Intel G35 Express Chipset Instruction Manual

Document Number: 317609-001
Intel®G35 Express Chipset
Thermal and Mechanical Design Guidelines
— For the Intel®82G35 Graphics and Memory Controller Hub
(GMCH)
August 2007

2 Thermal and Mechanical Design Guidelines
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR
IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT
AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY
WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL
PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY,
OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended
for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel
reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from
future changes to them.
The Intel 82G35 Graphics and Memory Controller Hub (GMCH) may contain design defects or errors known as errata which may
cause the product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Intel, Pentium, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United
States and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2007, Intel Corporation. All rights reserved.

Thermal and Mechanical Design Guidelines 3
Contents
1Introduction.....................................................................................................7
1.1 Terminology ..........................................................................................8
1.2 Reference Documents .............................................................................9
2Product Specifications......................................................................................11
2.1 Package Description..............................................................................11
2.1.1 Non-Grid Array Package Ball Placement......................................11
2.2 Package Loading Specifications...............................................................12
2.3 Thermal Specifications ..........................................................................13
2.4 Thermal Design Power (TDP)..................................................................13
2.4.1 Definition...............................................................................13
2.4.2 Methodology...........................................................................14
2.4.3 Specifications .........................................................................14
2.4.4 TCONTROL Limit..........................................................................14
2.5 Non-Critical to Function Solder Balls........................................................15
3Thermal Metrology..........................................................................................17
3.1 Case Temperature Measurements...........................................................17
3.1.1 Thermocouple Attach Methodology.............................................17
3.2 Airflow Characterization ........................................................................19
4Reference Thermal Solution..............................................................................21
4.1 Operating Environment .........................................................................21
4.1.1 ATX Form Factor Operating Environment ....................................21
4.1.2 Balanced Technology Extended (BTX) Form Factor Operating
Environment...........................................................................22
4.2 Reference Design Mechanical Envelope....................................................23
4.3 Thermal Solution Assembly....................................................................23
4.4 Environmental Reliability Requirements...................................................25
Appendix A Enabled Suppliers ...........................................................................................27
Appendix B Mechanical Drawings.......................................................................................29

4 Thermal and Mechanical Design Guidelines
Figures
Figure 1. GMCH Non-Grid Array ........................................................................12
Figure 2. Nominal Package Height ....................................................................13
Figure 3. Non-Critical to Function Solder Balls.....................................................15
Figure 4. 0° Angle Attach Methodology (top view, not to scale)..............................18
Figure 5. 0° Angle Attach Heatsink Modifications (generic heatsink side and
bottom view shown, not to scale) ......................................................18
Figure 6. Airflow andTemperature Measurement Locations ....................................19
Figure 7. Processor Heatsink Orientation to Provide Airflow to GMCH Heatsink
on an ATX Platform ............................................................................22
Figure 8. Processor Heatsink Orientation to Provide Airflow to GMCH Heatsink
on a Balanced Technology Extended (BTX) Platform................................23
Figure 9. ATX GMCH Heatsink - Installed on Board...............................................24
Figure 10. Balanced Technology Extended (BTX) GMCH Heatsink - Installed on Board25
Figure 11. GMCH Package Drawing....................................................................30
Figure 12. GMCH Keep-Out Restrictions for ATX Platforms.....................................31
Figure 13. GMCH Keep-Out Restrictions for Balanced Technology Extended (BTX)
Platforms........................................................................................32
Figure 14. GMCH Reference Heatsink for ATX Platforms – Sheet 1..........................33
Figure 15. GMCH Reference Heatsink for ATX Platforms – Sheet 2..........................34
Figure 16. GMCH Heatsink for ATX Platforms – Anchor .........................................35
Figure 17. GMCH Reference Heatsink for ATX Platforms – Ramp Retainer Sheet 1 ....36
Figure 18. GMCH Reference Heatsink for ATX Platforms – Ramp Retainer Sheet 2 ....37
Figure 19. GMCH Reference Heatsink for ATX Platforms – Wire Preload Clip.............38
Figure 20. GMCH Reference Heatsink for Balanced Technology Extended (BTX)
Platforms .......................................................................................39
Figure 21. GMCH Reference Heatsink for Balanced Technology Extended (BTX)
Platforms – Clip ..............................................................................40
Tables
Table 1. Package Loading Specifications............................................................12
Table 2. Thermal Specifications .......................................................................14
Table 3. ATX Reference Thermal Solution Environmental Reliability Requirements
(Board Level) ...................................................................................25
Table 4. Balanced Technology Extended (BTX) Reference Thermal Solution
Environmental Reliability Requirements (System Level)..........................26
Table 5. ATX Intel Reference Heatsink Enabled Suppliers for Intel®G35
Express Chipset ................................................................................27
Table 6. Balanced Technology Extended (BTX) Intel®Reference Heatsink
Enabled Suppliers for Intel®G35 Express Chipset ..................................27
Table 7. Supplier Contact Information ..............................................................28

Thermal and Mechanical Design Guidelines 5
Revision History
Revision
Number Description Date
-001 •Initial release. August 2007
§

6 Thermal and Mechanical Design Guidelines

Introduction
Thermal and Mechanical Design Guidelines 7
1Introduction
As the complexity of computer systems increases, so do power dissipation
requirements. The additional power of next generation systems must be properly
dissipated. Heat can be dissipated using improved system cooling, selective use of
ducting, and/or passive heatsinks.
The objective of thermal management is to ensure that the temperatures of all
components in a system are maintained within functional limits. The functional
temperature limit is the range within which the electrical circuits can be expected to
meet specified performance requirements. Operation outside the functional limit can
degrade system performance, cause logic errors, or cause component and/or system
damage. Temperatures exceeding the maximum operating limits may result in
irreversible changes in the operating characteristics of the component.
This document is for the following device:
•Intel®G35 Express Chipset GMCH (82G35 GMCH)
This document presents the conditions and requirements to properly design a cooling
solution for systems that implement the GMCH. Properly designed solutions provide
adequate cooling to maintain the GMCH case temperature at or below thermal
specifications. This is accomplished by providing a low local-ambient temperature,
ensuring adequate local airflow, and minimizing the case to local-ambient thermal
resistance. By maintaining the GMCH case temperature at or below those
recommended in this document, a system designer can ensure the proper
functionality, performance, and reliability of this component.
Note: Unless otherwise specified the information in this document applies to all
configurations of the Intel®G35 Express Chipset. The Intel®G35 Express Chipset will
be available with integrated graphics and associated SDVO and analog display ports.
The Intel®G35 Express Chipset is a Graphics Memory Controller Hub (GMCH) targeted
for use with the Intel®Core™2 Duo processor family and Intel®Core™2 Quad
processor family in the LGA775 Land Grid Array Package and the Intel®ICH8 in
desktop platforms.
Note: In this document the use of the term chipset refers to the combination of the GMCH
and the Intel ICH8. For the ICH8 thermal details, refer to the Intel®I/O Controller Hub
8 (ICH8) Thermal Design Guidelines.

Introduction
8 Thermal and Mechanical Design Guidelines
1.1 Terminology
Term Description
FC-BGA Flip Chip Ball Grid Array. A package type defined by a plastic substrate where a
die is mounted using an underfill C4 (Controlled Collapse Chip Connection)
attach style. The primary electrical interface is an array of solder balls attached
to the substrate opposite the die. Note that the device arrives at the customer
with solder balls attached.
Intel®ICH8 Intel®I/O Controller Hub 8. The chipset component that contains the primary
PCI interface, LPC interface, USB, ATA, and/or other legacy functions.
GMCH Graphic Memory Controller Hub. The chipset component that contains the
processor and memory interface and integrated graphics core.
TAThe local ambient air temperature at the component of interest. The ambient
temperature should be measured just upstream of airflow for a passive
heatsink or at the fan inlet for an active heatsink.
TCThe case temperature of the GMCH component. The measurement is made at
the geometric center of the die.
TC-MAX The maximum value of TC.
TC-MIN The minimum valued of TC.
TDP Thermal Design Power is specified as the maximum sustainable power to be
dissipated by the GMCH. This is based on extrapolations in both hardware and
software technology. Thermal solutions should be designed to TDP.
TIM Thermal Interface Material: thermally conductive material installed between
two surfaces to improve heat transfer and reduce interface contact resistance.
ΨCA Case-to-ambient thermal solution characterization parameter (Psi). A measure
of thermal solution performance using total package power. Defined as
(TC– TA) / Total Package Power. Heat source size should always be specified for
Ψmeasurements.

Introduction
Thermal and Mechanical Design Guidelines 9
1.2 Reference Documents
Document Location
Intel®G35 Express Chipset Datasheet http://www.intel.com/
design/chipsets/datas
hts/317607.htm
Intel®I/O Controller Hub 8 (ICH8) Family Thermal Design Guidelines http://www.intel.com/
design/chipsets/desig
nex/313058.htm
Intel®Core™2 Duo Processor and Intel®Pentium®Dual Core Processor
Thermal and Mechanical Design Guidelines http://www.intel.com /design/processor/spe
cupdt/313279.htm
Intel®Core™2 Extreme Quad-Core Processor and Intel®Core™2 Quad
Processor Thermal and Mechanical Design Guidelines http://www.intel.com /design/processor/des
ignex/315594.htm
Balanced Technology Extended (BTX) Interface Specification http://www.formfacto
rs.org
Various System Thermal Design Suggestions http://www.formfacto
rs.org
Various Chassis Thermal and Mechanical Design Suggestions http://www.formfacto
rs.org
§

Introduction
10 Thermal and Mechanical Design Guidelines

Product Specifications
Thermal and Mechanical Design Guidelines 11
2Product Specifications
2.1 Package Description
The GMCH is available in a 34 mm [1.34 in] x 34 mm [1.34 in] Flip Chip Ball Grid
Array (FC-BGA) package with 1226 solder balls. The die size is currently 11.83 mm
[0.466in] x 10.52 mm [0.414in] and is subject to change. A mechanical drawing of
the package is shown in Figure 11.
2.1.1 Non-Grid Array Package Ball Placement
The GMCH package uses a “balls anywhere” concept. Minimum ball pitch is 0.8 mm
[0.031 in], but ball ordering does not follow a 0.8-mm grid. Board designers should
ensure correct ball placement when designing for the non-grid array pattern. For exact
ball locations relative to the package, contact your Intel Field Sales Representative.

Product Specifications
12 Thermal and Mechanical Design Guidelines
Figure 1. GMCH Non-Grid Array
34 x 34mm Substrate [1.34 x 1.34 in]
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Non-standard grid ball pattern. Minimum Pitch 0.8mm [0.31 in]
2.2 Package Loading Specifications
Table 1 provides static load specifications for the package. This mechanical maximum
load limit should not be exceeded during heatsink assembly, shipping conditions, or
standard use condition. Also, any mechanical system or component testing should not
exceed the maximum limit. The package substrate should not be used as a mechanical
reference or load-bearing surface for the thermal and mechanical solution.
Table 1. Package Loading Specifications
Parameter Maximum Notes
Static 15 lbf 1,2,3
NOTES:
1. These specifications apply to uniform compressive loading in a direction normal to the
package.
2. This is the maximum force that can be applied by a heatsink retention clip. The clip must
also provide the minimum specified load on the package.
3. These specifications are based on limited testing for design characterization. Loading limits
are for the package only.

Product Specifications
Thermal and Mechanical Design Guidelines 13
To ensure the package static load limit is not exceeded, the designer should
understand the post reflow package height. The following figure shows the nominal
post-reflow package height assumed for calculation of a heatsink clip preload of the
reference design. Refer to the package drawing in Appendix B to perform a detailed
analysis.
Figure 2. Nominal Package Height
PCB
2.38 mm
Solder Ball
Top of (G)MCH
2.3 Thermal Specifications
To ensure proper operation and reliability of the GMCH, the temperature must be at or
below the maximum case temperature specified in Table 2 when operating at TDP.
System and component level thermal enhancements are required to dissipate the heat
generated and maintain the GMCH within specifications. Chapter 0 provides the
thermal metrology guidelines for case temperature measurements.
The GMCH should also operate above the minimum case temperature specification
listed in Table 2.
2.4 Thermal Design Power (TDP)
2.4.1 Definition
Thermal design power (TDP) is the estimated power dissipation of the GMCH based on
normal operating conditions including VCC and TC-MAX while executing real worst-case
power intensive applications. This value is based on expected worst-case data traffic
patterns and usage of the chipset and does not represent a specific software
application. TDP attempts to account for expected increases in power due to variation
in GMCH current consumption due to silicon process variation, processor speed, DRAM
capacitive bus loading and temperature. However, since these variations are subject
to change, the TDP cannot guarantee that all applications will not exceed the TDP
value.
The system designer must design a thermal solution for the GMCH such that it
maintains TCbelow TC-MAX for a sustained power level equal to TDP. Please note that
the TC-MAX specification is a requirement for a sustained power level equal to TDP, and
that the case temperature must be maintained at temperatures less than TC-MAX when
operating at power levels less than TDP. This temperature compliance is to ensure
component reliability over its useful life. The TDP value can be used for thermal design
if the thermal protection mechanisms are enabled. The GMCH incorporate a hardware-
based fail-safe mechanism to keep the product temperature in specification in the
event of unusually strenuous usage above the TDP power.

Product Specifications
14 Thermal and Mechanical Design Guidelines
2.4.2 Methodology
2.4.2.1 Pre-Silicon
To determine TDP for pre-silicon products in development, it is necessary to make
estimates based on analytical models. These models rely on knowledge of the past
GMCH power dissipation behavior along with knowledge of planned architectural and
process changes that may affect TDP. Knowledge of applications available today and
their ability to stress various aspects of the GMCH is also included in the model. The
projection for TDP assumes GMCH operation at TC-MAX. The TDP estimate also accounts
for normal manufacturing process variation.
2.4.2.2 Post-Silicon
Once the product silicon is available, post-silicon validation is performed to assess the
validity of pre-silicon projections. Testing is performed on both commercially available
and synthetic high power applications and power data is compared to pre-silicon
estimates. Post-silicon validation may result in a small adjustment to pre-silicon TDP
estimates.
2.4.3 Specifications
The data in Table 2 is based on post-silicon power measurements of the GMCH. The
system configuration is: two (2) DIMMs per channel, DDR2, FSB operating at the top
speed allowed by the chipset with a processor operating at that system bus speed. FC-
BGA packages have poor heat transfer capability into the board and have minimal
thermal capability without thermal solutions. Intel requires that system designers plan
for an attached heatsink when using the GMCH.
Table 2. Thermal Specifications
Component System
Bus Speed Memory Frequency TC-
MIN TC-MAX Max
Idle
Power
TDP
Value
Intel®82G35 GMCH 1333 MHz 800 MHz 0 °C 97°C 11 W 28 W
NOTES:
1. Thermal specifications assume an attached heatsink is present.
2. Max Idle Power is the worst case idle power in system booted to Windows* with no
background applications running.
3. When an external graphics card is installed in a system with the Intel®G35 Express
Chipset, the TDP for this part will drop to approximately 19 W. The GMCH will detect the
presence of the graphics card and disable the on-board graphics resulting in the lower
GMCH TDP.
2.4.4 TCONTROL Limit
Intel®Quiet System Technology (Intel®QST) monitors an embedded thermal sensor.
The maximum operating limit when monitoring this thermal sensor is TCONTROL. For the
GMCH this value has been defined as 95 °C. This value should be programmed into
the appropriate fields of Intel QST as the maximum sensor temperature for operation
of the Intel 82G35 GMCH.

Product Specifications
Thermal and Mechanical Design Guidelines 15
2.5 Non-Critical to Function Solder Balls
Intel has defined selected solder joints of the GMCH as non-critical to function (NCTF)
when evaluating package solder joints post environmental testing. The GMCH signals
at NCTF locations are typically redundant ground or non-critical reserved, so the loss
of the solder joint continuity at end of life conditions will not affect the overall product
functionality. Figure 3 identifies the NCTF solder joints of the GMCH package.
Figure 3. Non-Critical to Function Solder Balls
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AC3 7 AC39
AA39
AG38
AF38
AG37
AF37 AF39
AG39
AD4 3
AA42
AC42
AB43
AC41
AD4 2
AA41
AB42
AG42
AE42
AG41
AF42
AE41
AF43
B
D
F
H
K
M
P
T
V
Y
AD
AB
AF
AJ
AL
AN
AR
AU
AW
BA
BC
30 32 3634 38 4240
AY35
AL36
AN36
AM3 6
BB35
BA35
AJ36
AR32
AN3 2
AL32
AJ32
AP32
AT32
AM3 1
AL31
AK30
AJ30
AL29
AM2 9
AK29
AJ29 AJ31
AT31
AN3 1
AR3 1
AP31AP29
AR2 9
AT29
AN2 9
AM3 4
AJ34
AL34
AL3 3
AJ33
AM33
AJ35
AL35
AM35
AR33
AT33
AN3 3
AR3 5
AN35
AY32
AW32
BC3 2
AU32
BB32
AV32
AY29 AY31
AW31
AU3 1
AV31
AU2 9
AW29
AV29
BB30
BA30
BC3 0
BB29
BA29 BA31
BB31
AY33
AV33
AW33
AU33
AV35
AW35
AU3 5
BC34
BA34
BB34
BA33
BB33
AL40
AK41
AJ40
AP41
AM4 0
AR4 0
AN4 0
AM3 8
AJ38
AL38
AM37
AJ37
AL3 7 AL 39
AM3 9
AJ39
AN3 8
AR3 8
AR3 7
AN3 7
AR3 9
AN3 9
AK43
AJ42
AL42
AK42
AH4 2
AJ41
AL4 1
AP43
AR42
AN42
AM4 2
AP42
AR41
AN4 1
AM43
AU4 0
BB40BC41
BB41
AV40
AW41
AY38
AU3 8
AV38
AY37
AV37
AU3 7
AW37
AY40
AU3 9
AW39
BB38
BA38
BC3 7
BB37
BC3 9
BB39BA40
BA39
AV42
AY42
AW43
AU43
AY41
AV41
AU4 2
AW42
BA43
BC43
BB43
BB42
BA42
BC4 2
29 31 33 35 37 39 4341
AT
AM
AK
AP
AY
AV
BB
§

Product Specifications
16 Thermal and Mechanical Design Guidelines

Thermal Metrology
Thermal and Mechanical Design Guidelines 17
3Thermal Metrology
The system designer must measure temperatures in order to accurately determine the
thermal performance of the system. Intel has established guidelines for proper
techniques of measuring GMCH component case temperatures.
3.1 Case Temperature Measurements
To ensure functionality and reliability of the GMCH the TCmust be maintained at or
below the maximum temperature listed in Table 2. The surface temperature measured
at the geometric center of the die corresponds to TC. Measuring TCrequires special
care to ensure an accurate temperature reading.
Temperature differences between the temperature of a surface and the surrounding
local ambient air can introduce error in the measurements. The measurement errors
could be due to a poor thermal contact between the thermocouple bead and the
surface of the package, heat loss by radiation and/or convection, conduction through
thermocouple leads, or contact between the thermocouple cement and the heatsink
base (if a heatsink is used). To minimize these measurement errors a thermocouple
attach with a zero-degree methodology is recommended.
3.1.1 Thermocouple Attach Methodology
1. Mill a 3.3 mm [0.13 in] diameter hole centered on bottom of the heatsink base.
The milled hole should be approximately 1.5 mm [0.06 in] deep.
2. Mill a 1.3 mm [0.05 in] wide slot, 0.5 mm [0.02 in] deep, from the centered hole
to one edge of the heatsink. The slot should be in the direction parallel to the
heatsink fins (see Figure 5).
3. Attach thermal interface material (TIM) to the bottom of the heatsink base.
4. Cut out portions of the TIM to make room for the thermocouple wire and bead.
The cutouts should match the slot and hole milled into the heatsink base.
5. Attach a 36 gauge or smaller K-type thermocouple bead to the center of the top
surface of the die using cement with high thermal conductivity. During this step,
make sure no contact is present between the thermocouple cement and the
heatsink base because any contact will affect the thermocouple reading. It is
critical that the thermocouple bead makes contact with the die (see
Figure 4).
6. Attach heatsink assembly to the GMCH, and route thermocouple wires out through
the milled slot.

Thermal Metrology
18 Thermal and Mechanical Design Guidelines
Figure 4. 0° Angle Attach Methodology (top view, not to scale)
Figure 5. 0° Angle Attach Heatsink Modifications (generic heatsink side and bottom
view shown, not to scale)

Thermal Metrology
Thermal and Mechanical Design Guidelines 19
3.2 Airflow Characterization
Figure 6 shows the recommended location for air temperature measurements
measured relative to the component. For a more accurate measurement of the
average approach air temperature, Intel recommends averaging temperatures
recorded from two thermocouples spaced about 25 mm [1.0 in] apart. Locations for
both a single thermocouple and a pair of thermocouples are presented.
Figure 6. Airflow andTemperature Measurement Locations
Airflow velocity can be measured using sensors that combine air velocity and
temperature measurements. Typical airflow sensor technology may include hot wire
anemometers. Figure 6 provides guidance for airflow velocity measurement locations
which should be the same as used for temperature measurement. These locations are
for a typical JEDEC test setup and may not be compatible with chassis layouts due to
the proximity of the processor to the GMCH. The user may have to adjust the
locations for a specific chassis. Be aware that sensors may need to be aligned
perpendicular to the airflow velocity vector or an inaccurate measurement may result.
Measurements should be taken with the chassis fully sealed in its operational
configuration to achieve a representative airflow profile within the chassis.
§

Thermal Metrology
20 Thermal and Mechanical Design Guidelines