HP ZCentral 4R Assembly instructions

EL-MF877-00 Page 1
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Workstation
Marketing Name / Model
[List multiple models if applicable.]
HP ZCentral 4R Workstation
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the
disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the
plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
Item Description Notes
Quantity of
items
included in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
1
Batteries, excluding Li-Ion batteries.
All types including standard alkaline, coin or button style
batteries
1
Li-Ion batteries. Include all Li-Ion batteries if more than
one is provided with the product (such as a detachable
notebook keyboard battery, RTC coin cell, etc.)
Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[ ] screws
[X] snaps
[ ] adhesive
[ ] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater than
100 sq cm
Includes background illuminated displays with gas
discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring greater
than 2.5 cm in diameter or height
Flatiron PSU 90% 675W Chicony
1
External electrical cables and cords
Power Cord
1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)

EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Item Description Notes
Quantity of
items
included in
product
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing refractory
ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Hexagon Screw Driver
T-15
Crisscross Screw Driver
PH1
Electric Iron
QUICK 310
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1 Open access panel
2 Remove the cage from host up
3 Use PH1screwdriver to loose the screws and remove the heatsink
4 Rotate the handle and open it up
5 Remove the CPU from the board
6 Remove memory from MB
7 Remove Graphic card from host up
8.Use PH1 screwdriver to loose the screws
9. Press the Graphic card’s latch and remove it
10Use PH1screwdriver to loose the screws and remove the PCIe card
11Use PH1 screwdriver to loose the screws and remove the cable
12.Press the PSU’s latch on chassis and remove the PSU from chassis
13 Use PH1 to unscrew five screws to loosen top cover.
14 Slide top cover to unhook bottom chassis before top cover removal
15 Remove top cover from bottom chassis
16 Remove the Mylar from top cover by hand-pulling.
17 Use PH1 to unscrew six screws to loosen PCBA from bottom chassis.
18 Disconnect fan cable connector and LED cable connector from PCBA
19 Remove PCBA away from bottom chassis
20 Heat the solder of the Electrolytic Capacitors of greater than 2.5cm in diameter or height and Remove it
21 Remove the Mylar from bottom chassis by hand-pulling
22 Use PH1 to unscrew four screws to loosen fan from bottom chassis
23 Remove fan from the bottom chassis by hand-pulling upwardly
24 Use PH1 to unscrew two screws to loosen handle-released module from bottom chassis
25 Use PH1 to unscrew one cross screw and tool#3 to unscrew one torx screw.
26 Remove metal handle away from handle-released module.
27 Slide handle-released module away from bottom chassis.
28 No more treatment for bottom chassis and fan bracket.

EL-MF877-00 Page 3
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
29 Use PH1 screwdriver to loose the screws and remove the iron
30 Use PH1 screwdriver to loose the screws and remove the iron
31 Disconnect fan cable from MB
32. Remove the fans
33. Disconnect cables from convert board
34. Use PH1screwdriver to loose the screws and remove the iron
35. Press the button and remove the cable
36. Disconnect all cables from MB
37. Use PH1 screwdriver to loose the screws of MB from board
38. Remove MB from chassis
39. Remove the battery from the system board
40. Use PH1 screwdriver to loose the screws and remove the led flatiron
41. Rotate the handle and open it up and remove WLAN M.2 Card
42. Press the botton
43. Remove the HDD
44 Press the convert board latch
45 Remove convert board from the cage
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the
product that require selective treatment (with descriptions and arrows identifying locations).
Step1
Open access panel
Step2
Remove the cage from host up
Step3
Use PH1 screwdriver to loose the screws and remove
the heatsink
Step4
Rotate the handle and open it up

EL-MF877-00 Page 4
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step5
Remove the CPU from the board
Step6
Remove memory from MB
Step7
Remove Graphic card from host up
Step8
Use PH1screwdriver to loose the screws
Step9
Press the Graphic card’s latch and Remove it
Step10
Use PH1 screwdriver to loose the screws and remove
the PCIe card

EL-MF877-00 Page 5
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step11
Use PH1 screwdriver to loose the screws and
remove the cable
Step12
Press the PSU’s latch on chassis and remove the PSU
from chassis
Step13 Use PH1 to unscrew five screws to loosen top
cover.
Step14 Slide top cover to unhook bottom chassis before
top cover removal.
Step15
Remove top cover from bottom chassis.
Step16
Remove the Mylar from top cover by hand-pulling.

EL-MF877-00 Page 6
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step17
Use PH1 to unscrew six screws to loosen PCBA
from bottom chassis.
Step18
Disconnect fan cable connector and LED cable
connector from PCBA.
Step19 Remove PCBA away from bottom chassis. Step20 Heat the solder of the Electrolytic Capacitors of
greater than 2.5cm in diameter or height and Remove it
Step21
Remove the Mylar from bottom chassis by hand-
pulling.
Step22
Use PH1 to unscrew four screws to loosen fan
from bottom chassis.

EL-MF877-00 Page 7
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step23
Remove fan from the bottom chassis by hand-
pulling upwardly.
Step24
Use PH1 to unscrew two screws to loosen handle-
released module from bottom chassis.
Step25
Use t PH1 to unscrew one cross screw and
tool#3 to unscrew one torx screw.
Step26
Remove metal handle away from handle-released
module.
Step27
Slide handle-released module away from bottom
chassis.
Step28
No more treatment for bottom chassis and fan
bracket.

EL-MF877-00 Page 8
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step29
Use PH1 screwdriver to loose the screws and
remove the iron
Step30
Use PH1 screwdriver to loose the screws and remove
the iron
Step31 Disconnect fan cable from MB Step32 Remove the fans
Step33
Disconnect cables from convert board
Step34
Use PH1 screwdriver to loose the screws and remove
the iron

EL-MF877-00 Page 9
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step35
Press the button and remove the cable
Step36
Disconnect all cables from MB
Step37
Use PH1 screwdriver to loose the screws of MB from
board
Step38
Remove MB from chassis
Step39
Remove the battery from the system board
Step40
Use PH1 screwdriver to loose the screws and remove
the led flatiron

EL-MF877-00 Page 10
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Step41
Rotate the handle and open it up and remove WLAN
M.2 Card
Step42
Press the botton
Step43
Remove the HDD
Step44
Press the convert board latch
Step45 Remove convert board from the cage