LG AT&T GR500 User manual

Service Manual Model : GR500
Internal Use Only
Service Manual
GR500
Date: March, 2009 / Issue 1.0

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Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Table Of Contents
1. INTRODUCTION...............................................5
1.1 Purpose......................................................................5
1.2 Regulatory Information.................................................5
2. SYSTEM SPECIFICATION.................................7
2.1 General function..........................................................7
2.2 Usable Environment.....................................................8
2.3 Radio Performance......................................................8
2.4 Current Consumption.................................................16
2.5 RSSI .........................................................................16
2.6 Battery Bar................................................................16
2.7 Sound Pressure Level ................................................17
2.8 Charging...................................................................18
3. TECHNICAL BRIEF......................................... 19
3.1 Digital Baseband(DBB) & Multimedia Processor...........19
3.2 GAM Hardware Subsystem.........................................39
3.3. Audio Part ................................................................50
3.4 GPADC(General Purpose ADC) and AUTOADC2............57
3.5 Charger control .........................................................58
3.6 Voltage Regulation.....................................................64
3.7 RF Technical Description ............................................65
4. TROUBLE SHOOTING..................................... 75
4.1 Power ON Trouble......................................................75
4.2 USB Trouble ..............................................................76
4.3 SIM Detect Trouble ....................................................77
4.4 MicroSD card Trouble ................................................78
4.5 Keypad Trouble..........................................................79
4.6 Touch Screen ............................................................80
4.7 Camera Trouble.........................................................82
4.8 Main LCD Trouble......................................................88
4.9 Keypad Backlight Trouble ...........................................90
4.10 Folder ON/OFF Trouble.............................................91
4.11 Audio Trouble Shooting ............................................93
4.12 Charger Trouble Shooting.......................................112
4.13 Checking Bluetooth Block ......................................114
4.14 Checking AGPS Block ............................................118
4.15 RF Component ......................................................121
4.16 Procedure to check ...............................................122
4.17 Checking Common Power Source Block..................123
4.18 Checking VCXO Block ............................................128
4.19 Checking Front End Module Block ..........................132
4.20 Checking Front End Module Block input logic ..........133
4.21 Checking WCDMA Block ........................................135
4.22 Checking GSM Block .............................................145
5. Download ................................................... 158
6. Block Diagram ........................................... 161
7. CIRCUIT DIAGRAM...................................... 163
8. BGA Pin Map ..............................................171
9. PCB LAYOUT ...............................................175
10. CALIBRATION............................................ 183
10.1 General Description ...............................................183
10.2 Environment..........................................................183
10.3 Calibration Environment .........................................184
10.4 Program Operation ................................................185
11. Stand-alone Test...................................... 190
11.1 General Description ...............................................190
11.2 USB Communication Setting...................................191
11.3 Program Operation ................................................192
11.4 Stand-alone Test ...................................................195
12. EXPLODED VIEW & REPLACEMENT
PART LIST .................................................197
12.1 EXPLODED VIEW ...................................................197
12.2 Replacement Parts ................................................205
12.3 Accessory .............................................................230

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LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

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Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
1. INTRODUCTION
 


1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services. System
users are responsible for the security of own system. There are may be risks of toll fraud associated with your
telecommunications system. System users are responsible for programming and configuring the equipment
to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the
above case but will prevent unauthorized use of common-carrier telecommunication service of facilities
accessed through or connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing
harm or interruption in service to the telephone network, it should disconnect telephone service until repair
can be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the this phone or compatibility with the network,
the telephone company is required to give advanced written notice to the user, allowing the user to take
appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent.
The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore,
note that unauthorized alternations or repair may affect the regulatory status of the system and may void
any remaining warranty.

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LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
 


E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information such
as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated
by the sign. Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system
boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat
which is also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective
package as described.

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Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
2. PERFORMANCE
Item Specifications Remark
Band GSM Quad Band(850/900/1800/1900), UMTS(1900/850), Bluetooth
Type Side Slide type
Dimension 105.5 × 53.5 × 15.8 mm
Weight 110g (with standard battery)
Power 950mAh Li-ion
Talk Time Over 180 Min : 950mAh Li-ion 2G
Stand-by Time Over 250 hours : 950mAh Li-ion
Antenna Intenna Type
LCD(Main) 2.8"(240x400), TFT Color LCD
Back Light Yes
Back Light color White
Vibrator Yes
Speaker Yes
MIC SMT type
Receiver Yes
Earphone Jack Yes
SIM Socket Yes(SIM Block Type) : 3.0V & 1.8V
Volume Key Push Type(+,-)
Camera Key Push Type
I/O Connect 5Pin Micro USB
Standard Accessory Ear-Mic(Stereo Earphone) Travel Adaptor 950mAh Li- Ion Battery USB cable Bundle S/W and Set up Wizard
CD Hand strap
Optional Accessory Second 950mAh Li-ion Battery
Bluetooth Stereo Headset
2.1 General function

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LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
2.2 Usable Environment
1) Environment
2) Environment(Accessory)
* CLA : 12~24V (DC)
2.3 Radio Performance
1) Transmitter – GSM Mode
Item Spec. Unit
Voltage 3.7 (Typ), 3.4 (Min), (Shut Down: 3.25) V
Operating Temp. -20 ~ + 60 °C
Storage Temp. -30 ~ + 85 °C
Humidity max. 85 %
Item Spec. Min Typ. Max Unit
Power Available power 100 220 240 Vac
No
9k ~ 1GHz -39dBm
1G ~ 1710MHz -33dBm
1710M ~ 1785MHz -39dBm
1785M ~ 12.75GHz -33dBm
100k ~ 880MHz -60dBm 100k ~ 880MHz -60dBm
880M ~ 915MHz -62dBm 880M ~ 915MHz -62dBm
915M ~ 1000Mz -60dBm 915M ~ 1000MHz -60dBm
1G ~ 1.71GHz -50dBm 1G ~ 1.71GHz -50dBm
1.71G ~ 1.785GHz -56dBm 1.71G ~ 1.785GHz -56dBm
1.785G ~ 12.75GHz -50dBm 1.785G ~ 12.75GHz -50dBm
Item
1
DCS/PCSGSM
Conducted
Spurious
Emission
-39dBm
-33dBm
MS allocated
Channel
100k ~ 1GHz
Idle Mode
1G ~ 12.75GHz

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Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
No
30M ~ 1GHz -36dBm
MS allocated 1G ~ 1710MHz -30dBm
Channel 1710M ~ 1785MHz -36dBm
Radiated 1785M ~ 4GHz -30dBm
Spurious 30M ~ 880MHz -57dBm 30M ~ 880MHz -57dBm
Emission 880M ~ 915MHz -59dBm 880M ~ 915MHz -59dBm
Idle Mode 915M ~ 1000Mz -57dBm 915M ~ 1000MHz -57dBm
1G ~ 1.71GHz -47dBm 1G ~ 1.71GHz -47dBm
1.71G ~ 1.785GHz -53dBm 1.71G ~ 1.785GHz -53dBm
1.785G ~ 4GHz -47dBm 1.785G ~ 4GHz -47dBm
2
0 ~ 100kHz +0.5dB 0 ~ 100kHz +0.5dB
200kHz -30dB 200kHz -30dB
250kHz -33dB 250kHz -31dB
Due to 400kHz -60dB 400kHz -60dB
Output RF modulation 600 ~ 1800kHz -66dB 600 ~ 1800kHz -60dB
Spectrum 1800 ~ 3000kHz -69dB 1800 ~ 6000kHz -65dB
3000 ~ 6000kHz -71dB ≥6000kHz -73dB
≥6000kHz -77dB
400kHz -19dB 400kHz -22dB
600kHz -21dB 600kHz -24dB
1200kHz -21dB 1200kHz -24dB
1800kHz -24dB 1800kHz -27dB
TU3: ±150Hz TU1.5: ±200Hz
5Due to
Switching
transient
4
Multipath and Interference HT100: ±100Hz HT100: ±250Hz
Condition TU50: ±100Hz TU50: ±150Hz
3dB below reference sensitivity 3dB below reference sensitivity
Frequency Error Under RA250: ±200Hz RA250: ±250Hz
Frequency Error ±0.1ppm ±0.1ppm
3PhaseError
±5(RMS) ±5(RMS)
±20(PEAK) ±20(PEAK)
1
DCS/PCSGSM
-36dBm
-30dBm
30M ~ 1GHz
1G ~ 4GHz
Item

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LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
No Item
800kHz
Power
control
Level
Power
(dBm)
Tolerance
(dB)
Power
control
Level
Power
(dBm)
Tolerance
(dB)
533±3030±3
631±3128±3
729±3226±3
827±3324±3
925±3422±3
10 23 ±3 5 20 ±3
11 21 ±3 6 18 ±3
12 19 ±3 7 16 ±3
13 17 ±3 8 14 ±3
14 15 ±3 9 12 ±4
15 13 ±3 10 10 ±4
16 11 ±5 11 8 ±4
17 9 ±5 12 6 ±4
18 7 ±5 13 4 ±4
19 5 ±5 14 2 ±5
15 0 ±5
9Bursttiming
GSM DCS/PCS
Frequency offset
Intermodulation product should
be Less than 55dB below the
level of Wanted signal
Mask IN
Intermodulation
attenuation –7
8Transmitter
Output Power
Mask IN

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Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
2) Transmitter – WCDMA Mode
No Item Specification
1 Maximum Output Power Class3: +24dBm(+1/-3dB)
Class4: +21dBm(±2dB)
2 Frequency Error ±0.1ppm
3 Open Loop Power control in uplink ±9dB@normal, ±12dB@extreme
4 Inner Loop Power control in uplink
Adjust output (TPC command)
cmd 1dB 2dB 3dB
+1 +0.5/1.5 +1/3 +1.5/4.5
0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5
-1 -0.5/-1.5 -1/-3 -1.5/-4.5
group(10equal command group)
+1 +8/+12 +
5 Minimum Output Power -50dBm(3.84MHz)
6 Out-of-synchronization handling of output power
Qin/Qout:DPCCH quality levels
Toff@DPCCH/lor:-22->-28dB
Ton@DPCCH/lor:-24->-18dB
7 TransmitOFFPower -56dBm(3.84M)
8 Transmit ON/OFF Time Mask ±25us
PRACH, CPCH, uplink compressed mode
9 Change of TFC
±25us
power varies according to the data rate
DTX : DPCH off
(minimize interference between UE)
10 Power setting in uplink compressed ±3dB(after 14slots transmission gap)
11 Occupied Bandwidth(OBW) 5MHz(99%)
12 Spectrum emission Mask
-35-15*(?f-2.5)dBc@?f=2.5~3.5MHz, 30k
-35-1*(?f-3.5)dBc@?f=3.5~7.5MHz, 1M
-39-10*(?f-7.5)dBc@?f=7.5~8.5MHz, 1M
-49 dBc@?f=8.5~12.5MHz, 1M

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LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
No Item Specification
13 Adjacent Channel Leakage Ratio(ACLR) 33dB@5MHz, ACP>-50dBm
43dB@10MHz, ACP>-50dBm
14 Spurious Emissions
*: additional requirement
-36dBm@f=9~150KHz, 1k BW
-36dBm@f=150KHz~30MHz, 10k
-36dBm@f=30~1000MHz, 100k
-30dBm@f=1~12.75GHz, 1M
-41dBm*@1893.5~1919.6MHz, 300k
-67dBm*@925~935MHz, 100k
-79dBm*@935~960MHz, 100k
-71dBm*@1805~1880MHz, 100k
15 Transmit Intermodulation -31dBc@5MHz, Interferer -40dBc
-41dBc@10MHz, Interferer -40dBc
16 Error Vector Magnitude(EVM) 17.5% (>-20dBm)
(@12.2k, 1DPDCH+1DPCCH)
17 Transmit OFF Power -15dB@SF=4, 768kbps,
multi-code transmission
3) Receiver - GSM Mode
No GSM DCS/PCS
1 -105dBm -105dBm
2 C/Ic=7dB C/Ic=7dB
3 Adjacent Channel 200kHz C/Ia1=-12dB C/Ia1=-12dB
Rejection 400kHz C/Ia2=-44dB C/Ia2=-44dB
4Wanted Signal: -98dBm 1’st interferer: -44dBm
2’st interferer: -45dBm
Wanted Signal: -96dBm
1’st interferer: -44dBm
2’st interferer: -44dBm
5Wanted Signal: -101dBm
Unwanted Signal: Depend on freq. Wanted Signal: -101dBm Unwanted Signal: Depend on freq.
Blocking Response
(TCH/FS Class II, RBER)
Item
Sensitivity (TCH/FS Class II)
Co-Channel Rejection
(TCH/FS Class II, RBER,
TUhigh/FH)
Intermodulation Rejection

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Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
4) Receiver – WCDMA Mode
No Item Specification
1 Reference Sensivitivity Level -106.7dBm(3.84M)
2 Maximum Input Level -25dBm(3.84MHz) -44dBm/3.84MHz(DPCH_Ec)
UE@+20dBm output power(class3)
3 Adjacent Channel Selectivity(ACS) 33dB
UE@+20dBm output power(class3)
-56dBm/3.84MHz@10MHz
UE@+20dBm output power(class3)
-44dBm/3.84MHz@15MHz
UE@+20dBm output power(class3)
-44dBm/3.84MHz@f=2050~2095 &
2185~2230MHz, band a)
UE@+20dBm output power(class3)
-30dBm/3.84MHz@f=2025~2050 &
2230~2255MHz, band a)
UE@+20dBm output power(class3)
-15dBm/3.84MHz@f=1~2025 &
2255~12500MHz, band a)
UE@+20dBm output power(class3)
6 Spurious Response -44dBm CW
UE@+20dBm output power(class3)
-46dBm CW@10MHz &
-46dBm/3.84MHz@20MHz
UE@+20dBm output power(class3)
-57dBm@f=9KHz~1GHz, 100k BW
-47dBm@f=1~12.75GHz, 1M
-60dBm@f=1920~1980MHz, 3.84MHz
-60dBm@f=2110~2170MHz, 3.84MHz
8 Spurious Emissions
4 In-band Blocking
5 Out-band Blocking
7 Intermodulation Characteristic

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LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
5) Bluetooth Mode
5.1) Transmitter
No Item
1 OutPower
2 Power Density
3 Power Control
4 TXOutput Spectrum -Frequency range
5 TX Output Spectrum -20dB Bandwidth
6 Tx Output Spectrum -Adjacent channel Po
7 Modulation Characteristics
8 Init. Carrier Freq. Tolerance
9 Carrier Frequency Drift
Freq.Range Operating Standby
30MHz~1GHz -36dBm -57dBm
Above 1GHz~12.75GHz -30dBm -47dBm
1.8~1.9GHz -47dBm -47dBm
5.15~5.3GHz -47dBm -47dBm
Specification
Out of Band Spurious Emissions
≤1MHz
≤-20dBm @ C/I = 2MHz
≤-40dBm @ C/I ≥3MHz
140kHz ≤delta f1 avg ≤175kHz
delta f2max ≥115kHz at least 99.9% of all deltaf2max
delta f2avg/deata f1avg≥0.8
≤±75KHz
Class 2 : -6~4dBm
Power density < 20dBm per 100kHz EIRP
Option
2dB ≤step size ≤8dB
fmax & fmin @ below the level of -30dBm
(100khz BW) within 2.4GHz~2.4835GHz
10
1 slot : ≤± 25kHz
3 slot : ≤± 40kHz
5 slot : ≤± 40kHz
Maximum drift rate ≤20KHz/50usec

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Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
5.2) Receiver
No Item
1 Sensitivity single slot packets
2 Sensitivity multi slot packets
Interference Ratio
Co-Channel interference, C/I co-channel 11dB
Adjacent(1MHz)interference, C/I 1MHz 0dB
Adjacent(2MHz)interference, C/I 2MHz -30dB
Adjacent(≥3MHz)interference, C/I ≥3MHz -40dB
Adjacent(≥3MHz)interference to in band -9dB
mirror frequency, C/I image ±1MHz -20dB
interfering Signal Frequency Power Level
30MHz~2000MHz -10dBm
2000MHz~2400MHz -27dBm
2500MHz~3000MHz -27dBm
3000MHz~12.75GHz -10dBm
5 Intermodluation Performance
6 Maximum Input Level
BER ≤0.1%@wanted signal -67dBm
BER ≤0.1%@wanted signal -64dBm
static sinwave signal at f1=-39dBm
a BT modulated signal f2=-39dBm(payload PRBS15)
BER ≤0.1%@-20dBm
Specification
BER0.1%@-70dBm
BER≤0.1%@-70dBm
BER ≤0.1%@ (Low,Mid,High Frequency)
2405MHz, 2441MHz, 2477MHz
C/I performance
Blocking Characteristic
3
4

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LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
StandbyIndication
3.2
󰆚 0.05VPower Off
3.64
󰆚 0.05VBar 1 Blink
3.73
󰆚 0.05VBar 2 1
3.83
󰆚 0.05VBar 3 2
Over 3.84
󰆚 0.05VBar3
2.4 Current Consumption
(VT test : Speaker off, LCD backlight On)
Stand by Voice Call VT
250 Hours = 3.4 mA 180 Min = 300 mA 125 Min= 380 mA
(DRX=2.56) (Tx=12dBm) (Tx=12dBm)
250 Hours = 3.4 mA 180 Min = 300 mA
(paging=5period) (Tx=Max)
WCDMA
GSM
2.5 RSSI
2.6 Battery Bar
-105  2 dBm-107  2 dBmBAR 1 BAR 0
-100
 2 dBm-104  2 dBmBAR 2 BAR 1
-95
 2 dBm-97  2 dBmBAR 3 BAR 2
-86
 2 dBm-87  2 dBmBAR 4 BAR 3
-77
 2 dBm-79  2 dBmBAR 5 BAR 4
WCDMAGSMCell Power [dBm]

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Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
2.7 Sound Pressure Level
No
NOM
MAX
NOM -1±3dB
MAX -15±3dB
NOM
MAX
NOM
MAX
5
6NOM
MAX
NOM -47dBPA under
MAX -36dBPA under
ANOM
CMAX
ONOM -1±3dB
UMAX -12±3dB
SNOM
TMAX
INOM
CMAX
13
14 NOM
MAX
NOM -45dBPA under
MAX -40dBPA under
SEND
REV.
SEND
REV.
SEND
REV.
SEND
REV.
12 Echo Loss (EL)
GSM
-62dBm under
DCS
Headset GSM
DCS
17
TDMA NOISE
GSM: Power Level: 5
DCS: Power Level: 0
(Cell Power: -90 ~ -105dBm)
Acoustic(Max Vol.)
MS/HEADSETSLR: 8±3dB
MS/HEADSETRLR: -13±1dB/-15dB
(SLR/RLR: mid-Value Setting)
MS
16 Idle Noise-Receiving (INR)
HEAD
SET
Receiving Distortion (RD)
9 Sending Loudness Rating (SLR)
10 Receiving Loudness Rating (RLR)
11
refer to TABLE 30.4
15 Idle Noise-Sending (INS) -55dBm0p under
40dB over
Sending Distortion (SD) refer to TABLE 30.3
25dB overSide Tone Masking Rating (STMR)
8±3dB
-64dBm0p under
8 Idle Noise-Receiving (INR)
MS
7 Idle Noise-Sending (INS)
Sending Distortion (SD) refer to TABLE 30.3
Receiving Distortion (RD) refer to TABLE 30.4
17dB over
4 Echo Loss (EL) 40dB over
3 Side Tone Masking Rating (STMR)
2 Receiving Loudness Rating (RLR)
Specification
1 Sending Loudness Rating (SLR) 8±3dB
Test Item

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LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
2.8 Charging
·Normal mode: Complete Voltage: 4.2V
Charging Current: 500mA
·Await mode: In case of During a Call, should be kept 3.9V
(GSM: It should be kept 3.9V in all power level
WCDMA: It will not be kept 3.9V in some power level)
·Extend await mode: At Charging prohibited temperature(0C under or 45C over)
(GSM: It should be kept 3.7V in all power level
WCDMA: It will not be kept 3.7V in some power level)

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Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
3.1 Digital Baseband(DBB) & Multimedia Processor
3.1.1 General Description
• Access subsystem
- Access Central Processing Unit (CPU) subsystem – ARM926, Joint Test Action Group (JTAG),
Embedded Trace Module (ETM), Instruction and Data (I&D)-cache, and I&D-TCM
- Access peripheral subsystems – Subscriber Identity Module (SIM) interface, IrDA®, Universal Serial
Bus (USB), Universal Asynchronous Receiver/Transmitter (UART), and so on
- Digital Signal Processor (DSP) subsystem – CEVA-X1620, JTAG, Static Random Access Memory
(SRAM), and Program Data Read Only Memory (PDROM)
- EDGE/GSM/GPRS (EGG) subsystem – EGG hardware accelerators
- WCDMA subsystem – WCDMA hardware accelerators
• Application subsystem
- Application CPU subsystem – containing ARM926, JTAG, ETM, I&D-cache, and I&D-TCM
- Application peripheral subsystems – I2C™, keypad, UART, and so on
- Graphics subsystem – XGAM subsystem
- Audio Processing Execution (APEX) and video encoder subsystems
In addition to the two subsystems above, there is also a test block, chip control block, and
a pad multiplexing block residing at the top level
yDSP
- The Digital Signal Processor Subsystem (DSPSUB) includes a DSP megacell, which
contains the DSP CPU together with a tightly coupled memory. The DSP is the Ceva-X
1620 core with a 64 kB instruction RAM and a 64 kB data RAM. It also contains debug
logic and interfaces. In addition to the megacell, the DSPSUB includes external memories,
peripheral units, and interfaces. The DSP megacell is clocked at 208 MHz.
- The DSPSUB includes an AHB master and an AHB slave interface. The AHB master
provides a direct access to the Internal Random Access Memory (IRAM) in the EGG core
through the AHB. The AHB slave interface allows the CPU and the DMA to access in the
program and data RAM residing in the DSPSUB.
yWCDMA subsystem
- The digital baseband controller WCDMA subsystem incorporate a WCDMA modem
- An interface to the WCMDA together with memory control and an internal single port
RAM. The WCDMA subsystem has three AHB slave interfaces.
- The Ericsson DB 3150 also includes HSDPA class 6 functionality.
- The WCDMA subsystem is handled and provided by Ericsson.
yXGAM subsystem
- The XGAM subsystem is a graphics acceleration module that provides hardware
support in the creation of visual imagery and the transfer of this data to a display.
The XGAM also provides support for connecting a Camera module. The visual data
could be graphics, still images, or video.
- The XGAM subsystem is handled and provided by Ericsson.
yOperation and Services
- IC™ Interface
-SIMInterfaces
- General Purpose I/O (GPIO) Interface
- External Memory Interface that supports NAND, NOR, PSRAM, SDRAM,
- JTAG
-RTC
- ETM (in Prototype Package)
3. TECHNICAL BRIEF

- 20 -
LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. TECHNICAL BRIEF
Figure 3-1-1 GR500R Block Diagram
RF3300
FEM (SWPlexer + GSM_RX_SAW)
1800/1900
850/90
0
TX_SAW DB3200
AB3100
2M
A-GPS
TX_SAW
850
SPDT
GSM Tx/Rx
SSB
I
SSB
I
I/Q Receiver
MIC
Power
GSM
PAM
RX_SAW
W-VCO
HDET
GSM 850 Rx
GSM 1800 Rx GSM 1900 Rx
Duplexer
Duplexer
1900
Coupler
LNA
1900
LNA
850
GSM-VCO
W-VCO
WCDMA Tx/Rx
USIM
USB
+5V
NAND 2G
SDRAM 1G
LCD
(2.8” WQVGA)
Stereo Headset
TX_SAW
900
WCDMA
PAM
TPA62
05
GSM 900 Rx
Coupler
RX_SAW
SSB
I
Micro
SD
Level
Shifter
Transceive
r
Bluetooth
X-Tal
26MHz
VGA

- 21 -
Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
3.1.2 External memory interface
RF calibration data, Audio parameters and battery calibration data etc are stored in flash memory
area.
A. GR500R’s memory
y2Gb NAND flash memory +1G SDRAM
Table 3- 1- 1. External Memory Interface Spec. of GR500
Figure 3- 1- 2. External Memory Configuration of GR500
Device Part Name Maker Item Time Size Speed
Program speed 220μs 1Page=(2K + 64)Bytes 10.32MByte/s
Erase speed 1.5ms 1Block=(128K+4K)Bytes 88MByte/s
NAND flash KA100J00BA-AJY Y Samsung
yPackage
- 10.5 by 13 mm 107 balls, 0.8mm pitch FBGA Production Package