Intel RealSense ID Solution F450 User manual

Rev: 001
Intel® RealSense™ID Solution F450,
F455
Datasheet
Intel®RealSense™ ID Solution F450, Intel® RealSense™ ID Solution F455
January 2021
Revision 001

2 Rev: 001
You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning
Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter
drafted which includes subject matter disclosed herein.
No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document.
Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service
activation. Learn more at Intel.com, or from the OEM or retailer.
No computer system can be absolutely secure. Intel does not assume any liability for lost or stolen data or systems or any
damages resulting from such losses.
The products described may contain design defects or errors known as errata which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness
for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or
usage in trade.
Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service
activation. Learn more at intel.com, or from the OEM or retailer.
All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest Intel
product specifications and roadmaps.
Copies of documents which have an order number and are referenced in this document may be obtained by calling 1-800-548-
4725 or visit www.intel.com/design/literature.htm.
By using this document, in addition to any agreements you have with Intel, you accept the terms set forth below.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Intel, RealSense, and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2021, Intel Corporation. All rights reserved.

Rev: 001 3
Contents
1Overview .......................................................................................................... 8
2Hardware Details ............................................................................................. 10
2.1 Host Interconnect ................................................................................. 11
2.1.1 Data Interface......................................................................... 11
2.1.2 Power Interface....................................................................... 11
2.1.3 Receptacle Pin Out................................................................... 12
2.2 Optical System ..................................................................................... 14
2.2.1 Cameras................................................................................. 14
2.2.2 IR Illuminators ........................................................................ 15
2.3 Thermal............................................................................................... 15
2.3.1 Intel® RealSense™ ID Solution F450 Thermal............................. 15
2.3.2 Intel® RealSense™ ID Solution F455 Thermal............................. 16
2.3.3 Power Profiling ........................................................................ 16
2.4 Firmware Upgrade ................................................................................ 16
3Mechanical...................................................................................................... 18
3.1 Mechanical Dimensions.......................................................................... 18
3.2 Cover Glass.......................................................................................... 19
3.3 Optical Isolation.................................................................................... 19
3.4 Orientation........................................................................................... 20
3.5 System Tilt .......................................................................................... 20
3.5.1 Heat Sink ............................................................................... 21
4Software Definition .......................................................................................... 22
4.1 Intel® RealSense™ ID SDK for Facial Authentication................................. 22
4.2 Face Authentication............................................................................... 22
5System Integration .......................................................................................... 24
5.1 Product Assembly ................................................................................. 24
5.1.1 Optical Assembly Considerations ............................................... 25
5.2 Trigger Heuristic ................................................................................... 25
5.3 User Feedback...................................................................................... 26
6Regulatory Compliance..................................................................................... 28
6.1 System Laser Compliance ...................................................................... 28
6.1.1 Certification Statement............................................................. 28
6.1.2 Explanatory Label .................................................................... 28
6.1.3 Cautionary Statements............................................................. 28
6.1.4 US FDA Accession Number........................................................ 29
6.2 Regulatory Compliance .......................................................................... 29
6.2.1 Manufacturer’s Information....................................................... 29
6.2.2 EU Single Place of Contact ........................................................ 29
6.2.3 UK Single Place of Contact ........................................................ 29
6.2.4 FCC Part 15 Declaration of Conformity ....................................... 30
6.2.5 Canada .................................................................................. 30
6.2.6 European Directives ................................................................. 31
6.2.7 Australia................................................................................. 31
6.2.8 Japan..................................................................................... 31
6.2.9 South Korea............................................................................ 31

4 Rev: 001
6.2.10 Customs Union ........................................................................ 32
6.3 Ecology Compliance .............................................................................. 33
6.3.1 China RoHS Declaration............................................................ 33
6.3.2 Waste Electrical and Electronic Equipment (WEEE)....................... 34
6.3.3 Turkey ................................................................................... 34
7Mechanical Drawings........................................................................................ 35
8Appendix A –Interposer Reference Designs ........................................................ 36

Rev: 001 5
List of Figures
Figure 1-1: Intel® RealSense™ ID Solution F450 Module........................................ 8
Figure 1-2: Intel® RealSense™ ID Solution F450 Module Host System Topology ....... 9
Figure 2-1: Intel® RealSense™ ID Solution F450 Module Front Side ...................... 10
Figure 2-2: Intel® RealSense™ ID Solution F450 Module Rear Side ....................... 10
Figure 2-3: Intel® RealSense™ ID Solution F450 Connector Pin 1 Location............. 14
Figure 3-1: Intel® RealSense™ ID Solution F450 Module Dimensions .................... 18
Figure 3-2: Through Hole Design ....................................................................... 19
Figure 3-3: Gasket........................................................................................... 20
Figure 3-4: Mount Orientation ........................................................................... 20
Figure 3-5: Tilt Profile and Field of View ............................................................. 21
Figure 3-6: System Tilt..................................................................................... 21
Figure 5-1: System Design Considerations .......................................................... 24
Figure 5-2: Trigger Heuristic ............................................................................. 26
Figure 7-1. Intel® RealSense™ ID Solution F455................................................. 35
Figure 8-1. USB Interposer Reference Design ...................................................... 36
Figure 8-2. UART Interposer Reference Design .................................................... 37

6 Rev: 001
List of Tables
Table 1-1: Intel® RealSense™ ID Solution F450 Configurations .............................. 8
Table 2-1: Intel® RealSense™ ID Solution F450 Component List........................... 10
Table 2-2: Data Interface ................................................................................. 11
Table 2-3: Power Interface ............................................................................... 11
Table 2-4: Power Consumption.......................................................................... 12
Table 2-5: Intel® RealSense™ ID Solution F450 Module Pin Out ........................... 12
Table 2-6. Interposer Interconnect Signal Description ......................................... 13
Table 2-7: Camera Parameters.......................................................................... 15
Table 2-8: Lens Parameters .............................................................................. 15
Table 2-9: IR Illuminator Parameters ................................................................. 15
Table 2-10: Intel® RealSense™ ID Solution F450 Temperature Specifications(1) ...... 15
Table 2-11: Temperature Component Considerations ........................................... 16
Table 2-12: Intel® RealSense™ ID Solution F455 Temperature Specifications(1) ...... 16
Table 2-13: Firmware Upgrade Parameter .......................................................... 17
Table 3-1: Intel® RealSense™ ID Solution F450 Module Dimensions...................... 18
Table 3-2: Intel® RealSense™ ID Solution F455 Peripheral Dimensions ................. 18
Table 3-3: Transmissivity Requirement............................................................... 19
Table 3-4: Human Height ................................................................................. 20
Table 4-1: Functional Metrics ............................................................................ 22
Table 4-2: Face Authentication Metrics ............................................................... 22
Table 4-3: Performance Metrics ......................................................................... 23
Table 5-1: Product Assembly Recommendation ................................................... 24
Table 5-2: Product Design Recommendation ....................................................... 25
Table 5-3: User Sensing Parameters .................................................................. 26
Table 5-4: Result Scenario Feedback.................................................................. 27
Table 5-5: Device Status Scenario Feedback ....................................................... 27
Table 6-1. U.S. FDA Accession Number............................................................... 29

Rev: 001 7
Revision History
Revision
Description
Date
001
•Initial Public Release
January 2021
§ §

Overview
8 Rev: 001
1Overview
The Intel® RealSense™ID Solution F450 is an embedded face authentication module
built upon a closed real-time operating system (RTOS) using neural network
algorithms. The Intel® RealSense™ ID Solution F450 module integrates the optical
components and processing hardware necessary to integrate high performance, local
face authentication capabilities into new and existing product types. The Intel®
RealSense™ ID Solution F455 is a peripheral device that incorporates the Intel®
RealSense™ ID Solution F450 module.
Figure 1-1: Intel® RealSense™ ID Solution F450 Module
The Intel® RealSense™ ID Solution F450 can be implemented as a peripheral or host.
If the Intel® RealSense™ ID Solution F450 is implemented as a peripheral, the
embedded host module or external host system will be responsible for defining the
enrollment and authentication flows using the Intel® RealSense™ ID Solution F450
software programming interface. The host will also be responsible for manageability,
power delivery, and connectivity to the outside world.
Table 1-1: Intel® RealSense™ ID Solution F450 Configurations
CONFIG
DESCRIPTION
Embedded
The Intel® RealSense™ ID Solution F450 is an embedded peripheral. An
embedded host module controls all boot-up and runtime flows of the Intel®
RealSense™ ID Solution F450 module through an internal data link
connection.
Host
The Intel® RealSense™ ID Solution F450 is both an embedded peripheral
and a host. The Intel® RealSense™ ID Solution F450 controls the power up
and runtime flows as a standalone device. A data link for command and
control is not necessary in this standalone configuration.
Peripheral
(Dev Kit)
The Intel® RealSense™ ID Solution F450 is an external peripheral
integrated into a mechanical housing. The Intel® RealSense™ ID Solution
F450 connects to an external host system through an external cable,
typically USB2.

Overview
Rev: 001 9
Figure 1-2: Intel® RealSense™ ID Solution F450 Module Host System Topology

Hardware Details
10 Rev: 001
2Hardware Details
The Intel® RealSense™ ID Solution F450 module is a single optical PCB subassembly
with processing capabilities that the product will mount into a system chassis and
connect to a host. The optical components consist of both image sensors and
illumination components.
Figure 2-1: Intel® RealSense™ ID Solution F450 Module Front Side
Table 2-1: Intel® RealSense™ ID Solution F450 Component List
SECTION
DESCRIPTION
SOC
System on Chip
Right Camera
Full HD RGB Camera
Left Camera
Full HD Camera
Projector
850nm IR
LED
850nm IR
Host Connector
IPEX 20708-050E Receptacle (50pin)
Crystal
24MHz
Flash
512Mb Storage
Figure 2-2: Intel® RealSense™ ID Solution F450 Module Rear Side

Hardware Details
Rev: 001 11
2.1 Host Interconnect
The Intel® RealSense™ ID Solution F450 module requires external power and a serial
data link for initialization and control of the Face Authentication system. Data signals
and external power are both routed through the same host connector interface.
2.1.1 Data Interface
The Intel® RealSense™ ID Solution F450 supports both UART and USB2 interfaces for
the data link. The boot up interface is configured through a FW and module strap
option.
Table 2-2: Data Interface
SECTION
DATA RATE
PINS
UART
(3V Interface)
115.2kbs to 4Mbps
UART_TX (Pin 47), UART_RX (Pin 49)
USB2
480Mbs
USB2_DP (Pin 46), USB2_DN (Pin 48)
2.1.2 Power Interface
The Intel® RealSense™ ID Solution F450 module has a peak power of up to 3W. The
host system must ensure the power supply can satisfy this peak power based on the
chosen Intel® RealSense™ ID Solution F450 voltage source (VDD). If the host
module supports power gate control it is the responsibility of the host module to
ensure no conflicts between power sequencing and data link initialization occurs
during power-up and power-down cycles.
Table 2-3: Power Interface
PIN
VOLTAGE RANGE
PEAK POWER
VDD (Pin 51/52)
3.15 to 5.0V
2.1 –3.0W(1)(2)
GND
-
-
NOTES:
(1) The power range is primarily dependent on illumination power set by the device.
(2) The typical max current for a USB2 port is 450mA, USB3 port is 900mA.
The Intel® RealSense™ ID Solution F450 supports three device states, off, standby,
and operation. In the off state the Intel® RealSense™ ID Solution F450 is shutdown
and the power supply from the host is disabled. In the standby, the Intel®
RealSense™ ID Solution F450 power supply is enabled, the SOC is in an execution
loop for manageability access or FW update, but the optical components are powered
down. In the operation state, the power supply is enabled, SOC is running FA
enrollment or authentication usage with the optical components activated.

Hardware Details
12 Rev: 001
Table 2-4: Power Consumption
SECTION
POWER CONSUMPTION
UNITS
Off
0
mW
Standby
50
mW
Operation
1.3
W
2.1.3 Receptacle Pin Out
The host connector receptacle part number is IPEX 20708-050E. The required host
cable plug for connecting the Intel® RealSense™ ID Solution F450 module must use
IPEX 20709-050E.
Table 2-5: Intel® RealSense™ID Solution F450 Module Pin Out
PIN
SIGNAL
PIN
SIGNAL
2
GND
1
CPU_RXD
4
AUDGPIO_2
3
CPU_TXD
6
AUDGPIO_1
5
GND
8
GND
7
-
10
CSI_DN1
9
I2C_SDA18
2
CSI_DP1
11
I2C_SCL18
14
GND
13
HOST_ADC_In
16
AUDGPIO_0
15
EXT_RSTn (Active Low)
18
-
17
GPO_1
20
GND
19
GPO_0
22
GPIO_6
21
GND
24
GPIO_5
23
-
26
GND
25
SDO1
28
GPIO_3
27
SCK1
30
GPIO_2
29
SDI1
32
GND
31
SEN1
34
CSI_CKN
33
GPO_4
36
CSI_CKP
35
GND
38
GND
37
CSI_VSD0
40
CSI_DN0
39
SCL_3
42
CSI_DP0
41
SDA_3
44
GND
43
PWM4
46
USB_DP
45
PWM3

Hardware Details
Rev: 001 13
48
USB_DM
47
CPU_TXD2
50
GND
49
CPU_RXD2
52
5V (Connector Pin)
51
5V (Connector Pin)
54
GND (Connector Pin)
53
GND (Connector Pin)
Table 2-6. Interposer Interconnect Signal Description
Position
Signal
Intel®
RealSense™
ID Solution
F450
In/Out
Interconnect Description
1
CPU_RXD
Input
3V Debug UART RxD or USB AUX_IN
2
GND
Ground
3
CPU_TXD
Output
3V Debug UART TxD or USB AUX_OUT
5
GND
Ground
8
GND
Ground
14
GND
Ground
15
EXT_RSTn
Input
External Reset, Open/GND discrete, of
Intel® RealSense™ ID Solution F450
module (should be connected to open
drain I/O).
20
GND
Ground
21
GND
Ground
22
GPIO_6
Input/Output
3V General Purpose I/O, defined by FW
(No external PU/PD needed).
26
GND
32
GND
33
GPO_4
Output
GPIO Output (No external PU/PD
needed).
35
GND
Ground
38
GND
Ground
44
GND
46
USB2+
USB 2 differential pair positive
47
CPU_TxD2
Output
3V UART TxD (Output from the Intel®
RealSense™ ID Solution F450 Module)
48
USB2-
USB 2 differential pair negative
49
CPU_RxD2
Input
3V UART RxD (Input into the Intel®
RealSense™ ID Solution F450 Module)
50
GND
Ground
51
Vin
Power IN
F450 Power IN –3.15V –5.5V

Hardware Details
14 Rev: 001
Position
Signal
Intel®
RealSense™
ID Solution
F450
In/Out
Interconnect Description
(Peak power consumption = 3.05W)
Typical = 3.6V
Maximum = 5.5V
Minimum = 3.15V
52
Vin
Power IN
Intel® RealSense™ ID Solution F450
Power IN –3.15V –5.5V
(Peak power consumption = 3.05W)
Typical = 3.6V
Maximum = 5.5V
Minimum = 3.15V
53
GND
Ground IN
Ground
54
GND
Ground IN
Ground
Figure 2-3: Intel® RealSense™ ID Solution F450 Connector Pin 1 Location
2.2 Optical System
2.2.1 Cameras
The optical system consists of two synced semi-mechanically aligned cameras which
capture images from different perspectives for the purpose of 3D triangulation to
create disparity. The Intel® RealSense™ ID Solution F450 utilizes the cameras for
face authentication. The right camera can provide 1080P RGB.
Note: Although face authentication utilizes RAW format from the sensor, only the processed
RGB video stream can be transmitted externally to the host.

Hardware Details
Rev: 001 15
Table 2-7: Camera Parameters
DIMENSION
CAMERA 1
CAMERA 2
Position (Camera Perspective)
Right
Left
Orientation
Portrait
Portrait
RGB Support
Yes
No
Table 2-8: Lens Parameters
DIMENSION
MIN
Field of View (Mono)
HFOV = 59o, VFOV = 80o, DFOV = 91o
2.2.2 IR Illuminators
The optical system consists of an IR LED for face illumination in low or non-uniform
lighting conditions and an IR dot projector for 3D triangulation to create disparity.
The illumination angle and placement of these components is chosen based on the
field of view for both cameras.
The IR illuminators are both tested to the eye safety industry standards as defined by
the IEC.
Table 2-9: IR Illuminator Parameters
DIMENSION
DOT PROJECTOR
LED
Orientation
Portrait
Portrait
Wavelength
850nm
850nm
Regulatory
Class 1 (IEC-60825-1 ED3)
RG0 (IEC-62471)
2.3 Thermal
2.3.1 Intel® RealSense™ ID Solution F450 Thermal
The Intel® RealSense™ ID Solution F450 module is designed to work indoors and
outdoors across a wide temperature range.
Table 2-10: Intel® RealSense™ ID Solution F450 Temperature Specifications(1)
DIMENSION
MIN
NOM
MAX
UNIT
Storage Temperature
-30
-
+70
oC
Operational
-30
-
+70
oC
Performance
0
-
+50
oC
NOTES:

Hardware Details
16 Rev: 001
1. Specification is based on preliminary assessment and will continue quality and reliability to
finalize in later datasheet versions.
The optical properties of the camera and projector components can change based on
the temperature of the component. This can range to a decrease in camera quality or
decrease in the illumination power. Either of these can have an impact on face
authentication performance, including the user being required to stand closer to the
Intel® RealSense™ ID Solution F450 module.
Table 2-11: Temperature Component Considerations
COMPONENT
PARAMETER
DESCRIPTION
Projector
Optical Power
The distance in which can be detected by the camera.
Field of View
The area in which covers the camera FOV.
Wavelength
Aligned to sensitivity of the camera IR channel.
Camera
Field of View
The area in which covers the camera FOV.
MTF
Sharpness of fuzziness of the camera FOV.
Sensitivity
Detection of user wavelengths across the FA spectrum.
SNR
Signal quality of the input data into the FA algorithms.
Lag
Time delta in which photons are measured by the camera.
2.3.2 Intel® RealSense™ ID Solution F455 Thermal
Table 2-12: Intel® RealSense™ ID Solution F455 Temperature Specifications(1)
DIMENSION
MIN
NOM
MAX
UNIT
Storage Temperature
-30
-
+70
oC
Operational
-30
-
+60
oC
Performance
0
-
+40
oC
NOTES:
1. Specification is based on preliminary assessment and will continue quality and reliability to
finalize in later datasheet versions.
2.3.3 Power Profiling
To minimize thermal dissipation design requirements for integrating the module into a
system, it is recommended to maintain a 2s cycle mode of work. Face authentication
is designed to work within this time span, but if the module is operating continuously
this will cause heating which may not be dissipated by design.
2.4 Firmware Upgrade
The Intel® RealSense™ ID Solution F450 implements 512Mb of local storage which
will contain the OS and face authentication runtime. Intel will provide a FW image

Hardware Details
Rev: 001 17
which is used for initial provisioning of the Intel® RealSense™ ID Solution F450. The
FW image contains a local flash update runtime which allows the host to push new FW
payloads to update the Intel® RealSense™ ID Solution F450 device.
Table 2-13: Firmware Upgrade Parameter
PARAMETER
SUPPORT
DESCRIPTION
FW Public Key
Yes
Stored on the Intel® RealSense™ ID Solution F450
device.
Signed FW
Yes
Update tool will compare signature before update.
Rollback Protection
No
Host system checks version before initiating an update.
Local Update
No
Host system must push payload.
Update Tool
Yes
Local Storage via Intel Tool
Host Interface
Yes
USB and UART

Mechanical
18 Rev: 001
3Mechanical
The small form factor of the Intel® RealSense™ ID Solution F450 module enables
integration flexibility. The host system will mount and tilt the Intel® RealSense™ ID
Solution F450 module based on the system installation height specification, user
height range, and user approach paths to the device. The placement and orientation
of the system design will depend on the following factors.
1. Sensor and lens field of view.
2. User height range and approach path.
3. Detection range of the face authentication system.
3.1 Mechanical Dimensions
Table 3-1: Intel® RealSense™ ID Solution F450 Module Dimensions
DIMENSION
MIN
NOM
MAX
TOLERANCE
UNIT
X
-
49.8
-
 0.15
mm
Y
-
18
-
 0.15
mm
Z
-
4.375
-
 0.2
mm
Figure 3-1: Intel® RealSense™ ID Solution F450 Module Dimensions
Table 3-2: Intel® RealSense™ ID Solution F455 Peripheral Dimensions
DIMENSION
MIN
NOM
MAX
TOLERANCE
UNIT
X
-
62
-
 0.1
mm
Y
-
32.50
-
 0.1
mm
Z
-
11
-
 0.15
mm

Mechanical
Rev: 001 19
3.2 Cover Glass
The Intel® RealSense™ ID Solution F450 module components must be covered to
minimize impact of dust and humidity. The transparent cover glass material stack-up
must provide acceptable transmission based on the component wavelengths. The
through hole sizes of the cover glass is dependent on the optical component field of
view or field of illumination as well as the cone diameter from the optical component
to the cover glass.
A 3D CAD assessment should be completed to ensure no collision between the cone
part of each optical component and the cover glass opening.
Table 3-3: Transmissivity Requirement
THROUGH HOLE
TRANSMISSIVITY
1, 2, 3 and 4
>98% @ 400nm to 865nm
Figure 3-2: Through Hole Design
3.3 Optical Isolation
It is recommended to isolate the cameras from the illumination components to
prevent reflections off the cover material. Not properly isolating the cameras can
result in leakage light from the illumination components. It is recommended to use a
gasket material in between the cover glass and the Intel® RealSense™ ID Solution
F450 module. The gasket material needs to be compliant so that it does not transmit
chassis flex forces to the module.

Mechanical
20 Rev: 001
Figure 3-3: Gasket
3.4 Orientation
The module can be assembled in either 0oor 180olandscape rotation. The module
cannot be assembled in a 90oor 270oportrait orientation.
Figure 3-4: Mount Orientation
3.5 System Tilt
Given the field of view of the cameras and illumination components, assembling the
Intel® RealSense™ ID Solution F450 module parallel to a typical mounting surface
may not cover the intended user height range for the product requirement. To
mitigate, the Intel® RealSense™ ID Solution F450 module can be assembled at an
angle to adjust the min and max user height for face authentication.
Table 3-4: Human Height
DIMENSION
MIN
NOM
MAX
UNIT
Vertical Range @ 55cm
120
-
190
cm
System Tilt
11
16
21
deg
Height Placement(1)
1.1
1.2
1.25
m
NOTES:
(1) The height placement is with respect to the sensor center line position.