Lenovo ThinkSystem SR635 User manual

ThinkSystem SR635
Maintenance Manual
Machine Types: 7Y98 and 7Y99

Note
Before using this information and the roduct it su orts, be sure to read and understand the safety
information and the safety instructions, which are available at:
htt ://thinksystem.lenovofiles.com/hel /to ic/safety_documentation/ df_files.html
In addition, ensure that you are familiar with the terms and conditions of the Lenovo warranty for your server,
which can be found at:
htt ://datacentersu ort.lenovo.com/warrantylooku
Eighth Edition (June 2021)
© Copyright Lenovo 201 , 2021.
LIMITED AND RESTRICTED RIGHTS NOTICE: If data or software is delivered ursuant to a General Services
Administration (GSA) contract, use, re roduction, or disclosure is subject to restrictions set forth in Contract No. GS-35F-
05925.

Contents
Safety . . . . . . . . . . . . . . . . . . v
Safety ins ection checklist . . . . . . . . . . . vi
Chapter 1. Introduction . . . . . . . . . 1
S ecifications . . . . . . . . . . . . . . . . 3
Particulate contamination . . . . . . . . . . 7
Firmware u dates . . . . . . . . . . . . . . . 8
Tech Ti s . . . . . . . . . . . . . . . . . 10
Security advisories . . . . . . . . . . . . . 11
Power on the server . . . . . . . . . . . . . 11
Power off the server . . . . . . . . . . . . . 11
Chapter 2. Server components . . . . 13
Front view . . . . . . . . . . . . . . . . . 13
O erator information anel . . . . . . . . . . 15
Rear view . . . . . . . . . . . . . . . . . 16
Rear view LEDs . . . . . . . . . . . . . . . 20
System board com onents . . . . . . . . . . 21
System board LEDs . . . . . . . . . . . . . 24
System board jum ers . . . . . . . . . . . . 26
Internal cable routing. . . . . . . . . . . . . 27
Power/Sideband cable routing . . . . . . . 28
Server model with four 3.5-inch SAS/SATA
drives . . . . . . . . . . . . . . . . . 30
Server model with eight 2.5-inch SAS/SATA
drives . . . . . . . . . . . . . . . . . 39
Server model with six 2.5-inch SAS/SATA
drives and four 2.5-inch NVMe drives . . . . 47
Server model with ten 2.5-inch SAS/SATA/
NVMe drives . . . . . . . . . . . . . . 54
M.2 module cable routing . . . . . . . . . 67
Su er ca acitor cable routing . . . . . . . 69
VGA/USB/Front anel connector . . . . . . 70
Intrusion switch cable routing . . . . . . . 72
Parts list. . . . . . . . . . . . . . . . . . 74
Power cords . . . . . . . . . . . . . . 77
Chapter 3. Hardware replacement
procedures . . . . . . . . . . . . . . . 7
Installation Guidelines . . . . . . . . . . . . 79
Safety ins ection checklist. . . . . . . . . 80
System reliability guidelines . . . . . . . . 81
Working inside the server with the ower on . . 81
Handling static-sensitive devices . . . . . . 82
Technical rules . . . . . . . . . . . . . . . 82
Technical rules for rocessor and heat sink . . 82
Technical rules for ower su ly . . . . . . 83
Technical rules for system fans . . . . . . . 85
Technical rules for GPU ada ters . . . . . . 85
Technical rules for drives . . . . . . . . . 87
Technical rules for HBA/RAID ada ters . . . . 88
Technical rules for PCIe NVMe ada ter . . . . 88
Technical rules for Ethernet ada ters. . . . . 88
To cover re lacement . . . . . . . . . . . . 89
Remove the to cover . . . . . . . . . . 89
Install the to cover . . . . . . . . . . . 90
Air baffle re lacement . . . . . . . . . . . . 91
Remove the air baffle . . . . . . . . . . . 92
Install the air baffle . . . . . . . . . . . . 93
Rack latches re lacement . . . . . . . . . . . 94
Remove the rack latches . . . . . . . . . 94
Install the rack latches . . . . . . . . . . 97
Security bezel re lacement . . . . . . . . . . 99
Remove the security bezel . . . . . . . . . 99
Install the security bezel. . . . . . . . . . 100
System fan re lacement . . . . . . . . . . . 102
Remove a system fan. . . . . . . . . . . 102
Install a system fan. . . . . . . . . . . . 103
Memory module re lacement . . . . . . . . . 105
Remove a memory module . . . . . . . . 105
Memory module installation rules . . . . . . 107
Install a memory module . . . . . . . . . 109
Hot-swa drive re lacement . . . . . . . . . . 110
Remove a hot-swa drive . . . . . . . . . 111
Install a hot-swa drive . . . . . . . . . . 112
OCP 3.0 Ethernet ada ter re lacement . . . . . 113
Remove the OCP 3.0 Ethernet ada ter . . . . 113
Install the OCP 3.0 Ethernet ada ter . . . . . 114
Internal riser assembly re lacement . . . . . . . 115
Remove the internal riser assembly . . . . . 115
Install the internal riser assembly . . . . . . 116
Riser card re lacement . . . . . . . . . . . . 117
Remove a riser card . . . . . . . . . . . 118
Install a riser card . . . . . . . . . . . . 120
PCIe ada ter re lacement. . . . . . . . . . . 121
Remove a PCIe ada ter . . . . . . . . . . 122
Install a PCIe ada ter . . . . . . . . . . . 125
Intrusion switch re lacement . . . . . . . . . 128
Remove an intrusion switch . . . . . . . . 128
Install an intrusion switch . . . . . . . . . 129
GPU re lacement . . . . . . . . . . . . . . 130
Remove a GPU ada ter . . . . . . . . . . 130
Install a GPU ada ter . . . . . . . . . . . 131
Back lane re lacement. . . . . . . . . . . . 131
© Co yright Lenovo 2019, 2021 i

Remove the back lane for four 3.5-inch hot-
swa drives . . . . . . . . . . . . . . 131
Install the back lane for four 3.5-inch hot-
swa drives . . . . . . . . . . . . . . 132
Remove the back lane for eight 2.5-inch hot-
swa drives . . . . . . . . . . . . . . 134
Install the back lane for eight 2.5-inch hot-
swa drives . . . . . . . . . . . . . . 134
Remove the back lane for ten 2.5-inch hot-
swa drives . . . . . . . . . . . . . . 135
Install the back lane for ten 2.5-inch hot-
swa drives . . . . . . . . . . . . . . 136
Remove the rear back lane . . . . . . . . 138
Install the rear back lane . . . . . . . . . 139
CMOS battery re lacement . . . . . . . . . . 142
Remove the CMOS battery . . . . . . . . 142
Install the CMOS battery . . . . . . . . . 143
TPM ada ter re lacement. . . . . . . . . . . 145
Remove the TPM ada ter . . . . . . . . . 145
Install the TPM ada ter . . . . . . . . . . 146
Rear hot-swa drive cage re lacement . . . . . 147
Remove the rear hot-swa drive cage . . . . 148
Install the rear hot-swa drive cage . . . . . 148
Middle drive cage re lacement . . . . . . . . . 152
Remove the middle drive cage . . . . . . . 152
Install the middle drive cage . . . . . . . . 155
M.2 ada ter and M.2 drive re lacement . . . . . 159
Remove the M.2 ada ter and M.2 drive. . . . 159
Adjust the retainer on the M.2 ada ter . . . . 162
Install the M.2 ada ter and M.2 drive. . . . . 163
RAID su er ca acitor module re lacement . . . . 167
Remove a su er ca acitor module on the M.2/
riser su ort bracket . . . . . . . . . . . 167
Install a su er ca acitor module on the M.2/
riser su ort bracket . . . . . . . . . . . 168
Remove the RAID su er ca acitor module on
the chassis . . . . . . . . . . . . . . . 169
Install the RAID su er ca acitor module on
the chassis . . . . . . . . . . . . . . . 170
Front I/O assembly re lacement . . . . . . . . 172
Remove the front I/O assembly . . . . . . . 173
Install the front I/O assembly . . . . . . . . 173
Hot-swa ower su ly re lacement . . . . . . 174
Remove a hot-swa ower su ly. . . . . . 174
Install a hot-swa ower su ly . . . . . . 179
Heat sink and micro rocessor re lacement . . . . 184
Remove a heat sink . . . . . . . . . . . 184
Remove a rocessor . . . . . . . . . . . 185
Install a rocessor . . . . . . . . . . . . 186
Install a heat sink . . . . . . . . . . . . 188
Fan board re lacement . . . . . . . . . . . . 189
Remove the fan board . . . . . . . . . . 189
Install the fan board . . . . . . . . . . . 190
Power inverter board (PIB) board re lacement . . . 191
Remove the PIB board . . . . . . . . . . 191
Install the PIB board . . . . . . . . . . . 192
System board re lacement . . . . . . . . . . 193
Remove the system board . . . . . . . . . 193
Install the system board . . . . . . . . . . 195
U date the Vital Product Data (VPD) . . . . . 197
Configure security settings. . . . . . . . . 199
Com lete the arts re lacement . . . . . . . . 203
Chapter 4. Problem
determination . . . . . . . . . . . . . 205
Event logs . . . . . . . . . . . . . . . . . 205
Light ath diagnostics . . . . . . . . . . . . 206
General roblem determination rocedures . . . . 206
Resolving sus ected ower roblems . . . . 207
Resolving sus ected Ethernet controller
roblems . . . . . . . . . . . . . . . 207
Troubleshooting by sym tom . . . . . . . . . 208
Power on and ower off roblems . . . . . . 208
Memory roblems . . . . . . . . . . . . 210
Hard disk drive roblems . . . . . . . . . 211
Monitor and video roblems . . . . . . . . 213
Keyboard, mouse, or USB-device
roblems . . . . . . . . . . . . . . . 214
O tional-device roblems . . . . . . . . . 215
Serial-device roblems . . . . . . . . . . 216
Intermittent roblems. . . . . . . . . . . 217
Power roblems . . . . . . . . . . . . . 218
Network roblems . . . . . . . . . . . . 218
Observable roblems. . . . . . . . . . . 218
Software roblems. . . . . . . . . . . . 221
Appendix A. Hardware
disassembling for recycle . . . . . . . 223
Disassembling the system board for recycle. . . . 223
Appendix B. Getting help and
technical assistance . . . . . . . . . . 225
Before you call . . . . . . . . . . . . . . . 225
Collecting service data . . . . . . . . . . . . 226
Contacting Su ort . . . . . . . . . . . . . 226
Appendix C. Notices. . . . . . . . . . 227
Trademarks . . . . . . . . . . . . . . . . 228
Im ortant notes . . . . . . . . . . . . . . . 228
Telecommunication regulatory statement. . . . . 228
Electronic emission notices . . . . . . . . . . 228
Taiwan BSMI RoHS declaration . . . . . . . 229
Taiwan im ort and ex ort contact information . . . 229
ii ThinkSystem SR635 Maintenance Manual

Index . . . . . . . . . . . . . . . . . . 231
© Co yright Lenovo 2019, 2021 iii

iv ThinkSystem SR635 Maintenance Manual

Safety
Before installing this roduct, read the Safety Information.
Antes de instalar este roduto, leia as Informações de Segurança.
在安装本产品之前，请仔细阅读 Safety Information （安全信息）。
Læs sikkerhedsforskrifterne, før du installerer dette rodukt.
Lees voordat u dit roduct installeert eerst de veiligheidsvoorschriften.
Ennen kuin asennat tämän tuotteen, lue turvaohjeet kohdasta Safety Information.
Avant d'installer ce roduit, lisez les consignes de sécurité.
Vor der Installation dieses Produkts die Sicherheitshinweise lesen.
Prima di installare questo rodotto, leggere le Informazioni sulla Sicurezza.
Les sikkerhetsinformasjonen (Safety Information) før du installerer dette roduktet.
Antes de instalar este roduto, leia as Informações sobre Segurança.
© Co yright Lenovo 2019, 2021 v

Antes de instalar este roducto, lea la información de seguridad.
Läs säkerhetsinformationen innan du installerar den här rodukten.
Safety inspection checklist
Use the information in this section to identify otentially unsafe conditions with your server. As each machine
was designed and built, required safety items were installed to rotect users and service technicians from
injury.
Notes:
1. The roduct is not suitable for use at visual dis lay work laces according to §2 of the Work lace
Regulations.
2. The set-u of the server is made in the server room only.
CAUTION:
This equipment must be installed or serviced by trained personnel, as defined by the NEC, IEC 62368-
1 & IEC 60 50-1, the standard for Safety of Electronic Equipment within the Field of Audio/Video,
Information Technology and Communication Technology. Lenovo assumes you are qualified in the
servicing of equipment and trained in recognizing hazards energy levels in products. Access to the
equipment is by the use of a tool, lock and key, or other means of security, and is controlled by the
authority responsible for the location.
Important: Electrical grounding of the server is required for o erator safety and correct system function.
Pro er grounding of the electrical outlet can be verified by a certified electrician.
Use the following checklist to verify that there are no otentially unsafe conditions:
1. Make sure that the ower is off and the ower cord is disconnected.
2. Check the ower cord.
• Make sure that the third-wire ground connector is in good condition. Use a meter to measure third-
wire ground continuity for 0.1 ohm or less between the external ground in and the frame ground.
• Make sure that the ower cord is the correct ty e.
To view the ower cords that are available for the server:
a. Go to:
vi ThinkSystem SR635 Maintenance Manual

htt ://dcsc.lenovo.com/#/
b. In the Customize a Model ane:
1) Click Select Options/Parts for a Model.
2) Enter the machine ty e and model for your server.
c. Click the Power tab to see all line cords.
• Make sure that the insulation is not frayed or worn.
3. Check for any obvious non-Lenovo alterations. Use good judgment as to the safety of any non-Lenovo
alterations.
4. Check inside the server for any obvious unsafe conditions, such as metal filings, contamination, water or
other liquid, or signs of fire or smoke damage.
5. Check for worn, frayed, or inched cables.
6. Make sure that the ower-su ly cover fasteners (screws or rivets) have not been removed or tam ered
with.
© Co yright Lenovo 2019, 2021 vii

viii ThinkSystem SR635 Maintenance Manual

Chapter 1. Introduction
The ThinkSystem SR635 server is a 1U rack server designed for erformance and ex ansion for various IT
workloads. With the modular design, the server is flexible to be customized for maximum storage ca acity or
high storage density with selectable in ut/out ut o tions and tiered system management.
Performance, ease of use, reliability, and ex ansion ca abilities were key considerations in the design of the
server. These design features make it ossible for you to customize the system hardware to meet your needs
today and rovide flexible ex ansion ca abilities for the future.
The server comes with a limited warranty. For details about the warranty, see:
htt s://su ort.lenovo.com/us/en/solutions/ht503310
For details about your s ecific warranty, see:
htt ://datacentersu ort.lenovo.com/warrantylooku
Identifying your server
When you contact Lenovo for hel , the machine ty e and serial number information hel s su ort
technicians to identify your server and rovide faster service.
The machine ty e and serial number are on the ID label on the right rack latch in the front of the server.
Figure 1. Location of the ID label
Quick response code
The system service label, which is on the to cover, rovides a quick res onse (QR) code for mobile access
to service information. Scan the QR code with a mobile device and a QR code reader a lication to get quick
access to the Lenovo Service Web site for this server. The Lenovo Service Information Web site rovides
additional information for arts installation and re lacement videos, and error codes for server su ort.
The following illustration shows the QR code: htt s://su ort.lenovo.com/ /servers/sr635
© Co yright Lenovo 2019, 2021 1

Figure 2. QR code
2ThinkSystem SR635 Maintenance Manual

Specifications
The following information is a summary of the features and s ecifications of the server. De ending on the
model, some features might not be available, or some s ecifications might not a ly.
Table 1. Server specifications
Specification Description
Dimension • 1U
• Height: 43.0 mm (1.69 inches)
• Width:
– With rack latches: 482.0 mm (19.0 inches)
– Without rack latches: 434.4 mm (17.1 inches)
• De th: 778.3 mm (30.6 inches)
Note: The de th is measured with rack latches and ower su ly installed, but
without security bezel installed.
Package weight U to 19.2 kg (42.3 lb)
Processor • One AMD® EPYC™ 7002 or 7003 rocessor
• Designed for Land Grid Array (LGA) 4094 (SP3) socket
• Scalable u to 64 cores
• Thermal Design Power (TDP): u to 280 watts
For a list of su orted rocessors, see:
htt s://static.lenovo.com/us/en/server roven/index.shtml
Heat sink • Standard heat sink
• High- erformance heat sink
Memory • Slots: 16 memory module slots
• Minimum memory: 8 GB
• Maximum memory: 2 TB
• Su orted memory module ty e:
– TruDDR4 2933, single-rank/dual-rank, 8 GB/16 GB/32 GB/64 GB RDIMM
– TruDDR4 3200, dual-rank, 16 GB/32 GB/64 GB RDIMM
– TruDDR4 2933, quad-rank, 128 GB 3DS RDIMM
Note: The o erating s eed and total memory ca acity de end on the rocessor
model and UEFI settings.
For a list of su orted memory, see the Lenovo ServerProven Web site: htt s://
static.lenovo.com/us/en/server roven/index.shtml.
Internal drives • U to two M.2 drives
• U to four 3.5-inch hot-swa SAS/SATA drives
• U to twelve 2.5-inch hot-swa SAS/SATA drives
• U to sixteen NVMe drives
PCIe slots De ending on the model, your server su orts u to three PCIe slots in the rear. For
detailed information, see “Rear view” on age 16.
Cha ter 1.Introduction 3

Table 1. Server specifications (continued
Specification Description
Gra hics rocessing unit
(GPU) • Maximum: three GPUs
• Ty e:
– NVIDIA Tesla T4
– NVIDIA Quadro P620
In ut/Out ut (I/O) features • Front anel:
– One VGA connector (o tional)
– Two USB 3.2 Gen 1 (5 Gb s) connectors
• Rear anel:
– One VGA connector
– Two USB 3.2 Gen 1 (5 Gb s) connectors
– Ethernet connectors on OCP 3.0 Ethernet ada ter (o tional)
– One RJ45 BMC management network connector
– One serial ort
HBA/RAID ada ters
(de ending on the model)
Su ort for JBOD mode :
• 430-8i SAS/SATA 12G HBA ada ter
• 430-16i SAS/SATA 12G HBA ada ter
• 430-8e SAS/SATA 12G HBA ada ter
• 430-16e SAS/SATA 12G HBA ada ter
Su ort for JBOD mode and RAID levels 0, 1, 5, 10, and 50:
• 530-8i PCIe 12G RAID ada ter
• 730-8i 1G Cache PCIe 12G RAID ada ter
• 730-8i 2G Flash PCIe 12G RAID ada ter
Su ort for JBOD mode and RAID levels 0, 1, 5, 10 ,50 , 6 and 60:
• 930-8i 2G Flash PCIe 12G RAID ada ter
• 930-16i 4G Flash PCIe 12G RAID ada ter
• 930-8e 4G Flash PCIe 12G RAID ada ter
• 930-16e 4G Flash PCIe 12G RAID ada ter
For technical rules for storage controller ada ters, see “Technical rules for HBA/RAID
ada ters” on age 88.
System fans Seven dual-rotor hot-swa fans (including one redundant fan rotor)
Power su lies One or two hot-swa ower su lies for redundancy su ort:
• 550-watt ac 80 PLUS Platinum
• 750-watt ac 80 PLUS Platinum
• 750-watt ac 80 PLUS Titanium
• 1100-watt ac 80 PLUS Platinum
4ThinkSystem SR635 Maintenance Manual

Table 1. Server specifications (continued
Specification Description
Minimal configuration for
debugging • One rocessor in rocessor socket 1
• One memory module in slot 1
• One ower su ly
• One HDD drive or one M.2 drive (if OS is needed for debugging)
• Six system fans (de ending on the configuration)
Acoustical noise emissions The declared acoustic noise levels are based on below configurations, which may
change de ending on configurations and conditions:
Config. Typical Storage rich GPU rich
CPU 1 x 155 W 1 x 155 W 1 x 155 W
DIMM 8 x 32 GB 16 x 64 GB 16 x 64 GB
Ethernet X710-T2L OCP 10 GbE BASE-T 4- ort
PCIe
10 GbE BASE-T 4- ort
PCIe
PSU 2 x 750 W 2 x 750 W 2 x 1100 W
RAID 530-8i RAID NA 930-16i RAID
Drive 8 x 2.5'' HDD 16 x 2.5'' NVMe SSD 10 x 2.5'' HDD
GPU NA NA 2 x T4 GPU
Acoustic noise levels:
Typical Storage rich GPU rich
Sound ower levels (LWA,m)
Idling 5.7 Bel 7.0 Bel 7.0 Bel
O erating 5.9 Bel 7.2 Bel 8.5 Bel
Sound ressure level (L A,m)
Idling 41 dBA 54 dBA 54 dBA
O erating 43 dBA 56 dBA 69 dBA
Notes:
• These sound levels were measured in controlled acoustical environments
according to rocedures s ecified by ISO7779 and are re orted in accordance
with ISO 9296.
• Government regulations (such as those rescribed by OSHA or Euro ean
Community Directives) may govern noise level ex osure in the work lace and may
a ly to you and your server installation. The actual sound ressure levels in your
installation de end u on a variety of factors, including the number of racks in the
installation; the size, materials, and configuration of the room; the noise levels from
other equi ment; the room ambient tem erature, and em loyee's location in
relation to the equi ment. Further, com liance with such government regulations
de ends on a variety of additional factors, including the duration of em loyees'
ex osure and whether em loyees wear hearing rotection. Lenovo recommends
that you consult with qualified ex erts in this field to determine whether you are in
com liance with the a licable regulations.
Cha ter 1.Introduction 5

Table 1. Server specifications (continued
Specification Description
Electrical in ut
Table 2. Electrical input for power supplies
Power supply 100–127 V ac (50–
60 Hz)
200–240 V ac (50–
60 Hz)
240 V dc*
550-watt 80 PLUS
Platinum
Yes Yes Yes
750-watt 80 PLUS
Platinum
Yes Yes Yes
750-watt 80 PLUS
Titanium
No Yes Yes
1100-watt 80
PLUS Platinum
Yes Yes Yes
CAUTION:
240 V dc input (input range: 180-300 V dc) is supported in Chinese Mainland
ONLY. Power supply with 240 V dc input cannot support hot plugging power
cord function. Before removing the power supply with dc input, please turn off
server or disconnect dc power sources at the breaker panel or by turning off the
power source. Then, remove the power cord.
Environment The server is su orted in the following environment:
Note: This server is designed for standard data center environment and
recommended to be laced in industrial data center.
• Air tem erature:
– O erating:
– ASHRAE class A2: 10–35°C (50–95°F); when the altitude exceeds 900 m
(2953 ft), the maximum ambient tem erature value decreases by 1°C (1.8°F)
with every 300 m (984 ft) of altitude increase.
– ASHRAE class A3: 5–40°C (41–104°F); when the altitude exceeds 900 m
(2953 ft), the maximum ambient tem erature value decreases by 1°C (1.8°F)
with every 175 m (574 ft) of altitude increase.
– ASHRAE class A4: 5–45°C (41–113°F); when the altitude exceeds 900 m
(2953 ft), the maximum ambient tem erature value decreases by 1°C (1.8°F)
with every 125 m (410 ft) of altitude increase.
– Server off: 5–45°C (41–113°F)
– Shi ing or storage: -40–60°C (-40–140°F)
• Maximum altitude: 3050 m (10 000 ft)
• Relative humidity (non-condensing):
– O erating:
– ASHRAE Class A2: 8%–80%, maximum dew oint: 21°C (70°F)
– ASHRAE Class A3: 8%–85%, maximum dew oint: 24°C (75°F)
– ASHRAE Class A4: 8%–90%, maximum dew oint: 24°C (75°F)
– Shi ment or storage: 8%–90%
• Particulate contamination
6ThinkSystem SR635 Maintenance Manual

Table 1. Server specifications (continued
Specification Description
Attention: Airborne articulates and reactive gases acting alone or in
combination with other environmental factors such as humidity or tem erature
might ose a risk to the server.
Your server com lies with ASHRAE class A2 s ecifications. The server erformance
might be im acted when the o erating tem erature is outside the ASHRAE A2
s ecifications. Server model with the following configurations com lies with ASHRAE
class A3 and class A4 s ecifications:
• The rocessor TDP is 120/155 watts.
• There is no NVMe drive, rear drive cage, M.2 drive, GPU ada ter, Ethernet ada ter
of 10 GbE or higher, or PCIe NVMe ada ter installed.
Note: Server model with 2 ort/4 ort 1G OCP 3.0 Ethernet ada ter installed can
com ly with ASHRAE class A3 and class A4 s ecifications.
Particulate contamination
Attention: Airborne articulates (including metal flakes or articles) and reactive gases acting alone or in
combination with other environmental factors such as humidity or tem erature might ose a risk to the
device that is described in this document.
Risks that are osed by the resence of excessive articulate levels or concentrations of harmful gases
include damage that might cause the device to malfunction or cease functioning altogether. This
s ecification sets forth limits for articulates and gases that are intended to avoid such damage. The limits
must not be viewed or used as definitive limits, because numerous other factors, such as tem erature or
moisture content of the air, can influence the im act of articulates or environmental corrosives and gaseous
contaminant transfer. In the absence of s ecific limits that are set forth in this document, you must
im lement ractices that maintain articulate and gas levels that are consistent with the rotection of human
health and safety. If Lenovo determines that the levels of articulates or gases in your environment have
caused damage to the device, Lenovo may condition rovision of re air or re lacement of devices or arts
on im lementation of a ro riate remedial measures to mitigate such environmental contamination.
Im lementation of such remedial measures is a customer res onsibility.
Cha ter 1.Introduction 7

Table 3. Limits for particulates and gases
Contaminant Limits
Reactive gases Severity level G1 as er ANSI/ISA 71.04-19851:
• The co er reactivity level shall be less than 300 Å/month (around 0.0039 μg/cm2-hour weight
gain).2
• The silver reactivity level shall be less than 200 Å/month (around 0.0035 μg/cm2-hour weight
gain).3
• The reactive monitoring of gaseous corrosivity must be conducted a roximately 5 cm (2 in.) in
front of the rack on the air inlet side at one-quarter and three-quarter frame height off the floor or
where the air velocity is much higher.
Airborne
articulates Data centers must meet the cleanliness level of ISO 14644-1 class 8.
For data centers without airside economizer, the ISO 14644-1 class 8 cleanliness might be met by
choosing one of the following filtration methods:
• The room air might be continuously filtered with MERV 8 filters.
• Air entering a data center might be filtered with MERV 11 or referably MERV 13 filters.
For data centers with airside economizers, the choice of filters to achieve ISO class 8 cleanliness
de ends on the s ecific conditions resent at that data center.
• The deliquescent relative humidity of the articulate contamination should be more than 60%
RH.4
• Data centers must be free of zinc whiskers.5
1 ANSI/ISA-71.04-1985. Environmental conditions for process measurement and control systems: Airborne
contaminants. Instrument Society of America, Research Triangle Park, North Carolina, U.S.A.
2 The derivation of the equivalence between the rate of co er corrosion growth in the thickness of the corrosion
roduct in Å/month and the rate of weight gain assumes that Cu2S and Cu2O grow in equal ro ortions.
3 The derivation of the equivalence between the rate of silver corrosion growth in the thickness of the corrosion
roduct in Å/month and the rate of weight gain assumes that Ag2S is the only corrosion roduct.
4 The deliquescent relative humidity of articulate contamination is the relative humidity at which the dust absorbs
enough water to become wet and romote ionic conduction.
5 Surface debris is randomly collected from 10 areas of the data center on a 1.5 cm diameter disk of sticky
electrically conductive ta e on a metal stub. If examination of the sticky ta e in a scanning electron microsco e
reveals no zinc whiskers, the data center is considered free of zinc whiskers.
Firmware updates
Several o tions are available to u date the firmware for the server.
You can use the tools listed here to u date the most current firmware for your server and the devices that are
installed in the server.
Note: Lenovo ty ically releases firmware in bundles called U dateX ress System Packs (UXSPs). To ensure
that all of the firmware u dates are com atible, you should u date all firmware at the same time. If you are
u dating firmware for both the BMC and UEFI, u date the firmware for BMC first.
Best ractice related to u dating firmware is available at the following location:
htt ://lenovo ress.com/LP0656
8ThinkSystem SR635 Maintenance Manual

Important terminology
• In-band update. The installation or u date is erformed using a tool or a lication within an o erating
system that is executing on the server’s core CPU.
• Out-of-band update. The installation or u date is erformed by the BMC collecting the u date and then
directing the u date to the target subsystem or device. Out-of-band u dates have no de endency on an
o erating system executing on the core CPU. However, most out-of-band o erations do not require the
server to be in the S0 (Working) ower state.
• On-Target update. The installation or u date is initiated from an O erating System executing on the
server’s o erating system.
• Off-Target update. The installation or u date is initiated from a com uting device interacting directly with
the server’s BMC.
• UpdateXpress System Packs (UXSPs). UXSPs are bundled u dates designed and tested to rovide the
interde endent level of functionality, erformance, and com atibility. UXSPs are server machine-ty e
s ecific and are built (with firmware and device driver u dates) to su ort s ecific Windows Server, Red
Hat Enter rise Linux (RHEL) and SUSE Linux Enter rise Server (SLES) o erating system distributions.
Machine-ty e-s ecific firmware-only UXSPs are also available.
See the following table to determine the best Lenovo tool to use for installing and setting u the firmware:
Note: The server UEFI settings for o tion ROM must be set to UEFI to u date the firmware using Lenovo
XClarity Essentials. For more information, see the following Tech Ti :
htt s://datacentersu ort.lenovo.com/us/en/solutions/ht506118
Tool
In-
band
update
Out-
of-
band
update
On-
target
update
Off-
target
update
Graphi-
cal user
inter-
face
Command-
line
interface
Supports
UXSPs
Lenovo XClarity Provisioning
Manager Lite V2
Limited to core system firmware
only.
√ √ √
ThinkSystem System Manager
Su orts core system firmware
and most advanced I/O o tion
firmware u dates
√ √ √ √
Lenovo XClarity Essentials
Bootable Media Creator
Su orts core system firmware
and I/O firmware u dates. You can
u date the Microsoft Windows
o erating system, but device
drivers are not included on the
bootable image
√ √ √ √
Lenovo XClarity Administrator
Su orts core system firmware
and I/O firmware u dates
√1√2√ √
Notes:
1. For I/O firmware u dates.
2. For BMC and UEFI firmware u dates.
Cha ter 1.Introduction

The latest firmware can be found at the following site:
htt ://datacentersu ort.lenovo.com/ roducts/servers/thinksystem/sr635/7y98/downloads
• Lenovo XClarity Provisioning Manager Lite V2
From Lenovo XClarity Provisioning Manager Lite V2, you can u date the BMC firmware, the UEFI
firmware, and the Lenovo XClarity Provisioning Manager Lite V2 software.
S ecific details about Lenovo XClarity Provisioning Manager Lite V2 are available at:
htt s://sysmgt.lenovofiles.com/hel /to ic/lx m_frontend/lx m_lite_v2_about.html
Note: By default, the Lenovo XClarity Provisioning Manager Lite V2 Gra hical User Interface is dis layed
when you ress F11. If your server starts with the text-based system setu , you can bring u the
Gra hical User Interface from the text-based system setu interface.
• ThinkSystem System Manager
From ThinkSystem System Manager, you can u date the system firmware, the back lane firmware, and
the ower su ly firmware.
If you need to install a s ecific u date, you can use ThinkSystem System Manager for a s ecific server.
S ecific details about u dating firmware using ThinkSystem System Manager are available at:
htt s://thinksystem.lenovofiles.com/hel /to ic/7Y98/bmc_user_guide. df
• Lenovo XClarity Essentials Bootable Media Creator
You can use Lenovo XClarity Essentials Bootable Media Creator to create bootable media that is suitable
for a lying firmware u dates.
You can obtain Lenovo XClarity Essentials BoMC from the following location:
htt s://datacentersu ort.lenovo.com/solutions/lnvo-bomc
• Lenovo XClarity Administrator
If you are managing multi le servers using the Lenovo XClarity Administrator, you can u date firmware for
all managed servers through that interface. Firmware management is sim lified by assigning firmware-
com liance olicies to managed end oints. When you create and assign a com liance olicy to managed
end oints, Lenovo XClarity Administrator monitors changes to the inventory for those end oints and flags
any end oints that are out of com liance.
S ecific details about u dating firmware using Lenovo XClarity Administrator are available at:
htt s://sysmgt.lenovofiles.com/hel /to ic/com.lenovo.lxca.doc/u date_fw.html
Tech Tips
Lenovo continually u dates the su ort Web site with the latest ti s and techniques that you can use to
solve issues that you might have with your server. These Tech Ti s (also called retain ti s or service bulletins)
rovide rocedures to work around issues related to the o eration of your server.
To find the Tech Ti s available for your server:
1. Go to htt ://datacentersu ort.lenovo.com and navigate to the su ort age for your server.
2. Click Documentation from the navigation ane.
Follow the on-screen instructions to choose the category for the roblem that you are having.
10 ThinkSystem SR635 Maintenance Manual