Lanner LEC-7233 Series User manual

Embedded Computing Platform
1
LEC‐7233Series
EmbeddedComputingPlatform
UserManual
Rev1.0Date:August8,2016

Embedded Computing Platform
2
RevisionHistory
ThisdocumentcontainsproprietaryinformationofLannerElectronicsInc.–andisnottobe
disclosedorusedexceptinaccordancewithapplicableagreements.
Copyright©2016.AllRightsReserved.
Copyright©2016LannerElectronicsInc.Allrightsreserved.Theinformationinthisdocumentis
proprietaryandconfidentialtoLannerElectronicsInc.Nopartofthisdocumentmaybe
reproducedinanyformorbyanymeansorusedtomakeanyderivativework(suchas
translation,transformation,oradaptation)withouttheexpresswrittenconsentofLanner
ElectronicsInc.LannerElectronicsInc.reservestherighttorevisethisdocumentandtomake
changesincontentfromtimetotimewithoutobligationonthepartofLannerElectronicsInc.to
providenotificationofsuchrevisionorchange.
Theinformationinthisdocumentisfurnishedforinformationaluseonly,issubjecttochange
withoutnotice,andshouldnotbeconstruedasacommitmentbyLannerElectronicsInc.Lanner
ElectronicsInc.assumesnoresponsibilityorliabilityforanyerrorsorinaccuraciesthatmay
appearinthisdocumentoranysoftwarethatmaybeprovidedinassociationwiththisdocument.
RevisionDateDescription
0.1July12,2016Preliminary
1.0August8,2016Officialrelease

Embedded Computing Platform
3
OnlineResources
Thelistedwebsitesarelinkstotheon‐lineproductinformationandtechnicalsupport.
ResourceWebsite
Lannerwww.lannerinc.com
ProductResourceswww.lannerinc.com/support/download‐center
RMAhttp://eRMA.lannerinc.com
Acknowledgement
Intel®,PentiumandCeleronareregisteredtrademarksofIntel®Corp.
MicrosoftWindowsandMS‐DOSareregisteredtrademarksofMicrosoftCorp.
Allotherproductnamesortrademarksarepropertiesoftheirrespectiveowners.
CompliancesandCertification
CECertification
ThisproducthaspassedtheCEtestforenvironmentalspecifications.Testconditionsforpassingincluded
theequipmentbeingoperatedwithinanindustrialenclosure.Inordertoprotecttheproductfrombeing
damagedbyESD(ElectrostaticDischarge)andEMIleakage,westronglyrecommendtheuseof
CE‐compliantindustrialenclosureproducts.
FCCClassACertification
ThisequipmenthasbeentestedandfoundtocomplywiththelimitsforaClassAdigitaldevice,pursuant
toPart15oftheFCCRules.Theselimitsaredesignedtoprovidereasonableprotectionagainstharmful
interferencewhentheequipmentisoperatedinacommercialenvironment.Thisequipmentgenerates,
usesandcanradiateradiofrequencyenergyand,ifnotinstalledandusedinaccordancewiththe
instructionmanual,maycauseharmfulinterferencetoradiocommunications.Operationofthis
equipmentinaresidentialareaislikelytocauseharmfulinterferenceinwhichcasetheuserwillbe
requiredtocorrecttheinterferenceathisownexpense.
EMCNotice
ThisequipmenthasbeentestedandfoundtocomplywiththelimitsforaClassAdigitaldevice,pursuant
toPart15oftheFCCRules.Theselimitsaredesignedtoprovidereasonableprotectionagainstharmful
interferencewhentheequipmentisoperatedinacommercialenvironment.Thisequipmentgenerates,
uses,andcanradiateradiofrequencyenergyand,ifnotinstalledandusedinaccordancewiththe
instructionmanual,maycauseharmfulinterferencetoradiocommunications.Operationofthis
equipmentinaresidentialareaislikelytocauseharmfulinterferenceinwhichcaseuserswillberequired

Embedded Computing Platform
4
tocorrecttheinterferenceattheirownexpense.
SafetyGuidelines
zFollowtheseguidelinestoensuregeneralsafety:
zKeepthechassisareaclearanddust‐freebefore,duringandafterinstallation.
zDonotwearlooseclothingorjewelrythatcouldgetcaughtinthechassis.Fastenyourtieorscarfand
rollupyoursleeves.
zWearsafetyglasses/gogglesifyouareworkingunderanyconditionsthatmightbehazardoustoyour
eyes.
zDonotperformanyactionthatcreatesapotentialhazardtopeopleormakestheequipmentunsafe.
zDisconnectallpowerbyturningoffthepowerandunpluggingthepowercordbeforeinstallingor
removingachassisorworkingnearpowersupplies
zDonotworkaloneifpotentiallyhazardousconditionsexist.
zNeverassumethatpowerisdisconnectedfromacircuit;alwayscheckthecircuit.
LITHIUMBATTERYCAUTION:
Riskofexplosioncouldoccurifbatteryisreplacedbyanincorrecttype.Pleasedisposeofusedbatteries
accordingtotherecyclinginstructionsofyourcountry.
OperatingSafety
zElectricalequipmentgeneratesheat.Ambientairtemperaturemaynotbeadequatetocool
equipmenttoacceptableoperatingtemperatureswithoutadequatecirculation.Besurethatthe
roominwhichyouchoosetooperateyoursystemhasadequateaircirculation.
zEnsurethatthechassiscoverissecure.Thechassisdesignallowscoolingairtocirculateeffectively.
Anopenchassispermitsairleaks,whichmayinterruptandredirecttheflowofcoolingairfrom
internalcomponents.
Electrostaticdischarge(ESD)candamageequipmentandimpairelectricalcircuitry.ESDdamageoccurs
whenelectroniccomponentsareimproperlyhandledandcanresultincompleteorintermittentfailures.
BesuretofollowESD‐preventionprocedureswhenremovingandreplacingcomponentstoavoidthese
problems.
zWearanESD‐preventivewriststrap,ensuringthatitmakesgoodskincontact.Ifnowriststrapis
available,groundyourselfbytouchingthemetalpartofthechassis.
zPeriodicallychecktheresistancevalueoftheantistaticstrap,whichshouldbebetween1and10
megohms(Mohms).
zInstallationonlybyatrainedelectricianoronlybyanelectricallytrainedpersonwhoknowsallthe
appliedorrelatedinstallationanddevicespecifications..
zDonotcarrythehandleofpowersupplieswhenmovingtootherplace.

Embedded Computing Platform
5
zThemachinecanonlybeusedinafixedlocationsuchaslabsorcomputerfacilities.
MountingInstallationEnvironmentPrecaution
1.ElevatedOperatingAmbient‐Ifinstalledinaclosedormulti‐unitrackassembly,theoperatingambient
temperatureoftherackenvironmentmaybegreaterthanroomambient.Therefore,consideration
shouldbegiventoinstallingtheequipmentinanenvironmentcompatiblewiththemaximumambient
temperature(Tma)specifiedbythemanufacturer.
2.ReducedAirFlow‐Installationoftheequipmentinarackshouldbesuchthattheamountofairflow
requiredforsafeoperationoftheequipmentisnotcompromised.
3.MechanicalLoading‐Mountingoftheequipmentintherackshouldbesuchthatahazardouscondition
isnotachievedduetounevenmechanicalloading.
4.CircuitOverloading‐Considerationshouldbegiventotheconnectionoftheequipmenttothesupply
circuitandtheeffectthatoverloadingofthecircuitsmighthaveonover‐currentprotectionandsupply
wiring.Appropriateconsiderationofequipmentnameplateratingsshouldbeusedwhenaddressingthis
concern.
5.ReliableEarthing‐Reliableearthingofrack‐mountedequipmentshouldbemaintained.Particular
attentionshouldbegiventosupplyconnectionsotherthandirectconnectionstothebranchcircuit(e.g.
useofpowerstrips).”
Consignesdesécurité
Suivezcesconsignespourassurerlasecuritegenerale:
zLaissezlazoneduchassispropreetsanspoussierependantetapresl’installation.
zNeportezpasdevetementsamplesoudebijouxquipourraientetreprisdanslechassis.Attachez
votrecravateouecharpeetremontezvosmanches.
zPortezdeslunettesdesecuritepourprotegervosmyeux.
zN’effectuezaucuneactionquipourraitcreerundangermpourd’autresourendrel’equipement
dangereux.
zCoupezcompletementl’alimentationeneteignantl’alimentationetendebranchantlecordon
d’alimentationavantd’installerouderetirerunchassisoudetravailleraproximitedesources
d’alimentation.
zNetravaillezpasseulsidesconditionsdangereusessontpresentes.
zNeconsiderezjamaisquel’alimentationestcoupeed’uncircuit,verifieztoujourslecircuit.Cet
appareilgenere,utiliseetemetuneenergieradiofrequenceet,s’iln’estpasinstalleetutilise
conformementauxinstructionsdesfournisseursdecomposantssansfil,ilrisquedeprovoquerdes
interferencesdanslescommunicationsradio.

Embedded Computing Platform
6
Avertissementconcernantlapileaulithium
zRisqued’explosionsilapileestremplaceeparuneautred’unmauvaistype.
zJetezlespilesusageesconformementauxinstructions.
zL’installationdoitetreeffectueeparunelectricienformeouunepersonneformeeal’electricite
connaissanttouteslesspecificationsd’installationetd’appareilduproduit.
zNetransportezpasl’uniteenlatenantparlecabled’alimentationlorsquevousdeplacezl’appareil.
zLamachinenepeutetreutiliseequ’aunlieufixecommeenlaboratoire,salled’ordinateursousalle
declasse.
Sécuritédefonctionnement
zL’equipementelectriquegeneredelachaleur.Latemperatureambiantepeutnepasetreadequate
pourrefroidirl’equipementaunetemperaturedefonctionnementacceptablesanscirculation
adaptee.Verifiezquevotresiteproposeunecirculationd’airadequate.
zVerifiezquelecouvercleduchassisestbienfixe.Laconceptionduchassispermetal’airde
refroidissementdebiencirculer.Unchassisouvertlaissel’airs’echapper,cequipeutinterrompreet
redirigerlefluxd’airfraisdestineauxcomposantsinternes.
zLesdechargeselectrostatiques(ESD)peuventendommagerl’equipementetgenerlescircuits
electriques.Desdegatsd’ESDsurviennentlorsquedescomposantselectroniquessontmalmanipules
etpeuventcauserdespannestotalesouintermittentes.Suivezlesproceduresdepreventiond’ESD
lorsduretraitetduremplacementdecomposants.
‐Portezunbraceletanti‐ESDetveillezacequ’ilsoitbienaucontactdelapeau.Siaucunbraceletn’est
disponible,reliezvotrecorpsalaterreentouchantlapartiemetalliqueduchassis.Verifiezregulierement
lavaleurderesistancedubraceletantistatique,quidoitetrecompriseentre1et10megohms(Mohms).
Consignesdesécuritéélectrique
zAvantd’allumerl’appareil,reliezlecabledemisealaterredel’equipementalaterre.
zUnebonnemisealaterre(connexionalaterre)esttresimportantepourprotegerlequipement
contreleseffetsnefastesdubruitexterneetreduirelesrisquesd’electrocutionencasdefoudre.
zPourdesinstallerl’equipement,debranchezlecabledemisealaterreapresavoireteintl’appareil.
zUncabledemisealaterreestrequisetlazonereliantlessectionsduconducteurdoitfaireplusde4
mm2ou10AWG.
Procéduredemiseàlaterrepoursourced’alimentationCC
Procéduredemiseàlaterrepoursourced’alimentationCC
•Desserrezlavisduterminaldemisealaterre.
•Branchezlecabledemisealaterrealaterre.

Embedded Computing Platform
7
•L’appareildeprotectionpourlasourced’alimentation
CCdoitfournir30Adecourant.Cetappareildeprotectiondoitetrebranchealasource
d’alimentationavantl’alimentationCC.

Embedded Computing Platform
8
TableofContents
RevisionHistory................................................................................................................... 2
Chapter1:Introduction ...................................................................................................... 9
Specifications .............................................................................................................. 9
OrderingInformation ................................................................................................ 10
Chapter2:SystemOverview............................................................................................. 11
MechanicalDrawing.................................................................................................. 11
BlockDiagram ........................................................................................................... 12
FrontI/Os .................................................................................................................. 13
RearI/Os.................................................................................................................... 14
Chapter3:BoardLayout ................................................................................................... 15
Jumpers&ConnectorsLocationsontheMotherboard ........................................... 15
JumperSettings&ConnectorPinout(Motherboard) .............................................. 16
Chapter4:HardwareSetup............................................................................................... 23
InstallingSO‐DIMMMemory .................................................................................... 25
InstallingmSATAandMini‐PCIeModule................................................................... 26
Appendix1:WatchdogTimer ........................................................................................... 27

Embedded Computing Platform
9
Chapter1:Introduction
ThankyouforchoosingLEC‐7233.ThisindustrialembeddedsystemisempoweredbyIntelBaytrailCPU,
withtheoptionofCeleronN2807orJ1900.LEC‐7233providesthenecessaryperformancewithlowpower
consumption,idealasindustrialembeddedgateway.RegardingI/Ofeatures,LEC‐7233supports3xLAN
ports,2xUSB2.0ports,1xUSB3.0port,2xCOMportsand1xHDMIport.Asanindustrialgateway,the
systemprovidesinternalTPMforsecuritypurpose.
ProductFeatures:
zIntel®CeleronN2807
z1xDDR3LSO‐DIMMsocketup4GB
zUSB:2xUSB2.0Type‐Aportsand1xUSB3.0Type‐Aport
zCOM:2xRS‐232/485inD‐Sub9connectors.
zDIO:4xDIand4xDO
zLAN:3x10/100/1000MbpsRJ‐45ports
zStorage:1xmSATAsocket
zDisplay:1xHDMIport
zTPMpinheader
zPCIe:1xmini‐PCIewithSIMcardreader(full‐size)and1xmini‐PCIe(half‐size)
Pleaserefertothefollowingtablefordetailedspecifications
Specifications
ProcessorIntelBayTrailCeleronN2807,1.58GHz,DualCores
Memory1xSO‐DIMMsocket,supportsupto4GBDDR3L
1333MHz
BIOSAMISPIFlashBIOS
Serial2xD‐Sub9maleconnectorswithRS‐232/485signals
USB1xUSB3.0Type‐Aport
2xUSB2.0Type‐Aports
DIO4xDI+4xDO
DisplayIntelHDGraphics
HDMI:1920x1080
Storage1xmSATAsocket
Expansion1xFull‐sizedMini‐PCIexpressexpansionsocket,USB
signalonly,withSIM‐cardreaderfor3G/LTEmodule

Embedded Computing Platform
10
1xHalf‐sizedMini‐PCIexpressexpansionsocket,with
PCIesignalonly,forwirelessmodules
TPM SupportsTPMinternalmodule
Antenna2xSMAantennaholes(sealedbydefault)
EthernetControllerIntel®i211Networking
EthernetPorts3xRJ‐4510/100/1000Mbpsports
LEDszGreen:power‐on/offstatus
zGreen:wirelessnetworkstatus
zYellow:storageaccess
Dimensions164.5x143.0x30.0,unit:mmPhysical
CharacteristicsMountingWallmount,VESAmount
PowerDC+12V+/‐5%input;ExternalAC/DCAdapter,36W
DCJackw/Lock
ReliabilityToolAutomaticReboot
Setting
LannerWatchdogTimerdemoutilitywith
Windows/Linuxsourcecode
Operating
Temperature
0°C~50°C(forN2807CPUwithindustrialgrade
storageandmemory.
Non‐operating
Temperature
‐20~70℃
Humidity5to95%(non‐condensing)
Environment
GreenRoHS
Standards&
Regulations
EMCCE,FCCClassA
OrderingInformation
LEC‐7233‐C11AFanlessIndustrialPCwithIntel®BayTrailCeleronN2807,
1.58GHz,2Cores

Embedded Computing Platform
11
Chapter2:SystemOverview
MechanicalDrawing
Unit: mm

Embedded Computing Platform
12
BlockDiagram

Embedded Computing Platform
13
FrontI/Os
F1USB3.01xUSB3.0Type‐Aport
F2USB2.02xUSB2.0Type‐Aports
F3LAN3x10/100/1000mbpsRJ‐45LANports
F4LEDszGreen:power‐on/offstatus
zGreen:wirelessnetworkstatus
zYellow:storageaccess
F5Reset1xResetbutton
F6PowerSwitch1xpoweron/offswitch
F1 F2 F3 F4
F5
F6

Embedded Computing Platform
14
RearI/Os
R1DC‐IN1xDCinputjack
R2DIO5‐pinterminalblocksupporting4xDIand4xDO
R3COM2xD‐subCOMportswithRS‐232/485signals
R4HDMI1xHDMIport
R5SMAAntenna(Optional)2xSMAantennaholes(theantennasareNOTincludedby
default)
R1
R2 R3 R4
R5 R5

Embedded Computing Platform
15
Chapter3:BoardLayout
Jumpers&ConnectorsLocationsontheMotherboard
JTPM1
MSATA1
USB1
LAN1-3
USB2
JLPC1
HDMI1
JVGA1
SATA1
JSP1
COM1-2
DIMM1
RST1
MPE3
JCMOS1
MPE1
SATAPWR1
DIO1 DCJACK1

Embedded Computing Platform
16
JumperSettings&ConnectorPinout(Motherboard)
HDMI1:High‐DefinitionMultimediaInterfaceconnector
JVGA1:15‐pininternalVGApinheader
Pin DescriptionPin DescriptionPin Description
1CRT‐R6GND11N.C
2CRT‐G7GND12V_SDAT
3CRT‐B8GND13HSYNC
4N.C9VCC14VSYNC
5GND10GND15V_SCLK
Pin DescriptionPin Description
1DATA2+2GND
3DATA2‐ 4DATA1+
5GND6DATA1‐
7DATA0+8GND
9DATA0‐ 10CLK+
11GND12CLK‐
13N.C14N.C
15DDCCLK16DDCDAT
17GND18HDMI_VCC
19HPD

Embedded Computing Platform
17
LAN1/2/3:LANConnector(RJ‐45connectorwithLED)
USB1:USB3.0Type‐AConnector
PinDescription
1TXD+MD0+
2TXD‐ MD0‐
3RXD+MD1+
4T45MD2+
5T45MD2‐
6RXD‐ MD1‐
7T78MD3+
8T78MD3‐
910‐/10 0‐/1000+
1010+/100+/1000‐
11NC
12NC
13ActiveLED‐(yellow)
14ActiveLED+
Pin DescriptionPin Description
1USB_VCC12USB1_D‐
3USB1_D+4GND
5USB1_RX‐ 6USB1_RX+
7GND8USB1_TX‐
9USB1_TX+

Embedded Computing Platform
18
USB2/USB3:USB2.0Type‐AConnectorsindouble‐stackedform
PinDescription
1USB_VCC1
2‐USB
3+USB
4GND
0USB_VCC2
6‐USB
7+USB
8GND
DIO:2x5‐pinDigitalI/Oterminalblockwith4xDIand4xDO
Pin SignalPinSignal
1DI_02DO_0
3DI_14DO_1
5DI_26DO_2
7DI_38DO_3
9V5S10GND
USBB2/3
5 8
4
1

Embedded Computing Platform
19
COM1/COM2:2xDB‐9COMports
Pin SignalPin Signal
1COM_DCD1#6COM_DSR1#
2COM_RXD17COM_RTS1#
3COM_TXD18COM_CTS1#
4COM_DTR1#9COM_RI1#
5GND
JTPM1:TPMmodulepinheaderforsecurityandprotection
Pin SignalPin Signal
1LPC_SERIRQ_H2V3P3A
3LPC_AD04V3P3A
5LPC_AD16GND
7LPC_FRAM#
9PLTRST#_LS10PLTRST#
11LPC_AD312LPC_AD2
LPC1:LPC(lowpincount)pinheaderfordebugpurpose
PinDescriptionPinDescription
1LPC_CLK2LAD1
3PLTRST4LAD0
5LFRAME#63.3V
7LAD38GND
9LAD210GND

Embedded Computing Platform
20
MPCIE1:mini‐PCIeSlot/wSIM(FullSize)
Pin DescriptionPin Description
1WAKE#2+3.3V
3RSVD4GND
5RSVD6+1.5V
7CLKREQ#8UIM_PWR
9GND10UIM_DATA
11REFCLK‐ 12UIM_CLK
13REFCLK+14UIM_RESET
15GND16UIM_VPP
KEY
17RSVD18GND
19RSVD20W_DISABLE#
21GND22PERST#
23PERn024+3.3V
25PERp026GND
27GND28+1.5V
29GND30SMB_CLK
31PETn032SMB_DATA
33PETp034GND
35GND36USB_D+
37GND38USB_D‐
39+3.3V40GND
41+3.3V42LED_WWAN#
43GND44LED_WLAN#
45RSVD46LED_WPAN#
47RSVD48+1.5V
49RSVD50GND
51RSVD52+3.3V
MPCIE1
Other manuals for LEC-7233 Series
1
Table of contents
Other Lanner Gateway manuals
Popular Gateway manuals by other brands

Watchguard
Watchguard Firebox X1000 reference guide

Multitech
Multitech MultiVOIP GSM SIP-to-Cellular Gateways... Cabling guide

Sierra Wireless
Sierra Wireless AirLink GX Series Hardware user's guide

Oki
Oki BV1270SIP-OD quick start guide

AirLive
AirLive RS-2500 user manual

Multitech
Multitech MULTIVOIP MVP-210 supplementary guide