IEI Technology WAFER-LX2-800 User manual

WAFER-LX2 3.5” Embedded SBC
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IEI Technology Corp.
User Manual
WAFER-LX2-800 3.5” SBC
MODEL:
WAFER-LX2-800
AMD GeodeLX 800 3.5" Single Board Computer
Eight serial ports, Audio, PC/104 Expansion and
supports CompactFlash® and IDE
Rev. 1.22 – 14 February, 2011

WAFER-LX2 3.5” Embedded SBC
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Revision
Date Version Changes
14 February, 2011 1.22 Modified COM2 Function Select Jumper (JP3) settings
7 April, 2010 1.21 Modified COM1 Pin 9 Jumper (JP1) and COM2 Function Select Jumper (JP3)
settings
11 May, 2009 1.20 Released as WAFER-LX2_UMN_v1.20 for WAFER-LX2-800-R12
09 September, 2009 1.11 Released as WAFER-LX2_UMN_v1.11
•Updated RJ-45 Ethernet pinouts
15 August, 2008- 1.10 Released as WAFER-LX2_UMN_v1.10
•Added JP7 for CF card slave/master control
•Changed address mapping images.
15 August, 2007 1.01 Released as WAFER-LX2_UMN_v1.01
•Corrected Section 5.6.4: Four Serial Port Connector Cable installation
•Added “Appendix G: HAZARDOUS MATERIALS DISCLOSURE”
15 November, 2006 1.0 Initial release (Released as WAFER-LX2_UMN_v1.0)

WAFER-LX2 3.5” Embedded SBC
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Manual Conventions
WARNING!
Warnings appear where overlooked details may cause damage to the equipment or result
in personal injury. Warnings should be taken seriously. Warnings are easy to recognize.
The word “warning” is written as “WARNING,” both capitalized and bold and is followed by
text. The text is the warning message. A warning message is shown below:
WARNING:
This is an example of a warning message. Failure to adhere to warning
messages may result in permanent damage to the WAFER-LX2 or
personal injury to the user. Please take warning messages seriously.
CAUTION!
Cautionary messages should also be heeded to help reduce the chance of losing data or
damaging the WAFER-LX2. Cautions are easy to recognize. The word “caution” is written
as “CAUTION,” both capitalized and bold and is followed. The italicized text is the
cautionary message. A caution message is shown below:

WAFER-LX2 3.5” Embedded SBC
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CAUTION:
This is an example of a caution message. Failure to adhere to cautions
messages may result in permanent damage to the WAFER-LX2.
Please take caution messages seriously.
NOTE:
These messages inform the reader of essential but non-critical information. These
messages should be read carefully as any directions or instructions contained therein can
help avoid making mistakes. Notes are easy to recognize. The word “note” is written as
“NOTE,” both capitalized and bold and is followed by text. The text is the cautionary
message. A note message is shown below:
NOTE:
This is an example of a note message. Notes should always be read.
Notes contain critical information about the WAFER-LX2. Please take
note messages seriously.

WAFER-LX2 3.5” Embedded SBC
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Copyright
COPYRIGHT NOTICE
The information in this document is subject to change without prior notice in order to
improve reliability, design and function and does not represent a commitment on the part
of the manufacturer.
In no event will the manufacturer be liable for direct, indirect, special, incidental, or
consequential damages arising out of the use or inability to use the product or
documentation, even if advised of the possibility of such damages.
This document contains proprietary information protected by copyright. All rights are
reserved. No part of this manual may be reproduced by any mechanical, electronic, or
other means in any form without prior written permission of the manufacturer.
TRADEMARKS
IBM PC is a registered trademark of International Business Machines Corporation. INTEL
is a registered trademark of INTEL Corporation. Other product names mentioned herein
are used for identification purposes only and may be trademarks and/or registered
trademarks of their respective owners.

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Packing List
NOTE:
If any of the components listed in the checklist below are missing,
please do not proceed with the installation. Contact the IEI reseller or
vendor you purchased the WAFER-LX2 from or contact an IEI sales
representative directly. To contact an IEI sales representative, please
send an email to [email protected].
The items listed below should all be included in the WAFER-LX2 package.
1 x WAFER-LX2 single board computer
1 x Audio cable
1 x IDE flat cable 44p/44p
2 x 4 COM port cable
1 x Mini jumper pack
1 x Utility CD
1 x QIG (quick installation guide)
Images of the above items are shown in Chapter 3.

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Table of Contents
1INTRODUCTION..................................................................................................... 1
1.1 WA F E R - L X 2 OVERVIEW........................................................................................... 2
1.1.1 WAFER-LX2 Applications.................................................................................. 2
1.1.2 WAFER-LX2 Benefits......................................................................................... 2
1.1.3 WAFER-LX2 Features........................................................................................ 3
1.2 WA F E R - L X 2 OVERVIEW........................................................................................... 4
1.2.1 WAFER-LX2 Connectors ................................................................................... 5
1.2.2 Technical Specifications..................................................................................... 6
2DETAILED SPECIFICATIONS ............................................................................. 8
2.1 OVERVIEW.................................................................................................................. 9
2.2 DIMENSIONS............................................................................................................... 9
2.2.1 Board Dimensions.............................................................................................. 9
2.2.2 External Interface Panel Dimensions................................................................ 9
2.3 DATA FLOW .............................................................................................................. 10
2.4 CPU SUPPORT ...........................................................................................................11
2.4.1 AMD
®
Geode™ LX 800 500MHz Overview.....................................................11
2.4.2 AMD
®
Geode™ LX 800 Memory Support....................................................... 12
2.4.3 AMD
®
Geode™ LX 800 500MHz Display Support......................................... 12
2.4.4 AMD
®
Geode™ LX 800 500MHz Graphics processor.................................... 12
2.4.5 AMD
®
Geode™ LX 800 500MHz Power Management................................... 14
2.5 SYSTEM CHIPSET...................................................................................................... 14
2.5.1 GeodeLink™ Interface Unit............................................................................. 14
2.5.2 AMD
®
Geode™ CS5536 ATA-6 Controller..................................................... 15
2.5.3 AMD
®
Geode™ CS5536 Audio Codec 97 (AC’97) Controller ....................... 15
2.5.4 AMD
®
Geode™ CS5536 Flash Interface ........................................................ 17
2.5.5 AMD
®
Geode™ CS5536 USB Controller........................................................ 17
2.5.6 AMD
®
Geode™ CS5536 Serial Communications........................................... 17
2.5.7 AMD
®
Geode™ CS5536 Real Time Clock ...................................................... 18
2.5.8 BIOS................................................................................................................. 18
2.6 GEODELINK™PCI BRIDGE ..................................................................................... 18

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2.6.1 Overview.......................................................................................................... 18
2.6.2 10/100M Ethernet ............................................................................................ 19
2.6.3 PCI to ISA Bridge ............................................................................................ 20
2.7 ENVIRONMENTAL AND POWER SPECIFICATIONS ....................................................... 20
2.7.1 System Monitoring ........................................................................................... 20
2.7.2 Operating Temperature and Temperature Control........................................... 21
2.7.3 Power Consumption......................................................................................... 21
3UNPACKING.......................................................................................................... 22
3.1 ANTI-STATIC PRECAUTIONS ...................................................................................... 23
3.2 UNPACKING.............................................................................................................. 23
3.2.1 Unpacking Precautions.................................................................................... 23
3.3 UNPACKING CHECKLIST ........................................................................................... 24
3.3.1 Package Contents............................................................................................. 24
4CONNECTOR PINOUTS...................................................................................... 26
4.1 PERIPHERAL INTERFACE CONNECTORS..................................................................... 27
4.1.1 WAFER-LX2 Layout......................................................................................... 27
4.1.2 Peripheral Interface Connectors ..................................................................... 28
4.1.3 External Interface Panel Connectors............................................................... 29
4.2 INTERNAL PERIPHERAL CONNECTORS ...................................................................... 30
4.2.1 AT Power Connector........................................................................................ 30
4.2.2 ATX Power Supply Enable Connector............................................................. 31
4.2.3 Audio Connector (10-pin)................................................................................ 32
4.2.4 Backlight Inverter Connector .......................................................................... 33
4.2.5 Battery Connector............................................................................................ 34
4.2.6 Compact Flash Socket...................................................................................... 35
4.2.7 GPIO Connector.............................................................................................. 36
4.2.8 IDE Connector(44-pin).................................................................................... 37
4.2.9 LED Connector................................................................................................ 39
4.2.10 PC/104 Slot.................................................................................................... 40
4.2.11 PC/104 Power Input Connector..................................................................... 42
4.2.12 Power Button Connector................................................................................ 43
4.2.13 Reset Button Connector ................................................................................. 43
4.2.14 Serial Port Connector (COM 2, COM 3 and COM 4)................................... 44

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4.2.15 Serial Port Connector (COM 5, COM 6, COM 7 and COM 8)..................... 46
4.2.16 TFT LCD LVDS Connector............................................................................ 48
4.2.17 TFT LCD TTL Connector............................................................................... 49
4.3 EXTERNAL PERIPHERAL INTERFACE CONNECTORS................................................... 50
4.3.1 External Peripheral Interface Connector Overview........................................ 50
4.3.2 RJ-45 Ethernet Connector ............................................................................... 51
4.3.3 Serial Port Connector (COM 1) ...................................................................... 52
4.3.4 USB Combo Port.............................................................................................. 53
4.3.5 VGA Connector................................................................................................ 53
5INSTALLATION .................................................................................................... 55
5.1 ANTI-STATIC PRECAUTIONS ...................................................................................... 56
5.2 INSTALLATION CONSIDERATIONS.............................................................................. 57
5.2.1 Installation Notices.......................................................................................... 57
5.2.2 Installation Checklist....................................................................................... 58
5.3 SODIMM INSTALLATION AND CF CARD INSTALLATION .......................................... 59
5.3.1 SODIMM Installation ...................................................................................... 59
5.3.2 CF Card Installation........................................................................................ 60
5.4 JUMPER SETTINGS .................................................................................................... 61
5.4.1 AT Power Select Jumper Settings..................................................................... 62
5.4.2 Clear CMOS Jumper........................................................................................ 63
5.4.3 CF Card Setup ................................................................................................. 64
5.4.4 COM 1 Pin 9 Setting Jumper........................................................................... 65
5.4.5 COM 2 Function Select Jumper....................................................................... 66
5.4.6 LCD Voltage Selection..................................................................................... 67
5.4.7 LCD Clock Select Jumper................................................................................ 68
5.5 CHASSIS INSTALLATION............................................................................................ 69
5.5.1 Airflow.............................................................................................................. 69
5.5.2 Motherboard Installation................................................................................. 70
5.6 INTERNAL PERIPHERAL DEVICE CONNECTIONS........................................................ 70
5.6.1 Peripheral Device Cables................................................................................ 70
5.6.2 ATA Flat Cable Connection ............................................................................. 70
5.6.3 Audio Kit Installation....................................................................................... 71
5.6.4 Four Serial Port Connector Cable .................................................................. 72
5.7 EXTERNAL PERIPHERAL INTERFACE CONNECTION ................................................... 73

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6AWARD BIOS ......................................................................................................... 75
6.1 INTRODUCTION......................................................................................................... 76
6.1.1 Starting Setup................................................................................................... 76
6.1.2 Using Setup...................................................................................................... 76
6.1.3 Getting Help..................................................................................................... 77
6.1.4 Unable to Reboot After Configuration Changes.............................................. 77
6.1.5 Main BIOS Menu ............................................................................................. 77
6.2 STANDARD CMOS FEATURES .................................................................................. 80
6.2.1 IDE Primary Master/Slave .............................................................................. 82
6.3 ADVANCED BIOS FEATURES .................................................................................... 86
6.4 ADVANCED CHIPSET FEATURES ................................................................................ 92
6.4.1 Flat Panel Configuration................................................................................. 94
6.5 INTEGRATED PERIPHERALS....................................................................................... 96
6.5.1 IT8888 ISA Decode IO................................................................................... 100
6.5.2 IT8888 ISA Decode Memory.......................................................................... 103
6.6 POWER MANAGEMENT SETUP ................................................................................ 105
6.7 PNP/PCI CONFIGURATIONS .................................................................................... 106
7SOFTWARE DRIVERS........................................................................................112
7.1 AVAILABLE SOFTWARE DRIVERS .............................................................................113
7.2 VGA DRIVER ..........................................................................................................115
7.3 AUDIO DRIVER INSTALLATION ............................................................................... 125
7.4 LAN DRIVER ......................................................................................................... 132
7.5 ISA DRIVER ........................................................................................................... 136
ABIOS OPTIONS.................................................................................................... 144
BGPIO CONNECTION.......................................................................................... 148
B.1 GPIO SETTINGS AND DEFAULT VALUES................................................................. 149
B.1.1 GPIO Settings................................................................................................ 149
B.1.2 Default Settings ............................................................................................. 149
B.2 ASSEMBLY LANGUAGE SAMPLES........................................................................... 150
B.2.1 GPIO Initialization Procedure...................................................................... 150
B.2.2 General Purpose Output Procedure.............................................................. 150
B.2.3 General Purpose Input Procedure................................................................. 151