HP ProCurve 745wl Assembly instructions

Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
ProCurve Acess Control Server 745wl (J9038A)
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA) With a surface greater than 10 sq cm 7
Batteries All types including standard alkaline and lithium coin
or button style batteries 1
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm Includes background illuminated displays with gas discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height 10
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
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2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Pozidriv screwdrivers 1Pt, 2Pt
Wire stripper/cutter n/a
Phillips screwdriver P0
Torx Screw Driver T-8
Flat scredriver 3/16"
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove front bezel panel by manually grasping left and right side of panel and pulling it out
2. Using a 1Pt pozidriv screwdriver, remove all 5 screws securing top cover to chassis.. Slighly slide back top cover to
release it from chassis. Remove cover.
3. Remove power supply by removing 4 pozidriv screws attaching power supply to back side of chasis (Use 2Pt pozidriv
screwdrive .
4. Remove 4 phillips screws (P0) on the power supply chassis and remove top plate.
5. Using a wire cutter cut off all internal cables from power supply.
6. Remove 4 Phillips screws (using a P1 screwdrive) attaching fan to power supply chassis. Remove fan.
7. Remove 2 phillips screws (using a P1 screwdriver) attaching power connector to power supply chassis. Remove
connector.
8. Unscrew 4 Posidriv screws attaching Power Supply main PCA to Power Supply Chassis. Remove PCA
9. Remove large electrolitic capacitor from Power Supply main PCA.
10. Remove Hard Disk drive assemply bracket by removing 4 Posidriv screws (1pt) attaching bracket to main chassis
11. Disconnect or cut cables going to Hard Disk Assembly
12. Remove 4 Phillips screws (use P1 screwdriver) attaching hard disk to hard disk mounting bracket. Remove Hard disk
13. Unscrew 4 Torx screws (use T-8 screw driver) attaching small PCA to bottom of Hard Disk
14. Remove 4 phillips screws (P1) from back side of main chassis attaching fan assembly to chassis. Remove additional
24 phillips screws (using P1 screwdriver) attaching all three fans to fan mounting bracket and fan screens
15. Using a 3/16" flat screwdriver, unscrew and remove 2 screws attaching large heat sink to mother board. remove heat
sink. Remove fan attached to heat sink by unscrewing 4 phillips screws. Use a P0 screwdriver. Cut wires from heatsink
to mother board.
16. Remove 4 Pozidriv screws attaching small PCA LCD assembly to the front main chassis. Access screws from the
inside of chassis. Use 1Pt screwdriver. Cut off wires. Remove PCA.
17. Remove 12 Pozidriv screws attaching mother board to chassis. Use a 2Pt screwdriver. Remove Main PCA
motherboard. Remove 8 large capacitors from mother board. Cut off or disconnect all wires going to mother
board.Remove the 2 small memory boards (PCAs).
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3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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