LG G5300 User manual

GSM Phone
SERVICE MANUAL
MODEL : G5300 / W5300
P/N : MMBD0020301 DECEMBER, 2002
SERVICE MANUAL MODEL : G5300 / W5300

- 1 -
1. INTRODUCTION.................................. 3
1.1 Purpose ................................................. 3
1.2 Regulatory Information .......................... 3
A. Security ............................................. 3
B. Incidence of Harm ............................. 3
C. Changes in Service ........................... 3
D. Maintenance Limitations ................... 3
E. Notice of Radiated Emissions ............ 4
F. Pictures ............................................. 4
G. Interference and Attenuation ............ 4
H. Electrostatic Sensitive Devices ......... 4
1.3 Abbreviations ......................................... 5
2. PERFORMANCE .................................... 6
2.1 H/W Feature .......................................... 6
2.2 Technical Specification .......................... 7
3. TECHNICAL BRIEF ............................ 11
3.1 General Description ............................. 11
3.2 Receiver ............................................... 11
A. RF front end .................................... 12
B. Demodulator and baseband
processing ....................................... 12
C. DC Offset Compensation ................ 12
3.3 Transmitter Part ................................... 13
A. IF Modulator .................................... 13
B. OPLL ............................................... 14
C. Synthesizer ..................................... 14
D. Power Amplifier ............................... 15
3.4 13 MHz Clock ...................................... 16
3.5 Power Supplies and Control Signals ... 16
3.6 Testing Set-up and Checking Signals .. 17
A. Received RF Level and Checks ...... 17
B. Transmitted RF Level and Checks .. 17
3.7 Digital Main Processor ......................... 30
3.8 Analog Main Processor ........................ 35
3.9 Power management ............................. 40
3.10 Memories ........................................... 42
3.11 Display and Interface ......................... 42
3.12 Keypad Switches and Scanning ........ 43
3.13 Microphone ........................................ 44
3.14 Earpiece ............................................. 45
3.15 Hands-free Interface .......................... 45
3.16 Headset Jack Interface ...................... 45
3.17 Key Back-light Illumination ................. 46
3.18 LCD Back-light Illumination ................ 47
3.19 Speaker & MIDI IC ............................. 48
4. TROUBLE SHOOTING ..................... 50
4.1 RF Components ................................. 50
4.2 Rx Trouble .......................................... 51
4.3 Tx Trouble .......................................... 59
4.4 Power On Trouble .............................. 72
4.5 Charging Trouble ............................... 74
4.6 LCD Trouble ....................................... 76
4.7 Receiver Trouble ................................ 78
4.8 Speaker Trouble ................................. 80
4.9 Mic. Trouble ........................................ 83
4.10 Vibrator Trouble ............................... 86
4.11 Backlight LED Trouble ..................... 88
4.12 SIM Detect Trouble .......................... 90
4.13 Earphone Trouble ............................ 92
4.14 HFK Trouble ..................................... 97
5. DISASSEMBLY
INSTRUCTION ................................... 100
5.1 Disassembly ..................................... 100
6. DOWNLOAD AND
CALIBRATION ................................... 103
6.1 Download ......................................... 103
6.2 Calibration ........................................ 109
A. Equipment List .............................. 109
B. Equipment Setup ........................... 109
C. Test Jig Operation ......................... 110
D. Procedure ..................................... 111
Table Of Contents

- 2 -
7. BLOCK DIAGRAM ............................. 112
8. CIRCUIT DIAGRAM ........................... 113
8.1 MAIN ................................................ 113
8.2 MEMORY & MMI .............................. 114
8.3 MIDI .................................................. 115
8.4 RF CIRCUIT ..................................... 116
9. PCB LAYOUT ..................................... 117
10. ENGINEERING MODE .................. 119
A. About Engineering Mode ............... 119
B. Access Codes ............................... 119
C. Key Operation ............................... 119
10.1 BB Test [MENU 1] ........................ 119
A. LCD [1-1] ....................................... 119
B. Backlight [1-2] ............................... 119
C. Buzzer [1-3] ................................... 119
D. Vibrator [1-4] ................................. 119
E. ADC (Analog to Digital
Converter) [1-5] ............................. 120
F. BATTERY [1-6] .............................. 120
G. Audio [1-7] .................................... 120
H. DAI (Digital Audio Interface) [1-8] .120
10.2 RF Test [MENU 2] ........................ 121
A. SAR Test [2-1] ............................... 121
10.3 MF Mode [MENU 3] ...................... 121
A. All auto test [3-1] ........................... 121
B. Backlight [3-2] ............................... 121
C. Buzzer [3-3] ................................... 121
D. Vibrator [3-4] ................................. 121
E. LCD [3-5] ....................................... 121
F. Key pad [3-6] ................................. 121
10.4 Trace option [MENU 4] ................. 122
10.5 Call Timer [MENU 5] ..................... 122
A. All calls [5-1] .................................. 122
B. Reset settings [5-2] ....................... 122
10.6 Fact. Reset [MENU 6] ................... 122
10.7 S/W version [MENU 7] .................. 122
11. STAND ALONE TEST ................... 123
11.1 Introduction ................................... 123
A. Tx Test .......................................... 123
B. Rx Test .......................................... 123
11.2 Setting Method ............................. 123
A. COM port ....................................... 123
B. Tx .................................................. 123
C. Rx .................................................. 123
11.3 Means of Test ............................... 124
12. AUTO CALIBRATION ................... 125
12.1 Overview ....................................... 125
12.2 Requirements ............................... 125
12.3 Menu and settings ........................ 125
12.4 AGC .............................................. 127
12.5 APC .............................................. 127
12.6 ADC .............................................. 127
12.7 Setting .......................................... 127
12.8 How to do calibration .................... 127
13. EXPLODED VIEW &
REPLACEMENT PART LIST ...... 128
13.1 Accessories .................................. 130
13.2 Replacement Part List .................. 131

1. INTRODUCTION
- 3 -
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for
example, persons other than your company’s employees, agents, subcontractors, or person working
on your company’s behalf) can result in substantial additional charges for your telecommunications
services. System users are responsible for the security of own system. There are may be risks of
toll fraud associated with your telecommunications system. System users are responsible for
programming and configuring the equipment to prevent unauthorized use. The manufacturer does
not warrant that this product is immune from the above case but will prevent unauthorized use of
common-carrier telecommunication service of facilities accessed through or connected to it. The
manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long
as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If
these changes could reasonably be expected to affect the use of the this phone or compatibility with
the network, the telephone company is required to give advanced written notice to the user, allowing
the user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this
manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of
the system and may void any remaining warranty.

1. INTRODUCTION
- 4 -
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.
Following information is ESD handling:
Service personnel should ground themselves by using a wrist strap when exchange system
boards.
When repairs are made to a system board, they should spread the floor with anti-static mat which
is also grounded.
Use a suitable, grounded soldering iron.
Keep sensitive parts in these protective packages until these are used.
When returning system boards or parts like EEPROM to the factory, use the protective package
as described.

1. INTRODUCTION
- 5 -
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
APC Automatic Power Control
BB Baseband
BER Bit Error Ratio
CC-CV Constant Current – Constant Voltage
DAC Digital to Analog Converter
DCS Digital Communication System
dBm dB relative to 1 milliwatt
DSP Digital Signal Processing
EEPROM Electrical Erasable Programmable Read-Only Memory
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output
LED Light Emitting Diode
OPLL Offset Phase Locked Loop
PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loop
PSTN Public Switched Telephone Network
RF Radio Frequency
RLR Receiving Loudness Rating
RMS Root Mean Square
RTC Real Time Clock
SAW Surface Acoustic Wave
SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
PSRAM Paeudo SRAM
STMR Side Tone Masking Rating
TA Travel Adapter
TDD Time Division Duplex
TDMA Time Division Multiple Access
UART Universal Asynchronous Receiver/Transmitter
VCO Voltage Controlled Oscillator
VCTCXO Voltage Control Temperature Compensated Crystal Oscillator
WAP Wireless Application Protocol

2. PERFORMANCE
- 6 -
2. PERFORMANCE
2.1 H/W Features
Item Feature Comment
Li-ion, 850 mAh
Standard Battery Si e: 42.73 64.25 7.5mm
Weight: 30g
Under the minimum current consumption environment
Stand by Current (such as paging period 9), the level of standby current is
below 4mA.
Talk time Up to 3 hours (GSM TX Level 7)
Stand by time Up to 200 hours (Paging Period: 9, RSSI: -85 dBm)
Charging time 3 hours
RX Sensitivity GSM, EGSM: -105dBm, DCS: -105dBm
TX output power GSM, EGSM: 32 dBm (Level 5)
DCS: 29dBm (Level 0)
GPRS compatibility Class 10
SIM card type 3V Small
Display 128 128 pixel 65K Color LCD
Hard icons
Key Pad:
Status Indicator 0 ~ 9, #, *, Up/Down Navigation Key
& keypad Confirm Key, Clear Key
Send Key, END/PWR Key
ANT Internal
EAR Phone Jack Yes
PC Synchronization Yes
Speech coding EFR/FR/HR
Data and Fax Yes
Vibrator Yes
Loud Speaker Yes
Voice Recording Yes
C-Mike Yes
Receiver Yes
Travel Adapter Yes
Options Hands-free kit, CLA, Data Kit

2. PERFORMANCE
- 7 -
2.2 Technical Specification
Item Description Specification
GSM
TX: 890 + n 0.2 MHz
RX: 935 + n 0.2 MHz (n = 1 ~ 124)
EGSM
1 Frequency Band TX: 890 + (n – 1024) 0.2 MHz
RX: 935 + (n – 1024) 0.2 MHz (n = 975 ~ 1024)
DCS
TX: 1710 + (n – 512) 0.2 MHz
Rx: 1805 + (n – 512) 0.2 MHz (n = 512 ~ 885)
2 Phase Error RMS < 5 degrees
Peak < 20 degrees
3 Frequency Error < 0.1 ppm
GSM, EGSM
Level Power Toler. Level Power Toler.
5 33 dBm 2dB 13 17 dBm 3dB
6 31 dBm 3dB 14 15 dBm 3dB
7 29 dBm 3dB 15 13 dBm 3dB
8 27 dBm 3dB 16 11 dBm 5dB
9 25 dBm 3dB 17 9 dBm 5dB
10 23 dBm 3dB 18 7 dBm 5dB
11 21 dBm 3dB 19 5 dBm 5dB
4 Power Level 12 19 dBm 3dB
DCS
Level Power Toler. Level Power Toler.
0 30 dBm 2dB 8 14 dBm 3dB
1 28 dBm 3dB 9 12 dBm 4dB
2 26 dBm 3dB 10 10 dBm 4dB
3 24 dBm 3dB 11 8 dBm 4dB
4 22 dBm 3dB 12 6 dBm 4dB
5 20 dBm 3dB 13 4 dBm 4dB
6 18 dBm 3dB 14 2 dBm 5dB
7 16 dBm 3dB 15 0 dBm 5dB

2. PERFORMANCE
- 8 -
Item Description Specification
GSM, EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600 ~ 1,200 -60
1,200 ~ 1,800 -60
1,800 ~ 3,000 -63
3,000 ~ 6,000 -65
5 Output RF Spectrum 6,000 -71
(due to modulation) DCS
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600 ~ 1,200 -60
1,200 ~ 1,800 -60
1,800 ~ 3,000 -65
3,000 ~ 6,000 -65
6,000 -73
GSM, EGSM
Offset from Carrier (kHz) Max. (dBm)
400 -19
600 -21
1,200 -21
6 Output RF Spectrum 1,800 -24
(due to switching transient) GSM
Offset from Carrier (kHz) Max. (dBm)
400 -22
600 -24
1,200 -24
1,800 -27
7 Spurious Emissions Conduction, Emission Status

2. PERFORMANCE
- 9 -
Item Description Specification
GSM, EGSM
8 Bit Error Ratio BER (Class II) < 2.439% @-102 dBm
DCS
BER (Class II) < 2.439% @-100 dBm
9 RX Level Report Accuracy 3 dB
10 SLR 8 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 0 -12
11 Sending Response 1,000 0 -6
2,000 4 -6
3,000 4 -6
3,400 4 -9
4,000 0 -
12 RLR 2 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 2 -7
500 *-5
13 Receiving Response 1,000 0 -5
3,000 2 -5
3,400 2 -10
4,000 2
* Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.
14 STMR 13 5 dB
15 Stability Margin > 6 dB
dB to ARL (dB) Level Ratio (dB)
-35 17.5
-30 22.5
16 Distortion -20 30.7
-10 33.3
0 33.7
7 31.7
10 25.5
17 Side Tone Distortion Three stage distortion < 10%
18 System frequency (13 MHz) tolerance ≤2.5 ppm

2. PERFORMANCE
- 10 -
Item Description Specification
19 32.768KHz tolerance ≤30 ppm
At least 80 dB under below conditions:
20 Ringer Volume 1. Ringer set as ringer.
2. Test distance set as 50 cm
21 Charge Voltage Fast Charge : < 500 mA
Slow Charge: < 60 mA
Antenna Bar Number Power
5 -85 dBm ~
4 -90 dBm ~ -86 dBm
22 Antenna Display 3 -95 dBm ~ -91 dBm
2 -100 dBm ~ -96 dBm
1 -105 dBm ~ -101 dBm
0 ~ -105 dBm
Battery Bar Number Voltage
0 ~ 3.62 V
23 Battery Indicator 1 3.62 ~ 3.73 V
2 3.73 ~ 3.82 V
3 3.82 V ~
24 Low Voltage Warning 3.5 0.03 V (Call)
3.62 0.03 V (Standby)
25 Forced shut down Voltage 3.35 0.03 V
1 Li-ion Battery
Standard Voltage = 3.7 V
26 Battery Type Battery full charge voltage = 4.2 V
Capacity: 850mAh
Switching-mode charger
27 Travel Charger Input: 100 ~ 240 V, 50/60 Hz
Output: 5.2 V, 600 mA

3. TECHNICAL BRIEF
- 11 -
3. TECHNICAL BRIEF
3.1 General Description
The RF parts consists of a transmitter part, a receiver part, a synthesizer part, a voltage supply part,
a VCTCXO part. And the main RF Chipset CX74017[U401] is a single-chip dual-band transceiver
for the extended global system for mobile communication[E-GSM900MHz]/Digital communication
system[DCS1800MHz] voice and data transfer applications.
This device integrated a direct conversion receiver architecture, which eliminates the need of
Intermediate Frequency, a transmitter based on a modulation loop architecture and fractional-N
synthesizer part with built in TXVCO and Local-VCO.
3.2 Receiver
The Receiver part in CX74017 contains all active circuits completely, full receiver chain with the
exception of discrete front-end RF SAW filters. The filtered and amplified signal is down converted
in the RF-mixer to the baseband output. The receiver path is supported by internal channel filtering.
The RF front-end circuit is shown Fig. 3-1.
Figure 3-1. RF front-end circuit.

3. TECHNICAL BRIEF
- 12 -
A. RF front end
RF front end consists of Antenna Switch(FL401), dual band LNAs integrated in transceiver(U401).
The Received RF signals (GSM 925MHz ~ 960MHz, DCS 1805MHz ~ 1880MHz) are fed into the
antenna or mobile switch. An antenna matching circuit is between the antenna and the mobile
switch.
The Antenna Switch (FL401) is used to control the Rx and TX paths. And, the input signals VC1 and
VC2 of a FL401 are connected to DCSSEL(GPO_9) and GSMSEL(GPO_11) ports of U101 to
switch either TX or RX path on. When the RX path is turned on, the received RF signal then feeds
either Rx_900_RF or RX_1800_RF path controlled by GSM-RX and DCS-RX respectively. This
Rx_900_RF path contains one SAW filter, followed after the Antenna Switch (FL401), to filter any
unwanted signal apart from the DCS RX band. And, the RX_1800_RF path is the same case. The
logic and current for Antenna Switch is given below Table 3-1.
Table 3-1. The logic and current
These two paths are then connected to the LNAGSMN (#11) and LNADCSIN (#13) of CX74017
(U401), respectively. A low-noise bipolar RF amplifier, contained within the U401, amplifies the RF
signal. The RF signals from the front-end pass to the receiver mixers within the U401 device.
B. Demodulator and baseband processing
In direct conversion receiver there is only one mixer down-converting received RF signal to BB
signal directly. The gain down converting mixer is 40dB at high gain mode and 22dB at low gain
mode.
The Rx gain setting is done in the AGC algorithm. The nominal gain of the receiver is set as a
function of the expected signal strength at the antenna input so that a desired level is reached at the
Rx I/Q. 7 blocks in the receiver chain have variable gains, LNA, Mixer, LPF1, VGA1, gmC Filter,
Auxiliary gain control and VGA2. The gain settings can be adjustable via 3-wire bus control lines.
The baseband signals pass via integrated low-pass filters to the baseband A/D converters. The
remainder of the channel filtering is performed by the baseband chipset. The demodulator contains
switches to maintain the sense of the baseband I/Q outputs with respect to the incoming RF signal
on both GSM900 and DCS1800.
C. DC Offset Compensation
Three correction loops ensure that DC offsets, generated in the CX74017, do not overload the
baseband chain at any point.
After compensation, the correction voltages are held on capacitors for the duration of the receive
slot(s). A rising edge on the RXEN signal, selected via the serial interface, placed the DC
compensation circuitry in the track mode.
VC1 VC2 Current
GSM TX 0 V 2.7 V 10.0 mA max
DCS TX 2.7 V 0 V 10.0 mA max
GSM/DCS RX 0 V 0 V < 0.1 mA

3. TECHNICAL BRIEF
- 13 -
3.3 Transmitter Part
The Transmitter part contains CX74017 active parts, PAM and Antenna Switch. The CX74017
active part consists of a vector modulator and offset phase-locked loop block(OPLL) including down-
converter, phase detector, loop filter and dual band transmit VCO which can operate at either final
RF output frequency. The RF GMSK outputs from the transmit VCO are fed directly to the RF power
amplifiers.
Fig. 3-2. Transmitter Block diagram.
The peak output power and the profile of the transmitted burst are controlled by means of power
control loop. The power control function is integrated, eliminating the need for directional couplers,
detector diodes, power control IC and other power control circuitry. This allows the module to be
driven directly from the DAC output. The PA outputs from the directional coupler pass to the
antenna connector via Antenna Switch.
A. IF Modulator
The baseband converter(BBC) within the GSM chipset generates I and Q baseband signals for the
transmit vector modulator. The modulator provides more than 40dBc of carrier and unwanted side-
band rejection and produces a GMSK modulated signal. The baseband software is able to cancel
out differential DC offsets in the I/Q baseband signals caused by imperfections in the D/A
converters.
The TX-Modulator implements a quadrature modulator. The IF-frequency input signal is split into
two precise orthogonal carriers, which are multiplied by the baseband modulation signal IT/ITX and
QT/QTX. It is used as reference signal for the OPLL.

B. OPLL
The offset mixer down converts the feedback Tx RF signal using LO to generate a IF modulating
signal. The IF signal goes via external passive bandpass filter to one port of the phase detector. The
other side of the phase detector input is LO signal. The phase detector generates an error current
proportional to the phase difference between the modulated signal from the offset mixer and the
reference signal from the LO.
The error current is filtered by a second order low-pass filter to generate an output voltage which
depends on the GMSK modulation and the desired channel frequency. This voltage controls the
transmit VCO such that the VCO output signal, centered on the correct RF channel, is frequency
modulated with the original GMSK data. The OPLL acts as a tracking narrowband band pass filter
tuned to the desired channel frequency. This reduces the wideband noise floor of the modulation
and up-conversion process and provides significant filtering of spurious products.
C. Synthesizer
The CX74017 includes a fully integrated UHF VCO with an on-chip LC tank.
A single sigma-delta fractional-N synthesizer can phase lock the local oscillator used in both
transmit and receive path to a precision frequency reference input. Fractional-N operation offers low
phase noise and fast setting times, allowing for multiple slot applications such as GPRS.
The generated frequency is given by the following equation.
where : = Generated VCO frequency
N = N-divider ratio integer part
FN = Fractional setting
R = R-divider ratio
= Reference Frequency
3. TECHNICAL BRIEF
- 14 -
VCO
f
VCO
f

3. TECHNICAL BRIEF
- 15 -
The counter and mode settings of the synthesizer are also programmed via 3-wire interface.
Figure 3-3. Synthesizer Block diagram.
D. Power Amplifier
The RF3110[U402] is a Dual band amplifier for E-GSM(880 to 915MHz) and DCS1800(1710 to
1785MHz). The efficiency of module is the 50% at nominal output power for E-GSM and the 45%
for DCS1800. This module should be operated under the GSM burst pulse. To avoid permanent
degradation, CW operation should not be applied. To avoid the oscillation at no input power,
before the input is cut off, the control voltage Vapc should be control to less than 0.5V.
We have to improve thermal resistance, the through holes should be layouted as many as
possible on PCB under the module. And to get good stability, all the GND terminals should be
soldered to ground plane of PCB.

3.4 13 MHz Clock
The 13 MHz clock (X401) consists of a TCXO (Temperature Compensated Crystal Oscillator) which
oscillates at a frequency of 13 MHz.
It is used within the CX74017 RF Main Chip, BB Analog chip-set (AD6521), and Digital (AD6522).
Figure 3-4. VCTCXO Circuit.
3.5 Power Supplies and Control Signals
There are two regulators used in the phone to provide RF power. One is contained inside of
ADP3408 (U301), power management IC to provide the power for the VCTXO (X401). The other is
used to provide the power for remaining RF circuits.
Table 3-2.
Figure 3-5. Regulator Circuit.
3. TECHNICAL BRIEF
- 16 -
X401
1CTL
2GND
3
OUT
VCC 4
13MHz
1MR426
2.2u
2012
C454
GND
3
IN
2
OUT
4
VCC
5
U403
SN74AHC1GU04DCKR
C455
1000p 100
R425
15K
R424 1000p
C456
13MHZ
2V7_VTCXO
AFC
ADP3330
U404
4
GND
2
IN
NR
5
OUT
1
_ERR
3
6
_SD
VBAT
RF2.85V
0
R430
470p
C459
2.2u
C457
2012
10uF
C458
2012
VSYNTHEN
Regulator Voltage Powers Enable Signal
Regulator 1
(U301, 2V7_VTCXO) 2.7 V 0.5 V VCTXO
Regulator 2
(U404, RF2V8) 2.85 V 0.5 V RF circuitry VSYNTHEN

3. TECHNICAL BRIEF
- 17 -
3.6 Testing Set-up and Checking Signals
A. Received RF Level and Checks
This section shows the typical RF levels expected throughout the receiver path. A block diagram
showing the locations of the RF measurement points and levels is shown in Fig. 3-11.
Receiver Testing Set-up
To check the receiver the following conditions have to be set:
On a signal generator or a GSM/DCS test box, output a CW signal of amplitude = -60 dBm at either:
947.4 MHz (CH62) when testing the GSM RX path or 1842.6 MHz (CH699) when testing the DCS
RX path. Set the DC power supply to 4.0 V.
Note: All RF values shown are only intended as a guide figure and may differ from readings taken
with other test equipment and leads. Lead and connector losses should always be taken into
account when performing such RF measurements.
Testing Receiver
Using a suitable high frequency probe measure the RF levels at the relevant points shown in
Fig. 3-9 and compare your measurements with those shown in the diagram. If there are any major
difference between the readings taken and those indicated then further investigation of that
particular point will be required. It will also be necessary to ensure that all the following power
supplies and signals are present which control this part of the receiver circuit :
1. The Control Signal of FEM (see Fig. 3-15, 16, 17)
2. RF2V8 (see Fig. 3-12)
3. 2V7_VTCXO (see Fig. 3-13)
4. 13MHz (see Fig. 3-14)
5. PLL_CLK, PLL_DATA, PLL_LE (see Fig. 3-18)
8. RX IP, IN, QP, QN (see Fig. 3-21)
B. Transmitted RF Level and Checks
This section shows the typical RF levels expected throughout the transmitter path. A block diagram
showing the locations of the RF measurement points and levels is shown in Fig. 3-8.
Transmitter Testing Set-up
To check the transmitter the following conditions have to be set :
1. Set the DC Power supply to 4.0 V.
2. Power up the GSM/DCS test set and then establishing a call with an attached mobile on active
mode.
3. Select Channel, TX Level and Input Level according to which parameter is required.
Note: All RF values shown are only intended as a guide figure and may differ from readings taken
with other test equipment and leads. Lead and connector losses should always be taken into
account when performing such RF measurements.

3. TECHNICAL BRIEF
- 18 -
Testing Transmitter
Using a suitable high frequency probe measure the RF levels at the relevant points shown in
Fig. 3-9, 10, and compare your measurements with those shown in the diagram. If there are any
major difference between the readings taken and those indicated then further investigation of that
particular point will be required. It will also be necessary to ensure that all the following power
supplies and signals are present which control this part of the transmitter circuit:
1. The Control Signal of FEM (see Fig. 3-15, 16, 17)
2. RF2V8 (see Fig. 3-12)
3. 2V7_VTCXO (see Fig. 3-13)
4. 13 MHz (see Fig. 3-14)
5. TXEN, TXRAMP, TXPA (see Fig. 3-19)
6. TX IP, IN, QP, QN (see Fig. 3-20)

3. TECHNICAL BRIEF
- 19 -
RF components (Component Side)
Figure 3-6. RF components (Component Side).
Reference Description Reference Description
U401 RF Main Chipset FL402 Dual SAW Filter
CN401 Mobile S/W X401 VCTCXO
FL401 Ant. S/W U404 LDO
U402 PAM U403 Inverter IC
CN401
U402
U403
FL401
FL402
U401
U404
X401