Kemppi Oy
CONTENTS
1. READ THIS FIRST........................................................................................................................................... 1
2. GENERAL......................................................................................................................................................... 2
3. TECHNICAL INFORMATION........................................................................................................................... 3
3.1. Technical data........................................................................................................................................... 3
3.2. Wiring diagram.......................................................................................................................................... 5
3.3. Construction.............................................................................................................................................. 6
3.3.1. Inner structure.................................................................................................................................... 7
3.3.2. Z001 main circuit card structure ........................................................................................................ 8
3.3.3. A001 control card structure................................................................................................................ 9
3.4. Description of operation.......................................................................................................................... 10
3.4.1. Z001 Main circuit card ..................................................................................................................... 10
3.4.2. A001 Control card............................................................................................................................ 11
4. SERVICE INSTRUCTIONS............................................................................................................................ 12
4.1. Programming........................................................................................................................................... 12
4.2. Calibration............................................................................................................................................... 12
4.2.1. Functions and buttons ..................................................................................................................... 12
4.2.2. Calibration parameters .................................................................................................................... 15
4.2.3. Calibration procedure ...................................................................................................................... 15
4.3. Measurements and tests......................................................................................................................... 16
4.3.1. Z001 Main circuit card ..................................................................................................................... 16
4.3.1.1. Input rectifier and PFC circuit................................................................................................... 17
4.3.1.2. IGBT ......................................................................................................................................... 19
4.3.1.3. Secondary rectifier.................................................................................................................... 21
4.3.1.4. Voltages.................................................................................................................................... 22
4.3.1.5. Overheat protection.................................................................................................................. 23
4.3.2. A001 control card............................................................................................................................. 24
4.3.3. Cooling fan....................................................................................................................................... 26
4.3.4. Low voltage tests............................................................................................................................. 26
4.3.5. Safety tests...................................................................................................................................... 26
4.4. Semiconductor installation...................................................................................................................... 26
4.4.1. Rectifier/PFC module and IGBT ...................................................................................................... 26
4.4.2. Secondary rectifier........................................................................................................................... 27
4.5. Final testing............................................................................................................................................. 27
4.5.1. Load bank test ................................................................................................................................. 28
4.5.2. Test welding..................................................................................................................................... 28
5. NOTES ........................................................................................................................................................... 29
APPENDIX.......................................................................................................................................................... 29