Table 3. Additional system parts (continued)
Index
number Part number Units per assembly Description
17 M393A1G40DB0-
CPB
16 8 GB, 2133 MHz 1RX4 DDR4 RDIMM (Samsung Electronics
Co., Ltd.)* (8001-12C)
17 M393A2G40DB0-
CPB
16 16 GB, 2133 MHz 2RX4 DDR4 RDIMM (Samsung Electronics
Co., Ltd.)* (8001-12C)
17 M393A4K40BB0-CPB 16 32 GB, 2133 MHz 2RX4 DDR4 RDIMM (Samsung Electronics
Co., Ltd.)* (8001-12C)
17 HMA41GR7AFR4N-
TF
16 8 GB, 2133 MHz 1RX4 DDR4 RDIMM (SK hynix, Inc.)*
(8001-12C)
17 HMA42GR7AFR4N-
TF
16 16 GB, 2133 MHz 2RX4 DDR4 RDIMM (SK hynix, Inc.)*
(8001-12C)
17 HMA84GR7MFR4N-
TFT1
16 32 GB, 2133 MHz 2RX4 DDR4 RDIMM (SK hynix, Inc.)*
(8001-12C)
17 MEM-DR480L-HL02-
ER21,
MEM-DR480L-SL01-
ER21, or
MEM-DR480L-CL03-
ER24
16 8 GB, 2133 MHz 2RX4 DDR4 ISRDIMM (Super Micro
Computer, Inc.)* (8005-12N)
17 MEM-DR416L-CL03-
ER24,
MEM-DR416L-SL01-
ER21, or
MEM-DR416L-HL02-
ER21
16 16 GB, 2133 MHz 2RX4 DDR4 ISRDIMM (Super Micro
Computer, Inc.)*
18 SSD-DM064-PHI 2 64 GB SATA drive on module (DOM) (8001-12C)
18 SSD-DM064-
SMCMVN1
2 64 GB SATA drive on module (DOM) (8005-12N)
18 SSD-DM128-
SMCMVN1
2 128 GB SATA drive on module (DOM) (8001-12C)
19 MBD-P8DTU-1U-
IB001,
MCP-74Y4912-IB001,
and
MCP-01AF132-IB001
1 System backplane kit (includes system backplane, tray, and
vacuum pen)
Note: You must order all three part numbers to receive all of
the kit contents.
20 14 Screws
21 CPU-KIT-00E4887-
IB001
2 8 core 2.328 GHz system processor module kit (includes
system processor, tray, and vacuum pen) (8001-12C)
CPU-KIT-01EM061-
IB001
2 10 core 2.095 GHz system processor module kit (includes
system processor, tray, and vacuum pen)
22 SNK-P0052P-IB001 2 Heat sink kit (includes heat sink and thermal interface
material)
*All of the memory in a 8001-12C system must be the same size and from the same supplier. The
8001-12C system does not support mixing different sizes of memory or mixing memory from different
suppliers. All of the memory in a 8005-12N system must be the same size and from the same supplier.
The 8005-12N system does not support mixing different sizes of memory or mixing memory from
different suppliers.
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