Lenovo ThinkSystem SR665 V3 User manual

ThinkSystem SR665 V3
System Configuration Guide
Machine Types: 7D9A, 7D9

Note
efore using this information and the product it supports, be sure to read and understand the safety
information and the safety instructions, which are available at:
http://thinksystem.lenovofiles.com/help/topic/safety_documentation/pdf_files.html
In addition, be sure that you are familiar with the terms and conditions of the Lenovo warranty for your server,
which can be found at:
http://datacentersupport.lenovo.com/warrantylookup
First Edition (December 2022)
© Copyright Leno o 2022.
LIMITED AND RESTRICTED RIGHTS NOTICE: If data or software is delivered pursuant to a General Services
Administration (GSA) contract, use, reproduction, or disclosure is subject to restrictions set forth in Contract No. GS-35F-
05925.

Contents
Contents . . . . . . . . . . . . . . . . . i
Safety . . . . . . . . . . . . . . . . . . iii
Safety inspection checklist . . . . . . . . . . . iv
Chapter 1. Introduction . . . . . . . . . 1
Features. . . . . . . . . . . . . . . . . . . 1
Tech Tips . . . . . . . . . . . . . . . . . . 2
Security advisories . . . . . . . . . . . . . . 2
Specifications . . . . . . . . . . . . . . . . 2
Technical specifications. . . . . . . . . . . 3
Mechanical specifications . . . . . . . . . . 5
Environmental specifications . . . . . . . . . 5
Management options. . . . . . . . . . . . . . 8
Chapter 2. Ser er components . . . . 11
Front view . . . . . . . . . . . . . . . . . 11
Front I/O module . . . . . . . . . . . . . . 15
Rear view . . . . . . . . . . . . . . . . . 17
Top view . . . . . . . . . . . . . . . . . 19
System-board-assembly layout . . . . . . . . 20
System-board-assembly connectors. . . . . 21
System-board-assembly switch . . . . . . 23
System LEDs and diagnostics display . . . . . . 25
Drive LEDs . . . . . . . . . . . . . . . 25
Front operator panel LEDs . . . . . . . . . 26
External diagnostics handset . . . . . . . . 27
XCC system management port LEDs. . . . . 33
Power supply LEDs . . . . . . . . . . . 34
System-board-assembly LEDs . . . . . . . 36
LEDs on the firmware and RoT security
module . . . . . . . . . . . . . . . . 38
Chapter 3. Parts list . . . . . . . . . . 41
2.5-inch drive bay chassis. . . . . . . . . . . 41
3.5-inch drive bay chassis. . . . . . . . . . . 45
Power cords . . . . . . . . . . . . . . . . 47
Chapter 4. Unboxing and setup . . . . 49
Server package contents . . . . . . . . . . . 49
Identify the server and access the Lenovo XClarity
Controller . . . . . . . . . . . . . . . . . 49
Server setup checklist . . . . . . . . . . . . 50
Chapter 5. System configuration . . . 53
Set the network connection for the Lenovo XClarity
Controller . . . . . . . . . . . . . . . . . 53
Update the firmware . . . . . . . . . . . . . 53
Configure the firmware . . . . . . . . . . . . 56
Memory module configuration . . . . . . . . . 57
RAID configuration . . . . . . . . . . . . . 57
Deploy the operating system. . . . . . . . . . 58
ack up the server configuration . . . . . . . . 58
Appendix A. Getting help and
technical assistance . . . . . . . . . . 61
efore you call . . . . . . . . . . . . . . . 61
Collecting service data . . . . . . . . . . . . 62
Contacting Support . . . . . . . . . . . . . 63
Appendix B. Documents and
supports . . . . . . . . . . . . . . . . 65
Documents download . . . . . . . . . . . . 65
Support websites . . . . . . . . . . . . . . 65
Appendix C. Notices. . . . . . . . . . 67
Trademarks . . . . . . . . . . . . . . . . 68
Important notes . . . . . . . . . . . . . . . 68
Electronic emission notices . . . . . . . . . . 68
Taiwan Region SMI RoHS declaration . . . . . 69
Taiwan Region import and export contact
information . . . . . . . . . . . . . . . . 69
© Copyright Lenovo 2022 i

ii ThinkSystem SR665 V3 System Configuration Guide

Safety
efore installing this product, read the Safety Information.
Antes de instalar este produto, leia as Informações de Segurança.
在安装本产品之前，请仔细阅读 Safety Information （安全信息）。
Læs sikkerhedsforskrifterne, før du installerer dette produkt.
Lees voordat u dit product installeert eerst de veiligheidsvoorschriften.
Ennen kuin asennat tämän tuotteen, lue turvaohjeet kohdasta Safety Information.
Avant d'installer ce produit, lisez les consignes de sécurité.
Vor der Installation dieses Produkts die Sicherheitshinweise lesen.
Prima di installare questo prodotto, leggere le Informazioni sulla Sicurezza.
Les sikkerhetsinformasjonen (Safety Information) før du installerer dette produktet.
Antes de instalar este produto, leia as Informações sobre Segurança.
© Copyright Lenovo 2022 iii

Antes de instalar este producto, lea la información de seguridad.
Läs säkerhetsinformationen innan du installerar den här produkten.
Safety inspection checklist
Use the information in this section to identify potentially unsafe conditions with your server. As each machine
was designed and built, required safety items were installed to protect users and service technicians from
injury.
Note: The product is not suitable for use at visual display workplaces according to §2 of the Workplace
Regulations.
Note: The set-up of the server is made in the server room only.
CAUTION:
This equipment must be installed or ser iced by trained personnel, as defined by the NEC, IEC 62368-
1 & IEC 60950-1, the standard for Safety of Electronic Equipment within the Field of Audio/Video,
Information Technology and Communication Technology. Leno o assumes you are qualified in the
ser icing of equipment and trained in recognizing hazards energy le els in products. Access to the
equipment is by the use of a tool, lock and key, or other means of security, and is controlled by the
authority responsible for the location.
Important: Electrical grounding of the server is required for operator safety and correct system function.
Proper grounding of the electrical outlet can be verified by a certified electrician.
Use the following checklist to verify that there are no potentially unsafe conditions:
1. If you need to power off the server, make sure that the power cord is disconnected.
S002
CAUTION:
i ThinkSystem SR665 V3 System Configuration Guide

The power-control button on the de ice and the power switch on the power supply do not turn off
the electrical current supplied to the de ice. The de ice also might ha e more than one power
cord. To remo e all electrical current from the de ice, ensure that all power cords are
disconnected from the power source.
Note: Under certain circumstances, powering off the server is not a prerequisite. Refer to the
precautions before conducting any tasks.
2. Check the power cord.
• Make sure that the third-wire ground connector is in good condition. Use a meter to measure third-
wire ground continuity for 0.1 ohm or less between the external ground pin and the frame ground.
• Make sure that the power cord is the correct type.
To view the power cords that are available for the server:
a. Go to:
http://dcsc.lenovo.com/#/
b. Click Preconfigured Model or Configure to order.
c. Enter the machine type and model for your server to display the configurator page.
d. Click Power ➙ Power Cables to see all line cords.
• Make sure that the insulation is not frayed or worn.
3. Check for any obvious non-Lenovo alterations. Use good judgment as to the safety of any non-Lenovo
alterations.
4. Check inside the server for any obvious unsafe conditions, such as metal filings, contamination, water or
other liquid, or signs of fire or smoke damage.
5. Check for worn, frayed, or pinched cables.
6. Make sure that the power-supply cover fasteners (screws or rivets) have not been removed or tampered
with.
© Copyright Lenovo 2022

i ThinkSystem SR665 V3 System Configuration Guide

Chapter 1. Introduction
The ThinkSystem SR665 V3 server (7D9A and 7D9 ) is a 2-socket 2U server that features the 4th generation
EPYCTM processor family of AMD®. The server offers a broad selection of drive and slot configurations, high
performance, and expansion for various IT workloads. Combining performance and flexibility, the server is a
great choice for enterprises of all sizes.
Figure 1. ThinkSystem SR665 V3
Features
Performance, ease of use, reliability, and expansion capabilities were key considerations in the design of
your server. These design features make it possible for you to customize the system hardware to meet your
needs today and provide flexible expansion capabilities for the future.
Your server implements the following features and technologies:
• Features on Demand
If a Features on Demand feature is integrated in the server or in an optional device that is installed in the
server, you can purchase an activation key to activate the feature. For information about Features on
Demand, see:
https://fod.lenovo.com/lkms
• Leno o XClarity Controller (XCC)
The Lenovo XClarity Controller is the common management controller for Lenovo ThinkSystem server
hardware. The Lenovo XClarity Controller consolidates multiple management functions in a single chip on
the server system board assembly. Some of the features that are unique to the Lenovo XClarity Controller
are enhanced performance, higher-resolution remote video, and expanded security options.
The server supports Lenovo XClarity Controller 2 (XCC2). For additional information about Lenovo XClarity
Controller 2 (XCC2), refer to https://sysmgt.lenovofiles.com/help/topic/lxcc_frontend/lxcc_overview.html.
• UEFI-compliant ser er firmware
Lenovo ThinkSystem firmware is Unified Extensible Firmware Interface (UEFI) compliant. UEFI replaces
IOS and defines a standard interface between the operating system, platform firmware, and external
devices.
Lenovo ThinkSystem servers are capable of booting UEFI-compliant operating systems, IOS-based
operating systems, and IOS-based adapters as well as UEFI-compliant adapters.
Note: The server does not support Disk Operating System (DOS).
• Large system-memory capacity
The server supports up to 24 TruDDR5 dual inline memory modules (DIMMs) with error correcting code
(ECC). For more information about the specific types and maximum amount of memory, see “Technical
specifications” on page 3.
© Copyright Lenovo 2022 1

• Large data-storage capacity and hot-swap capability
With the hot-swap feature, you can add, remove, or replace hard disk drives without turning off the server.
Storage capacity is different depending on server model. See “Technical specifications” on page 3 for
more information.
• Lightpath Diagnostics
Lightpath Diagnostics provides LEDs to help you diagnose problems. For more information about the
Lightpath Diagnostics, see “System LEDs and diagnostics display” on page 25.
• Redundant networking connection
The Lenovo XClarity Controller provides failover capability to a redundant Ethernet connection with the
applicable application installed. If a problem occurs with the primary Ethernet connection, all Ethernet
traffic that is associated with the primary connection is automatically switched to the optional redundant
Ethernet connection. If the applicable device drivers are installed, this switching occurs without data loss
and without user intervention.
• Redundant cooling
The redundant cooling by the fans in the server enables continued operation if one rotor of a fan fails.
• ThinkSystem RAID support
The ThinkSystem RAID adapter provides hardware redundant array of independent disks (RAID) support
to create configurations, supporting RAID levels 0, 1, 5, 6, 10, 50, and 60.
Tech Tips
Lenovo continually updates the support website with the latest tips and techniques that you can use to solve
issues that your server might encounter. These Tech Tips (also called retain tips or service bulletins) provide
procedures to work around issues or solve problems related to the operation of your server.
To find the Tech Tips available for your server:
1. Go to http://datacentersupport.lenovo.com and navigate to the support page for your server.
2. Click on How To’s from the navigation pane.
3. Click Article Type ➙ Solution from the drop-down menu.
Follow the on-screen instructions to choose the category for the problem that you are having.
Security ad isories
Lenovo is committed to developing products and services that adhere to the highest security standards in
order to protect our customers and their data. When potential vulnerabilities are reported, it is the
responsibility of the Lenovo Product Security Incident Response Team (PSIRT) to investigate and provide
information to our customers so they may put mitigation plans in place as we work toward providing
solutions.
The list of current advisories is available at the following site:
https://datacentersupport.lenovo.com/product_security/home
Specifications
Summary of the features and specifications of the server. Depending on the model, some features might not
be available, or some specifications might not apply. The latest specifications information is always available
at https://lenovopress.lenovo.com/.
2ThinkSystem SR665 V3 System Configuration Guide

Refer to the below table for specifications categories and the content of each category.
Specification
category
Technical specifications Mechanical specifications Environmental specifications
Content • Processor
• Memory
• Internal drives
• Expansion slots
• Storage controller
• Integrated functions and I/O
connectors
• Network
• System fan
• Power supplies
• Minimal configuration for
debugging
• Operating systems
• Dimension
• Weight
• Acoustical noise emissions
• Environment
• Particulate contamination
Technical specifications
Summary of the technical specifications of server. Depending on the model, some features might not be
available, or some specifications might not apply. The latest specifications information is always available at
https://lenovopress.lenovo.com/.
Processor
Supports fourth-generation AMD® EPYCTM processors, with 5nm process technology.
• Up to two processors with the new LGA 6096 (SP5) socket
• Up to 96 Zen4 cores (192 threads) per socket
• Up to 4 xGMI3 links at up to 32 GT/s
• Thermal Design Power (TDP): up to 400 watts
For a list of supported processors, see https://serverproven.lenovo.com/.
Memory
See “Memory module installation rules and order” in User Guide or Hardware Maintenance Guide for detailed
information about memory configuration and setup.
• Slots: 24 dual inline memory module (DIMM) slots (12 channels per processor, 1 DIMM per channel)
• Memory module type: TruDDR5 RDIMM 16 G (1Rx8), 32 G (2Rx8), 64 G (2Rx4 10x4)
• Capacity:
– Minimum: 16 G (1 x 16 G RDIMM)
– Maximum: 1.5 T (24 x 64 G RDIMM)
• Speed: 4800 MT/s
For a list of supported memory modules, see https://serverproven.lenovo.com/.
Internal dri es
• Front drive bays:
– Up to 24 x 2.5-inch hot-swap SAS/SATA/NVMe drives
– Up to 12 x 3.5-inch hot-swap SAS/SATA drives
• Rear drive bays:
– Up to 4 x 2.5-inch hot-swap SAS/SATA drives
• Up to two internal M.2 drives
Chapter 1.Introduction 3

Expansion slots
• Up to eight PCIe slots
• One OCP module slot
PCIe slot availability is based on riser selection and rear drive bay selection. See “Rear view” on page 17 and “PCIe
slots and PCIe adapters” in User Guide or Hardware Maintenance Guide.
Storage controller
• ThinkSystem RAID 540-8i PCIe Gen4 12Gb Adapter
• ThinkSystem RAID 940-8i 4G Flash PCIe Gen4 12Gb Adapter
• ThinkSystem RAID 940-16i 4G Flash PCIe Gen4 12Gb Adapter
• ThinkSystem 440-16i SAS/SATA PCIe Gen4 12Gb H A
Note:
For more information about the RAID/H A adapters, see Lenovo ThinkSystem RAID Adapter and H A Reference.
Integrated functions and I/O connectors
• Lenovo XClarity Controller (XCC), which provides service processor control and monitoring functions, video
controller, and remote keyboard, video, mouse, and remote drive capabilities.
– The server supports Lenovo XClarity Controller 2 (XCC2). For additional information about Lenovo XClarity
Controller 2 (XCC2), refer to https://sysmgt.lenovofiles.com/help/topic/lxcc_frontend/lxcc_overview.html.
• Front connectors:
– One VGA connector (optional)
– One US 3.2 Gen 1 (5 Gbps) connector
– One US 2.0 connector
– One external diagnostics connector
• Rear connectors:
– One VGA connector
– Three US 3.2 Gen 1 (5 Gbps) connectors
– One XCC system management port
– Two or four Ethernet connectors on the OCP module (optional)
Network
• OCP module, which provides two or four Ethernet connectors for network support
System fan
• Supported fan types:
– Standard fan 6038 (single-rotor, 17000 RPM)
– Performance fan 6056 (dual-rotor, 21000 RPM)
• Fan redundancy: N+1 redundancy, one redundant fan rotor
– One processor: five hot-swap system fans (one redundant fan rotor)
– Two processors or one processor with middle/rear bay or Riser 3: six hot-swap system fans (one redundant fan
rotor)
Notes:
• Single-rotor hot-swap fans cannot be mixed with dual-rotor hot-swap fans.
• The redundant cooling by the fans in the server enables continued operation if one rotor of a fan fails.
Power supplies
The server supports up to two power supplies for redundancy.
Power supply 200–240 V ac 240 V dc
4ThinkSystem SR665 V3 System Configuration Guide

Power supplies
1800W Platinum √ √
CAUTION:
• 240 V dc input (input range: 180-300 V dc) is supported in Chinese Mainland ONLY.
• Power supply with 240 V dc input cannot support hot plugging power cord function. Before remo ing the
power supply with dc input, please turn off ser er or disconnect dc power sources at the breaker panel or by
turning off the power source. Then, remo e the power cord.
Minimal configuration for debugging
• One processor in socket 1
• One memory module in slot 7
• One power supply unit
• One HDD/SSD drive or one M.2 drive (if OS is needed for debugging)
• Five system fans
Operating systems
Supported and certified operating systems:
• Microsoft Windows Server
• Red Hat Enterprise Linux
• VMware ESXi
References:
• Complete list of available operating systems: https://lenovopress.lenovo.com/osig.
• OS deployment instructions, see “Deploy the operating system” on page 58.
Mechanical specifications
Summary of the mechanical specifications of server. Depending on the model, some features might not be
available, or some specifications might not apply. The latest specifications information is always available at
https://lenovopress.lenovo.com/.
Dimension
• Form factor: 2U
• Height: 86.5 mm (3.4 inches)
• Width:
– With rack latches: 482.0 mm (19.0 inches)
– Without rack latches: 444.6 mm (17.5 inches)
• Depth: 763.7 mm (30.1 inches)
Note: The depth is measured with rack latches installed, but without the security bezel installed.
Weight
Up to 39 kg (86 lb), depending on the server configuration
En ironmental specifications
Summary of the environmental specifications of server. Depending on the model, some features might not be
available, or some specifications might not apply. The latest specifications information is always available at
https://lenovopress.lenovo.com/.
• “Acoustical noise emissions” on page
Chapter 1.Introduction 5

• “Environment” on page
Acoustical noise emissions
The server has the following acoustic noise emissions declaration.
Minimal Typical Storage GPU
Sound power levels (LWAd)
Idling 5.9 el 6.5 el 7.3 el 7.3 el
Operating 6.5 el 8.1 el 7.5 el 8.7 el
Sound pressure level (LpAm)
Idling 41.5 d A 51 d A 60.2 d A 60.2 d A
Operating 48.3 d A 66.6 d A 61.3 d A 71.9 d A
The declared sound levels are based on the following configurations, which may change depending on configurations
or conditions.
Config. Minimal Typical Storage GPU
Chassis
(2U)
Front 8 x 2.5'' Front 16 x 2.5'' Front 12 x 3.5'' + rear 4
x 2.5''
Front 16 x 2.5''
Fan 6 x standard fans 6 x high performance
fans
6 x high performance
fans
6 x high performance
fans
Processor 2 x 240 W 2 x 300 W 2 x 240 W 2 x 300 W
DIMM 12 x 64 G 24 x 64 G 12 x 64 G 24 x 64 G
Drive 8 x 2.4 T SAS HDDs 16 x 2.4 T SAS HDDs Front 12 x 14 T + rear
4 x 2 T SAS HDDs 16 x 2.4 T SAS HDDs
RAID 1 x RAID 940-8i 1 x RAID 940-8i 1 x RAID 940-16i 1 x RAID 940-16i
OCP 1 x Intel E810-DA2 10/25GbE SFP28 2-Port OCP
PSU 2 x 1100 W 2 x 1800 W 2 x 1800 W 2 x 2400 W
GPU None None None 3 x A100
Notes:
• These sound levels were measured in controlled acoustical environments according to procedures specified by
ISO7779 and are reported in accordance with ISO 9296.
• Government regulations (such as those prescribed by OSHA or European Community Directives) may govern noise
level exposure in the workplace and may apply to you and your server installation. The actual sound pressure levels
in your installation depend upon a variety of factors, including the number of racks in the installation; the size,
materials, and configuration of the room; the noise levels from other equipment; the room ambient temperature, and
employee's location in relation to the equipment. Further, compliance with such government regulations depends
on a variety of additional factors, including the duration of employees' exposure and whether employees wear
hearing protection. Lenovo recommends that you consult with qualified experts in this field to determine whether
you are in compliance with the applicable regulations.
6ThinkSystem SR665 V3 System Configuration Guide

En ironment
ThinkSystem SR665 V3 is designed for standard data center environment and is recommended to be placed in
industrial data center. Depending on hardware configurations, the server complies with ASHRAE Class H1, A2, A3, or
A4 specifications with certain thermal restrictions. For detailed thermal information, see “Thermal rules” in User Guide
or Hardware Maintenance Guide. System performance may be impacted when operating temperature is outside
permitted conditions.
• Air temperature:
– Operating
– ASHRAE class H1: 5°C to 25°C (41°F to 77°F)
The maximum ambient temperature decreases by 1°C for every 500 m (1640 ft) increase in altitude above 900
m (2,953 ft)
– ASHRAE class A2: 10°C to 35°C (50°F to 95°F)
The maximum ambient temperature decreases by 1°C for every 300 m (984 ft) increase in altitude above 900
m (2,953 ft)
– ASHRAE class A3: 5°C to 40°C (41°F to 104°F)
The maximum ambient temperature decreases by 1°C for every 175 m (574 ft) increase in altitude above 900
m (2,953 ft)
– ASHRAE class A4: 5°C to 45°C (41°F to 113°F)
The maximum ambient temperature decreases by 1°C for every 125 m (410 ft) increase in altitude above 900
m (2,953 ft)
– Server off: 5°C to 45°C (41°F to 113°F)
– Shipment/storage: -40°C to 60°C (-40°F to 140°F)
• Maximum altitude: 3,050 m (10,000 ft)
• Relati e Humidity (non-condensing):
– Operating
– ASHRAE class H1: 8%–80%; maximum dew point: 17°C (62.6°F)
– ASHRAE class A2: 8%–80%; maximum dew point: 21°C (70°F)
– ASHRAE class A3: 8%–85%; maximum dew point: 24°C (75°F)
– ASHRAE class A4: 8%–90%; maximum dew point: 24°C (75°F)
– Shipment/storage: 8% to 90%
Particulate contamination
Attention: Airborne particulates (including metal flakes or particles) and reactive gases acting alone or in
combination with other environmental factors such as humidity or temperature might pose a risk to the
device that is described in this document.
Risks that are posed by the presence of excessive particulate levels or concentrations of harmful gases
include damage that might cause the device to malfunction or cease functioning altogether. This
specification sets forth limits for particulates and gases that are intended to avoid such damage. The limits
must not be viewed or used as definitive limits, because numerous other factors, such as temperature or
moisture content of the air, can influence the impact of particulates or environmental corrosives and gaseous
contaminant transfer. In the absence of specific limits that are set forth in this document, you must
implement practices that maintain particulate and gas levels that are consistent with the protection of human
health and safety. If Lenovo determines that the levels of particulates or gases in your environment have
caused damage to the device, Lenovo may condition provision of repair or replacement of devices or parts
on implementation of appropriate remedial measures to mitigate such environmental contamination.
Implementation of such remedial measures is a customer responsibility.
Chapter 1.Introduction 7

Ta le 1. Limits for particulates and gases
Contaminant Limits
Reactive gases Severity level G1 as per ANSI/ISA 71.04-19851:
• The copper reactivity level shall be less than 300 Angstroms per month (Å/month ≈ 0.0039 μg/
cm2-hour weight gain).2
• The silver reactivity level shall be less than 200 Å/month (Å/month ≈ 0.0035 μg/cm2-hour
weight gain).3
• The reactive monitoring of gaseous corrosivity must be conducted approximately 5 cm (2 in.) in
front of the rack on the air inlet side at one-quarter and three-quarter frame height off the floor
or where the air velocity is much higher.
Airborne
particulates Data centers must meet the cleanliness level of ISO 14644-1 class 8.
For data centers without airside economizer, the ISO 14644-1 class 8 cleanliness might be met by
choosing one of the following filtration methods:
• The room air might be continuously filtered with MERV 8 filters.
• Air entering a data center might be filtered with MERV 11 or preferably MERV 13 filters.
For data centers with airside economizers, the choice of filters to achieve ISO class 8 cleanliness
depends on the specific conditions present at that data center.
• The deliquescent relative humidity of the particulate contamination should be more than 60%
RH.4
• Data centers must be free of zinc whiskers.5
1 ANSI/ISA-71.04-1985. Environmental conditions for process measurement and control systems: Air orne
contaminants. Instrument Society of America, Research Triangle Park, North Carolina, U.S.A.
2 The derivation of the equivalence between the rate of copper corrosion growth in the thickness of the corrosion
product in Å/month and the rate of weight gain assumes that Cu2S and Cu2O grow in equal proportions.
3 The derivation of the equivalence between the rate of silver corrosion growth in the thickness of the corrosion
product in Å/month and the rate of weight gain assumes that Ag2S is the only corrosion product.
4 The deliquescent relative humidity of particulate contamination is the relative humidity at which the dust absorbs
enough water to become wet and promote ionic conduction.
5 Surface debris is randomly collected from 10 areas of the data center on a 1.5 cm diameter disk of sticky
electrically conductive tape on a metal stub. If examination of the sticky tape in a scanning electron microscope
reveals no zinc whiskers, the data center is considered free of zinc whiskers.
Management options
The XClarity portfolio and other system management options described in this section are available to help
you manage the servers more conveniently and efficiently.
8ThinkSystem SR665 V3 System Configuration Guide

O er iew
Options Description
Lenovo XClarity Controller
aseboard management controller ( MC).
Consolidates the service processor functionality, Super I/O, video controller, and
remote presence capabilities into a single chip on the server system board assembly.
Interface
• CLI application
• Web GUI interface
• REST API
Usage and downloads
https://sysmgt.lenovofiles.com/help/topic/lxcc_frontend/lxcc_overview.html
Lenovo XClarity Essentials
toolset
Portable and light toolset for server configuration, data collection, and firmware
updates. Suitable both for single-server or multi-server management contexts.
Interface
• OneCLI: CLI application
• Bootable Media Creator: CLI application, GUI application
• UpdateXpress: GUI application
Usage and downloads
http://sysmgt.lenovofiles.com/help/topic/xclarity_essentials/overview.html
Lenovo XClarity Provisioning
Manager
UEFI-based embedded GUI tool on a single server that can simplify management
tasks.
Interface
• Web interface ( MC remote access)
• GUI application
Usage and downloads
https://sysmgt.lenovofiles.com/help/topic/lxpm_frontend/lxpm_product_page.html
Important:
Lenovo XClarity Provisioning Manager (LXPM) supported version varies by product. All
versions of Lenovo XClarity Provisioning Manager are referred to as Lenovo XClarity
Provisioning Manager and LXPM in this document, unless specified otherwise. To see
the LXPM version supported by your server, go to https://sysmgt.lenovofiles.com/help/
topic/lxpm_frontend/lxpm_product_page.html.
Chapter 1.Introduction 9

Functions
Options
Functions
Multi-
system
mgmt
OS
deploy-
ment
System
configu-
ration
Firm-
ware
up-
dates1
E ent-
s/alert
moni-
toring
In en-
tory/
logs
Pow-
er
mgmt
Power
planning
Lenovo XClarity Controller √ √2√ √4
Lenovo
XClarity
Essen-
tials
toolset
OneCLI √ √ √2√ √4
ootable Media
Creator √ √2√4
UpdateXpress √ √2
Lenovo XClarity Provisioning
Manager √ √ √3√5
Notes:
1. Most options can be updated through the Lenovo tools. Some options, such as GPU firmware or Omni-
Path firmware require the use of supplier tools.
2. The server UEFI settings for option ROM must be set to Auto or UEFI to update firmware using Lenovo
XClarity Essentials or Lenovo XClarity Controller.
3. Firmware updates are limited to Lenovo XClarity Provisioning Manager, Lenovo XClarity Controller, and
UEFI updates only. Firmware updates for optional devices, such as adapters, are not supported.
4. The server UEFI settings for option ROM must be set to Auto or UEFI for detailed adapter card
information, such as model name and firmware levels, to be displayed in Lenovo XClarity Controller or
Lenovo XClarity Essentials.
5. Limited inventory.
10 ThinkSystem SR665 V3 System Configuration Guide

Chapter 2. Ser er components
This section contains information about each of the components associated with the server.
Front iew
The front view of the server varies by model. Depending on the model, your server might look slightly
different from the illustrations in this topic.
Refer to the following front views for different server models:
• “Front view with eight 2.5-inch front drive bays (model 1)” on page 11
• “Front view with eight 2.5-inch front drive bays (model 2)” on page 11
• “Front view with sixteen 2.5-inch front drive bays (model 1)” on page 12
• “Front view with sixteen 2.5-inch front drive bays (model 2)” on page 12
• “Front view with twenty-four 2.5-inch front drive bays” on page 13
• “Front view with twelve 3.5-inch front drive bays” on page 13
Front iew with eight 2.5-inch front dri e bays (model 1)
Ta le 2. Components on the front of the server
Callout Callout
1 “External diagnostics connector (optional)” on page 14 2 “VGA connector (optional)” on page 15
3 “Drive activity LED” on page 14 4 “Drive status LED” on page 14
5 “Drive bay fillers” on page 14 6 “Front I/O module (on rack latch)” on page 15
7 “Rack latch (right)” on page 15 8 “Pull-out information tab” on page 15
9 “Drive bays” on page 14 10 “Rack latch (left)” on page 15
Front iew with eight 2.5-inch front dri e bays (model 2)
© Copyright Lenovo 2022 11

Ta le 3. Components on the front of the server
Callout Callout
1 “External diagnostics connector (optional)” on page 14 2 “VGA connector (optional)” on page 15
3 “Drive activity LED” on page 14 4 “Drive status LED” on page 14
5 “Drive bay filler” on page 14 6 “Front I/O module (on media bay)” on page 15
7 “Rack latch (right)” on page 15 8 “Pull-out information tab” on page 15
9 “Drive bays” on page 14 10 “Rack latch (left)” on page 15
Front iew with sixteen 2.5-inch front dri e bays (model 1)
Ta le 4. Components on the front of server models
Callout Callout
1 “External diagnostics connector (optional)” on page 14 2 “VGA connector (optional)” on page 15
3 “Drive activity LED” on page 14 4 “Drive status LED” on page 14
5 “Drive bay filler” on page 14 6 “Front I/O module (on rack latch)” on page 15
7 “Rack latch (right)” on page 15 8 “Pull-out information tab” on page 15
9 “Drive bays” on page 14 10 “Rack latch (left)” on page 15
Front iew with sixteen 2.5-inch front dri e bays (model 2)
Ta le 5. Components on the front of the server
Callout Callout
1 “External diagnostics connector (optional)” on page 14 2 “VGA connector (optional)” on page 15
3 “Drive activity LED” on page 14 4 “Drive status LED” on page 14
12 ThinkSystem SR665 V3 System Configuration Guide