Inrevium TB-6V-LX760-LSI Instructions for use

TB-6V-LX760-LSI Hardware User Manual
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TB-6V-LX760-LSI
Hardware User Manual
Rev.3.00

TB-6V-LX760-LSI Hardware User Manual
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Revision History
Version Date Description Publisher
Rev.1.xx 2009/xx/xx Preliminary
Rev.2.00 2010/05/06
Initial release Sen
Odajima
Rev.2.01 2010/06/25 -Added J66, J53 to figure 12-1
-Modified table 12-1
Added J66,J53
Separate SW5,SW6
Changed initial settings : No1, 6 ,7 ,18, 20.21
Yoshioka
Rev.2.02 2010/07/07
- Modified table 6-1, table 6-2, table 6-3
- Modified figure 6-1, figure 7-3
- Delete wrong information on 8-3 FMC connector
- Modified explaining of clock signal of each FMC connectors
- Modified figure 9-1
- Add DIP SW pin number on table 9-1 and 9-2
- Changed connector for FAN on 6.5 Power supply for FAN
Yoshioka
Rev.2.03 2012/04/24
-Modified Q’ty of TB-FMCH-STACK and
Q’ty of TB-FMCH-CONNECTRO Yoshioka
Rev.3.00 2012/07/17
- Modified revision of pin assign table
- Modified PCB dimension and surface coating
- Modified External view
- Modified Table 8-1 LA06_P/N, LA33_P/N, CLK1_M2C_P/N
and CLK0_M2C_P/N
- Add comment to Table 8-1, 8-2, 8-6, 8-7: LA33_P/N. these
are not differential pair
- Modified Table 8-2 LA15_P/N, LA19_P/N, LA33_P/N,
CLK1_M2C_P/N and CLK0_M2C_P/N
- Modified Table 8-4 CLK1_M2C_P/N and CLK0_M2C_P/N
- Modified Table 8-5 CLK1_M2C_P/N and CLK0_M2C_P/N
- Modified Table 8-6 LA11_P/N, LA33_P/N, CLK1_M2C_P/N
and CLK0_M2C_P/N
- Modified Table 8-7 CLK1_M2C_P/N and CLK0_M2C_P/N
- Modified Table 8-8 CLK1_M2C_P/N and CLK0_M2C_P/N
- Modified Table 8-9 CLK1_M2C_P/N and CLK0_M2C_P/N
- Modified Table 8-10 CLK1_M2C_P/N and CLK0_M2C_P/N
- Modified Figure 1-3 Power Supply Arrangement for FPGA
Banks
- Modified Spec of FAN
- Added 11-4 Pin header and Table 11-4 pin assign of pin
header
- Modified Figure 12-1 Default settings
- Modified Table 12-1 Initial Settings (removed J66)
Yoshioka

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Table of Contents
1. Related Documents and Accessories ......................................................................................... 9
2. Overview...................................................................................................................................... 9
3. Feature ........................................................................................................................................ 9
4. Block Diagram............................................................................................................................11
5. External View of the Board........................................................................................................ 12
5.1. TB-6V-LX760-LSI .................................................................................................................... 12
5.2. TB-FMCH-STACK and TB-FMCH-CONNECTOR................................................................... 13
6. Board Specifications.................................................................................................................. 14
6.1. TB-6V-LX760-LSI Board Structure .......................................................................................... 14
6.2. TB-FMCH-STACK Board Structure ......................................................................................... 14
6.3. TB-FMCH-CONNECTER Board Structure.............................................................................. 15
6.4. Layout of TB-6V-LX760-LSI Board Components .................................................................... 16
6.5. Layout of the TB-FMCH-STACK Board Components ............................................................. 17
6.6. Layout of the TB-FMCH-CONNECTER Board Components .................................................. 17
7. Description of Components....................................................................................................... 18
7.1. DDR3 SDRAM......................................................................................................................... 18
7.2. SPI FLASH .............................................................................................................................. 19
7.3. BPI FLASH .............................................................................................................................. 19
7.4. MicroSD/NAND FLASH (these are only for Virtex-6 configuration) ........................................ 20
8. Interfaces................................................................................................................................... 21
8.1. USB and I2C............................................................................................................................ 21
8.2. Method of Rewriting an EEPROM for USB PHY..................................................................... 21
8.3. FMC Connector ....................................................................................................................... 22
8.3.1. FMC1 LPC MC / CC Connector ...................................................................................... 23
8.3.2. FMC2 LPC MC / CC Connector ...................................................................................... 25
8.3.3. FMC3 LPC MC / CC Connector ...................................................................................... 27
8.3.4. FMC4 LPC MC / CC Connector ...................................................................................... 29
8.3.5. FMC5 LPC MC / CC Connector ...................................................................................... 31
8.3.6. FMC6 LPC MC / CC Connector ...................................................................................... 33
8.3.7. FMC7 LPC MC / CC Connector ...................................................................................... 35
8.3.8. FMC8 LPC MC / CC Connector ...................................................................................... 37
8.3.9. FMC9 LPC MC / CC Connector ...................................................................................... 39
8.3.10. FMC10 LPC MC / CC Connector .................................................................................... 41
9. Clock System Diagram.............................................................................................................. 45
9.1. PLL Setting .............................................................................................................................. 46
10. Power Supply System........................................................................................................... 48
10.1. Power Consumption Estimation .......................................................................................... 48
10.2. Power Supply System Diagram........................................................................................... 49
10.3. Power Supply Monitor ......................................................................................................... 50
10.4. Power Supply Arrangement for FPGA Banks...................................................................... 51
10.5. Power Supply for Fan.......................................................................................................... 51

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11. LED/SW/JUMPER ................................................................................................................ 52
11.1. LED.......................................................................................................................................... 52
11.2. Switch ...................................................................................................................................... 53
11.3. JUMPER.................................................................................................................................. 54
11.4. Pin Header............................................................................................................................... 55
12. Initial Settings........................................................................................................................ 56
List of Figures
Figure4-1 Block Diagram ..................................................................................................................11
Figure5-1 Component Side.............................................................................................................. 12
Figure5-3 External view of the TB-FMCH-STACK and TB-FMCH-CONNECTOR .......................... 13
Figure6-1 Layout of TB-6V-LX760-LSI Board Components............................................................. 16
Figure6-2 Layout of the TB-FMCH-STACK Board Components...................................................... 17
Figure6-3 Layout of the TB-FMCH-CONNECTER Board Components........................................... 17
Figure7-1 DDR3 Peripheral Connections......................................................................................... 18
Figure7-2 SPI Flash Peripheral Connections................................................................................... 19
Figure7-3 BPI Flash Peripheral Connections................................................................................... 19
Figure7-4 CONFIG Peripheral Connections .................................................................................... 20
Figure7-5 JTAG Chain...................................................................................................................... 20
Figure8-1 USB and I2C Peripheral Connections ............................................................................. 21
Figure8-2 FMC Connector Peripheral Connections......................................................................... 22
Figure8-3 Low-Pin Count Pinouts .................................................................................................... 22
Figure8-4 SDA,SCL,GA1/0 TDI/TDO Circuit.................................................................................... 43
Figure8-5 PG_C2M Circuit............................................................................................................... 43
Figure8-6 VREF_A_M2C Circuit...................................................................................................... 43
Figure8-7 FMC_VREF Select Circuit............................................................................................... 44
Figure8-8 VADJ Circuit..................................................................................................................... 44
Figure9-1 Clock System Diagram .................................................................................................... 45
Figure10-1 Power Supply System Diagram..................................................................................... 49
Figure10-2 Power Supply Monitor.................................................................................................... 50
Figure10-3 Power Supply Arrangement for FPGA Banks................................................................ 51
Figure10-4 Fan Connector Peripheral Circuit .................................................................................. 51
Figure12-1 Default Settings (component side) ................................................................................ 56

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List of Tables
Table6-1 TB-6V-LX760-LSI Board Structure.................................................................................... 14
Table6-2 TB-FMCH-STACK Board Structure................................................................................... 14
Table6-3 TB-FMCH-CONNECTER Board Structure........................................................................ 15
Table8-1 FMC1 Connector Pinouts on Component and Solder Sides............................................. 23
Table8-2 FMC2 Connector Pinouts on Component and Solder Sides............................................. 25
Table8-3 FMC3 Connector Pinouts on Component and Solder Sides............................................. 27
Table8-4 FMC4 Pinouts on Component and Solder Sides .............................................................. 29
Table8-5 FMC5 Pinouts on Component and Solder Sides .............................................................. 31
Table8-6 FMC6 Connector Pinouts on Component and Solder Sides............................................. 33
Table8-7 FMC7 Connector Pinouts on Component and Solder Sides............................................. 35
Table8-8 FMC8 Connector Pinouts on Component and Solder Sides............................................. 37
Table8-9 FMC9 Connector Pinouts on Component and Solder Sides............................................. 39
Table8-10 FMC10 Connector Pinouts on Component and Solder Sides......................................... 41
Table9-1 PLL’s M Divide Setting Table............................................................................................. 46
Table9-2 PLL’s N Divide Setting Table ............................................................................................. 47
Table11-1 LED Functions ................................................................................................................. 52
Table11-2 Switch Functions.............................................................................................................. 53
Table11-3 Jumper Functions............................................................................................................ 54
Table11-4 Pin assign of Pin header.................................................................................................. 55
Table12-1 Initial Settings.................................................................................................................. 57

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Introduction
Thank you for purchasing the TB-6V-LX760-LSI board. Before using the product, be sure to carefully
read this user manual and fully understand how to correctly use the product. First read through this
manual, and then always keep it handy.
SAFETY PRECAUTIONS Besuretoobservethese precautions
Observe the precautions listed below to prevent injuries to you, other personnel or damage to property.
Before using the product, read these safety precautions carefully to assure safe use.
These precautions contain serious safety instructions that must be observed.
After reading through this manual, be sure to always keep it handy.
The following conventions are used to indicate the possibility of injury/damage and classify precautions if
the product is handled incorrectly.
Indicates the high possibility of serious injury or death if the product is handled
incorrectly.
Indicates the possibility of serious injury or death if the product is handled
incorrectly.
Indicates the possibility of injury or physical damage in connection with property if
the product is handled incorrectly.
The following graphical symbols are used to indicate and classify precautions in this manual.
(Examples)
Turn off the power switch.
Do not disassemble the product.
Do not attempt this.
Danger
Warning
Caution
!

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In the event of a failure, disconnect the power supply.
If the product is used as is, a fire or electric shock may occur. Disconnect the power supply
immediately and contact technical support.
If an unpleasant smell or smoking occurs, disconnect the power supply.
If the product is used as is, a fire or electric shock may occur. Disconnect the power supply
immediately. After verifying that no smoking is observed, contact our sales personnel for
repair.
Do not disassemble, repair or modify the product.
Otherwise, a fire or electric shock may occur due to a short circuit or heat generation. For
inspection, modification or repair, contact our sales personnel.
Do not touch a cooling fan.
As a cooling fan rotates at high speed, do not put your hand close to it or touch it.
Otherwise, it may cause injury.
Do not place the product in an unstable position.
Otherwise, it may drop or fall, resulting in injury to persons or failure.
If the product is dropped or damaged, do not use it as is.
Otherwise, a fire or electric shock may occur.
Do not touch the product with a metallic object.
Otherwise, a fire or electric shock may occur.
Do not place the product in dusty or humid locations or where water may
splash on it.
Otherwise, a fire or electric shock may occur.
Do not get the product wet or touch it with a wet hand.
Otherwise, the product may be damaged and break down or it may cause a fire or electric
shock.
Do not touch a connector on the product (gold-plated portion).
Otherwise, the surface of a connector may be contaminated with sweat or skin oil, resulting
in contact failure of a connector or it may cause a malfunction, fire or electric shock due to
static electricity.
Warning
!
!
!
!
!
!
!

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Do not use or place the product in the following locations.
Humid and dusty locations
Airless locations such as closet or bookshelf
Locations which receive oily smoke or steam
Locations exposed to direct sunlight
Locations close to heating equipment
Closed inside of a car where the temperature becomes high
Static locations
Locations close to water or chemicals
Otherwise, a fire, electric shock, accident or deformation may occur due to a short circuit or heat
generation.
Do not place heavy things on the product.
Otherwise, the product may be damaged.
■Disclaimer
This product is a Xilinx Virtex6 FPGA evaluation board. Tokyo Electron Device Limited assumes no
responsibility for any damages resulting from the use of this product for purposes other than those
stated.
Even if the product is used properly, Tokyo Electron Device Limited assumes no responsibility for any
damages caused by:
(1) Earthquake, thunder, natural disaster or fire resulting from the use beyond our responsibility, acts by
a third party or other accidents, the customer’s willful or accidental misuse or use under other
abnormal conditions.
(2) Secondary impact arising from use of this product or its unusable state (business interruption or
others)
(3) Use of this product against the instructions given in this manual.
(4) Malfunctions due to connection to other devices.
Tokyo Electron Device Limited assumes no responsibility or liability for:
(1) Erasure or corruption of data arising from use of this product.
(2) Any consequences or other abnormalities arising from use of this product, or
(3) Damage of this product not due to our responsibility or failure due to modification
This product has been developed for research, testing or evaluation. It is not authorized for use in any
system or application that requires high reliability.
Repair of this product is carried out by replacing it on a chargeable basis, not repairing the faulty devices.
However, non-chargeable replacement is offered for initial failure if such notification is received within
two weeks after delivery of the product.
The specification of this product is subject to change without prior notice.
The product is subject to discontinuation without prior notice.
Caution
!
!

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1. Related Documents and Accessories
Related documents:
All documents relating to this board can be downloaded from our website. Please see attached
“Welcome latter”on the products.
Board accessories:
- FMC spacer set
2. Overview
This document describes the design specification of the TB-6V-LX760-LSI board.
The design covers the TB-6V-LX760-LSI board and two FMC option boards (TB-FMCH-STACK and
TB-FMCH-CONNECTOR).
3. Feature
FPGA Devices : XC6VLX760-2FFG1760
: XC3S700AN-4FGG484C (It is only for Virtex-6 Configuration)
Memory
DDR3 SDRAM CH1 : 1Gbit (8Meg x 16bit x 8Bank) x 2
DDR3 SDRAM CH2 : 1Gbit (8Meg x 16bit x 8Bank) x 2
NAND FLASH : 4G (16bit) x 1 (for FPGA Configuration)
SPI Flash : 64MBit x 1 (for MicroBlaze)
BPI Flash : 256MBit x 1 (for test)
Interface
FMC (LPC) : Connectors for component side x 10
FMC (LPC) : Connectors for solder side x 10
USB : Type B Hi-speed USB (target)
SD CARD : MicroSD (It is only for Virtex-6 Configuration)
Expansion Connector : x 1 (30-bit) connecting to XC6VLX760
Others
LTC2978CUP : Onboard power source monitor
Clock : OSC 24MHz for USB (mounted)
: 50MHz for XC3S700AN (mounted)
: 266MHz for DDR3 (mounted)
: 16MHz for PLL (mounted)
I2C : 4pin Header
FAN : 3pin Header connecting to XC3S700AN
LED : Green color LED for XC6VLX760 configuration DONE
: 14 general purpose green color LEDs connecting to XC6VLX760
: 2 general purpose red LEDs connecting to XC6VLX760
: Green color LED for XC3S700AN configuration DONE
: 3 general purpose red LEDs connected to XC3S700AN
SW : Pushbutton switch to initiate configuration
: General purpose 16-bit DIP switch connected to XC6VLX760
: General purpose 4-bit pushbutton switch connected to XC6VLX760
Rotary SW : 2 switches connected to XC3S700AN

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Power Supply: The +12 volt power supply can be derived either from the Molex 39-29-1048 connector or
from the 39-30-0060. A dedicated power supply is attached.
Onboard power supply module: Various Linear modules (LTM4601A, LTM4606, LTM8025 etc.)
Holes for fixing an FPGA radiator, dedicated heat sink and FAN
Spacers and screws for attaching option boards
5 TB-FMCH-STACK boards and 3 TB-FMCH-CONNECTERs
Warning Virtex-6 FPGA does not support 3.3V IO.

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4. Block Diagram
The following figure represents the block diagram of the TB-6V-LX760-LSI and illustrates the assignment
of various blocks and connectors to IO banks on the FPGA.
Figure4-1 Block Diagram

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5. External View of the Board
5.1. TB-6V-LX760-LSI
Figure5-1 Component Side
FMCConnector6
（ModuleLowPin）FMCConnector7 （ModuleLowPin）FMCConnector8 （ModuleLowPin）FMCConnector9
（ModuleLowPin）FMCConnector10 （ModuleLowPin）
FMCConnector1
（ModuleLowPin）FMCConnector2 （ModuleLowPin）FMCConnector3 （ModuleLowPin）FMCConnector4 （ModuleLowPin）FMCConnector5 （ModuleLowPin）
Figure5-2 Solder Side

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5.2. TB-FMCH-STACK and TB-FMCH-CONNECTOR
The TB-FMCH-STACK and the TB-FMCH-CONNECTOR permit the interconnection of multiple
TB-6V-LX760T-LSI boards in either a horizontal or vertical configuration.
Figure5-3 External view of the TB-FMCH-STACK and TB-FMCH-CONNECTOR
TB-FMCH-Connector Solder side

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6. Board Specifications
6.1. TB-6V-LX760-LSI Board Structure
The following table shows the board structure and the specifications.
For details about connector locations, refer to the board layout drawing.
For details about clock structure and operational frequency, refer to the clock system diagram.
Table6-1 TB-6V-LX760-LSI Board Structure
Item Category-I Category-II Specification Remarks
1
Board Structure
Number of Layers 16
2 Dimensions 369mm x 225mm
3 Thickness 3mm
4 Resist Color Red
5 Material FR-4
6 Height Component Side 13.0mm
(without FAN and power connector)
7 Solder Side 7.1mm
8 Impedance Control Single Signal 50 Ohm
9 Differential Signal 90 Ohm, 100 Ohm
10 RoHS/Pbfree RoHS/Pbfree RoHS, lead-free solder
11 Surface Coating - Gold plating
6.2. TB-FMCH-STACK Board Structure
The following table shows the board structure and the specifications.
For details about connector locations, refer to the board layout drawing.
Table6-2 TB-FMCH-STACK Board Structure
Item Category-I Category-II Specification Remarks
1
Board Structure
Number of Layers 16
2 Dimensions 69mm x 40mm
3 Thickness 3mm
4 Resist Color Red
5 Material FR-4
6 Height Component Side 6.5mm
7 Solder Side 7.1mm
8 Impedance Control Single Signal 50 Ohm
9 Differential Signal 100 Ohm
10 RoHS/Pbfree RoHS/Pbfree RoHS, lead-free solder
11 Surface Coating - Gold plating

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6.3. TB-FMCH-CONNECTER Board Structure
The following table shows the board structure and the specifications.
For details about connector locations, refer to the board layout drawing.
Table6-3 TB-FMCH-CONNECTER Board Structure
Item Category-I Category-II Specification Remarks
1
Board Structure
Number of Layers 16
2 Dimensions 69mm x 80mm
3 Thickness 3mm
4 Resist Color Red
5 Material FR-4
6 Height Component Side 2mm
7 Solder Side 7.1mm
8 Impedance Control Single Signal 50 Ohm
9 Differential Signal 100 Ohm
10 RoHS/Pbfree RoHS/Pbfree RoHS, lead-free solder
11 Surface Coating - Gold plating

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6.4. Layout of TB-6V-LX760-LSI Board Components
The following figure shows the dimensions of the TB-6V-LX760-LSI.
225
XC6VSX760T-1
FF1760
(42.5x42.5)
12.5 15.5
44.5
369
FMC10 FMC9 FMC8 FMC7FMC6
FMC5 FMC4 FMC3FMC2FMC1
Unit:mm 112.5
112.5
149.5 219.5
Ф6.0
69
31.
5
31.
5
3
3
69
31.
5
31.
5
3
31
A01 A01 A01 A01 A01
A01A01A01A01A01
15.5
5.0
31.5
70.0
Ф2.7
44.570.070.0
8.0
DC-DC
Regulato
r
2908-05WB-MG
MicroSD
DC-DC
Regulato
r
DC-DC
Regulato
r
DC-DC
Regulato
r
DC-DC
Regulato
r
DC-DC
Regulato
r
DC-DC
Regulato
r
ATXCNATXCN
DDR
3
DDR
3
DDR
3
DDR
3
LEDOUTLEDOUT
LEDOUTLEDOUT
LEDOUT
LEDOUTLEDOUTLEDOUTLEDOUTLEDOUT
JS28F256
DC-DC
Regulato
r
XC3S700AN
-FG484
23*23
MT29F4G16 BABWP
50MHz OSC
CY7C68013A
-56PVXC
XR2A-0811-N
SN74CB3 T3245PW SN74CB3 T3245PW SN74CB3 T3245PW SN74CB3 T3245PW
USB
FANCN
DC-DC
Regulato
r
LTC2
978
5.0
8.0
DC-DC
Regulato
r
Figure6-1 Layout of TB-6V-LX760-LSI Board Components

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6.5. Layout of the TB-FMCH-STACK Board Components
The following figure shows the dimensions of the TB-FMCH-STACK board and locations of its
connectors.
Figure6-2 Layout of the TB-FMCH-STACK Board Components
6.6. Layout of the TB-FMCH-CONNECTER Board Components
The following figure shows the dimensions of the TB-FMCH-CONNECTER board and locations of its
connectors.
Figure6-3 Layout of the TB-FMCH-CONNECTER Board Components

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7. Description of Components
7.1. DDR3 SDRAM
The TB-6V-LX760-LSI board has four DDR3 SDRAM chips.
Device: MT41J64M16LA-15E:B (Micron) 1-Gbit (8Meg x 16bit x 8Bank) x 4 or equivalents
The DDR3 memory device can be divided into two groups as shown in following figure.
DDR3-SDRAM
1Gbit
[MT41J64M16LA-15]
FPGA
[XC6VLX760-FFG1760C]
DM[3:2]
DQ[31:16],
DQS[3:2],XDQS[3:2]
DQ[15:0],
DQS[1:0],XDQS[1:0]
DM[1:0]
GroupA
A[13:0], BA[2:0], CK,
XCK, CKE, XCS,
ODT, XWE, XRAS,
XCAS, XRESET
DM[3:2]
DQ[31:16],
DQS[3:2],XDQS[3:2]
DQ[15:0],
DQS[1:0],XDQS[1:0]
DM[1:0]
GroupB
A[13:0], BA[2:0], CK,
XCK, CKE, XCS, ODT,
XWE, XRAS, XCAS,
XRESET
DDR3-SDRAM
1Gbit
[MT41J64M16LA-15]
DDR3-SDRAM
1Gbit
[MT41J64M16LA-15]
DDR3-SDRAM
1Gbit
[MT41J64M16LA-15]
Figure7-1 DDR3 Peripheral Connections

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7.2. SPI FLASH
The TB-6V-LX760-LSI board has one SPI Flash memory device.
Device: M25P64-VMF6TP (Numonyx) 64-MBit
Figure7-2 SPI Flash Peripheral Connections
7.3. BPI FLASH
The TB-6V-LX760-LSI board has one BPI Flash memory device.
Device: JS28F256P30TF (Numonyx) 256-MBit
Figure7-3 BPI Flash Peripheral Connections

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7.4. MicroSD/NAND FLASH (these are only for Virtex-6 configuration)
The TB-6V-LX760-LSI board has one NAND Flash for storing Virtex-6 configuration files and one
MicroSD socket.
The Spartan-3AN reads the data stored in the Micro SD/NAND Flash memory device to configure the
Virtex-6 device.
Device: NAND Flash: MT29F4G16BABWP (Micron) 4-G (16-bit)
For more information, refer to the related document “Configuration Method Using SD and XC3S700AN”
(uSD_CONF_UserManual_V6LSI_x.xxe.pdf).
NMT
Figure7-4 CONFIG Peripheral Connections
The following figure shows the JTAG chain of Virtex-6 and Spartan-3AN.
The Spartan-3AN comes with burned ROM data for configuration.
No need to change it, if it is used in an ordinary way.
Figure7-5 JTAG Chain