HQ K455 Technical specifications

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V1.0
Technical Document
Technical Document Name: Model K455 Mobile Phone Maintenance Instructions
Technical Document No.:
Version: V1.0
23 Pages
(Including front cover)
MadeBy: TanRiping
CheckedBy:
CountersignedBy:
StandardizedBy:
ApprovedBy:
Shanghai HuaQin Telecom Technology CO., Ltd.
Amendment Record:
Document No. Version Made or
Revised by
Date
of Making or
Amendment
Reasons for
Amendment
Main
Amendment
Contents(Only
showmain oints)
V1.0 Tan Riping 2009/08/27 None None
Note 1: Fill this table when documents are amended and filed every time.
Note 2: The answers for the columns of Reasons for Amendment and Main Amendment Contents should
be NONE when the document is firstly filed.

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V1.0
Contents
1AssemblyandDisassemblyInstructions 3
1.1AttachedDrawingofComplete-machineAssemblyProcess 3
1.2DisassemblyInstructions 8
2CommonFailuresAnalysisandTroubleshootingFlowChart 8
2.1FailuresonStructuralElements 9
2.2Non-startingupFailure 9
2.3Non-ringingFailure 10
2.4 Abnormal Displaying on LCD 11
2.5AbnormalCharging 12
2.6AbnormalPhoto-takingandVideo-making 13
2.7Non-recognizingSIMCard 14
2.8NoReplyorUnabletoRecordSound(withRinging) 15
2.9FailureonPushNumberKey 16
2.10FailureonPushFunctionKey 17
2.11 No-receiving or Silent Speaker 18
2.12Non-vibrationorAbnormalVibration 19
2.13NoReceivingRadio 20
2.14NoBluetooth 21
2.15Nosignal 22
2.16Non-recognizingTCard 23
2.17FailureonEarphone 24
2.18SlideInvalid 25

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V1.0
1 Assembly and Disassembly Instructions
1.1 Attached Drawing of Complete-machine Assembly Process
（1） take screw Cover、RF Cover、Battery cover
screw Cover and RF Cover Directly to the upturned，Be careful not to scratch
the shell。remove the battery cover
（2） demolition of screws
Removal of four screws
（3） demolition D Shell
Screw removal，See the left picture，Remove D Shell Shown to the right
battery cover
screw Cover
RF cover

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（4） Demolition Main board
first Relax Card Hook，The Main board and C Shell Separation，Shown to
the right，Gently moving card hook，The master FPC motherboard removal。
（5） Demolition See the left picture，In accordance with the direction of the arrow，Shall
SIM Card separated，SIM card connector PCBAWelded Demolition
（6） Demolition GSM Antenna and Bluetooth antenna
See the left picture，First of all demolition GSM antenna screws and Bluetooth
antenna screws，Bluetooth antenna will automatically be demolished，
GSM antenna screws can also be directly from the motherboard removal。
hook
GSM antenna screws
Bluetooth antenna
Bluetooth antenna
Bluetooth antenna

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（7） Demolition MIC and Motor
Iron Melting MIC and Motor Pad On Solder，Demolition MIC and Motor。
（8） Demolition Number keys DOME
First, the number buttons on the removal of conductive foam，And then gently removed to expose the
motherboard DOME
（9） Demolition C Shell、Steel、Number keys
First, the demolition of the number keys on the C shell，Demolition four screws，Shrapnel Automatic
Shedding，Last Demolition C Shell Main FPC
Motor Pad

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（10） Demolition B Shell
See the left picture，First of all demolition B shell screw cap，And then demolition B Shell
the of the two screws，Reference picture gently moving the demolition B shell。
（11） Demolition Slide
See the Next picture，4 Slide screw Demolition，Slide the final demolition.
B Shell Screw cap

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（12） Demolition Keyboard Stand and Magnet
See the left picture, According to the arrow direction, gently moving, removal of the keyboard bracket；
Then, Demolition Keyboard Stand Back Magnet
（13） Demolition Main FPC
See the left picture，First Gently Demolition FPC Conductive Fabric，See the Right
picture，Arrow Direction，And then gently moving cable buckle，Demolition Main FPC。
Please note that during assembly the connection direction of UB and MB.
（14） Demolition UB PCBA、Function keys
First, the camera connector releasable buckle，camera and Speaker Demolition，Demolition
function keys from behind，UB PCBA Demolition，Demolition when the camera FPC
Note: FPC on camera gum.
Magnet
Conductive Fabric

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（15） Demolition camera and Speaker
See the Right picture，Iron melting camera pad, plus tin, and then drag, demolition camera。See the left
picture，Facing the speaker pads, direct the demolition speaker.
（16） Demolition LCD
Along the edge of LCD，one side of lcd is not smooth，Camera directly to the demolition。
1.2 Assembly Instructions
Assembly process is opposite to Disassembly process
Camera pad
Speaker pad

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2 Common mistakes analysis flow chart
2.1 Mechanical mistakes
Please refer to the Uninstall processing change the parts.
2.2 Non-starting up Failure
Mark the failure
mainborad & Reference
to the maintenance
manual of the mainboard
Check the battery mounted correctly&
battery voltage >3.4V?
Failure to starting
up
OK
YE
S
Properly Re-mount it
& charge the battery
Check If the LCD and the mainboard are
connected correctly
YE
S
Re-weld the LCD
connector
NO
Replace with the new LCD Replace with the new
lcd & mark the failure
lcd
Download the SW
Pay attention to
retained the
calibration data
Replace with the new mainboard
YE
S
NO
YE
S
NO
YE
S
NO
YE
S

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V1.0
2.3 Non-ringing Failure
Check if the speaker wires are in
poor solder
Non-ringing
OK
YES
Re-weld the
Speaker
Replace with a new speaker
NO
Replace with a
new one & Mark
the failure
Speaker
YES
Check if the speaker circuit short circuit
or open circuit
Repair it
Referring to the
maintenance manual
of the mainboard
Replace with the new mainboard
Mark the failure
mainborad & Reference
to the maintenance
manual of the mainboard
YES
NO
YES
NO
YES

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2.4 Abnormal Displaying on LCD
Check If the lcd be damaged
Abnormal LCD
Display
OK
YES
Replace with new
LCD
Check if the lcd connector in poor solder
NO
Weld the lcd
connector
YES
Check If the LCD is intervened with the
Mechanical part Re-mount the lcd
Replace with the new mainboard Reference to the
maintenance manual of
the mainboard
NO
YES
YES
NO
YES

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2.5 Abnormal Charging
Replace with the new battery or charger
Abnormal Charging
OK
YES
Change the battery
or charger
Check if the charger connector in poor
solder
NO
Weld the connector
YES
Repair the charging circuit of
the mainboard
Repair it Reference to
the maintenance
manual of the
mainboard
Replace with the new mainboard Reference to the
maintenance manual of
the mainboard
NO
YES
YES
NO
YES

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V1.0
2.6 Abnormal photo
Camera FPC damage
Abnormal photo
OK
YES
Change camera
Camera FPC not solder correctly on UB
NO
Assembly again
YES
Replace with the new mainboard Reference to the maintenance
manual of the mainboard
NO
YES
YES
Link FPC damage Change Link FPC
YES
NO
Check the camera circuit
NO
YES Reference to the maintenance
manual of the UB mainboard

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V1.0
2.7 Non-recognizing SIM Card
If the SIM card is inserted correctly
Non-recognizing sim
card
OK
YES
Change the SIM card
Check if the SIM connector has poor
solder
NO
Re-weld the SIM
connector
YES
Check if the sim circuit i s
damaged
Repair it Reference
to the maintenance
manual of the
mainboard
Replace with the new mainboard Reference to the
maintenance manual of
the mainboard
NO
YES
YES
NO
YES

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V1.0
2.8 No Reply or Unable to Record Sound (with Ringing)
Check if the mic is in poor solder
No Reply or Unable to Record
Sound(with Ringing)
OK
YE
S
Re-weld or change
the MIC
Check if the mic hole be stoppaged
NO
Clean the mic hole
YE
S
Check if the mic circuit is damaged
Repair it
Referencetothe
maintenance manual
of the mainboard
Replace with the new mainboard Referencetothe
maintenance manual of
the mainboard
NO
YE
S
YE
S
NO
YE
S

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V1.0
2.9 Failure on numeric keypad
Check if the demo is placed correctly or if
there is any foreign material on its surface
Failure of the
numeric keypad
OK
YES
Re-mount or clean it
Check if the sidekey in poor solder or
short circuit
NO
Re-weld or clean it
YES
If the structure is intervened with the
sidekey Re-mount the sidekey
Replace with the new mainboard Reference to the maintenance
manual of the mainboard
NO
YES
YES
NO
YES
Check if the keypad circuit is damaged Repair it Reference to the
maintenance manual of the
mainboard
YES
NO

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V1.0
2.10 Failure on functional keypad
Check if the demo is placed correctly or if
there is any foreign material on its surface
Failure of the
functional keypad
OK
YES
Re-mount or clean it
Check if the sidekey in poor solder or
short circuit
NO
Re-weld or clean it
YES
If the structure is intervened with the
sidekey Re-mount the sidekey
Replace with the new mainboard Reference to the maintenance
manual of the mainboard
NO
YES
YES
NO
YES
Check if the keypad circuit is damaged Repair it Reference to the
maintenance manual of the
mainboard
YES
NO

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V1.0
2.11 No Receiving Radio or Silent Speaker
Check if the receiver is in poor solder
No Receiving
OK
YES
Re-weld the receiver
Replace with the new Receiver
NO
Change the Receiver
YES
Replace with the new mainboard Reference to the maintenance
manual of the mainboard
NO
YES
YES
Check if the receiver circuit is damaged Repair it Reference to the
maintenance manual of the
mainboard
YES
NO

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V1.0
2.12 Abnormal vibrate or no vibrate
Check if the Moto is in poor solder
Abnormal vibrate or
no vibrate
OK
YES
Re-weld the MOTO
Replace with the new MOTO
NO
Change the MOTO
YES
Replace with the new mainboard Reference to the maintenance
manual of the mainboard
NO
YES
YES
Check if the MOTO circuit is damaged Repair it Reference to the
maintenance manual of the
mainboard
YES
NO

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V1.0
2.13 No receiving of headset Radio
Check if the headset is damaged
No receiving of headset Radio
OK
YES
Repair the headset
or change w i t h a
new one
Check if the headset connector of the
mainboard is in poor solder
NO
Re-weld the
connector
YES
Replace with the new mainboard Referencetothe
maintenance manual of
the mainboard
NO
YES
YES
Check if there is any foreign body in the
connector Clean the foreign body
YES
NO
Check the headset circuit in the
mainboard
NO
YES Repair it Reference to the
maintenance manual of
the mainboard