Intel BOXDH61ZE User manual

Intel® Desktop Board
DH61ZE
Technical Product Specification
April 2012
Part Number: G48081-003
The Intel®Desktop Board DH61ZE may contain design defects or errors known as errata that may cause the product to deviate from published
specifications. Current characterized errata are documented in the Intel Desktop Board DH61ZE Specification Update.

ii
Revision History
Revision Revision History Date
-001 First release of the Intel®Desktop Board DH61ZE Technical Product
Specification
October 2011
-002 Second release of the Intel®Desktop Board DH61ZE Technical Product
Specification
November 2011
-003 Updated the Board Identification Information section April 2012
Disclaimer
This product specification applies to only the standard Intel®Desktop Board DH61ZE with BIOS
identifier BEH6110H.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL®PRODUCTS. NO LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR
SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR
IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT
OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN
WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN
WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR
DEATH MAY OCCUR.
All Intel®desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal
computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The
suitability of this product for other PC or embedded non-PC applications or other environments, such as
medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by
Intel.
Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other
intellectual property rights that relate to the presented subject matter. The furnishing of documents and
other materials and information does not provide any license, express or implied, by estoppel or otherwise,
to any such patents, trademarks, copyrights, or other intellectual property rights.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”
or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them.
Intel desktop boards may contain design defects or errors known as errata, which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Intel, Intel Core, and Pentium are trademarks of Intel Corporation in the U.S. and/or other countries.
* Other names and brands may be claimed as the property of others.
Copyright ©2011, 2012 Intel Corporation. All rights reserved.

iii
Board Identification Information
Basic Desktop Board DH61ZE Identification Information
AA Revision BIOS Revision Notes
G43004-101 BEH6110H.86A.0034 1,2
G43004-200 BEH6110H.86A.0034 1,2
G43004-201 BEH6110H.86A.0038 1,2
G43007-101 BEH6110H.86A.0034 1,2
G43007-200 BEH6110H.86A.0034 1,2
G43007-201 BEH6110H.86A.0038 1,2
Notes:
1. The AA number is found on a small label on the component side of the board.
2. The H61 processor used on this AA revision consists of the following component:
Device Stepping S-Spec Numbers
82H61 B3 SLJ4B
Errata
Current characterized errata, if any, are documented in a separate Specification
Update. See http://developer.intel.com/products/desktop/motherboard/index.htm
for the latest documentation.

iv

v
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the
Intel®Desktop Board DH61ZE.
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop
Board DH61ZE and its components to the vendors, system integrators, and other
engineers and technicians who need this level of information. It is specifically not
intended for general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the Intel Desktop Board DH61ZE
2 A map of the resources of the Intel Desktop Board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.

Intel Desktop Board DH61ZE Technical Product Specification
vi
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/s Gigabytes per second
Gb/s Gigabits per second
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/s 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/s Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbits/s Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.

vii
Contents
Revision History
Disclaimer............................................................................................... ii
Board Identification Information .................................................................iii
Errata.....................................................................................................iii
Preface
Intended Audience ................................................................................... v
What This Document Contains.................................................................... v
Typographical Conventions ........................................................................ v
1Product Description
1.1Overview........................................................................................ 11
1.1.1Feature Summary ................................................................ 11
1.1.2Board Layout ....................................................................... 13
1.1.3Block Diagram ..................................................................... 15
1.2Legacy Considerations...................................................................... 16
1.3Online Support................................................................................ 16
1.4Processor ....................................................................................... 16
1.5Intel®H61 Express Chipset ............................................................... 17
1.6System Memory .............................................................................. 17
1.6.1Memory Configurations ......................................................... 18
1.7Graphics Subsystem ........................................................................ 20
1.7.1Integrated Graphics.............................................................. 20
1.7.2PCI Express x16 Graphics ...................................................... 21
1.8USB............................................................................................... 21
1.9SATA Interfaces .............................................................................. 22
1.10Legacy I/O Controller....................................................................... 22
1.10.1Serial Port ........................................................................... 22
1.11Audio Subsystem............................................................................. 23
1.11.1Audio Subsystem Software .................................................... 24
1.11.2Audio Headers and Connectors ............................................... 24
1.12LAN Subsystem............................................................................... 26
1.12.1Intel®82579V Gigabit Ethernet Controller................................ 26
1.12.2LAN Subsystem Software....................................................... 26
1.12.3RJ-45 LAN Connector with Integrated LEDs .............................. 27
1.13Real-Time Clock Subsystem .............................................................. 28
1.14Thermal Monitoring.......................................................................... 29
1.15Platform Management and Security
.................................................... 30
1.15.1Hardware Management Subsystem ......................................... 30
1.15.2Hardware Monitoring............................................................. 30

viii
1.16Power Management ......................................................................... 31
1.16.1ACPI................................................................................... 31
1.16.2Hardware Support ................................................................ 34
2Technical Reference
2.1Memory Resources .......................................................................... 38
2.1.1Addressable Memory............................................................. 38
2.1.2Memory Map........................................................................ 40
2.2Connectors and Headers................................................................... 40
2.2.1Back Panel Connectors
.......................................................... 41
2.2.2Component-side Connectors and Headers ................................ 42
2.3BIOS Configuration Jumper Block....................................................... 51
2.4Intel®Management Engine BIOS Extension (Intel®MEBX) Reset Header . 53
2.5Mechanical Considerations ................................................................ 54
2.5.1Form Factor......................................................................... 54
2.6Electrical Considerations
................................................................... 55
2.6.1Power Supply Considerations ................................................. 55
2.6.2Fan Header Current Capability................................................ 56
2.6.3Add-in Board Considerations .................................................. 56
2.7Thermal Considerations
.................................................................... 57
2.8Reliability ....................................................................................... 59
2.9Environmental ................................................................................ 59
3Overview of BIOS Features
3.1Introduction ................................................................................... 60
3.2System Management BIOS (SMBIOS)................................................. 62
3.3Legacy USB Support ........................................................................ 62
3.4BIOS Updates ................................................................................. 63
3.4.1Language Support ................................................................ 63
3.4.2Custom Splash Screen .......................................................... 64
3.5BIOS Recovery................................................................................ 64
3.6Boot Options................................................................................... 65
3.6.1Optical Drive Boot ................................................................ 65
3.6.2Network Boot....................................................................... 65
3.6.3Booting Without Attached Devices........................................... 65
3.6.4Changing the Default Boot Device During POST ........................ 65
4Error Messages and Beep Codes
4.1Speaker ......................................................................................... 66
4.2BIOS Beep Codes ............................................................................ 66
4.3Front-panel Power LED Blink Codes
.................................................... 67
4.4BIOS Error Messages ....................................................................... 67
4.5Port 80h POST Codes ....................................................................... 68

Contents
ix
5Regulatory Compliance and Battery Disposal Information
5.1Regulatory Compliance..................................................................... 75
5.1.1Safety Standards.................................................................. 75
5.1.2European Union Declaration of Conformity Statement
................ 76
5.1.3Product Ecology Statements................................................... 77
5.1.4EMC Regulations .................................................................. 79
5.1.5ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 82
5.1.6Regulatory Compliance Marks (Board Level)
............................. 83
5.2Battery Disposal Information............................................................. 84
Figures
1. Major Board Components.................................................................. 13
2. Block Diagram ................................................................................ 15
3. Memory Channel and DIMM Configuration ........................................... 19
4. Back Panel Audio Connector Options .................................................. 25
5. LAN Connector LED Locations............................................................ 27
6. Thermal Sensors and Fan Headers ..................................................... 29
7. Location of the Standby Power LED (Green) ........................................ 37
8. Detailed System Memory Address Map ............................................... 39
9. Back Panel Connectors ..................................................................... 41
10. Component-side Connectors and Headers ........................................... 42
11. Connection Diagram for Front Panel Header ........................................ 48
12. Connection Diagram for Front Panel USB Headers ................................ 50
13. Location of the Jumper Block............................................................. 51
14. Intel MEBX Reset Header.................................................................. 53
15. Board Dimensions ........................................................................... 54
16. Localized High Temperature Zones..................................................... 58
Tables
1. Feature Summary............................................................................ 11
2. Components Shown in Figure 1 ......................................................... 14
3. Supported Memory Configurations ..................................................... 18
4. HDMI Port Status Conditions ............................................................. 20
5. Audio Jack Support.......................................................................... 23
6. LAN Connector LED States ................................................................ 27
7. Effects of Pressing the Power Switch .................................................. 31
8. Power States and Targeted System Power........................................... 32
9. Wake-up Devices and Events ............................................................ 33
10. System Memory Map ....................................................................... 40
11. Component-side Connectors and Headers Shown in Figure 10................ 43
12. TPM Header.................................................................................... 44
13. Serial Port Header ........................................................................... 44
14. S/PDIF Header ................................................................................ 44
15. Internal Mono Speaker Header .......................................................... 44
16. Front Panel Audio Header for Intel HD Audio........................................ 45

x
17. Front Panel Audio Header for AC ’97 Audio .......................................... 45
18. Front Panel USB Header ................................................................... 45
19. SATA Connectors............................................................................. 45
20. Chassis Intrusion Header.................................................................. 46
21. Fan Headers ................................................................................... 46
22. Processor Core Power Connector........................................................ 47
23. Main Power Connector...................................................................... 47
24. Front Panel Header .......................................................................... 48
25. States for a One-Color Power LED...................................................... 49
26. Alternate Front Panel Power LED Header............................................. 49
27. LPC Debug Header........................................................................... 50
28. BIOS Setup Configuration Jumper Settings.......................................... 52
29. Intel MEBX Reset Header Signals ....................................................... 53
30. Recommended Power Supply Current Values ....................................... 55
31. Fan Header Current Capability........................................................... 56
32. Thermal Considerations for Components ............................................. 58
33. Environmental Specifications............................................................. 59
34. BIOS Setup Program Menu Bar.......................................................... 61
35. BIOS Setup Program Function Keys.................................................... 61
36. AccepDrives/Media Types for BIOS Recovery ....................................... 64
37. Boot Device Menu Options ................................................................ 65
38. BIOS Beep Codes ............................................................................ 66
39. Front-panel Power LED Blink Codes.................................................... 67
40. BIOS Error Messages ....................................................................... 67
41. Port 80h POST Code Ranges.............................................................. 68
42. Port 80h POST Codes ....................................................................... 69
43. Typical Port 80h POST Sequence........................................................ 73
44. Safety Standards............................................................................. 75
45. EMC Regulations ............................................................................. 79
46. Regulatory Compliance Marks............................................................ 83

11
1Product Description
1.1 Overview
1.1.1 Feature Summary
Table 1 summarizes the major features of the board.
Table 1. Feature Summary
Form Factor MicroATX (9.60 inches by 7.80 inches [243.84 millimeters by
198.12 millimeters])
Processor •Intel®Core™ i7, Intel®Core™ i5, Intel®Core™ i3, and Intel®Pentium®
processors in an LGA1155 socket with up to 95 W TDP:
―Integrated graphics processing (processors with Intel®Graphics
Technology)
―External graphics interface controller
―Integrated memory controller
Chipset Intel®H61 Express Chipset consisting of the Intel®H61 Platform Controller
Hub (PCH)
Memory •Two 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets
•Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs
•Support for 1 Gb, 2 Gb, and 4 Gb memory technology
•Support for up to 16 GB of system memory with two DIMMs using 4 Gb
memory technology
•Support for non-ECC memory
Graphics •Integrated graphics support for processors with Intel®Graphics Technology:
―VGA
―High-Definition Multi-media Interface* (HDMI*) 1.4
•Discrete graphics support for PCI Express 2.0 x16 add-in graphics card
Audio •Intel®High Definition Audio:
―Realtek* ALC892 audio codec
―S/PDIF audio header
―Front panel audio header
―Mono speaker header
•8-channel (5.1+2) Intel High Definition Audio via the HDMI interface
continued

12
Table 1. Feature Summary (continued)
Peripheral
Interfaces
•Ten USB ports:
―Four USB 2.0 ports are implemented with stacked back panel connectors
―Six USB 2.0 front panel ports are implemented through three dual-port
internal headers
•Four SATA interfaces through the Intel H61 Express Chipset
•One serial port header
•One parallel port connector on the back panel
•One PS/2* keyboard/mouse port on back panel
Legacy I/O Control •Nuvoton* W83677HG-i Super I/O controller for hardware management and
serial port, parallel port, and PS/2 support
BIOS •Intel®BIOS resident in the SPI Flash device
•Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,
and SMBIOS
Instantly Available
PC Technology
•Support for PCI* Local Bus Specification Revision 2.2
•Support for PCI Express*
•Suspend to RAM support
•Wake on Conventional PCI, PCI Express, LAN, front panel, serial, PS/2, and
USB ports
LAN Support Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel®82579V Gigabit
Ethernet Controller
Expansion
Capabilities
•One PCI Express 2.0 x16 add-in card connector
•Two PCI Express 2.0 x1 add-in card connectors
•One Conventional PCI bus connector
Hardware Monitor
Subsystem
•Hardware monitoring through the Nuvoton Super I/O controller
•Voltage sense to detect out of range power supply voltages
•Thermal sense to detect out of range thermal values
•Three fan headers
•Two fan sense inputs used to monitor fan activity
•Fan speed control

Product Description
13
1.1.2 Board Layout
Figure 1 shows the location of the major components on Intel Desktop Board DH61ZE.
Figure 1. Major Board Components
Table 2 lists the components identified in Figure 1.

14
Table 2. Components Shown in Figure 1
Item/callout
from Figure 1 Description
A Conventional PCI bus add-in card connector
B PCI Express x1 add-in card connector
C Chassis intrusion header
D S/PDIF header
E PCI Express x1 add-in card connector
F Battery
G PCI Express x16 add-in card connector
H Back panel connectors
I Standby power LED
J 12 V internal power connector (ATX12V)
K Rear chassis fan header
L Piezoelectric speaker
M LGA1155 processor socket
N Processor fan header
O Front chassis fan header
P Low Pin Count (LPC) Debug header
Q DIMM 1 (Channel A DIMM 1)
R DIMM 2 (Channel B DIMM 1)
S Trusted Platform Module (TPM) header
T Main power connector (2 x 12)
U SATA connectors
V BIOS setup configuration jumper block
W Front panel header
X Alternate front panel power LED header
Y Intel®Management Engine BIOS Extension (Intel®MEBX) Reset header
Z Intel H61 Express Chipset
AA Serial port header
BB Front panel USB 2.0 headers (3)
CC Internal mono speaker header
DD Front panel audio header

Product Description
15
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
Figure 2. Block Diagram

16
1.2 Legacy Considerations
This board differs from other Intel Desktop Board products, with specific changes
including (but not limited to) the following:
•No Parallel ATA (PATA) IDE drive connector
1.3 Online Support
To find information about… Visit this World Wide Web site:
Intel Desktop Board DH61ZE http://www.intel.com/products/motherboard/index.htm
Desktop Board Support http://www.intel.com/p/en_US/support?iid=hdr+support
Available configurations for the Intel
Desktop Board DH61ZE
http://ark.intel.com
Supported processors http://processormatch.intel.com
Chipset information http://www.intel.com/products/desktop/chipsets/index.htm
BIOS and driver updates http://downloadcenter.intel.com
Tested memory http://www.intel.com/support/motherboards/desktop/sb/CS-
025414.htm
Integration information http://www.intel.com/support/go/buildit
1.4 Processor
The board is designed to support the Intel Core i7, Intel Core i5, Intel Core i3, and
Intel Pentium processors in an LGA1155 socket.
Other processors may be supported in the future. This board is designed to support
processors with a maximum TDP of 95 W. See the Intel web site listed below for the
most up-to-date list of supported processors.
For information about… Refer to:
Supported processors http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors
can damage the board, the processor, and the power supply.
NOTE
This board has specific requirements for providing power to the processor. Refer to
Section 2.6.1 on page 55 for information on power supply requirements for this board.

Product Description
17
1.5 Intel®H61 Express Chipset
The Intel H61 Express Chipset consisting of the Intel H61 Platform Controller Hub
(PCH) provides interfaces to the processor and the USB, SATA, LPC, audio, network,
display, and PCI Express. The PCH is a centralized controller for the board’s I/O paths.
For information about Refer to
The Intel H61 Express chipset http://www.intel.com/products/desktop/chipsets/index.htm
Resources used by the chipset Chapter 2
1.6 System Memory
The board has two DIMM sockets and supports the following memory features:
•Two independent memory channels with interleaved mode support
•Supports 1.2 V – 1.8 V DIMM memory voltage
•Support for non-ECC, unbuffered, single-sided or double-sided DIMMs with x8
organization
•16 GB maximum total system memory (with 4 Gb memory technology). Refer to
Section 2.1.1 on page 38 for information on the total amount of addressable
memory.
•Minimum total system memory: 1 GB using 1 Gb x8 module
•Serial Presence Detect
•DDR3 1333 MHz and DDR3 1066 MHz SDRAM DIMMs
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board
should be populated with DIMMs that support the Serial Presence Detect (SPD) data
structure. This allows the BIOS to read the SPD data and program the chipset to
accurately configure memory settings for optimum performance. If non-SPD memory
is installed, the BIOS will attempt to correctly configure the memory settings, but
performance and reliability may be impacted or the DIMMs may not function under the
determined frequency.

18
Table 3 lists the supported DIMM configurations.
Table 3. Supported Memory Configurations
DIMM
Capacity
Configuration (Note) SDRAM
Density
SDRAM Organization
Front-side/Back-side
Number of SDRAM
Devices
512 MB SS 1 Gbit 64 M x16/empty 4
1024 MB SS 1 Gbit 128 M x8/empty 8
1024 MB SS 2 Gbit 128 M x16/empty 4
2048 MB DS 1 Gbit 128 M x8/128 M x8 16
2048 MB SS 2 Gbit 128 M x16/empty 8
4096 MB DS 2 Gbit 256 M x8/256 M x8 16
4096 MB SS 4 Gbit 512 M x8/empty 8
8192 MB DS 4 Gbit 512 M x8/512 M x8 16
Note: “DS” refers to double-sided memory modules (containing two rows of SDRAM) and “SS” refers to
single-sided memory modules (containing one row of SDRAM).
For information about… Refer to:
Tested Memory http://support.intel.com/support/motherboards/desktop/sb/CS-
025414.htm
1.6.1 Memory Configurations
The Intel Core i7, Intel Core i5, Intel Core i3, and Intel Pentium processors support the
following types of memory organization:
•Dual channel (Interleaved) mode. This mode offers the highest throughput for
real world applications. Dual channel mode is enabled when the installed memory
capacities of both DIMM channels are equal. Technology and device width can vary
from one channel to the other but the installed memory capacity for each channel
must be equal. If different speed DIMMs are used between channels, the slowest
memory timing will be used.
•Single channel (Asymmetric) mode. This mode is equivalent to single channel
bandwidth operation for real world applications. This mode is used when only a
single DIMM is installed or the memory capacities are unequal. Technology and
device width can vary from one channel to the other. If different speed DIMMs are
used between channels, the slowest memory timing will be used.
For information about… Refer to:
Memory Configuration examples http://www.intel.com/support/motherboards/desktop/sb/cs-
011965.htm

Product Description
19
Figure 3 illustrates the memory channel and DIMM configuration.
Figure 3. Memory Channel and DIMM Configuration

20
1.7 Graphics Subsystem
The board supports system graphics through either Intel Graphics Technology or a
PCI Express 2.0 x16 add-in graphics card.
1.7.1 Integrated Graphics
The board supports integrated graphics through the Intel®Flexible Display Interface
(Intel®FDI) for processors with Intel Graphics Technology.
NOTE
The board will support up to two integrated graphics interfaces plus one PCI Express
Graphics card simultaneously with required changes to the BIOS setup.
1.7.1.1 Analog Display (VGA)
The VGA port supports analog displays. The maximum supported resolution is 2048 x
1536 (QXGA) at a 75 Hz refresh rate. The VGA port is enabled for POST whenever a
monitor is attached, regardless of the HDMI connector status.
1.7.1.2 High Definition Multimedia Interface* (HDMI*)
The HDMI port supports standard, enhanced, or high definition video, plus multi-
channel digital audio on a single cable. It is compatible with all ATSC and DVB HDTV
standards and supports eight full range channels at 24-bit/96 kHz audio of lossless
audio formats such as Dolby* TrueHD or DTS* HD Master Audio. The maximum
supported resolution is 1920 x 1200 (WUXGA). The HDMI port is compliant with the
HDMI 1.4 specification.
Depending on the type of add-in card installed in the PCI Express x1 connector, the
HDMI port will behave as described in Table 4.
Table 4. HDMI Port Status Conditions
PCI Express x1 Connector Status HDMI Port Status
No add-in card installed Enabled
Non-video PCI Express x1 add-in card installed Enabled
Video PCI Express x1 add-in card installed Disabled (Note)
Note: Default behavior per BIOS setup option.