IBM RS/6000 SP Setup guide

RS/6000 SP IBM
Maintenance Information Volume 2,
Maintenance Analysis Procedures
GA22-7376-01

RS/6000 SP IBM
Maintenance Information Volume 2,
Maintenance Analysis Procedures
GA22-7376-01

Note!
Before using this information and the product it supports, be sure to read the general information under “Notices” on page ix.
Second Edition (February 1999)
This is a major revision of GA22-7376-00.
This edition applies to the IBM RS/6000 SP Systems, Version 3 Release 1 of IBM Parallel System Support Programs for AIX
(5765-529), which runs on IBM RS/6000 SP, and to all subsequent releases and modifications until otherwise indicated in new edi-
tions.
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 Copyright International Business Machines Corporation 1994, 1999. All rights reserved.
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Contents
Notices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ix
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ix
Safety Notices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . x
Personal ESD Requirements ........................................... x
Electronic Emissions Notices ......................................... xi
Federal Communications Commission (FCC) Statement ........................... xi
European Union (EU) Statement ......................................... xi
United Kingdom Telecommunications Safety Requirements ......................... xi
Notice to Customers .............................................. xi
Industry Canada Compliance Statement .................................... xii
For Installations in Japan: ............................................ xii
Electromagnetic Interference (EMI) Statement - Taiwan ........................... xii
Radio Protection for Germany .......................................... xii
About This Book ................................................. xv
Who Should Use This Book ............................................ xv
User's Responsibilities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xv
How to Use This Book ............................................... xv
Getting More Information ............................................. xvi
Summary of Changes ............................................. xvii
GA22-7376-00 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xvii
GA22-7376-01 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xvii
Chapter 1. Maintenance Analysis Procedures (MAPs) ......................... 1-1
Safety Notices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
Lockout Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
Lockout Procedure for SEPBU ....................................... 1-2
Lockout/Tagout Procedure for PDU ..................................... 1-2
Lockout/Bagout Procedure for PDU ..................................... 1-3
MAP 0100: Start of Service Call ...................................... 1-4
MAP 0110: Supervisor Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10
MAP 0120: Supervisor Bus Problem ................................... 1-19
MAP 0130: Processor Node . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-30
MAP 0140: Thin Node/Thin Node 2 Environment ........................... 1-50
MAP 0150: 120/160 MHz Thin Node Environment ........................... 1-60
MAP 0160: Thin Processor Node Power ................................ 1-69
MAP 0170: Thin Processor Node Control ................................ 1-74
MAP 0180: Thin Processor Node dc Short/Open ........................... 1-84
MAP 0190: Processor Node Function .................................. 1-87
MAP 0200: Processor IPL Problem ................................... 1-94
MAP 0210: Wide Processor Node Environment ............................ 1-98
MAP 0220: Wide Processor Node Power ................................ 1-105
MAP 0230: Wide Processor Node Control ............................... 1-110
MAP 0240: Wide Processor Node dc Short/Open ........................... 1-120
MAP 0250: 604 or 604e High Node Environment ........................... 1-124
MAP 0260: 604 or 604e High Node Power ............................... 1-130
MAP 0270: 604 or 604e High Node Control .............................. 1-135
MAP 0280: 604 or 604e High Node Minimum Configuration ..................... 1-145
 Copyright IBM Corp. 1994, 1999 iii

MAP 0290: 332 MHz SMP Node Environment ............................. 1-160
MAP 0300: 332 MHz SMP Node Power ................................ 1-169
MAP 0310: 332 MHz SMP Node Control ................................ 1-177
MAP 0320: 332 MHz SMP Node Minimum Configuration ....................... 1-186
MAP 0330: POWER3 SMP Thin and Wide Node Environment ................... 1-191
MAP 0340: POWER3 SMP Thin and Wide Node Power ....................... 1-200
MAP 0350: POWER3 SMP Thin and Wide Node Control ...................... 1-208
MAP 0360: POWER3 SMP Thin and Wide Node Minimum Configuration ............. 1-217
MAP 0370: Main Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-222
MAP 0380: Power Distribution Unit (PDU) ............................... 1-225
MAP 0390: Supervisor Power Problem ................................. 1-229
MAP 0400: Supervisor Power 12 V dc Problem ............................ 1-237
MAP 0410: Supervisor Power 24 V dc Problem ............................ 1-244
MAP 0420: Main Power Switch ...................................... 1-247
MAP 0430: dc Power Loss from Bulk dc Power Supply(s) ...................... 1-250
MAP 0440: Short in 48 V dc Power Distribution ............................ 1-257
MAP 0450: Frame Environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-262
MAP 0460: Scalable Electrical Power Base Unit (SEPBU) ...................... 1-265
MAP 0470: SEPBU Power Control Interface .............................. 1-280
MAP 0480: Open in 48 V dc Distribution ................................ 1-283
MAP 0490: Network Problem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-286
MAP 0500: Ethernet LAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-288
MAP 0510: Switch Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-294
MAP 0520: Switch Assembly Environment ............................... 1-301
MAP 0530: Switch Assembly Power ................................... 1-313
MAP 0540: Switch Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-322
MAP 0550: Dependent Node . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-351
MAP 0560: Block Multiplexer Channel Adapter (BMCA) ....................... 1-353
MAP 0570: End of Call .......................................... 1-357
MAP 1520: Main Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-359
MAP 1540: Minimum Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-360
Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . X-1
iv RS/6000 SP MAPs

Figures
1-1. 8-LED Frame Supervisor Card LEDs ............................... 1-11
1-2. RS/6000 SP Supervisor Subsystem Diagram (PDU) ...................... 1-12
1-3. RS/6000 SP Supervisor Subsystem Diagram (SEPBU) .................... 1-13
1-4. High Node Supervisor Card LEDs ................................. 1-31
1-5. 332 MHz SMP Node Supervisor Card LEDs ........................... 1-32
1-6. POWER3 SMP Node Supervisor Card LEDs .......................... 1-32
1-7. Thin Node High Level Diagram .................................. 1-40
1-8. Thin Node 2 High Level Diagram ................................. 1-41
1-9. 120 and 160 MHz Thin Node High Level Diagram ....................... 1-42
1-10. Wide Node High Level Diagram .................................. 1-43
1-11. 604 or 604e High Node High Level Component Diagram ................... 1-44
1-12. 332 MHz SMP Node High Level Component Diagram ..................... 1-45
1-13. POWER3 SMP Thin and Wide Node High Level Component Diagram ............ 1-46
1-14. Thin Node Supervisor Control Cable ............................... 1-54
1-15. 120 or 160 MHz Thin Node Supervisor Control Cable ..................... 1-63
1-16. Wide Node Supervisor Control Cable ............................... 1-102
1-17. Rear View of Power Distribution Unit ............................... 1-222
1-18. Rear View of Scalable Electrical Power Base Unit ....................... 1-223
1-19. Front View of 49-Inch Frame Locations .............................. 1-223
1-20. RS/6000 SP PDU Power Diagram ................................. 1-226
1-21. Wiring Diagram of RS/6000 SP Power Distribution Unit .................... 1-228
1-22. PDU Supervisor Power + 12 V dc Diagram ........................... 1-237
1-23. PDU + 24 V dc Circuit Diagram .................................. 1-244
1-24. PDU + 24 V dc Circuit Diagram .................................. 1-247
1-25. PDU + 48 V dc Power Diagram .................................. 1-250
1-26. PDU 48 Volts Distribution Diagram ................................ 1-257
1-27. SEPBU Power Diagram ....................................... 1-267
1-28. Typical Ethernet TTP Topology .................................. 1-289
1-29. High Performance Switch (HiPS) Assembly High-Level Diagram ............... 1-296
1-30. Scalable POWERparallel Switch (SPS) Assembly High-Level Diagram ........... 1-297
1-31. HiPS Wrap Plugs .......................................... 1-299
1-32. SPS Wrap Plugs ........................................... 1-300
1-33. HiPS Switch Supervisor Control Cable .............................. 1-305
1-34. SPS Inner Chassis and Front Chassis Cables .......................... 1-306
1-35. Switch Connectivity Diagram .................................... 1-320
1-36. HiPS 2.0 Interposer ......................................... 1-320
1-37. BMCA Cabling to Single Processor Node ............................ 1-353
1-38. BMCA Cabling to Multiple Processor Nodes ........................... 1-355
 Copyright IBM Corp. 1994, 1999 v

vi RS/6000 SP MAPs

Tables
1-1. 8-LED Frame Supervisor LED Definitions ............................ 1-10
1-2. 4-LED Frame Supervisor LED Definitions ............................ 1-11
1-3. 604 or 604e High Node LED Definitions ............................. 1-30
1-4. 332 MHz SMP Node LED Definitions ............................... 1-31
1-5. POWER3 SMP Node LED Definitions .............................. 1-32
1-6. SP Processor Nodes and Their Functionally Equivalent RS/6000 Models .......... 1-33
1-7. Cable Continuity Check Points ................................... 1-78
1-8. Cable Continuity Check Points ................................... 1-114
1-9. Inner Chassis Cable Continuity .................................. 1-318
1-10. Front Chassis Cable Continuity .................................. 1-318
1-11. HiPS Error Conditions ........................................ 1-324
1-12. SPS Error Conditions ........................................ 1-327
1-13. Service Request Number (SRN) Table for Switch Adapters .................. 1-332
1-14. Proper Serial Number to Record .................................. 1-358
 Copyright IBM Corp. 1994, 1999 vii

viii RS/6000 SP MAPs