Lenovo ThinkAgile MX3321-H User manual

ThinkAgile MX Certified Node 1U
ThinkAgile MX3321-H, MX3321-F
User Guide
Machine Type: 7D1H

Note
Before using this infor ation and the product it supports, be sure to read and understand the safety
infor ation and the safety instructions, which are available at:
http://thinksyste .lenovofiles.co /help/topic/safety_docu entation/pdf_files.ht l?cp=9_0
In addition, be sure that you are fa iliar with the ter s and conditions of the Lenovo warranty for your server,
which can be found at:
https://datacentersupport.lenovo.co /us/zh/warrantylookup
First Edition (January 2020)
© opyright Lenovo 2018, 2020.
LIMITED AND RESTRICTED RIGHTS NOTICE: If data or software is delivered pursuant to a General Services
Ad inistration (GSA) contract, use, reproduction, or disclosure is subject to restrictions set forth in Contract No. GS-35F-
05925.

Contents
hapter 1. Lenovo ThinkAgile MX
ertified Nodes overview . . . . . . . . 1
ThinkAgile MX certified configurations . . . . . . . 1
Network and infrastructure planning . . . . . . . . 1
hapter 2. Specifications . . . . . . . . 3
hapter 3. Server components . . . . 13
Front view . . . . . . . . . . . . . . . . . 13
Operator infor ation panel . . . . . . . . . . 15
Rear view . . . . . . . . . . . . . . . . . 16
Rear view LEDs . . . . . . . . . . . . . . . 22
Syste board co ponents . . . . . . . . . . 24
Syste board LEDs . . . . . . . . . . . . . 25
Syste board ju pers . . . . . . . . . . . . 26
hapter 4. Hardware removal,
installation and management
guidelines . . . . . . . . . . . . . . . 29
Syste reliability guidelines . . . . . . . . . . 30
Working inside the server with the power on. . . . 30
Handling static-sensitive devices . . . . . . . . 31
Set the network connection for the Lenovo XClarity
Controller . . . . . . . . . . . . . . . . . 32
Internal cable routing. . . . . . . . . . . . . 33
Turn off the server . . . . . . . . . . . . . . 34
Turn on the server . . . . . . . . . . . . . . 34
Co plete the parts replace ent . . . . . . . . 34
Manage ent options. . . . . . . . . . . . . 35
Updating fir ware. . . . . . . . . . . . . . 36
Me ory configuration . . . . . . . . . . . . 37
DC Persistent Me ory Module (DCPMM)
setup . . . . . . . . . . . . . . . . . 38
Configuring DC Persistent Me ory Module
(DCPMM) . . . . . . . . . . . . . . . 38
Adding e ory odules with DCPMMs . . . 43
hapter 5. Hardware replacement
procedures . . . . . . . . . . . . . . . 45
Air baffle replace ent . . . . . . . . . . . . 45
Re ove the air baffle . . . . . . . . . . . 45
Install the air baffle . . . . . . . . . . . . 46
Hot-swap drive replace ent . . . . . . . . . . 47
Re ove a hot-swap drive . . . . . . . . . 48
Install a hot-swap drive . . . . . . . . . . 49
Hot-swap power supply replace ent . . . . . . 50
Re ove a hot-swap power supply. . . . . . 50
Install a hot-swap power supply . . . . . . 55
PCIe adapter replace ent. . . . . . . . . . . 60
Re ove a PCIe adapter . . . . . . . . . . 61
Install a PCIe adapter . . . . . . . . . . . 61
Riser card replace ent . . . . . . . . . . . . 62
Re ove a riser card . . . . . . . . . . . 63
Install a riser card . . . . . . . . . . . . 65
RAID adapter replace ent . . . . . . . . . . 67
Re ove the RAID adapter . . . . . . . . . 67
Install the RAID adapter . . . . . . . . . . 68
LOM adapter replace ent . . . . . . . . . . 69
Re ove the LOM adapter . . . . . . . . . 69
Install the LOM adapter . . . . . . . . . . 69
Me ory odule replace ent . . . . . . . . . 70
Re ove a e ory odule . . . . . . . . 70
Install a e ory odule . . . . . . . . . 72
DRAM DIMM installation rules . . . . . . . 75
DCPMM installation rules . . . . . . . . . 79
M.2 backplane and M.2 drive replace ent . . . . 87
Adjust the retainer on the M.2 backplane . . . 87
Re ove the M.2 backplane and M.2 drive. . . 88
Install the M.2 backplane and M.2 drive. . . . 89
RAID super capacitor odule replace ent . . . . 92
Install a RAID super capacitor odule on the
botto of the air baffle . . . . . . . . . . 92
Re ove a RAID super capacitor odule on
the botto of the air baffle . . . . . . . . . 94
Rack latches replace ent . . . . . . . . . . . 94
Install the rack latches . . . . . . . . . . 94
Re ove the rack latches . . . . . . . . . 97
Rear hot-swap drive asse bly replace ent . . . . 99
Re ove the rear hot-swap drive asse bly . . 99
Install the rear hot-swap drive asse bly . . . 100
Security bezel replace ent . . . . . . . . . . 102
Re ove the security bezel . . . . . . . . . 102
Install the security bezel. . . . . . . . . . 103
Syste fan replace ent . . . . . . . . . . . 105
Re ove a syste fan. . . . . . . . . . . 105
Install a syste fan. . . . . . . . . . . . 106
Top cover replace ent . . . . . . . . . . . . 107
Re ove the top cover . . . . . . . . . . 108
Install the top cover . . . . . . . . . . . 109
Appendix A. Getting help and
technical assistance . . . . . . . . . . 111
Before you call . . . . . . . . . . . . . . . 111
Collecting service data . . . . . . . . . . . . 112
Contacting Support . . . . . . . . . . . . . 113
© Copyright Lenovo 2018, 2020 i

Appendix B. Notices. . . . . . . . . . 115
Trade arks . . . . . . . . . . . . . . . . 116
I portant notes . . . . . . . . . . . . . . . 116
Particulate conta ination . . . . . . . . . . . 116
Teleco unication regulatory state ent . . . . . 117
Electronic e ission notices . . . . . . . . . . 117
Taiwan BSMI RoHS declaration . . . . . . . 118
Taiwan i port and export contact infor ation . . . 118
Index . . . . . . . . . . . . . . . . . . 119
ii ThinkAgile MX Certified Node 1UThinkAgile MX3321-H, MX3321-FUser Guide

hapter 1. Lenovo ThinkAgile MX ertified Nodes overview
ThinkAgile MX Certified Nodes are a series of Microsoft Windows Server Software-Defined Datacenter
(WSSD) Pre iu hyper-converged infrastructure (HCI)-certified node.
ThinkAgile MX Certified Nodes are a series of Lenovo servers that require Microsoft Windows Server
Software-Defined Datacenter (WSSD) certification for all connected co ponents, not a solution bundled with
a rack, PDUs, switches, or network cables. Valid configurations ust only consist of WSSD HCI-certified
co ponents, including :
• Servers (syste , processors, e ory)
• Network interface adapters
• Storage adapters
• Storage devices
Additionally, Lenovo ThinkAgile MX Best Recipe si plifies fir ware and driver co pliance with the latest set
of WSSD HCI-certified fir ware and driver versions.
You can order ThinkAgile MX with Windows Server 2016 preloaded.
ThinkAgile MX certified configurations
Lenovo Certified Configurations for Microsoft Storage Spaces Direct provides detailed views of Lenovo
certified configurations for building Microsoft Storage Spaces Direct (S2D) solutions. The guide describes the
Microsoft Windows Server Software-Defined Datacenter progra , explains syste co ponent selection
criteria, and lists supported Lenovo switches for S2D.
To download a free copy of this guide, go to https://lenovopress.co /lp0866.
Network and infrastructure planning
Use the following table to plan for your Microsoft Windows Server Software-Defined Datacenter
i ple entation.
ThinkAgile MX Servers
X IP address X host name Hypervisor IP address Hypervisor host name
Node 1
Node 2
Node 3
User ID/
Password
User ID:
USERID (Default)
Password:
PASSW0RD (Default)
User ID:
root (Default)
Password:
Virtual Machines (VMs)
IPV4 Host name User ID Password
© Copyright Lenovo 2018, 2020 1

vCenter
Server (for
ESXi only)
XClarity
Ad inis-
trator
Infrastructure
Do ain
DNS/NTP
Default
Gateway
Virtual Network
Physical Adapters VMkernel Adapter
vSwitch 0
vSwitch 1
VLAN Name VLAN ID VLAN Portgroup Assigned vSwitch
VMKernel
Adapter
Services
vMotion Provision-
ing
FT
Logging
Manage-
ment
vSphere
Replica-
tion
vSphere
Replica-
tion NF
Adapter 1
Adapter 2
2ThinkAgile MX Certified Node 1UThinkAgile MX3321-H, MX3321-FUser Guide

hapter 2. Specifications
The following infor ation is a su ary of the features and specifications of the server. Depending on the
odel, so e features ight not be available, or so e specifications ight not apply.
Table 1. Server specifications
Specification Description
Di ension • 1U
• Height: 43.0 (1.7 inches)
• Width:
– With rack latches: 482.0 (19.0 inches)
– Without rack latches: 434.4 (17.1 inches)
• Depth: 778.3 (30.7 inches)
Note: The depth is easured with rack latches and power supply installed, but
without security bezel installed.
Weight Up to 19.0 kg (41.9 lb)
Processor (depending on the
odel) • Up to two Intel® Xeon® Scalable Processors
– Designed for Land Grid Array (LGA) 3647 socket
– Up to 28 cores
– Ther al Design Power (TDP): up to 205 watts
• Up to two Jintide® processors for Chinese Mainland only.
For ore i portant infor ation about the processor, refer to “I portant infor ation
for syste board, processor, and heat sink” on page 11.
For a list of supported processors, see:
http://www.lenovo.co /us/en/serverproven/
Note: For Jintide processors, only C08101, C10201, C12301, C14501, and C16401
odels are supported for Chinese Mainland.
© Copyright Lenovo 2018, 2020 3

Table 1. Server specifications (continued)
Specification Description
Me ory For 1st Generation Intel Xeon Scalable Processor (Intel Xeon SP Gen 1) or Jintide
processors:
• Slots: 24 e ory odule slots
• Mini u : 8 GB
• Maxi u :
– 768 GB using registered e ory odules (RDIMMs)
– 1.5 TB using load-reduced e ory odules (LRDIMMs)
– 3 TB using three-di ensional stack registered e ory odules (3DS RDIMMs)
• Type:
– or
– TruDDR4 2666, single-rank/dual-rank, 8 GB/16 GB/32 GB RDIMM
– TruDDR4 2666, quad-rank, 64 GB LRDIMM
– TruDDR4 2666, octa-rank, 128 GB 3DS RDIMM
For 2nd Generation Intel Xeon Scalable Processor (Intel Xeon SP Gen 2):
• Slots: 24 e ory odule slots
• Mini u : 8 GB
• Maxi u :
– 1.5 TB using registered e ory odules (RDIMMs)
– 3 TB using three-di ensional stack registered e ory odules (3DS RDIMMs)
– 6 TB using DC Persistent Me ory Module (DCPMM) and RDIMMs/3DS
RDIMMs in Me ory Mode
• Type: (depending on the odel)
– TruDDR4 2666, single-rank/dual-rank, 16 GB/32 GB RDIMMs
– TruDDR4 2933, single-rank/dual-rank, 8 GB/16 GB/32 GB/64 GB RDIMMs
– TruDDR4 2666, quad-rank, 64 GB 3DS RDIMMs
– TruDDR4 2933, quad-rank, 128 GB 3DS RDIMMs
– 128 GB/256 GB/512 GB DC Persistent Me ory Module
DCPMM installation rules:
• DCPMMs are not supported if any GPU is installed.
Notes:
• Operating speed and total e ory capacity depend on the processor odel and
UEFI settings.
• Rear drive asse bly and 256 GB/512 GB DCPMM are not installed at the sa e
ti e.
For a list of supported e ory, see the Lenovo ServerProven Web site: https://
static.lenovo.co /us/en/serverproven/index.sht l.
Internal drives • Up to two M.2 drives
• Up to four 3.5-inch hot-swap SAS/SATA drives
• Up to four 3.5-inch hot-swap SAS/SATA/NVMe drives
• Up to eight 2.5-inch hot-swap SAS/SATA drives
• Up to ten 2.5-inch hot-swap SAS/SATA/NVMe drives (NVMe drives are supported
only in drive bays 6–9)
• Up to ten 2.5-inch hot-swap NVMe drives
• Up to two 2.5-inch hot-swap SAS/SATA drives in the rear (the processor TDP
should be less than or equal to 125 watts)
4ThinkAgile MX Certified Node 1UThinkAgile MX3321-H, MX3321-FUser Guide

Table 1. Server specifications (continued)
Specification Description
Notes:
– NVMe drives eans Non-Volatile Me ory express drives.
– Only use M.2 drives provided by Lenovo.
– The backplane for ten 2.5-inch hot-swap NVMe drives is supported only when
the following configuration require ents are et:
– Intel Xeon 6144, 6146, 6154, 6240Y, 6244, 6246, 6252N, 6254, 8168,
8171M, 8180, 8180M, 8268, 8270, 8280, 8280L, and 8280M processors are
not installed.
– The power of the hot-swap power supply is 1100 watts.
– Rear hot-swap drive asse bly is not installed.
– GPU is not installed.
– NVMe PCIe flash adapter is not installed.
– 256 GB/512 GB DCPMM is not installed.
PCIe slots Depending on the odel, your server supports up to three PCIe slots in the rear. For
detailed infor ation, see “Rear view” on page 16.
Note: For ThinkSyste Mellanox ConnectX-6 HDR/200GbE QSFP56 1-port PCIe
adapter, when AOC cable and transceiver are installed, the syste operating
te perature ust be less than or equal to 30°C; when other DAC cable is installed,
the syste operating te perature ust be less than or equal to 35°C.
Chapter 2.Specifications 5

Table 1. Server specifications (continued)
Specification Description
Graphics processing unit
(GPU)
Your server supports the following GPUs:
• One NVIDIA Quadro P2000 PCIe Active GPU (full-height, 3/4 length)
• One NVIDIA Quadro P2200 PCIe Active GPU (full-height, 3/4 length)
• One NVIDIA Quadro P4000 PCIe Active GPU (full-height, full-length)
• One NVIDIA Quadro RTX4000 PCIe Active GPU (full-height, full-length)
• Up to two NVIDIA Tesla P4 8GB PCIe Passive GPU (low-profile)
• Up to two NVIDIA Tesla T4 8GB PCIe Passive GPU (low-profile)
• Up to three NVIDIA Quadro P600 2GB PCIe Active GPU (low-profile)
• Up to three NVIDIA Quadro P620 PCIe Active GPU (low-profile)
Location for installing GPUs:
• Install P2000/P2200/P4000/RTX4000 GPU only in the full-height PCIe slot 2.
• Install the first P4/T4 GPU in PCIe slot 3 and install the second P4/T4 GPU in PCIe
slot 1.
• Install the first P600 GPU in PCIe slot 3, install the second P600 GPU in PCIe slot
1, and install the third P600 GPU in PCIe slot 2.
• Install the first P620 GPU in PCIe slot 3, install the second P620 GPU in PCIe slot
1, and install the third P620 GPU in PCIe slot 2.
GPU installation requirements:
• P2000/P2200 GPU is supported only when the following configuration
require ents are et:
– Processor TDP is less than or equal to 140 watts.
– No RAID adapter is installed on the RAID adapter slot on the syste board. If
you want to install a RAID adapter, install it in PCIe slot 1.
– The power of the hot-swap power supply is 750 watts or 1100 watts.
– The backplane for ten 2.5-inch NVMe drives is not installed.
– Rear hot-swap drive asse bly is not installed.
– No syste fan is failed.
• P4000/RTX4000 GPU is supported only when the following configuration
require ents are et:
– Intel Xeon 6144, 6146, 6246, or 6252N processor is not installed and processor
TDP is less than or equal to 165 watts.
– No RAID adapter is installed on the RAID adapter slot on the syste board. If
you want to install a RAID adapter, install it in PCIe slot 1.
– The power of the hot-swap power supply is 750 watts or 1100 watts.
– The backplane for ten 2.5-inch NVMe drives is not installed.
– Rear hot-swap drive asse bly is not installed.
– No syste fan is failed.
• P4/T4 GPU is supported only when the following configuration require ents are
et:
– Intel Xeon 6144, 6146, 6246, or 6252N processor is not installed and processor
TDP is less than or equal to 165 watts.
– The backplane for ten 2.5-inch NVMe drives is not installed.
– Rear hot-swap drive asse bly is not installed.
6ThinkAgile MX Certified Node 1UThinkAgile MX3321-H, MX3321-FUser Guide

Table 1. Server specifications (continued)
Specification Description
– If one P4/T4 GPU is installed, the power of the hot-swap power supply ust be
750 watts or 1100 watts.
– If two P4/T4 GPUs are installed, the power of the hot-swap power supply ust
be 1100 watts
– If one P4/T4 GPU is installed in PCIe slot 3, the syste operating te perature
ust be less than or equal to 35 °C to support fan rotor redundancy.
– If two P4/T4 GPUs are installed, one in PCIe slot 1 and one in PCIe slot 3, the
syste operating te perature ust be less than or equal to 30 °C to support
fan rotor redundancy.
• P600 GPU is supported only when the following configuration require ents are
et:
– Intel Xeon 6144, 6146, 6246, or 6252N processor is not installed and processor
TDP is less than or equal to 165 watts.
– If one or two P600 GPUs are installed, the power of the hot-swap power supply
is 750 watts or 1100 watts; if three P600 GPUs are installed, the power of the
hot-swap power supply is 1100 watts.
– The backplane for ten 2.5-inch NVMe drives is not installed.
– Rear hot-swap drive asse bly is not installed.
– No syste fan is failed.
• P620 GPU is supported only when the following configuration require ents are
et:
– Intel Xeon 6144, 6146, 6246, or 6252N processor is not installed and processor
TDP is less than or equal to 165 watts.
– If one or two P620 GPUs are installed, the power of the hot-swap power supply
is 750 watts or 1100 watts; if three P620 GPUs are installed, the power of the
hot-swap power supply is 1100 watts.
– The backplane for ten 2.5-inch NVMe drives is not installed.
– Rear hot-swap drive asse bly is not installed.
– No syste fan is failed.
Input/Output (I/O) features • Front panel:
– One VGA connector (available on so e odels)
– One XClarity Controller USB 2.0 connector
– One USB 3.0 connector
• Rear panel:
– One VGA connector
– Two USB 3.0 connectors
– One XClarity Controller network connector
– Two or four Ethernet connectors on the LOM adapter (available on so e
odels)
– One serial port (available on so e odels)
RAID adapters (depending on
the odel) • A RAID 530-8i SAS/SATA adapter that supports JBOD ode and RAID levels 0, 1,
5, 10, and 50
• A RAID 730-8i 1G Cache SAS/SATA adapter that supports JBOD ode and RAID
levels 0, 1, 5, 10, and 50 (for Chinese Mainland only)
Chapter 2.Specifications 7

Table 1. Server specifications (continued)
Specification Description
• A RAID 730-8i 2G Cache SAS/SATA adapter that supports JBOD ode and RAID
levels 0, 1, 5, 6, 10, 50, and 60
• A RAID 930-8i or 930-16i SAS/SATA adapter that supports JBOD ode and RAID
levels 0, 1, 5, 6, 10, 50, and 60
• A RAID 930-8e SAS/SATA adapter that supports JBOD ode and RAID levels 0,
1, 5, 6, 10, 50, and 60
Notes:
• RAID 530-8i SAS/SATA adapter, RAID 730-8i SAS/SATA adapter, and RAID 930-
8i SAS/SATA adapter cannot be ixed.
• A RAID super capacitor odule ust be installed if the RAID 930-8i or 930-16i
SAS/SATA adapter or RAID 930-8e SAS/SATA adapter is installed.
Syste fans • One processor: five dual-rotor hot-swap fans (including one redundant fan rotor)
• Two processors: seven dual-rotor hot-swap fans (including one redundant fan
rotor)
Notes:
• For server odels installed with Intel Xeon 6144, 6146, 6154, 6240Y, 6244, 6246,
6252N, 6254, 8168, 8171M, 8180, 8180M, 8268, 8270, 8280, 8280L, and 8280M
processors, fan rotor redundancy is not supported. If one fan rotor fails, the server
perfor ance will be degraded.
• If your server co es with only one processor, five syste fans (fan 1 to fan 5) are
adequate to provide proper cooling. However, you ust keep the locations for fan
6 and fan 7 occupied by a fan filler to ensure proper airflow.
• When 256 GB/512 GB DCPMM is installed, and the a bient te perature is ore
than 30°C, fan rotor redundancy is not supported.
Power supplies One or two hot-swap power supplies for redundancy support
• 550-watt ac 80 PLUS Platinu
• 750-watt ac 80 PLUS Platinu
• 750-watt ac 80 PLUS Titaniu
• 1100-watt ac 80 PLUS Platinu
Mini al configuration for
debugging • One processor in processor socket 1
• One e ory odule in slot 5
• One power supply
• One HDD drive or one M.2 drive (if OS is needed for debugging)
• Five syste fans (fan 1 to fan 5)
8ThinkAgile MX Certified Node 1UThinkAgile MX3321-H, MX3321-FUser Guide

Table 1. Server specifications (continued)
Specification Description
Acoustical noise e issions • Sound power levels, idle
– 4.9 bels, ini u
– 5.0 bels, typical
– 5.8 bels, axi u
• Sound power levels, operating
– 5.3 bels, ini u
– 6.1 bels, typical
– 6.2 bels, axi u
Notes:
• These sound power levels are easured in controlled acoustical environ ents
according to procedures specified by ISO 7779 and are reported in accordance
with ISO 9296.
• The declared acoustic noise levels are based on specified configurations, which
ay change slightly depending on configuration/conditions.
Electrical input • Sine-wave input (50–60 Hz) required
• Input voltage low range:
– Mini u : 100 V ac
– Maxi u : 127 V ac
• Input voltage high range:
– Mini u : 200 V ac
– Maxi u : 240 V ac
Note: For server odels with 750-watt ac 80 PLUS Titaniu power supplies, 100–
127 V ac input voltage is not supported.
AUTION:
240 V dc input (input range: 180-300 V dc) is supported in hinese Mainland
ONLY. Power supply with 240 V dc input cannot support hot plugging power
cord function. Before removing the power supply with dc input, please turn off
server or disconnect dc power sources at the breaker panel or by turning off the
power source. Then, remove the power cord.
Environ ent The server is supported in the following environ ent:
• Air te perature:
– Operating:
– ASHRAE class A2: 10–35°C (50–95°F); when the altitude exceeds 900
(2953 ft), the axi u a bient te perature value decreases by 1°C (1.8°F)
with every 300 (984 ft) of altitude increase.
– ASHRAE class A3: 5–40°C (41–104°F); when the altitude exceeds 900
(2953 ft), the axi u a bient te perature value decreases by 1°C (1.8°F)
with every 175 (574 ft) of altitude increase.
– ASHRAE class A4: 5–45°C (41–113°F); when the altitude exceeds 900
(2953 ft), the axi u a bient te perature value decreases by 1°C (1.8°F)
with every 125 (410 ft) of altitude increase.
– Server off: 5–45°C (41–113°F)
– Shipping or storage: -40–60°C (-40–140°F)
Chapter 2.Specifications 9

Table 1. Server specifications (continued)
Specification Description
• Maxi u altitude: 3050 (10 000 ft)
• Relative hu idity (non-condensing):
– Operating:
– ASHRAE class A2: 8%–80%; axi u dew point: 21°C (70°F)
– ASHRAE class A3: 8%–85%; axi u dew point: 24°C (75°F)
– ASHRAE class A4: 8%–90%; axi u dew point: 24°C (75°F)
– Shipping or storage: 8%–90%
• Particulate conta ination
Attention: Airborne particulates and reactive gases acting alone or in
co bination with other environ ental factors such as hu idity or te perature
ight pose a risk to the server. For infor ation about the li its for particulates and
gases, see “Particulate conta ination” on page 116.
Note: Your server co plies with ASHRAE class A2 specifications. The server
perfor ance ight be i pacted when the syste operating te perature is outside
the ASHRAE A2 specifications. Depending on the hardware configuration, so e
server odels co ply with ASHRAE class A3 and class A4 specifications. To co ply
with ASHRAE class A3 and class A4 specifications, the server odels ust eet the
following hardware configuration require ents at the sa e ti e:
• Two power supplies are installed.
• NVMe drive is not installed.
• NVMe PCIe flash adapter is not installed.
• P2000 GPU is not installed.
• P2200 GPU is not installed.
• P4000 GPU is not installed.
• RTX4000 GPU is not installed.
• No P4 GPU is installed in PCIe slot 1.
• No T4 GPU is installed in PCIe slot 1.
• No P600 GPU is installed in PCIe slot 2.
• No P620 GPU is installed in PCIe slot 2.
• Innova-2 FPGA S art NIC active GPU is not installed.
• ThinkSyste Mellanox ConnectX-6 100 Gbs 1P/2P PCIe adapter is not installed.
• ThinkSyste Mellanox ConnectX-6 HDR/200GbE QSFP56 1-port PCIe adapter is
not installed.
• For server odels with 2.5-inch drive bays, the RAID super capacitor odule
cannot be installed on the botto of the air baffle, but only can be installed on the
chassis.
• The backplane for ten 2.5-inch NVMe drives is not installed.
• The following processors are not installed:
– Processors with TDP higher than or equal to 150 watts
– Intel Xeon 4112, 5122, 6126, 6128, 6132, 6134, 6134M, and 8156 processors
10 ThinkAgile MX Certified Node 1UThinkAgile MX3321-H, MX3321-FUser Guide

Important information for system board, processor, and heat sink
There are two types of syste board for your server:
• Left: Syste board with large lift handle 1
• Right: Syste board with s all lift handle 2
Figure 1. Two types of syste board
There are two shape types of heat sink for your server:
• Left: S all-size heat sink
• Right: Large-size heat sink
Figure 2. Two types of heat sink
Chapter 2.Specifications 11

The following table lists the i portant infor ation for the syste board, heat sink, and processor.
System board
installed
Heat sink
installed
Important information
Syste board
with large lift
handle or syste
board with s all
lift handle
S all size heat
sink
For server odels installed with Intel Xeon 6144, 6146, 6154, 6240Y, 6244,
6246, 6252N, 6254, 8168, 8171M, 8180, 8180M, 8268, 8270, 8280, 8280L,
and 8280M processors, the following parts are not supported:
• Front backplane and front hot-swap SAS/SATA/NVMe drives
• Rear hot-swap drive asse bly
• RAID super capacitor odule on the botto of the air baffle
• NVMe PCIe flash adapter
• GPU
Syste board
with s all lift
handle
Large size heat
sink • For server odels installed with large size heat sink, the air baffle and the
RAID super capacitor odule on the botto of the air baffle are not
supported.
• For server odels installed with Intel Xeon 6144, 6146, 6244, 6246,
6252N, 8168, 8171M, 8180, 8180M, 8268, 8270, 8280, 8280L, and 8280M
processors, ensure that the following configuration require ents are et:
– The backplane for ten 2.5-inch NVMe drives is not installed.
– No syste fan is failed.
– Rear hot-swap drive asse bly is not installed.
– NVMe PCIe flash adapter is not installed.
– GPU is not installed.
• For server odels installed with the backplane for ten 2.5-inch SAS/
SATA/NVMe drives, Intel Xeon 6154, 6254, and 6240Y processor is
supported with the condition that the following configuration require ents
are et:
– No syste fan is failed.
– Only four SAS/SATA/NVMe drives are installed in drive bays 6–9.
– Rear hot-swap drive asse bly is not installed.
– NVMe PCIe flash adapter is not installed.
– GPU is not installed.
Figure 3. Front view of server odels installed with Intel Xeon 6154, 6254
and 6240Y processor
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hapter 3. Server components
Use the infor ation in this section to learn about each of the co ponents associated with your server.
Front view
The front view of the server varies by odel. Depending on the odel, your server ight look slightly
different fro the illustrations in this topic.
Figure 4. Front view of server odels with four 3.5-inch drive bays
Figure 5. Front view of server odels with eight 2.5-inch drive bays
Figure 6. Front view of server odels with ten 2.5-inch drive bays
Table 2. Co ponents on the front of the server
1 VGA connector (available on so e odels) 2 Pull-out infor ation tab
3 XClarity Controller USB connector 4 USB 3.0 connector
5 Operator infor ation panel 6 Rack latch (right)
© Copyright Lenovo 2018, 2020 13

Table 2. Co ponents on the front of the server (continued)
7 Hot-swap drive bays 8 Drive status LED (yellow)
9 Drive activity LED (green) 10 Rack latch (left)
1 VGA connector (available on some models)
Used to attach a high-perfor ance onitor, a direct-drive onitor, or other devices that use a VGA
connector.
2 Pull-out information tab
The XClarity Controller network access label is attached on the pull-out infor ation tab.
3 X larity ontroller USB connector
Depending on the setting, this connector supports USB 2.0 function, XClarity Controller anage ent
function, or both.
• If the connector is set for USB 2.0 function, you can attach a device that requires a USB 2.0 connection,
such as a keyboard, a ouse, or a USB storage device.
• If the connector is set for XClarity Controller anage ent function, you can attach a obile device
installed with the application to run XClarity Controller event logs.
• If the connector is set to have both functions, you can press the ID button for three seconds to switch
between the two functions.
4 USB 3.0 connector
Attach a USB-co patible device, such as a USB keyboard, USB ouse, or USB storage device.
5 Operator information panel
For infor ation about the controls and status LEDs on the operator infor ation panel, see “Operator
infor ation panel” on page 15.
6 10 Rack latches
If your server is installed in a rack, you can use the rack latches to help you slide the server out of the rack.
You also can use the rack latches and screws to secure the server in the rack so that the server cannot slide
out, especially in vibration-prone areas. For ore infor ation, refer to the Rack Installation Guide that co es
with your rail kit.
7 Hot-swap drive bays
The nu ber of the installed drives in your server varies by odel. When you install drives, follow the order of
the drive bay nu bers.
The EMI integrity and cooling of the server are protected by having all drive bays occupied. The vacant drive
bays ust be occupied by drive fillers.
8 Drive status LED
9 Drive activity LED
Each hot-swap drive has two LEDs.
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Drive LED Status Description
8 Drive status LED (right) Solid yellow The drive has an error.
Blinking yellow (blinking slowly, about one
flash per second)
The drive is being rebuilt.
Blinking yellow (blinking rapidly, about four
flashes per second)
The RAID adapter is locating the drive.
9 Drive activity LED (left) Solid green The drive is powered but not active.
Blinking green The drive is active.
Operator information panel
The operator infor ation panel of the server provides controls and LEDs.
The following illustration shows the operator infor ation panel of the server.
Figure 7. Operator infor ation panel
Table 3. Co ponents on the operator infor ation panel
1 Power button with power status LED 2 Network activity LED
3 Syste ID button with syste ID LED 4 Syste error LED
1 Power button with power status LED
You can press the power button to power on the server when you finish setting up the server. You also can
hold the power button for several seconds to power off the server if you cannot shut down the server fro
the operating syste . The power status LED helps you to deter ine the current power status.
Status olor Description
Solid on Green The server is on and running.
Slow blinking
(about one flash
per second)
Green The server is off and is ready to be powered on (standby state).
Fast blinking
(about four
flashes per
second)
Green The server is off, but the XClarity Controller is initializing, and the server is not ready
to be powered on.
Off None There is no ac power applied to the server.
2 Network activity LED
The network activity LED on the operator infor ation panel helps you identify the network connectivity and
activity.
Chapter 3.Server co ponents 15

Status olor Description
On Green The server is connected to a network.
Blinking Green The network is connected and active.
Off None The server is disconnected fro the network.
Co patibility of the NIC adapter and the network activity LED:
NI adapter Network activity LED
LOM adapter Support
ML2 NIC adapter Support
PCIe NIC adapter Not support
3 System ID button with system ID LED
Use this syste ID button and the blue syste ID LED to visually locate the server. A syste ID LED is also
located on the rear of the server. Each ti e you press the syste ID button, the state of both the syste ID
LEDs changes. The LEDs can be changed to on, blinking, or off. You can also use the Lenovo XClarity
Controller or a re ote anage ent progra to change the state of the syste ID LEDs to assist in visually
locating the server a ong other servers.
If the XClarity Controller USB connector is set to have both the USB 2.0 function and XClarity Controller
anage ent function, you can press the syste ID button for three seconds to switch between the two
functions.
4 System error LED
The syste error LED helps you to deter ine if there are any syste errors.
Status olor Description Action
On Yellow An error has been detected on the server.
Causes ight include but not li ited to the
following errors:
• The te perature of the server reached
the non-critical te perature threshold.
• The voltage of the server reached the
non-critical voltage threshold.
• A fan has been detected to be running at
low speed.
• A hot-swap fan has been re oved.
• The power supply has a critical error.
• The power supply is not connected to
the power.
Check the event log to deter ine the exact
cause of the error.
Off None The server is off or the server is on and is
working correctly.
None.
Rear view
The rear of the server provides access to several connectors and co ponents, including the power supplies,
PCIe adapters, hot-swap drive bays, serial port, and Ethernet connectors.
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