HP 5500-24G-SFP EI TAA Assembly instructions

Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
HP 5500-24G-SFP HI Switch w/2 Intf Slt(JG543A)
HP 5500-24G-SFP HI TAA Swch w/2Slt(JG681A)
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
1
Batteries
All types including standard alkaline and lithium coin
or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
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Tool Description
Tool Size (if
applicable)
Screw driver
2#
Tweezers
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Unscrew the screws for mounting angle 1, and then remove the mounting angle 1 from the rack.
2. Remove all of the labels.
3. Unscrew the screws on filler panel 2 and 3, and then remove them.
4. Unscrew the screws on top cover 4, and then remove it.
5. Unscrew the screws on PCB-assembly 5, and then remove the assembly.
6. Remove the light pipes 6,7,8,9 on the PCB-assembly 5.
7. Unscrew the screws on fans 10 and 11, remove them from chassis assembly 13.
8. Remove the front panel assembly 12 from chassis assembly 13.
9. Remove shielding fingers 3.1 from filler panel 3.
10. Unscrew the screws on part 5.1, remove it from PCB-assembly 5.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Figure 1Remove mounting angle Figure 2 Rear of HP 5500-24G-SFP HI Switch
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Template Revision B

3.3 Material of the facility built
Facility
Components
Material
Weight(g)
Weight
percentage
Selective treatment for materials
and components
Details
1
Fe
76
1.6%
Fe
recycling
2
Fe
50
1.1%
Fe
recycling
3
3.2
Fe
80
1.7%
Fe
recycling
4
Fe
1460
30.7%
Fe
recycling
5
5.1
Al
100
2.1%
Al
recycling
Figure 3Treatments to the product Figure 4Treatments to the filler panel 3
Figure 5Treatments to PCB-assembly
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5.2
Complex
PCB
1010
21.3%
The surface of PCB is greater
than 10 square centimeters;
6
PC
33
0.7%
Pla
recycling
10
PC
20
0.4%
11
PC
90
1.9%
12
PC+ABS
50
1.1%
Pla
recycling
13
Fe
1860
39.2%
Fe
recycling
4. Revised record
Date
Version
Author
Modify content
2012.11.20
V0
Wang Zitao
Initial version
2013.04.10
V1
Liu Baoquan
Add the module JG681A
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Template Revision B