HP Agilent 37717B PDH Use and care manual

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Errata
Title & Document Type:
Manual Part Number:
Revision Date:
HP References in this Manual
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Packard's former test and measurement, semiconductor products and chemical analysis
businesses are now part of Agilent Technologies. We have made no changes to this
manual copy. The HP XXXX referred to in this document is now the Agilent XXXX.
For example, model number HP8648A is now model number Agilent 8648A.
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PDHISDH Test Set
Calibration Manual
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HP 37717B PDHISDH test set
CALIBRATION MANUAL
SERIAL NUMBERS
This manual applies directly toinstruments
with serial numbers GBOOOOOlOl and above.
Fa
HEWLETT
PACKARD
HP Part No. 37717-90084
Printed in
U.K. July 1995
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CERTIFICATION
Hewlett-Packard Company certifies that this product met itspublished
specifications at the time of shipment from the factory. Hewlett-Packard further
certifies that its calibmtion measurements are traceable to the United States
National Bureau of Standads, to the extent allowed by the Bureau's calibration
facility and to the calibration facilities of other International Standards
Organization members.
ASSISTANCE
Product maintenance agreements and other customer assistance agreements are
available for Hewlett-Packard products.
For any assistance, contact your Hewlett-Packard Sales and Service Ofice.
Addresses are provided at the back of this manual.
NOTICE
The information contained in this document is subject to change without
notice.
Hewlett-Packard shall not be liable for errors contained herein or for incidental
or consequential damages in connection with the furnishing, performance or use
of this material.
This document contains proprietary information which is protected
by copyright. All rights are reserved. No part of this document may
be photocopied or reproduced without the prior written consent of
Hewlett-Packard Ltd.
PRINTING HISTORY
First Edition July 1995
Copyright @ Hewlett-Packard Ltd. (1995)
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WARNING
READ THE FOLLOWING NOTES BEFORE INSTALLING OR'SERVICING
0
ANY INSTRUMENT.
1. IF THIS INSTRUMENT IS TO BE ENERGISED VIA AN AUTO-
TRANSFORMER MAKE SURE THAT THE COMMON TERMINAL OF
THE AUTO-TRANSFORMER IS CONNECTED TO THE NEUTRAL
POLE OF THE POWER SOURCE.
a
2. THE INSTRUMENT MUST ONLY BE USED WITH THE MAINS
CABLE PROVIDED. IF THIS IS NOT SUITABLE, CONTACT YOUR
NEAREST HP SERVICE OFFICE. THE MAINS PLUG SHALL
ONLY BE INSERTED IN A SOCKET OUTLET PROVIDED WITH
A PROTECTIVE EARTH CONTACT. THE PROTECTIVE ACTION
MUST NOT BE NEGATED BY THE USE OF AN EXTEKSION
CORD (POWER CABLE) WITHOUT A PROTECTIVE CONDUCTOR
(GROUNDING).
3. BEFORE SWITCHING ON THIS INSTRUMENT:
a
a. Ensure that all devices connected to this instrument are connected to the
protective (earth) ground.
b. Ensure that the line power (mains) plug is connected to a three-
conductor line power outlet that has a protective (earth)ground.
(Grounding one conductor of a two-conductor outlet is not sufficient).
@
c. Check correct type and rating of the instrument fuse(s).
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Contents
General Information
Specifications .........
..... Safety Considerations
Manual Safety Markings . .
Instrument Safety Markings .
Laser Safety ........
Laser Warning Symbols ...
ESD Precautions ......
Product Regulations .....
Operators Maintenance ....
Cleaning ..........
Optical Fibre Cleaning . .
Instruments Covered By Manual
...........
Options
Accessories
.........
........ Specifications
Installation
Initial Inspection ......
Preparation for Use .....
Power Requirements ...
Power Cord ......
Operators Maintenance ...
Fuse Replacement ....
Line Voltage Selector Switch
Hewlett-Packard Interface Bus
HP-IB Address Selection
.
Operating Environment ...
Storage and Shipment ....
Repackaging for Shipment .
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3 . Performance Tests
.......................
Introduction
..................
Equipment Required
Performance Test Record
................
....................
Calibration Cycle
.................
Recall Default Settings
........................
Self Test
.......................
Description
..................
Self Test Loopbacks
Procedure
.......................
.............
PDH Internal Transmitter Clocks
......................
Specifications
Description
.......................
.......................
Equipment
Procedure
.......................
...................
Frequency Offsets
..................
PDH Transmitter Output
......................
Specifications
Description
.......................
.......................
Equipment
.......................
Procedure
Multiple PDH Transmitter Outputs (Option UHC[US6])
...
......................
Specifications
.......................
Description
Equipment
.......................
.......................
Procedure
...................
PDH Frame Analysis
......................
Specifications
.......................
Equipment
.......................
Description
.......................
Procedure
................
2 Mb/s Frame Analysis
................
8 Mb/s Frame Analysis
................
34 Mb/s nameAnalysis
...............
140 Mb/s Frame Analysis
................
PDH Receiver Equalization
......................
Specifications
.......................
Description
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.......................
Equipment 3-49
.......................
Procedure 3-49
.... PDH Receiver Monitor Levels (Option UKK[USB] only)
3-53
......................
Specification 3-53
.......................
Description 3-53
.......................
Equipment 3-53
.......................
Procedure 3-53
SPDH Receiver Monitor Levels (Options UKJ.[USA] and
......................
UKL.[USC]) 3-56
......................
Specifications 3-56
.......................
Description 3-56
.......................
Equipment 3-56
.......................
Procedure 3-57
..... External 2Mb/s Mux/Demux (Options UKJ. [USA])
3-60
......................
Specifications 3-60
.......................
Description 3-60
.......................
Equipment 3-61
.......................
Procedure 3-61
........
External 2Mb/s Demux (Options UKL. [USC]) 3-67
......................
Specifications 3-67
.......................
Description 3-67
.......................
Equipment 3-67
.......................
Procedure 3-68
......PDH Receiver Monitor Levels (Special Option 808) 3-73
......................
Specification 3-73
.......................
Description 3-73
.......................
Equipment 3-73
.......................
Procedure 3-73
....................
PDH Error Output 3-77
......................
Specifications 3-77
.......................
Description 3-77
.......................
Equipment 3-77
Procedure ....................... 3-77 .
.......
PDH Frequency Measurement and Looped Clock
3-79
......................
Specifications 3-79
.......................
Description 3-79
.......................
Equipment 3-79
.......................
Procedure 3-79
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Internal SDH Transmitter Clock (Options USl[US5]. AlT[AlU]) 3-83
......................
Specifications 3-83
.......................
Description 3-83
.......................
Equipment 3-83
.......................
Procedure 3-83
SDH Frequency Offsets (Options USl[US5]. AlT[AlU])
.... 3-85
......................
Specifications 3-85
.......................
Description 3-85
..................
Equipment Required 3-85
.......................
Procedure 3-85
External MTS Clock (Options USl[US5]. AlT[AlU])
..... 3-88
......................
Specifications 3-88
.......................
Description 3-88
..................
Equipment Required 3-88
.......................
Procedure 3-88
STM-1 Transmitter Output Waveshape (Options US
1 [US5].
......................
AlT[AlU]) 3-91
......................
Specifications 3-91
.......................
Description 3-91
..................
EquipmentRequired 3-91
.......................
Procedure 3-91
STM-1 Receiver Monitor Input (Options US1[US5]. AlT[AlU]) 3-99
......................
Specification 3-99
.......................
Description 3-99
..................
Equipment Required 3-99
.......................
Procedure 3-99
.....
STM-1 Receiver Monitor Input (Special Option 808) 3-101
......................
Specification 3-101
.......................
Description 3-101
..................
Equipment Required 3-101
.......................
Procedure 3-101
STM-1 Receiver Input Equalization (Options US
1 [US5].
......................
AlT[AlU]) 3-103
......................
Specification 3-103
.......................
Description 3-103
..................
Equipment Required 3-103
.......................
Procedure 3-103
...........
STM-1 Optical Interface (Option UH1) 3-104
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................
Specification (Transmitter)
................. Specification (Receiver)
Description
.......................
Equipment Required ..................
.......................
Procedure
STM-114 Optical Interface (Option UH2)
..........
Specification (Transmitter) ................
Specification (Receiver) .................
.......................
Description
Equipment Required
..................
.......................
Procedure
STM.114. 1550nm Optical Interface (Option URU)
......
Specification (Transmitter) ................
.................
Specification (Receiver)
.......................
Description
Equipment Required
..................
.......................
Procedure
Transmitted Jitter Amplitude Accuracy (Option UHK)
....
......................
Specifications
.......................
Description
.......................
Equipment
..................
Pre-Adjustment Setup
.......................
Procedure
Received Jitter Accuracy (Option UHN[US9])
........
......................
Specifications
.......................
Description
.......................
Equipment
Pre-Adjustment Setup
..................
Jitter Generation Module Calibration Procedure
......
Received Jitter Accuracy Procedure ............
Fitting A Jitter Generation Module ............
WanderISlips Measurement (Option UHN[US9]) .......
......................
Specifications
.......................
Description
.......................
Equipment
........................
Procedure
Performance Test Record
.................
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A. Default Settings
B. Self Test Fail Numbers
Index
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Figures
...................
1.1.SerialNumberPlate 1-7
................
2.1 . Power Cord Part Numbers 2-4
...........
2.2 . HP-IB Connections and Logic Levels 2-6
3.1
. Self Test RS-232 port loopback connections ........ 3-5
.................
. 3.2 704 kb/s Pulse Criteria 3-13
...................
.
3.3 2 Mb/s Pulse Mask 3-14
..............
3.4 . 2 Mb/s Isolated Positive Pulse 3-15
..............
.
3.5 2 Mb/s Isolated Negative Pulse 3-16
...................
. 3.6 8 Mb/s Pulse Mask 3-17
..............
3.7 . 8 Mb/s Isolated Positive Pulse 3-18
..............
.
3.8 8 Mb/s Isolated Negative Pulse 3-18
..................
. 3.9 34 Mb/s Pulse Mask 3-19
..............
3.10 . 34 Mb/s Isolated Positive Pulse 3-20
.............
3.11 . 34 Mb/s Isolated Negative Pulse 3-21
...............
3.12 . 140 Mb/s Pulse Mask All 1's 3-22
................
3.13 . 140 Mb/s All Ones Pulse 3-23
...............
3.14 . 140 Mb/s Pulse Mask All 0's 3-24
................
3.15 . 140 Mb/s All Zeros Pulse 3-24
.................
3.16 . 704 kb/s Pulse Criteria 3-27
...................
3.17 . 2 Mb/s Pulse Mask 3-29
...................
3.18 . 8 Mb/s Pulse Mask 3-32
..................
3.19 . 34 Mb/s Pulse Mask 3-35
...............
3.20 . 140 Mb/s Pulse Mask All 1's 3-38
...............
3.21 . 140 Mb/s Pulse Mask All 0's 3-39
3.22
. PDH Receiver Equalization Test Setup .......... 3-50
3.23
. PDH Receiver Monitor Levels Test Setup ......... 3-54
3.24
. SPDHReceiverMonitorInput .............. 3-57
..............
3.25 . External 2 Mb/s Mux/Demux 3-61
...................
3.26 . 2 Mb/s Pulse Mask 3-64
3.27
. 2 Mb/s Isolated Positive Pulse .............. 3-65
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..............
3.28 . 2 Mb/s Isolated Negative Pulse 3-66
.................
3.29 . External 2mb/s Demux 3-68
...................
3.30 . 2 Mb/s Pulse Mask 3-70
3.31.. 2 Mb/s Isolated Positive Pulse
.............. 3-71
..............
3.32 . 2 Mb/s Isolated Negative Pulse 3-72
3.33
. PDH Receiver Monitor Levels Test Setup ......... 3-74
3.34
. Receiver Frequency Measurement Test Setup ........ 3-80
3.35
. STM-1 Transmitter Output Waveshape, Test Setup ..... 3-92
.................
3.36 . STM-I All Ones Pattern 3-94
..................
3.37 . STM-1 All Ones Mask 3-95
.................
3.38 . STM-1 All Zeros Pattern 3-96
3.39
. STM-1 All Zeros Mask ................. 3-97
...............
3.40 . STM-1 Eye Diagram Pattern 3-98
................
3.41 . STM-1 Eye Diagram Mask
3-98
..............
3.42 . STM-1 Receiver Monitor Input 3-100
..............
3.43 . STM-1 Receiver Monitor Input 3-102
..............
3.44 . TX Jitter Accuracy Test Setup 3-121
..................
3.45 . Bessel Null Example 3-122
..............
3.46 . TX Jitter Accuracy Test Setup 3-128
........ 3.47 . Self Test RS-232 port loopback connections 3-133
...............
3.48 . Slips and Wander Test Setup 3-137
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1-1 . Recommended Test Equipment ..............
2.1 . Fuses .........................
2.2 . HP-IB Interconnecting Cables
..............
3-1 . Recommended Test Equipment
..............
3.2 . Transmitter Clock Offset .................
3.3 . Measured Offset ....................
3.4 . Range 1 Tx Jitter Amplitude Accuracy
..........
3.5 . Range 10 Tx Jitter Amplitude Accuracy ..........
B.1 . PDH Tests, Option UKK (75 52 Unbal Back to Back) ....
B.2 . PDH Tests, Option UKK (120 52 Bal Back to Back) .....
B.3 . PDH Tests, Option UKK (Offset, Frequency Measurement) .
. ..... B.4 PDH Tests, Option UKK (Error Add/Error Count)
B.5
. PDH Tests, Option UKK (Clock Recovery) .........
B.6 . PDH Tests, Option UKK (FAS Word) ...........
B.7 . SPDH Tests, Option UKJ (Line Code 750 Unbal Back to
....................... Back)
B.8
. SPDH Tests, Option UKJ (Line Code 12052 Bal Back to Back)
B.9
. SPDH Tests, Option UKJ (Offset, Frequency Measurement) .
B.10 . SPDH Tests, Option UKJ (34 Mb/s, Error Add/Error Count)
B.11
. SPDH Tests, Option UKJ (karning/Unframed) .......
B.12 . SPDH Tests, Option UKJ (Structured Payloads) ......
B.13 . SPDH Tests, Option UKJ (Patterns) ...........
B.14 . SPDH Tests, Option UKJ (Drop/Insert) ..........
B.15 . SPDH Tests, Option UKJ (Round Trip Delay) .......
B.16 . SDH Tests Option A1T (STM-1) .............
B.17 . SDH Tests Option A1T (STM-1 Frequency Offset) .....
B.18 . SDH Tests Option A1T (STM.1, Overhead)
........
B.19 . SDH Tests Option A1T (Frame Error Add) ........
B.20 . SDH Tests Option A1T (140 Mb/s Payload) ........
B.21 . SDH Tests Option A1T (TU3 Payload) ..........
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..... B.22 . SDH Tests Option A1T (TU12 Payload Overhead) B-12
B.23
. SDH Tests Option A1T (Payload Pattern) ......... B-12
.... B.24 . SDH Tests Option A1T (TU2 Payload Bit Error Add) B-13
B.25
. SDH Tests Option A1T (Freq Offset/Pointer Movements) . . B-13
.......
B.26 . SDH Tests Option A1T (Thru Mode and DCC) B-14
B.27
. SDH Tests Option US1 (STM-1) ............. B-14
..... B.28 . SDH Tests Option US1 (STM.1, Frequency Offset) B-14
B.29
. SDH Tests Option US1 (STM.1, 140 Mb/s Payload/Overhead) B-14
B.30
. SDH Tests Option US1 (STM.1, 34 Mb/s Payload/Overhead) B-15
B.31
. SDH Tests Option US1 (STM.1, 2 Mb/s Payload/Overhead) .
B-15
... B.32 . SDH Tests Option US1 (Payload/Background Patterns) B-15
B.33
. SDH Tests Option US1 (Alarm Detect) .......... B-16
B.34
. Optical Tests Option UH1 (STM-1) ............ B-17
B.35 . Optical Tests Options UH2, URU (STM-1) ......... B-17
B.36 . JITTER Generator Tests (Opt UHK) ........... B-19
B.37
. JITTER Receiver Tests (Opt UHN) ............ B-19
B.38
. JITTER Back to Back Tests (Opt UHK and UHN)
..... B-21
.... B.39 . STM-1 Electrical JITTER Receiver Tests (Opt AIM) B-22
....... B.40 . ATM Alarms, Back to Back Tests (Opt UKN) B-24
...... B.41 . ATM Bandwidth, Back to Back Tests (Opt UKN) B-24
.....
B.42 . ATM Distribution, Back to Back Tests (Opt UKN) B-25
...... B.43 . ATM Error Add, Back to Back Tests (Opt UKN) B-25
.......
B.44 . ATM Headers, Back to Back Tests (Opt UKN) B-27
...... B.45 . ATM Payloads, Back to Back Tests (Opt UKN) B-29
...... B.46 . ATM Test Cell, Back to Back Tests (Opt UKN) B-29
...... B.47 . ATM Trail Trace, Back to Back Tests (Opt UKN) B-30
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General lnformation
This section contains general information concerning the HP 37717B
PDH/SDH test set.
SPECIFICATIONS
SAFETY CONSIDERATIONS
PRODUCT REGULATIONS
OPERATORS MAINTENANCE
INSTRUMENTS COVERED
BY MANUAL
OPTIONS
ACCESSORIES
Specifications
The instrument specifications are listed on Pages 1-11 to 1-28. These
specifications are the performance standard or limits, against which the
instrument is tested.
The recommended test equipment required to carry out the performance tests
is listed in Table
1-1.
General lnformation 1-1
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Safety Considerations
The HP 37717B PDH/SDH test set is a Safety Class 1 (IEC) product
(provided with a protective earthing ground incorporated in the power cord).
This instrument has been designed and tested in accordance with IEC
Publication 348, Safety Requirements for Electronic Measuring Apparatus, and
has been supplied in a safe condition. The instruction documentation contains
information and warnings which must be followed by the user to ensure safe
operation and to maintain the instrument in a safe condition.
Manual Safety Markings
Warning
THE WARNING SIGN DENOTES A HAZARD TO THE OPERATOR.
IT CALLS ATTENTION TO A PROCEDURE, PRACTICE, OR THE
LIKE, WHICH IF NOT CORRECTLY PERFORMED OR ADHERED
TO, COULD RESULT IN INJURY OR LOSS OF LIFE. DO NOT
PROCEED BEYOND A WARNING SlGN UNTIL THE INDICATED
CONDITIONSARE FULLY UNDERSTOOD AND MET.
-
Caution
The CAUTION sign denotes a hazard to the instrument. It
calls attention to an operating or maintenance procedure,
practice, or the like, which if not correctly performed or
adhered to, could result in damage to or destruction of part or
all of the instrument. Do not proceed beyond
a CAUTION sign
until the indicated conditions are fully understood and met.
Instrument Safety Markings
A
Refer To Service Manual : This symbol on the instrument means
the user must refer to the instrument Service Manual to protect the
instrument from damage.
1-2 General Information
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A-
Protective Earth Ground : Indicates protective earth ground
-
0
terminal of the ac power source on the instrument. All exposed
metal surfaces on the instrument must connect to a protective earth
ground terminal.
,+, OR 1
Wame or Chassis Terminal : This symbol identifies a terminal that
is normally common to all exposed metal surfaces on the instrument.
Warning
NO OPERATOR SERVICEABLE PARTS INSIDE. REFER
SERVICING TO QUALIFIED PERSONNEL. TO PREVENT
ELECTRICAL SHOCK DO NOT REMOVE COVERS.
Laser Safety
The HP 37717B Option UH1, UH2 and URU Optical modules are classified
as Class
1 (non-hazardous) laser products. These products comply with the
United States Food and Drug Administration (FDA) Standard 21 CFR Ch.1
1040.10 and EN 60825.
To avoid exposure to hazardous laser radiation, it is recommended that the
following practices are observed during system operation:
ALWAYS DEACTIVATE THE LASER BEFORE CONNECTING OR
DISCONNECTING OPTICAL CABLES.
When connecting or disconnecting optical cables between the module and
device-under-test, observe the connection sequences given below.
Connecting :
Connect the optical cable to the input of the device-
under-test
before connecting to the module's Optical Out
connector.
Disconnecting : Disconnect the optical cable from the module's Optical Out
connector before disconnecting from the device-under-test.
Always ensure the shutter closes properly and covers the
laser aperture.
NEVER examine or stareinto the open
end of a broken, severed, or
disconnected optical cable when it is connected to the module's
Optical Out
connector.
Arrange for service-trained personnel, who are aware of the hazards involved,
to repair optical cables.
General Information 1-3
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Laser Warning Symbols
The optical module's front panel contains the followinglabel:
(CLASS 1 LASER PRODUCT]
This label indicates that the radiant energy present in this instrument is
non-hazardous.
ESD Precautions
Caution
The module contains components sensitive to electrostatic
discharge. To prevent component damage, carefully follow the
handling precautions presented below.
The smallest static voltage most people can feel is about
3500 volts. It takes
less than one tenth of that (about
300 volts) to destroy or severely damage
static sensitive circuits. Often, static damage does not immediately cause a
malfunction but significantly reduces the component's life. Adhering to the
following precautions will reduce the risk of static discharge damage.
Keep the module in its conductive storage box when not installed in the
Mainframe. Save the box for future storage of the module.
Before handling the module, select a work area where potential static sources
are minimized. Avoid working in carpeted areas and non-conductive chairs.
Keep body movement to a minimum. Hewlett-Packard recommends that you
use a controlled static workstation.
rn Handle the module by its front-panel. Avoid touching any components or
edge connectors. When you install the module, keep one hand in contact
with the protective bag as you pick up the module with your other hand.
Then, before installing the module, make contact with the metal surface
of the Mainframe with your free hand to bring you, the module, and the
mainframe to the same static potential.
This also applies whenever you
connect/disconnect cables on the fiont-panel.
1-4 General Information
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