphics card, disconnect the auxiliary power supply cable
from the card (not illustrated) if required, and move the lever to release the card 3and lift it
out of the chassis.
.
PCI or PCI-X card PCI Express card
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8. Remove the CPU Heatsink.
Remove the CPU airflow duct by lifting up on the tabs 1and rotating the duct away 2from the
CPU heatsinks.
Disconnect the CPU heatsink fan connector 1from the system board. Loosen the heatsink
mounting screws 2. Before lifting the heatsink, carefully break the thermal compound between
the CPU heatsink and processor by moving the heatsink back and forth or twisting it 3.
.
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9. Remove the power supply from the chassis. Remove the four screws 1from the back panel.
Slide the power supply toward the front and lift up 2to remove it from the chassis.
10. If the workstation is equipped with a liquid cooling unit, see section 3.4 for instructions on
draining the fluid.
11. Rotate the system board latch lever 90 degrees 1clockwise to unlock the system board. Slide
the system board forward 2to disengage the metal mounting standoffs from the chassis. Lift
the system board out 3of the chassis. You can lift the board by the rear audio connector and
the 2 x 4 power connector 4.
12. Dispose of all removed components according to regulatory requirements.
1
2
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3.3 Power Supply Disassembly Procedures
1. Cut the cable tie at the rear of the unit.
2. Remove the eight power supply screws—three on each side of the front, one at the side,
and one at the top back.
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3. Slide the chassis housing from the power supply unit.
4. Remove the four screws from the corners of the first PCB card. Pull the card loose from the
chassis.
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5. Unplug the connectors that connect the two PCB cards together. Remove the first PCB
card from the chassis.
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6. Use a diagonal cutter to remove the desired components from both PCB cards. (Note that
some components may need to be unsoldered if a diagonal cutter does not fit between the
component and the PCB card.)
7. Dispose of all removed components according to regulatory requirements.
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3.4 Draining the liquid cooling unit
If your workstation has a liquid cooling unit, follow the procedures below to remove the cooling unit from the
workstation and drain the coolant.
1. Disconnect power from the workstation and remove the access panel.
2. Loosen the two liquid cooling unit/CPU 0 mounting screws (1) from the liquid cooling unit.
Alternately and evenly loosen the two radiator fastening screws (2).
3. Raise the fan/radiator to its upright position.
4. Disconnect the memory fan (1), radiator fan (2), and voltage regulator fan (3) cables from
the system board. Pull the memory fan cable clear of the liquid cooling unit.
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5. Alternately and evenly loosen the two liquid cooling unit/CPU 1 mounting screws from the
liquid cooling unit.
6. Lower the fan/radiator to its closed position.
7. For convenience, disconnect the PSU (1) cable from the system board. Disconnect the
liquid cooling unit pump cable (2) from the system board.
8. Press the green tab in on the memory fan housing (1) and lift the unit from the system
board (2). Carefully pull the memory fan cable from the liquid cooling unit.
9. Raise the liquid cooling unit fan/radiator to its upright position and remove the unit from the
workstation.
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10. Cut all hoses and remove them from the cooling unit
11. Drain the coolant from the unit and dispose of it according to regulatory requirements.
(Refer to Appendix: Cooling Fluid MSDS for a description of the fluid composition.)
12. Return to section 3.2 Workstation Disassembly Procedures to complete the workstation
disassembly.

Appendix: Cooling Fluid MSDS
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