EL-MF877-00
Template Revision B
PSG instructions for this template are available at EL-MF877-01
including liquids, semi-liquids (gel/paste) and toner
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
Description #1 Screw Driver, Cross Type
Description #2 Cut-Pliers, Small Size
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Slide the latch and remove access panel.(see Figure 1-2 below)
2. Rotate the driver cage form the hook on slide rail.(see Figure 3 below)
3. Disconnect power cable from the MB.(see Figure 4 below)
4. Disconnect SATA cables from the MB.(see Figure 5 below)
5. Disconnect speaker cable from the MB.(see Figure 6 below)
6. Disconnect other PSU cables from the MB.(see Figure 7-8 below)
7. Remove the fan duct (see Figure 9-10 below)
8. Disconnect P3 cable from MB.(see Figure 11 below)
9. Remove HDD/ODD from chassis.(see Figure 12-19 below)
10. Remove the heatsink from MB.(see Figure 20-21 below)
11. Separate the fan from CPU heatsink.（see Figure 22 below）
12. Remove the memory card from the MB.(see Figure 23 below)
13. Remove the CPU from the MB.(see Figure 24-25 below)
14. Remove M/B from chassis .(see Figure 26-27 below)
15. Remove the battery from MB.(see Figure 28 below)
16. Remove LED holder from MB.(see Figure 29 below)
17. Remove front panel from chassis.(see Figure 30 below)
18. Remove Speaker from chassis.(see Figure 31 below)
19. Unscrew the PSU and disconnect all PSU cables from chassis.(see Figure 32-35 below)
20. Remove PSU cover and remove the Electrolytic Capacitors.(see Figure 36-41 below)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
