HP Compaq V2000 Series Assembly instructions

HP-00007-01, Appendix 3 13-Oct-2004
HP Restricted
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Appendix 3 Product End-of-Life Disassembly instructions
Product Identification:
Marketing Name / Model Description
Compaq V2000 Series Notebook PC Notebook PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the
basic instructions for the disassembly of HP products to remove components and materials requiring
selective treatment.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in
the right column, as applicable.
Item Description Notes Quantity of
items included
in product.
Printed Circuit Boards (PCB) or Printed
Circuit Assemblies (PCA) With a surface greater than 10 square cm 5
Batteries All types including standard
alkaline and lithium coin or button
style batteries
2
Mercury containing components For example, mercury in lamps,
display backlights, scanner lamps,
switches, batteries
1
Liquid Crystal Displays (LCD) with a
surface greater than 100 square cm Includes background illuminated displays with gas discharge lamps 1
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing
PCB / PCT) 0
Electrolytic Capacitors / Condensers
measuring greater than 2.5 cm in
diameter or height
0
External electrical cables and cords 0
Gas Discharge Lamps 0
Plastics containing Brominated Flame
Retardants 0
Components and parts containing toner
and ink, including liquids, semi-liquids
(gel/paste) and toner
Include the cartridges, print
heads, tubes, vent chambers, and
service stations.
0
Components and waste containing
asbestos 0
Components, parts and materials 0

HP-00007-01, Appendix 3 13-Oct-2004
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containing refractory ceramic fibers
Components, parts and materials
containing radioactive substances 0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a
point where components and materials requiring selective treatment can be removed.
Tool Description Tool Size (if applicable)
Screwdriver Type-cross #1 (JIS B 4633-1987)
Screwdriver Type-cross #2 (JIS B 4633-1987)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials
requiring selective treatment:
1 Remove 6 cell battery.
2 Remove two M2.5*5L screws on HDD door, then take out HDD (contains PCA)
3 Remove one M2.5*7.5L screw on BASE cover, then take out ODD (contains PCA)
4 Remove three M2.5*5L screws on BASE cover, then take out RAM door and MINIPCI
door.
5 Remove fourteen M2.5*7.5L and nine M2*3L screws on BASE cover, then reverse it.
6 Remove keyboard cover assy., then take out keyboard and draw out LCD assy.
7 Reverse it and remove BASE case assy.
8 Remove two M2.5*4L screws, then remove daughter board PCA.
9 Remove four M2.5*4L screws on top cover assy., then remove AV board PCA.
10 Remove four M2.5*4L screws, then take out MB PCA.
11 Remove six M2.5*5L screws, then take out LCD bezel
12 Remove one M2*2.5L and six M2.5*5L screws, then take out inverter board and LCD
panel.
13 Disassemble LCD panel and remove mercury backlight for selective treatment
14 Remove three MS2*1.8L screws on top cover assy., then take out LED board.
15 Divide motherboard from connecter and take out RTC coin cell battery for selective
treatment
3.2 OPTIONAL: Depending upon the complexity of the disassembly process, a graphic
depicting the locations of items contained within the product which require selective
treatment (with descriptions and arrows identifying locations) can be inserted below:

HP-00007-01, Appendix 3 13-Oct-2004
HP Restricted
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