
Contents
Notices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ix
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ix
Safety Notices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . x
Personal ESD Requirements ........................................... x
Electronic Emissions Notices ......................................... xi
Federal Communications Commission (FCC) Statement ........................... xi
European Union (EU) Statement ......................................... xi
United Kingdom Telecommunications Safety Requirements ......................... xi
Notice to Customers .............................................. xi
Industry Canada Compliance Statement .................................... xii
For Installations in Japan: ............................................ xii
Electromagnetic Interference (EMI) Statement - Taiwan ........................... xii
Radio Protection for Germany .......................................... xii
About This Book ................................................. xv
Who Should Use This Book ............................................ xv
User's Responsibilities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xv
How to Use This Book ............................................... xv
Getting More Information ............................................. xvi
Summary of Changes ............................................. xvii
GA22-7376-00 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xvii
GA22-7376-01 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xvii
Chapter 1. Maintenance Analysis Procedures (MAPs) ......................... 1-1
Safety Notices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
Lockout Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
Lockout Procedure for SEPBU ....................................... 1-2
Lockout/Tagout Procedure for PDU ..................................... 1-2
Lockout/Bagout Procedure for PDU ..................................... 1-3
MAP 0100: Start of Service Call ...................................... 1-4
MAP 0110: Supervisor Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10
MAP 0120: Supervisor Bus Problem ................................... 1-19
MAP 0130: Processor Node . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-30
MAP 0140: Thin Node/Thin Node 2 Environment ........................... 1-50
MAP 0150: 120/160 MHz Thin Node Environment ........................... 1-60
MAP 0160: Thin Processor Node Power ................................ 1-69
MAP 0170: Thin Processor Node Control ................................ 1-74
MAP 0180: Thin Processor Node dc Short/Open ........................... 1-84
MAP 0190: Processor Node Function .................................. 1-87
MAP 0200: Processor IPL Problem ................................... 1-94
MAP 0210: Wide Processor Node Environment ............................ 1-98
MAP 0220: Wide Processor Node Power ................................ 1-105
MAP 0230: Wide Processor Node Control ............................... 1-110
MAP 0240: Wide Processor Node dc Short/Open ........................... 1-120
MAP 0250: 604 or 604e High Node Environment ........................... 1-124
MAP 0260: 604 or 604e High Node Power ............................... 1-130
MAP 0270: 604 or 604e High Node Control .............................. 1-135
MAP 0280: 604 or 604e High Node Minimum Configuration ..................... 1-145
Copyright IBM Corp. 1994, 1999 iii