Intel BOXDG33TLM Configuration guide

May 2007
Order Number: D95738-001US
The Intel®Desktop Board DG33TL may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board DG33TL Specification Update.
Intel® Desktop Board
DG33TL
Technical Product Specification

Revision History
Revision Revision History Date
-001 First release of the Intel®Desktop Board DG33TL Technical Product
Specification.
May 2007
This product specification applies to only the standard Intel®Desktop Board DG33TL with BIOS
identifier DPP3510J.86A.
Changes to this specification will be published in the Intel Desktop Board DG33TL Specification
Update before being incorporated into a revision of this document.
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Copyright © 2007, Intel Corporation. All rights reserved.

iii
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the Intel®
Desktop Board DG33TL. It describes the standard product and available
manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Desktop Board
DG33TL and its components to the vendors, system integrators, and other engineers
and technicians who need this level of information. It is specifically not intended for
general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the board
2 A map of the resources of the board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
 NOTE
Notes call attention to important information.
# INTEGRATOR’S NOTES
Integrator’s notes are used to call attention to information that may be useful to
system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.

Intel Desktop Board DG33TL Technical Product Specification
iv
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/sec Gigabytes per second
Gbit Gigabit (1,073,741,824 bits)
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbit/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.

v
Contents
1Product Description
1.1 Overview........................................................................................ 10
1.1.1 Feature Summary ................................................................ 10
1.1.2 Board Layout ....................................................................... 12
1.1.3 Block Diagram ..................................................................... 14
1.2 Legacy Considerations...................................................................... 15
1.3 Online Support................................................................................ 15
1.4 Processor ....................................................................................... 15
1.5 System Memory .............................................................................. 16
1.5.1 Memory Configurations ......................................................... 17
1.6 Intel®G33 Express Chipset............................................................... 19
1.6.1 Intel G33 Graphics Subsystem ............................................... 19
1.6.2 Intel®Viiv™ Processor Technology.......................................... 21
1.6.3 USB ................................................................................... 21
1.6.4 Serial ATA Interfaces ............................................................ 22
1.7 Parallel IDE Controller ...................................................................... 23
1.8 Real-Time Clock Subsystem .............................................................. 23
1.9 Legacy I/O Controller....................................................................... 24
1.9.1 Consumer Infrared (CIR)....................................................... 24
1.9.2 Serial Port ........................................................................... 24
1.10 Audio Subsystem............................................................................. 25
1.10.1 Audio Subsystem Software .................................................... 26
1.10.2 Audio Connectors and Headers ............................................... 26
1.11 LAN Subsystem............................................................................... 27
1.11.1 Intel®82566DC Gigabit Ethernet Controller.............................. 27
1.11.2 LAN Subsystem Software....................................................... 28
1.11.3 RJ-45 LAN Connector with Integrated LEDs .............................. 28
1.12 Hardware Management Subsystem .................................................... 29
1.12.1 Hardware Monitoring and Fan Control...................................... 29
1.12.2 Fan Monitoring..................................................................... 29
1.12.3 Chassis Intrusion and Detection.............................................. 29
1.12.4 Thermal Monitoring .............................................................. 30
1.13 Power Management ......................................................................... 31
1.13.1 ACPI .................................................................................. 31
1.13.2 Hardware Support ................................................................ 34
2Technical Reference
2.1 Memory Map................................................................................... 39
2.1.1 Addressable Memory............................................................. 39
2.2 Connectors and Headers................................................................... 42
2.2.1 Back Panel Connectors .......................................................... 43
2.2.2 Component-side Connectors and Headers ................................ 44

Intel Desktop Board DG33TL Technical Product Specification
vi
2.3 Jumper Block .................................................................................. 53
2.4 Mechanical Considerations ................................................................ 54
2.4.1 Form Factor......................................................................... 54
2.5 Electrical Considerations................................................................... 55
2.5.1 Power Supply Considerations ................................................. 55
2.5.2 Fan Header Current Capability................................................ 55
2.5.3 Add-in Board Considerations .................................................. 56
2.6 Thermal Considerations.................................................................... 56
2.7 Reliability ....................................................................................... 58
2.8 Environmental ................................................................................ 58
3Overview of BIOS Features
3.1 Introduction ................................................................................... 59
3.2 BIOS Flash Memory Organization....................................................... 60
3.3 Resource Configuration .................................................................... 60
3.3.1 PCI* Autoconfiguration.......................................................... 60
3.3.2 PCI IDE Support................................................................... 61
3.4 System Management BIOS (SMBIOS)................................................. 61
3.5 Legacy USB Support ........................................................................ 62
3.6 BIOS Updates ................................................................................. 63
3.6.1 Language Support ................................................................ 63
3.6.2 Custom Splash Screen .......................................................... 63
3.7 BIOS Recovery................................................................................ 64
3.8 Boot Options................................................................................... 65
3.8.1 CD-ROM Boot ...................................................................... 65
3.8.2 Network Boot....................................................................... 65
3.8.3 Booting Without Attached Devices........................................... 65
3.8.4 Changing the Default Boot Device During POST ........................ 65
3.9 Adjusting Boot Speed....................................................................... 66
3.9.1 Peripheral Selection and Configuration..................................... 66
3.9.2 BIOS Boot Optimizations ....................................................... 66
3.10 BIOS Security Features .................................................................... 67
4Error Messages and Beep Codes
4.1 Speaker ......................................................................................... 69
4.2 BIOS Beep Codes ............................................................................ 69
4.3 BIOS Error Messages ....................................................................... 69
4.4 Port 80h POST Codes ....................................................................... 70
5Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance..................................................................... 75
5.1.1 Safety Standards.................................................................. 75
5.1.2 European Union Declaration of Conformity Statement................ 76
5.1.3 Product Ecology Statements................................................... 78
5.1.4 EMC Regulations .................................................................. 82
5.1.5 Product Certification Markings (Board Level)............................. 84
5.2 Battery Disposal Information............................................................. 85

Contents
vii
Figures
1. Major Board Components.................................................................. 12
2. Block Diagram ................................................................................ 14
3. Memory Channel and DIMM Configuration ........................................... 18
4. Back Panel Audio Connector Options .................................................. 26
5. LAN Connector LED Locations............................................................ 28
6. Thermal Sensors and Fan Headers ..................................................... 30
7. Location of the Standby Power Indicator LED....................................... 37
8. Detailed System Memory Address Map ............................................... 40
9. Back Panel Connectors ..................................................................... 43
10. Component-side Connectors and Headers ........................................... 44
11. Connection Diagram for Front Panel Header ........................................ 50
12. Connection Diagram for Front Panel USB Headers ................................ 52
13. Connection Diagram for IEEE 1394a Header ........................................ 52
14. Location of the Jumper Block............................................................. 53
15. Board Dimensions ........................................................................... 54
16. Localized High Temperature Zones..................................................... 57
Tables
1. Feature Summary............................................................................ 10
2. Board Components Shown in Figure 1 ................................................ 13
3. Supported Memory Configurations ..................................................... 16
4. DVI Port Status Conditions................................................................ 20
5. Audio Jack Retasking Support ........................................................... 25
6. LAN Connector LED States ................................................................ 28
7. Effects of Pressing the Power Switch .................................................. 31
8. Power States and Targeted System Power........................................... 32
9. Wake-up Devices and Events ............................................................ 33
10. System Memory Map ....................................................................... 41
11. Component-side Connectors and Headers Shown in Figure 10................ 45
12. HD Audio Link Header ...................................................................... 46
13. Front Panel Audio Header ................................................................. 46
14. Serial ATA Connectors...................................................................... 46
15. Serial Port Header ........................................................................... 46
16. Chassis Intrusion Header.................................................................. 47
17. Front and Rear Chassis (3-Pin) Fan Headers ........................................ 47
18. Processor (4-Pin) Fan Header ............................................................ 47
19. Auxiliary Front Panel Power/Sleep LED Header..................................... 48
20. Processor Core Power Connector........................................................ 49
21. Main Power Connector...................................................................... 49
22. Front Panel Header .......................................................................... 50
23. States for a One-Color Power LED...................................................... 51
24. States for a Two-Color Power LED...................................................... 51
25. BIOS Setup Configuration Jumper Settings.......................................... 53
26. Recommended Power Supply Current Values ....................................... 55
27. Fan Header Current Capability........................................................... 55

Intel Desktop Board DG33TL Technical Product Specification
viii
28. Thermal Considerations for Components ............................................. 57
29. Desktop Board DG33TL Environmental Specifications............................ 58
30. BIOS Setup Program Menu Bar.......................................................... 60
31. BIOS Setup Program Function Keys.................................................... 60
32. Acceptable Drives/Media Types for BIOS Recovery ............................... 64
33. Boot Device Menu Options ................................................................ 65
34. Supervisor and User Password Functions............................................. 67
35. Beep Codes .................................................................................... 69
36. BIOS Error Messages ....................................................................... 69
37. Port 80h POST Code Ranges.............................................................. 70
38. Port 80h POST Codes ....................................................................... 71
39. Typical Port 80h POST Sequence........................................................ 74
40. Safety Standards............................................................................. 75
41. Lead-Free Board Markings ................................................................ 81
42. EMC Regulations ............................................................................. 82
43. Product Certification Markings ........................................................... 84

9
1Product Description
What This Chapter Contains
1.1 Overview........................................................................................ 10
1.2 Legacy Considerations...................................................................... 15
1.3 Online Support................................................................................ 15
1.4 Processor ....................................................................................... 15
1.5 System Memory .............................................................................. 16
1.6 Intel®G33 Express Chipset............................................................... 19
1.7 Parallel IDE Controller ...................................................................... 23
1.8 Real-Time Clock Subsystem .............................................................. 23
1.9 Legacy I/O Controller....................................................................... 24
1.10 Audio Subsystem............................................................................. 25
1.11 LAN Subsystem............................................................................... 27
1.12 Hardware Management Subsystem .................................................... 29
1.13 Power Management ......................................................................... 31

Intel Desktop Board DG33TL Technical Product Specification
10
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the Desktop Board DG33TL.
Table 1. Feature Summary
Form Factor ATX (9.60 inches by 9.60 inches [243.84 millimeters by 243.84 millimeters])
Processor Support for the following:
•Intel®Core™2 Quad processor in an LGA775 socket with a 1066 MHz
system bus
•Intel®Core™2 Duo processor in an LGA775 socket with a 1333 or 1066 or 800
MHz system bus
•Intel®Pentium®Dual-Core processor in an LGA775 socket with an 800 MHz
system bus
•Intel®Celeron®processor in an LGA775 socket with an 800 MHz system bus
Memory •Four 240-pin DDR2 SDRAM Dual Inline Memory Module (DIMM) sockets
•Support for DDR2 800 or DDR2 667 MHz DIMMs
•Support for up to 8 GB of system memory using DDR2 800 or DDR2
667 DIMMs
Chipset Intel®G33 Express Chipset, consisting of:
•Intel®82G33 Graphics and Memory Controller Hub (GMCH)
•Intel®82801IR I/O Controller Hub (ICH9R)
Audio 8-channel (7.1) audio subsystem using the IDT* STAC9271D audio codec and
Dolby* Home Theater certification
Video Intel® Graphics Media Accelerator (Intel®GMA) 3100 onboard graphics
subsystem.
Legacy I/O Control Legacy I/O controller for serial port header and Consumer Infrared (CIR)
Peripheral
Interfaces
•12 USB 2.0 ports
•Two IEEE-1394a interfaces: one back panel connector and one front-panel
header
•Six Serial ATA (3 Gbps) interfaces, including one red-colored external Serial
ATA (eSATA) interface
•One Parallel ATA IDE interface with UDMA 33, ATA-66/100 support
•One serial port header (may require specialized chassis or cable for use)
LAN Support Gigabit (10/100/1000 Mbits/sec) LAN subsystem using the Intel®82566DC
Gigabit Ethernet Controller
BIOS •Intel®BIOS (resident in the SPI Flash device)
•Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
continued