Lenovo ThinkSystem SR860 V3 User manual

ThinkSystem SR860 V3
User Guide
Machine Type: 7D93, 7D94, and 7D95

Note
Be ore using this in ormation and the product it supports, be sure to read and understand the sa ety
in ormation and the sa ety instructions, which are available at:
https://pubs.lenovo.com/sa ety_documentation/
In addition, be sure that you are amiliar with the terms and conditions o the Lenovo warranty or your server,
which can be ound at:
http://datacentersupport.lenovo.com/warrantylookup
First Edition (May 2023)
© Copyright Lenovo 2023.
LIMITED AND RESTRICTED RIGHTS NOTICE: I data or so tware is delivered pursuant to a General Services
Administration (GSA) contract, use, reproduction, or disclosure is subject to restrictions set orth in Contract No. GS-35F-
05925.

Contents
Contents . . . . . . . . . . . . . . . . . i
afety . . . . . . . . . . . . . . . . . . v
Sa ety inspection checklist . . . . . . . . . . . vi
Chapter 1. Introduction . . . . . . . . . 1
Features. . . . . . . . . . . . . . . . . . . 1
Tech Tips . . . . . . . . . . . . . . . . . . 2
Security advisories . . . . . . . . . . . . . . 3
Speci ications . . . . . . . . . . . . . . . . 3
Technical speci ications. . . . . . . . . . . 3
Mechanical speci ications . . . . . . . . . . 8
Environmental speci ications . . . . . . . . . 9
Management options. . . . . . . . . . . . . 13
Chapter 2. erver components . . . . 17
Front view . . . . . . . . . . . . . . . . . 17
Rear view . . . . . . . . . . . . . . . . . 20
Top view . . . . . . . . . . . . . . . . . 23
Front I/O module . . . . . . . . . . . . . . 24
System board assembly layout . . . . . . . . . 27
System-board-assembly connectors. . . . . 28
System-board-assembly switches. . . . . . 29
System LEDs and diagnostics display . . . . . . 31
Chapter 3. Parts list . . . . . . . . . . 33
Power cords . . . . . . . . . . . . . . . . 37
Chapter 4. Unboxing and setup . . . . 39
Server package contents . . . . . . . . . . . 39
Identi y the server and access the Lenovo XClarity
Controller . . . . . . . . . . . . . . . . . 39
Server setup checklist . . . . . . . . . . . . 41
Chapter 5. Hardware replacement
procedures . . . . . . . . . . . . . . . 43
Installation Guidelines . . . . . . . . . . . . 43
Sa ety inspection checklist. . . . . . . . . 44
System reliability guidelines . . . . . . . . 45
Working inside the server with the power on . . 45
Handling static-sensitive devices . . . . . . 46
Memory module installation rules and order . . . . 46
Independent memory mode installation
order . . . . . . . . . . . . . . . . . 49
Memory mirroring mode installation order . . . 53
Drive backplane installation rules and order . . . . 54
PCIe riser and adapter installation rules and
order . . . . . . . . . . . . . . . . . . . 55
Power on and power o the server . . . . . . . 57
Power on the server . . . . . . . . . . . 57
Power o the server . . . . . . . . . . . 58
Server replacement . . . . . . . . . . . . . 58
Remove the server rom rails . . . . . . . . 58
Install the server to rails . . . . . . . . . . 65
Remove the rails rom the rack . . . . . . . 73
7mm drive and drive cage replacement . . . . . 73
Remove a 7mm drive . . . . . . . . . . . 73
Remove the 7mm drive cage . . . . . . . . 74
Install the 7mm drive cage . . . . . . . . . 80
Install a 7mm drive . . . . . . . . . . . . 85
Air ba le replacement . . . . . . . . . . . . 87
Remove the ront air ba le . . . . . . . . . 87
Install the ront air ba le. . . . . . . . . . 90
Remove the rear air ba le . . . . . . . . . 94
Install the rear air ba le . . . . . . . . . . 98
CMOS battery (CR2032) replacement . . . . . . 103
Remove the CMOS battery (CR2032) . . . . 103
Install the CMOS battery (CR2032) . . . . . 106
Crossbar replacement . . . . . . . . . . . . 109
Remove the crossbar . . . . . . . . . . . 109
Install the crossbar . . . . . . . . . . . . 112
Drive replacement . . . . . . . . . . . . . . 115
Remove a 2.5-inch hot-swap drive . . . . . 115
Install a 2.5-inch hot-swap drive . . . . . . 116
Drive backplane carrier assembly and drive
backplane replacement. . . . . . . . . . . . 118
Remove the drive backplane carrier
assembly . . . . . . . . . . . . . . . 118
Remove a 2.5-inch drive backplane . . . . . 119
Install a 2.5-inch drive backplane . . . . . . 121
Install the drive backplane carrier
assembly . . . . . . . . . . . . . . . 124
Fan and an cage replacement . . . . . . . . . 125
Remove a an module . . . . . . . . . . 125
Remove the an cage . . . . . . . . . . . 127
Install the an cage . . . . . . . . . . . . 129
Install a an module . . . . . . . . . . . 131
Flash power module replacement . . . . . . . . 133
Remove a lash power module . . . . . . . 133
Install a lash power module . . . . . . . . 134
GPU adapter link bridge and double-wide GPU
adapter replacement . . . . . . . . . . . . . 136
Remove a GPU adapter link bridge . . . . . 136
Remove a double-wide GPU adapter . . . . 138
Install a double-wide GPU adapter . . . . . 142
© Copyright Lenovo 2023 i

Install a GPU adapter link bridge . . . . . . 146
Intrusion switch replacement . . . . . . . . . 148
Remove the intrusion switch . . . . . . . . 148
Install the intrusion switch . . . . . . . . . 150
M.2 drive and M.2 boot adapter replacement . . . 152
Remove an M.2 drive . . . . . . . . . . . 152
Remove the M.2 boot adapter . . . . . . . 154
Install the M.2 boot adapter . . . . . . . . 156
Adjust the retainer on the M.2 backplane . . . 158
Install an M.2 drive . . . . . . . . . . . . 159
Management NIC adapter replacement . . . . . 161
Remove the management NIC adapter . . . . 161
Install the management NIC adapter . . . . . 163
Memory module replacement . . . . . . . . . 164
Remove a memory module . . . . . . . . 164
Install a memory module . . . . . . . . . 166
MicroSD card replacement . . . . . . . . . . 169
Remove the MicroSD card . . . . . . . . . 169
Install the MicroSD card. . . . . . . . . . 170
OCP module replacement . . . . . . . . . . . 171
Remove the OCP module . . . . . . . . . 171
Install the OCP module . . . . . . . . . . 172
PCIe riser and adapter replacement . . . . . . . 174
Remove the PCIe riser . . . . . . . . . . 174
Remove a PCIe adapter . . . . . . . . . . 179
Install a PCIe adapter . . . . . . . . . . . 183
Install the PCIe riser . . . . . . . . . . . 187
PCIe riser card and cage replacement . . . . . . 193
Remove a PCIe riser card and cage . . . . . 193
Install a PCIe riser card and cage . . . . . . 201
PCIe riser extender replacement . . . . . . . . 212
Remove a PCIe riser extender . . . . . . . 212
Install a PCIe riser extender . . . . . . . . 215
Power backplane replacement . . . . . . . . . 218
Remove the power backplane . . . . . . . 218
Install the power backplane . . . . . . . . 222
Power supply bracket (CRPS) replacement . . . . 224
Remove a power supply bracket (CRPS) . . . 224
Install a power supply bracket (CRPS) . . . . 227
Power supply key (CFFv4) replacement . . . . . 228
Remove a power supply key (CFFv4). . . . . 228
Install a power supply key (CFFv4). . . . . . 231
Power supply unit replacement . . . . . . . . . 233
Remove a hot-swap power supply unit . . . . 233
Install a hot-swap power supply unit . . . . . 235
Processor and heat sink replacement (trained
technician only) . . . . . . . . . . . . . . . 237
Remove a processor and heat sink . . . . . 237
Separate the processor rom carrier and heat
sink. . . . . . . . . . . . . . . . . . 241
Install a processor and heat sink . . . . . . 243
Serial port module replacement . . . . . . . . 250
Remove the serial port module . . . . . . . 250
Install the serial port module . . . . . . . . 253
System board assembly replacement (trained
technician only) . . . . . . . . . . . . . . . 256
Remove the irmware and RoT security
module . . . . . . . . . . . . . . . . 258
Install the irmware and RoT security
module . . . . . . . . . . . . . . . . 259
Remove the system I/O board or processor
board . . . . . . . . . . . . . . . . . 261
Install the system I/O board or processor
board . . . . . . . . . . . . . . . . . 264
Update the Vital Product Data (VPD) . . . . . 268
Hide/observe TPM . . . . . . . . . . . . 269
Update the TPM irmware . . . . . . . . . 270
Enable UEFI Secure Boot . . . . . . . . . 271
Top cover replacement . . . . . . . . . . . . 272
Remove the ront top cover . . . . . . . . 272
Remove the rear top cover. . . . . . . . . 274
Install the rear top cover. . . . . . . . . . 276
Install the ront top cover . . . . . . . . . 278
Complete the parts replacement . . . . . . . . 281
Chapter 6. Internal cable routing . . . 283
Identi ying connectors . . . . . . . . . . . . 283
Drive backplane connectors . . . . . . . . 283
PCIe riser connectors. . . . . . . . . . . 284
Power backplane connectors. . . . . . . . 289
System-board-assembly connectors or cable
routing . . . . . . . . . . . . . . . . 290
2.5-inch drive backplane cable routing . . . . . . 292
SAS/SATA backplane combinations . . . . . 293
AnyBay backplane combinations . . . . . . 313
7mm drive backplane cable routing . . . . . . . 416
External diagnostic handset connector cable
routing . . . . . . . . . . . . . . . . . . 416
Flash power module cable routing . . . . . . . 417
Front I/O module cable routing . . . . . . . . . 418
Front VGA assembly cable routing . . . . . . . 419
M.2 boot adapter cable routing . . . . . . . . . 420
Management NIC adapter cable routing . . . . . 423
PCIe riser 1 cable routing . . . . . . . . . . . 424
PCIe riser 2 cable routing . . . . . . . . . . . 426
PCIe riser 3 cable routing . . . . . . . . . . . 428
Power backplane cable routing. . . . . . . . . 430
Chapter 7. ystem configuration . . . 433
Set the network connection or the Lenovo XClarity
Controller . . . . . . . . . . . . . . . . . 433
ii ThinkSystem SR860 V3 User Guide

Set ront USB port or Lenovo XClarity Controller
connection. . . . . . . . . . . . . . . . . 434
Update the irmware . . . . . . . . . . . . . 435
Con igure the irmware . . . . . . . . . . . . 438
Memory module con iguration . . . . . . . . . 439
Enable So tware Guard Extensions (SGX). . . . . 440
RAID con iguration . . . . . . . . . . . . . 440
Deploy the operating system. . . . . . . . . . 441
Back up the server con iguration . . . . . . . . 442
Chapter 8. Problem
determination . . . . . . . . . . . . . 443
Event logs . . . . . . . . . . . . . . . . . 443
Troubleshooting by system LEDs and diagnostics
display . . . . . . . . . . . . . . . . . . 445
Drive LEDs . . . . . . . . . . . . . . . 445
Front I/O module LEDs . . . . . . . . . . 445
Rear system LEDs . . . . . . . . . . . . 447
Power supply LEDs . . . . . . . . . . . 448
System-board-assembly LEDs . . . . . . . 450
Firmware and RoT security module LEDs . . . 454
XCC system management port LEDs. . . . . 455
External Diagnostics Handset . . . . . . . 456
General problem determination procedures . . . . 461
Resolving suspected power problems . . . . 462
Resolving suspected Ethernet controller
problems . . . . . . . . . . . . . . . 462
Troubleshooting by symptom . . . . . . . . . 463
Hard disk drive problems . . . . . . . . . 463
Intermittent problems. . . . . . . . . . . 465
Keyboard, mouse, KVM switch or USB-device
problems . . . . . . . . . . . . . . . 467
Memory problems . . . . . . . . . . . . 468
Monitor and video problems . . . . . . . . 469
Network problems . . . . . . . . . . . . 471
Observable problems. . . . . . . . . . . 471
Optional-device problems . . . . . . . . . 474
Per ormance problems . . . . . . . . . . 476
Power on and power o problems. . . . . . 476
Power problems . . . . . . . . . . . . . 477
Serial-device problems . . . . . . . . . . 478
So tware problems. . . . . . . . . . . . 478
Appendix A. Hardware
disassembling for recycle . . . . . . . 481
Disassemble the system board assembly or
recycle . . . . . . . . . . . . . . . . . . 481
Appendix B. Getting help and
technical assistance . . . . . . . . . . 485
Be ore you call . . . . . . . . . . . . . . . 485
Collecting service data . . . . . . . . . . . . 486
Contacting Support . . . . . . . . . . . . . 487
Appendix C. Documents and
supports . . . . . . . . . . . . . . . . 489
Documents download . . . . . . . . . . . . 489
Support websites . . . . . . . . . . . . . . 489
Appendix D. Notices. . . . . . . . . . 491
Trademarks . . . . . . . . . . . . . . . . 492
Important notes . . . . . . . . . . . . . . . 492
Electronic emission notices . . . . . . . . . . 492
Taiwan Region BSMI RoHS declaration . . . . . 493
Taiwan Region import and export contact
in ormation . . . . . . . . . . . . . . . . 493
© Copyright Lenovo 2023 iii

iv ThinkSystem SR860 V3 User Guide

afety
Be ore installing this product, read the Sa ety In ormation.
Antes de instalar este produto, leia as In ormações de Segurança.
在安装本产品之前，请仔细阅读 Sa ety In ormation （安全信息）。
Læs sikkerheds orskri terne, ør du installerer dette produkt.
Lees voordat u dit product installeert eerst de veiligheidsvoorschri ten.
Ennen kuin asennat tämän tuotteen, lue turvaohjeet kohdasta Sa ety In ormation.
Avant d'installer ce produit, lisez les consignes de sécurité.
Vor der Installation dieses Produkts die Sicherheitshinweise lesen.
Prima di installare questo prodotto, leggere le In ormazioni sulla Sicurezza.
Les sikkerhetsin ormasjonen (Sa ety In ormation) ør du installerer dette produktet.
Antes de instalar este produto, leia as In ormações sobre Segurança.
© Copyright Lenovo 2023 v

Antes de instalar este producto, lea la in ormación de seguridad.
Läs säkerhetsin ormationen innan du installerar den här produkten.
afety inspection checklist
Use the in ormation in this section to identi y potentially unsa e conditions with your server. As each machine
was designed and built, required sa ety items were installed to protect users and service technicians rom
injury.
Note: The product is not suitable or use at visual display workplaces according to §2 o the Workplace
Regulations.
Note: The set-up o the server is made in the server room only.
CAUTION:
This equipment must be installed or serviced by trained personnel, as defined by the NEC, IEC 62368-
1 & IEC 60950-1, the standard for afety of Electronic Equipment within the Field of Audio/Video,
Information Technology and Communication Technology. Lenovo assumes you are qualified in the
servicing of equipment and trained in recognizing hazards energy levels in products. Access to the
equipment is by the use of a tool, lock and key, or other means of security, and is controlled by the
authority responsible for the location.
Important: Electrical grounding o the server is required or operator sa ety and correct system unction.
Proper grounding o the electrical outlet can be veri ied by a certi ied electrician.
Use the ollowing checklist to veri y that there are no potentially unsa e conditions:
1. Make sure that the power is o and the power cord is disconnected.
2. Check the power cord.
• Make sure that the third-wire ground connector is in good condition. Use a meter to measure third-
wire ground continuity or 0.1 ohm or less between the external ground pin and the rame ground.
• Make sure that the power cord is the correct type.
To view the power cords that are available or the server:
a. Go to:
vi ThinkSystem SR860 V3 User Guide

http://dcsc.lenovo.com/#/
b. Click Preconfigured Model or Configure to order.
c. Enter the machine type and model or your server to display the con igurator page.
d. Click Power ➙ Power Cables to see all line cords.
• Make sure that the insulation is not rayed or worn.
3. Check or any obvious non-Lenovo alterations. Use good judgment as to the sa ety o any non-Lenovo
alterations.
4. Check inside the server or any obvious unsa e conditions, such as metal ilings, contamination, water or
other liquid, or signs o ire or smoke damage.
5. Check or worn, rayed, or pinched cables.
6. Make sure that the power-supply cover asteners (screws or rivets) have not been removed or tampered
with.
© Copyright Lenovo 2023 vii

viii ThinkSystem SR860 V3 User Guide

Chapter 1. Introduction
The ThinkSystem SR860 V3 server (Types 7D93, 7D94, and 7D95) is a 4U rack server designed or high-
volume network transaction processing. This high-per ormance, multi-core server is ideally suited or
networking environments that require superior processor per ormance, input/output (I/O) lexibility, and high
manageability.
Figure 1. ThinkSystem SR860 V3
Features
Per ormance, ease o use, reliability, and expansion capabilities were key considerations in the design o
your server. These design eatures make it possible or you to customize the system hardware to meet your
needs today and provide lexible expansion capabilities or the uture.
Your server implements the ollowing eatures and technologies:
• Features on Demand
I a Features on Demand eature is integrated in the server or in an optional device that is installed in the
server, you can purchase an activation key to activate the eature. For in ormation about Features on
Demand, see:
https:// od.lenovo.com/lkms
• Lenovo XClarity Controller (XCC)
The Lenovo XClarity Controller is the common management controller or Lenovo ThinkSystem server
hardware. The Lenovo XClarity Controller consolidates multiple management unctions in a single chip on
the server system board (system board assembly). Some o the eatures that are unique to the Lenovo
XClarity Controller are enhanced per ormance, higher-resolution remote video, and expanded security
options.
The server supports Lenovo XClarity Controller 2 (XCC2). For additional in ormation about Lenovo XClarity
Controller 2 (XCC2), re er to https://sysmgt.lenovo iles.com/help/topic/lxcc_ rontend/lxcc_overview.html.
• UEFI-compliant server firmware
Lenovo ThinkSystem irmware is Uni ied Extensible Firmware Inter ace (UEFI) compliant. UEFI replaces
BIOS and de ines a standard inter ace between the operating system, plat orm irmware, and external
devices.
Lenovo ThinkSystem servers are capable o booting UEFI-compliant operating systems, BIOS-based
operating systems, and BIOS-based adapters as well as UEFI-compliant adapters.
© Copyright Lenovo 2023 1

Note: The server does not support Disk Operating System (DOS).
• Active Memory
The Active Memory eature improves the reliability o memory through memory mirroring. Memory
mirroring mode replicates and stores data on one or two DIMMs within the channel (DIMM con iguration
must match between the mirrored channels). I a ailure occurs, the memory controller switches rom the
primary memory DIMMs to the backup DIMMs.
• Large system-memory capacity
The server supports up to 64 TruDDR5 memory DIMMs operating at up to 4800 MHz. For more
in ormation about the speci ic types and maximum amount o memory, see “Technical speci ications” on
page 3.
• Large data-storage capacity and hot-swap capability
With the hot-swap eature, you can add, remove, or replace hard disk drives without turning o the server.
Storage capacity is di erent depending on server model. See “Technical speci ications” on page 3 or
more in ormation.
• Lightpath Diagnostics
Lightpath Diagnostics provides LEDs to help you diagnose problems. For more in ormation about the
Lightpath Diagnostics, see “Troubleshooting by system LEDs and diagnostics display” on page 445.
• Mobile access to Lenovo ervice Information website
The server provides a QR code on the system service label, which is on the cover o the server, that you
can scan using a QR code reader and scanner with a mobile device to get quick access to the Lenovo
Service In ormation website. The Lenovo Service In ormation website provides additional in ormation or
parts installation, replacement videos, and error codes or server support.
• Active Energy Manager
Lenovo XClarity Energy Manager is a power and temperature management solution or data centers. You
can monitor and manage the power consumption and temperature o Converged, NeXtScale, System x,
and ThinkServer servers, and improve energy e iciency using Lenovo XClarity Energy Manager.
• Redundant networking connection
The Lenovo XClarity Controller provides ailover capability to a redundant Ethernet connection with the
applicable application installed. I a problem occurs with the primary Ethernet connection, all Ethernet
tra ic that is associated with the primary connection is automatically switched to the optional redundant
Ethernet connection. I the applicable device drivers are installed, this switching occurs without data loss
and without user intervention.
• Redundant cooling
The redundant cooling by the ans in the server enables continued operation i one o the ans ails.
• Think ystem RAID support
The ThinkSystem RAID adapter provides hardware redundant array o independent disks (RAID) support
to create con igurations, supporting RAID levels 0, 1, 5, 6, 10, 50, and 60.
Tech Tips
Lenovo continually updates the support website with the latest tips and techniques that you can use to solve
issues that your server might encounter. These Tech Tips (also called retain tips or service bulletins) provide
procedures to work around issues or solve problems related to the operation o your server.
To ind the Tech Tips available or your server:
2ThinkSystem SR860 V3 User Guide

1. Go to http://datacentersupport.lenovo.com and navigate to the support page or your server.
2. Click on How To’s rom the navigation pane.
3. Click Article Type ➙ olution rom the drop-down menu.
Follow the on-screen instructions to choose the category or the problem that you are having.
ecurity advisories
Lenovo is committed to developing products and services that adhere to the highest security standards in
order to protect our customers and their data. When potential vulnerabilities are reported, it is the
responsibility o the Lenovo Product Security Incident Response Team (PSIRT) to investigate and provide
in ormation to our customers so they may put mitigation plans in place as we work toward providing
solutions.
The list o current advisories is available at the ollowing site:
https://datacentersupport.lenovo.com/product_security/home
pecifications
Summary o the eatures and speci ications o the server. Depending on the model, some eatures might not
be available, or some speci ications might not apply.
Re er to the below table or speci ications categories and the content o each category.
pecification
category
Technical specifications Mechanical specifications Environmental specifications
Content • Processor
• Memory
• Internal drives
• Storage expansion
• Expansion slots
• Graphics processing units
(GPU)
• Integrated unctions and I/O
connectors
• Network
• Rear button
• RAID adapter
• Host bus adapter
• System an
• Electrical input
• Minimal con iguration or
debugging
• Operating systems
• Dimension
• Weight
• Acoustical noise emissions
• Ambient temperature
management
• Environmental
Technical specifications
Summary o the technical speci ications o server. Depending on the model, some eatures might not be
available, or some speci ications might not apply.
Chapter 1.Introduction 3

Processor
Supports multi-core Intel Xeon processors, with integrated memory controller and Intel Mesh UPI (Ultra Path
Interconnect) topology.
• Up to our 4th Gen Intel Xeon scalable processors with minimal requirement o two installed on the system board
assembly
• Designed or LGA 4677 sockets
• Scalable up to 60 cores
• Supports 4 UPI links per processor supporting 12.8 GT/s, 14.4 GT/s and 16 GT/s speeds
For a list o supported processors, see: http://datacentersupport.lenovo.com.
Memory
See “Memory module installation rules and order” on page 46 or detailed in ormation about memory con iguration and
setup.
• 64 dual inline memory module (DIMM) slots that support up to 64 DRAM DIMMs
• Memory module type:
– TruDDR5 4800MHz RDIMM: 16 GB (1Rx8), 32 GB (1Rx4, 2Rx8), 64 GB (2Rx4)
– TruDDR5 4800MHz Value RDIMM: 32 GB (1Rx4), 64 GB (2Rx4)
– TruDDR5 4800MHz 3DS RDIMM: 128 GB (4Rx4), 256 GB (8Rx4)
• Speed:
Note: Operating speed depends on processor model and UEFI settings.
– 4800 MT/s or 1 DIMM per channel
– 4400 MT/s or 2 DIMMs per channel
• Minimum memory: 32 GB
• Maximum memory: 16 TB
For a list o supported memory modules, see https://serverproven.lenovo.com.
4ThinkSystem SR860 V3 User Guide

Internal drives
The server supports up to two internal M.2 drives with the ollowing capacity:
• SATA M.2 drive:
– 128 GB
– 240 GB
– 480 GB
– 960 GB
• NVMe M.2 drive:
– 480 GB
– 960 GB
The ollowing orm actors are supported:
• 42 mm (2242)
• 60 mm (2260)
• 80 mm (2280)
• 110 mm (22110)
For a list o supported M.2 drives, see: https://serverproven.lenovo.com.
torage expansion
2.5-inch drive configuration:
• Forty-eight 2.5-inch drive bays:
– Bay 0 to 23 support SAS/SATA/NVMe drives.
– Bay 24 to 47 support SAS/SATA drives.
• Two 7mm drive bays support SATA/NVMe drives.
Notes:
• When an M.2 boot adapter is installed and connected to the NVMe 11 connector, the maximum number o
supported NVMe drives is twenty-two drives.
• VROC supported.
• Tri-mode adapters can support RAID with U.3 drives.
For a list o supported drives, see: https://serverproven.lenovo.com.
Expansion slots
• Up to eighteen rear PCIe slots
• Two OCP slots
Notes:
• PCIe slot availability is based on CPU con iguration, riser selection, and 7mm drive bay selection.
• When a ThinkSystem Intel E810-DA2 10/25GbE SFP28 2-Port PCIe Ethernet Adapter, ThinkSystem Intel E810-DA4
10/25GbE SFP28 4-Port PCIe Ethernet Adapter, ThinkSystem Intel E810-DA2 10/25GbE SFP28 2-Port OCP
Ethernet Adapter, or ThinkSystem Intel E810-DA4 10/25GbE SFP28 4-Port OCP Ethernet Adapter is installed, no
other Gen 3 RAID/HBA adapters can be installed.
• For more details on the di erent types o risers, see “Rear view” on page 20.
Chapter 1.Introduction 5

Graphics processing unit (GPU)
• Up to eight 75-watt low pro ile GPUs
• Up to our 350-watt double wide FHFL GPUs with Nvlink support
Note: Nvlink is only supported between GPUs installed in the same riser.
For a list o supported GPUs, see: https://serverproven.lenovo.com.
Integrated functions and I/O connectors
• Lenovo XClarity Controller (XCC), which provides service processor control and monitoring unctions, video
controller, and remote keyboard, video, mouse, and remote drive capabilities.
– The server supports Lenovo XClarity Controller 2 (XCC2). For additional in ormation about Lenovo XClarity
Controller 2 (XCC2), re er to https://sysmgt.lenovo iles.com/help/topic/lxcc_ rontend/lxcc_overview.html.
• Front connectors:
– One USB 3.1 Gen1 (5 Gbps) connector
– One USB 2.0 connector with XCC system management unction
– One VGA connector
– One external diagnostics connector
– Front I/O module
– System ID button/LED
– System error LED
– Network Activity LED
– Power button/LED
• Rear connectors:
– One VGA connector
– Three USB 3.1 Gen1 (5 Gbps) connectors
– One XCC system management port
– Two OCP slots
– One serial port
Network
Two or our Ethernet connectors on each OCP module (optional)
Rear button
NMI button
6ThinkSystem SR860 V3 User Guide

RAID adapter
• ThinkSystem RAID 9350-16i 4GB Flash PCIe 12Gb Adapter
• ThinkSystem RAID 9350-8i 2GB Flash PCIe 12Gb Adapter
• ThinkSystem RAID 5350-8i PCIe 12Gb Adapter
• ThinkSystem RAID 940-32i 8GB Flash PCIe Gen4 12Gb Adapter
• ThinkSystem RAID 940-16i 4GB Flash PCIe Gen4 12Gb Adapter
• ThinkSystem RAID 940-16i 8GB Flash PCIe Gen4 12Gb Adapter
• ThinkSystem RAID 540-16i PCIe Gen4 12Gb Adapter
• ThinkSystem RAID 940-8i 4GB Flash PCIe Gen4 12Gb Adapter
• ThinkSystem RAID 540-8i PCIe Gen4 12Gb Adapter
• ThinkSystem RAID 940-8e 4GB Flash PCIe Gen4 12Gb Adapter
For more in ormation about the RAID/HBA adapters, see Lenovo ThinkSystem RAID Adapter and HBA Re erence.
Host bus adapter
• ThinkSystem 4350-16i SAS/SATA 12Gb HBA
• ThinkSystem 4350-8i SAS/SATA 12Gb HBA
• ThinkSystem 440-16i SAS/SATA PCIe Gen4 12Gb HBA
• ThinkSystem 440-8i SAS/SATA PCIe Gen4 12Gb HBA
• ThinkSystem 440-8e SAS/SATA PCIe Gen4 12Gb HBA
• ThinkSystem 440-16e SAS/SATA PCIe Gen4 12Gb HBA
For more in ormation about the RAID/HBA adapters, see Lenovo ThinkSystem RAID Adapter and HBA Re erence.
ystem fan
Six (60 mm x 56 mm) dual- an single-rotor or dual- an dual-rotor an modules
Chapter 1.Introduction 7

Electrical input
The server supports up to our power supplies with N+N redundancy with oversubscription.
• Platinum:
– CFFv4S 1100-watt, input power 115 Vac / 230 Vac / 240 Vdc
– CFFv4S 1800-watt, input power 230 Vac / 240 Vdc
– CFFv4L 2400-watt, input power 230 Vac / 240 Vdc
– CRPS 1300-watt, input power 115 Vac / 230 Vac / 240 Vdc (Chinese Mainland Only)
– CRPS 2700-watt, input power 230 Vac / 240 Vdc (Chinese Mainland Only)
• Titanium:
– CFFv4S 1100-watt, input power 115 Vac / 230 Vac / 240 Vdc
– CFFv4S 1800-watt, input power 230 Vac / 240 Vdc
– CFFv4L 2600-watt, input power 230 Vac / 240 Vdc
• DC:
– CRPS 1600-watt, input power 336 Vdc (Chinese Mainland Only)
– CRPS 1600-watt, input power -48 Vdc (Chinese Mainland Only)
CAUTION:
• 240 Vdc input (input range: 180-300 Vdc) is supported in Chinese Mainland ONLY.
• Power supply with 240 Vdc input cannot support hot plugging power cord function. Before removing the
power supply with dc input, please turn off server or disconnect dc power sources at the breaker panel or by
turning off the power source. Then, remove the power cord.
Minimal configuration for debugging
• Two processors in processor socket 1 and 2
• Two DRAM DIMMs in slot 10 and 26
• Two power supplies
• One 2.5-inch drive, one M.2 drive, or one 7mm drive (i OS is needed or debugging)
• Six system an modules
Operating systems
Supported and certi ied operating systems:
• Microso t Windows Server
• VMware ESXi
• Red Hat Enterprise Linux
• SUSE Linux Enterprise Server
Re erences:
• Complete list o available operating systems: https://lenovopress.lenovo.com/osig.
• OS deployment instructions, see “Deploy the operating system” on page 441.
Mechanical specifications
Summary o the mechanical speci ications o server. Depending on the model, some eatures might not be
available, or some speci ications might not apply.
8ThinkSystem SR860 V3 User Guide

Dimension
4U server
• Height: 175 mm (6.9 inches)
• Width:
– With rack handles: 482 mm (19.0 inches)
– Without rack handles: 434.4 mm (17.1 inches)
• Depth: 869 mm (34.21 inches)
Weight
• 2.5-inch drive configuration:
– 59 kg (130.1 lb) maximum
Environmental specifications
Summary o the environmental speci ications o server. Depending on the model, some eatures might not be
available, or some speci ications might not apply.
Chapter 1.Introduction 9

Acoustical noise emissions
The server has the ollowing acoustic noise emissions declaration:
• Sound power level (LWAd)
– Idling:
– Typical: 7.1 Bel
– Storage rich: 7.1 Bel
– GPU: 8.0 Bel
– Operating:
– Typical: 8.0 Bel
– Storage rich: 8.0 Bel
– GPU: 9.2 Bel
• Sound pressure level (LpAm):
– Idling:
– Typical: 52 dBA
– Storage rich: 52.5 dBA
– GPU: 63.6 dBA
– Operating:
– Typical: 63.6 dBA
– Storage: 63.6 dBA
– GPU: 75 dBA
Notes:
• These sound levels were measured in controlled acoustical environments according to procedures speci ied by
ISO7779 and are reported in accordance with ISO 9296.
• The declared acoustic sound levels are based on the speci ied con igurations, which may change depending on
con iguration/conditions.
– Typical con iguration: our 250W CPUs, thirty-two 64GB RDIMMs, eight SAS HDDs, RAID 940-8i, Intel X710-T2L
10GBASE-T 2-port OCP, two 1100W PSUs.
– GPU con iguration: our 205W CPUs, our H100 GPUs, thirty-two 64GB RDIMMs, twenty- our SAS HDDs, RAID
940-16i, Intel X710-T2L 10GBASE-T 2-port OCP, two 1800W PSUs.
– Storage rich con iguration: our 205W CPUs, thirty-two 64GB RDIMMs, twenty- our SAS HDDs, RAID 940-8i,
Intel X710-T2L 10GBASE-T 2-port OCP, two 2600W PSUs.
• Government regulations (such as those prescribed by OSHA or European Community Directives) may govern noise
level exposure in the workplace and may apply to you and your server installation. The actual sound pressure levels
in your installation depend upon a variety o actors, including the number o racks in the installation; the size,
materials, and con iguration o the room; the noise levels rom other equipment; the room ambient temperature, and
employee's location in relation to the equipment. Further, compliance with such government regulations depends
on a variety o additional actors, including the duration o employees' exposure and whether employees wear
hearing protection. Lenovo recommends that you consult with quali ied experts in this ield to determine whether
you are in compliance with the applicable regulations.
10 ThinkSystem SR860 V3 User Guide