bit error that occurs within a single DRAM chip. Both x4 and x8 SDDC are supported (x8 requires
lockstep mode).
Memory online spare mode (also known as rank spare mode) detects a rank that is degrading and
switches operation to the spare rank.
Memory demand and patrol scrubbing to prevent accumulation of correctable errors and reducing
the likelihood of unplanned downtime.
Failed DIMM isolation improves the service time thus improving the overall system availability.
Address parity protection available on RDIMMs and LRDIMMs detects address bit errors to improve
service time and overall system availability.
Mezzanine options and I/O
Support for one (2) FlexibleLOMs, providing four (4) (i.e. redundant) Ethernet ports
Multiple mezzanine I/O expansion slots that support a wide variety of mezzanine cards each
supporting multiple data paths routed to redundant interconnect modules.
Network Adapter Teaming (bonding) provides network fault tolerance, transmit load balancing,
and switch-assisted load balancing.
Storage
Four (4) Small Form Factor hot-plug SAS/SATA HDD or SSD drive bays.
Choice of the HP Smart Array P246br Controller with 1GB FBWC/HP or the HP B140i (chipset
SATA). RAID 0 and 1 support for both storage controller offerings.,
Optional dual-port Fibre Channel mezzanine card(s) for redundant SAN connections.
Processor/Chipset
Processor internal sensors & thermal control protection against over-temperature conditions.
Cache parity/ECC protects cache data from accidental data corruption.
Machine Check Architecture (MCA) detects and captures hardware errors such as system bus,
memory ECC, parity, and cache, and improves service time.
Intel® QPI Protocol Protection allows detection of data errors using a checksum of 8-bits.
Core Disable for FRB (fault resilient boot) allows a system to power-on despite a failing core-pair.
It uses BIST (built-in self test) results to detect a failure and disables the target core-pair upon
subsequent boot.
Server Blade Enclosure Infrastructure
Pooled power for true N+N power redundancy through up to six (6) hot-plug, high-efficiency,
common slot enclosure-based power supplies (configuration dependent).
Up to ten (10) enclosure-based hot-plug HP Active Cool fans that scale to meet future demands,
optimize airflow, reduce power draw, and improve acoustic performance.
Dual grid power providing redundant rack enclosure power feeds to the server blade enclosure.
HP Dynamic Power Saver Mode monitors the total enclosure power consumption in real time and
automatically adjusts with change in demand for improved efficiency and reliability.HP Dynamic
Power Capping safely limits power usage without impacting performance by capping peak usage
instead of average power usage, removes risk to electrical infrastructure with a fast-acting,
hardware-based capping algorithm, and reclaims more power by dynamically controlling power
limits based on workload demand.
Up to eight interconnect modules per server blade enclosure providing four simultaneous
redundant fabrics for FlexFabric, Virtual Connect Ethernet, Fibre Channel, InfiniBand, Pass Thru
Ethernet, etc.
Enclosure crosslinks between adjacent enclosures to provide interconnect module-to-module
connections or as Virtual Connect module stacking links.
Optional enclosure redundant Onboard Administrator system management module.