HP Passport 1912nm Installation instructions

EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Monitors and Displays
Marketing Name / Model
[List multiple models if applicable.]
HP passport 1912nm 18.5-inch Internet Monitor
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
4
Batteries
All types including standard alkaline and lithium coin
or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
2
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
Power cord
1
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
0

EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1
#1 Bushing
Screw Driver
Description #2
#2 Crossing
Screw Driver
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Lay the Monitor on the desk.
2. Take out the base with finger.
3. Unlock 2 screws for VGA with #1 Bushing Screw Driver.
4. Release the stand arm down with thumb.
5. Unlock the 2 screws which fix the stand arm and Hinge with #2 Crossing Screw Driver.
6. Take the front bezel out.
7. Take the LVDs out
8. Take the panel out from the back cover assy.
9. Take the keypad out and unlocked the 11 screws which fixed the Power Board & I/F board &Arm Board and chassis
#2 Crossing Screw Driver.
10. Separated the connect and board.
11. Separated the chassis from the back cover with the shark tool.
12. Take the speakers out from the chassis with hand.
13. Take the 4 pcs VESA Cap out from the chassis with hand.
14. Unlock 2 screws from the hinge and back cover.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Issue Date:Dec 21, 2012
Initiator: Cook Lau
Action Tool
Lay the Monitor on the desk. N/A
Take out the base with finger N/A
Unlock 2 screws for VGA with screw
Driver. #1 Bushing Screw Driver
Release the stand arm down with thumb N/A
Unlock the 2 screws which fix the stand
arm and Hinge with screw driver. #2 Crossing Screw Driver
Take the front bezel out. N/A
Disassembly Flowchart for HP 1912nm Model
Photo

Take the LVDs out . N/A
Take the panel out from the back cover
assy. N/A
Take the keypad out and unlocked the
11 screws which fixed the Power Board
& I/F board &Arm Board and chassis. #2 Crossing Screw Driver
separated the connect and baord. N/A
Separated the chassis from the back
cover with the shark tool. N/A

Take the speakers out from the chassis
with hand. N/A
Take the 4 pcs VESA Cap out from the
chassis with hand. N/A
Unlock 2 screws from the hinge and
back cover, #2 Crossing Screw Driver

Page : 1 of 4
No.: F00024290-Ver.2
Chimei Innolux Corporation
No.3, Sec.1, Huansi Road, Tainan County,
Southern Taiwan Science Park 74147,
Taiwan
Subject : Lamp Assembly Disassembly order
Model : M185B1-L07
1. Separate the pcb protector film from the module
2.Remove 3 pcs screws.
3. Release the hooks around the module for remove the front metal frame
4. Separate the isolated film from the metal rear
PCB protector film
Isolated film

Page : 2 of 4
No.: F00024290-Ver.2
5.Remove wire fixing tape from lamp wire
6. Remove lamp wire from the housing.
7. Remove all hooks around the rear frame to separate housing.
Housing
Wire fixing tape
1.
2.
3.

Page : 3 of 4
No.: F00024290-Ver.2
8. Push up the upside film to remove film
9. Push up the side of LGP to remove LGP
10. Release the refector. from the rear frame.
LGP
Films
Reflector

Page : 4 of 4
No.: F00024290-Ver.2
11. Disassemble the lamp ASS’Y
12.Remove rubber cap from lamp
13. Remove lamp holder from metal rear
.
Lamp Asssy.
Rubber cap
Lamp holder