HP ProLiant DL380 Gen10 Plus Installation instructions

MF877-00 Page 1
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category
: Servers
Marketing Name / Model
[List multiple models if applicable.]
HPE ProLiant DL380 Gen10 Plus
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by
Directive 2012/19/EU of the European Parliament and of the Council on Waste Electrical and Electronic Equipment
(WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
8
Batteries
All types including standard alkaline and lithium
coin or button style batteries
2
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
14
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0

MF877-00 Page 2
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Item Description Notes
Quantity
of items
included
in product
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Torx driver
T15
Phillips screwdriver
#2
Flathead screwdriver
Medium
Socket screwdriver
5 mm / 8 mm
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove top cover of systems by hood latch.
2. Remove Fan cage module, Air baffle and Riser cage from system.
3. Remove lithium battery from the system by medium flat head screw driver.
4. Remove Mega-cell HSTNS-BB05 from the system
5. Use Torx driver with T15 to unlock screws and remove bracket with PCA from LFF system \ remove HDD cage with
PCA from SFF system.
6. Remove the Power supply(s) from system.
7. Use Torx driver with T15 to unlock thumbscrew and remove the System board with tray from system.
8. Riser cage : Use Torx driver with T15 to unlock screws and Remove the riser card (PCA)
9. bracket with PCA : Use Torx driver with T15 to unlock screws and remove HDD BP (PCA) from bracket [LFF system]
HDD cage with PCA : Use Torx driver with T15 to unlock screws and remove HDD BP (PCA) from HDD cage [SFF
system]
10. System board with tray : Use Torx driver with T15, 5 mm socket screwdriver and 8 mm socket screwdriver to unlock
screws to remove System board (PCA) from tray.
11. Power supply(s) : Remove Capacitors > 2.5CM of the power supply(s) from the system. With #2 Philips screw driver
remove the screws securing the top cover and the heatsinks in the P/S then locate the capacitors and pry from the
PCB with a medium flat head screw driver and dispose of properly.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

MF877-00 Page 3
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
1. Remove top cover of systems by hood latch.
2. Remove Fan cage module, Air baffle and Riser cage from system.
1. Remove top cover of systems.

MF877-00 Page 4
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
3. Remove lithium battery from the system by medium flat head screw driver.
4. Remove Mega-cell HSTNS-BB05 from the system

MF877-00 Page 5
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
5_a. Use Torx driver with T15 to unlock screws
5_b. Remove bracket with PCA from LFF system \ Remove HDD cage with PCA from SFF system.
6. Remove the power supply(s) from system.

MF877-00 Page 6
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
7_a. Use Torx driver with T15 to unlock thumbscrew.
7_b. Remove the system board with tray from system.

MF877-00 Page 7
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
8_a. Use Torx driver with T15 to unlock screws.
8_b. Remove the riser card (PCA)
2. Remove Fan cage module and Riser cage from system.

MF877-00 Page 8
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
9_a. Use Torx driver with T15 to unlock screws.
9_b. Remove HDD BP (PCA) from bracket [LFF system] \ Remove HDD BP (PCA) from HDD cage [SFF
system].

MF877-00 Page 9
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
10_a. Use Torx driver with T15, 5 mm socket screwdriver and 8 mm socket screwdriver to unlock screws.
10_b. Remove System board (PCA) from tray.

MF877-00 Page 10
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
10_a. Use Torx driver with T15, 5 mm socket screwdriver and 8 mm socket screwdriver to unlock screws.
10_b. Remove System board (PCA) from tray.
Remove Electrolytic Capacitors (C801: 25mm*55mm and C237, C238, C241:10mm*25mm) from power
supply HSTNS-PD40, HSTNS-PD40-1.

MF877-00 Page 11
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Remove Electrolytic Capacitor(C102:25mm*25mm) from HSTNS-PL40, HSTNS-PL40-1
Remove Electrolytic Capacitor (BC1: 25mm*60 mm and C106/C107/C108 10mm*25mm)
from power supply HSTNS-PC40, HSTNS-PC40-1.

MF877-00 Page 12
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Remove Electrolytic Capacitor (C801:25mm*60mm and C237/C238/C241:10mm*25) from power supply HSTNS-
PD41, HSTNS-PD41-1.
Remove Electrolytic Capacitor (C102:30mm*30mm) from power supply HSTNS-PL41, HSTNS-PL41-1.

MF877-00 Page 13
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Remove Electrolytic Capacitor (BC1: 25mm*60 mm and C106/C107/C108: 10mm*25mm) from power supply
HSTNS-PC41, HSTNS-PC41-1.
Remove Electrolytic Capacitor (C801: 25mm*60mm and C212/C233/C238: 10mm*25mm) from power supply
HSTNS-PD44, HSTNS-PD44-1.

MF877-00 Page 14
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Remove Electrolytic Capacitor (C102:30mm*30mm) from power supply HSTNS-PL45, HSTNS-PL45-1.
Remove Electrolytic Capacitor (C101,C105,C106,C114,C115: 8mm*20mm) from power supply HSTNS-PL46-1.

MF877-00 Page 15
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Remove Electrolytic Capacitor from power supply HSTNS-PF46-1.
Remove Electrolytic Capacitors (C201,202: 10mm*38.5mm, C200: 26mm*43mm , C250,251: 13mm*50mm) from
power supply HSTNS-PR62.

MF877-00 Page 16
Template Revision C, 30-July-2018
Copyright 2018 Hewlett Packard Enterprise Development LP
HPE instructions for this template are available at MF877-01
Remove Electrolytic Capacitor (C102:30mm*30mm) from power supply HSTNS-PL62.
Remove Electrolytic Capacitor (C12:1.60mm*25mm, C328:18mm*30mm) from power supply HSTNS-PD70.