LG KG195 User manual

Date: September, 2007 / Issue 1.0
Service Manual Model : KG195
Service Manual
KG195
Internal Use Only

- 1 -
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
AMENDMENT RECORD SHEET
For details of previous history refer to archival documents.
KG195 SERVICE MANUAL V1.5
AMENDMENT RECORD
New Issue Number - Date Changes This Issue, Page and Description Remarks
Draft 1.00 20.07.2007 All for Publication First draft Issue
Issue Number Date
Draft 1.00 20.07.2007

- 2 -
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 3 -
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. Introduction ..................................... 5
2. Precautions for Repair Work ......... 7
3. UNIT SPECIFICATION ................... 12
4. Circuit Description.........................23
4.1 LOGIC BLOCK DIAGRAM.....................24
4.2 LOGIC....................................................25
4.2.1 INTRODUCTION ............................25
4.2.2 SYSTEM BLOCK DIAGRAM ..........25
4.2.3 MEMORY SUBSYSTEM ................26
4.2.4 MTK6226 BASE BAND CHIP .........28
4.2.5 PMU IC MT 6305 ............................29
4.2.6 KEY SWITCHES.............................34
4.2.7 VIBRATOR .....................................35
4.2.8 KEY BACKLIGHT LED ...................35
4.2.9 BATTERY CHARGING...................36
4.2.10 REAL-TIME CLOCK (RTC) ..........39
4.2.11 EXTERNAL INTERFACE .............40
4.2.12 SIM INTERFACE ..........................41
4.2.13 SIGNAL CONTROL PATH FOR
BACKLIGHT LED, CAMERA FLASH
LED AND INDICATOR LED..........42
4.2.14 DISPLAY SYSTEM.......................44
4.2.15 CAMERA.......................................46
4.2.16 AUDIO SUBSYSTEM ...................47
4.2.17 FM interface..................................50
4.2.18 Bluetooth interface........................51
4.2.19 RF Sub-systems ...........................52
5. Servicing........................................ 56
5.1 STRUCTURE.........................................57
5.2 ACCESSORIES.....................................61
5.3 EXPLODED DIAGRAM..........................63
5.4 DISASSEMBLY......................................66
5.5 SOLDERING..........................................70
6. Repairing ....................................... 72
6.1 TESTING ...............................................73
6.2 TROUBLE SHOOTING..........................85
6.3 Circuit Diagrams ....................................85
7. Device Information...................... 109
8. ATE TOOL .....................................128
9. Swoftware Download
Procedure .....................................176
9.1 Install Leo Download tool.....................176
9.2 Connect Download cable with
computer and mobile ...........................179
9.3 Install SW.............................................179
Table of Contents

- 4 -
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Table Of Contents

- 5 -
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
SECTION 1
Introduction

- 6 -
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. Introduction
This is the Electronic Service Manual for KG195 Triple Band GSM Digital Cellular Telephone from LG.
It contains specific information on repair and test procedures.
For details of user functions, general operation and installation, please refer to the User Guide.
The Service Manual is set out in the following sections.
1. Precautions for Repair Work: provides general guidelines for undertaking safe and efficient repair
work.
2. Unit Specification: provides the technical specifications for KG195 Triple Band GSM Digital
Cellular Telephone.
3. Introduction of Service Level:
a) Service Level 1: describes definition of Service Level 1, equipment and tools required for this
level.
b) Service Level 2: describes definition, equipment and tools required for Service Level 2.
4. Circuit Description: provides functional details of the circuits, block diagrams and component
purpose descriptions.
5. Servicing: defines the jigs, fixtures and test configurations required for servicing the product; and
describes the processes of assembly and disassembly.
6. Troubleshooting: provides an aid to fault finding the product. Includes, using the signal levels and
plots at various parts of the circuit.
7. Device Information: provides functional information and pin-outs of most of the semiconductor
devices within the HHP.
8. Glossary: terms used in this GSM and this manual.
1. Introduction

- 7 -
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
SECTION 2
Precautions
for Repair Work

- 8 -
2. Precautions for Repair Work
AC Power Cord:
Care must be taken not to damage the AC power cord as fire or electric shock may result.
Battery Pack:
Only use the specified batteries and chargers with this equipment.
Do not short the battery terminals together.
Keep the battery pack away from fire and sources of ignition.
Remember to recharge the battery pack after each use.
Before Powering up the Equipment:
• Only switch on the telephone’s power once the test or installation set-up is complete.
• Switching on at the wrong time may result in electric shock or damage to system components.
• Always ensure that the power is switched off before making connections / disconnection’s.
• It is important to check that the correct DC voltage is applied to the equipment to prevent electrical
damage.
Component Polarity:
Always check the polarity of connections and components before soldering.
Particular attention must be paid to IC.s, diodes, transistors, capacitors and any other semiconductor
device that is polarity dependent.
Electrostatic Damage (ESD):
Semiconductor devices are easily damaged by electrostatic discharge. Many of the procedures
detailed in this manual involve disassembly of the equipment and therefore handling of the printed
circuit boards.
To protect these devices from ESD a wrist strap connected to ground must be worn.
In addition to this the work surface must be covered with an anti-electrostatic mat, which should also
be grounded.
If printed circuit boards are to be stored without being re-assembled into their equipment, then they
must be kept in an anti-electrostatic bag.
2. Precautions for Repair Work
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Important
CAUTION:
Please read the following cautions, notes and warnings before progressing through
this manual or undertaking any repair action.
Remember: SAFETY FIRST!

- 9 -
2. Precautions for Repair Work
Electrostatic Damage (ESD):
Semiconductor devices are easily damaged by electrostatic discharge. Many of the procedures
detailed in this manual involve disassembly of the equipment and therefore handling of the printed
circuit boards.
To protect these devices from ESD a wrist strap connected to ground must be worn.
In addition to this the work surface must be covered with an anti-electrostatic mat, which should also
be grounded.
If printed circuit boards are to be stored without being re-assembled into their equipment, then they
must be kept in an anti-electrostatic bag.
Grounding:
Each piece of test equipment should be electrically grounded. A third (grounding) pin is provided as a
safety feature. Ensure that the electrical outlet also contains this feature.
Cosmetic Protection during Repair Work:
Always ensure that the working surface is kept clean and free from abrasive materials.
The LCD is very susceptible to scratches and damage. It should be covered with clear adhesive vinyl
while the equipment is disassembled.
Storage of Faulty Components:
Any components that are replaced due to failure should be kept safely in an antielectrostatic container.
NEC’s Quality or Research & Development Departments may require them to make quality and
reliability investigations.
No Fault Found Equipment:
In some cases the reported symptom may not be apparent. You may subject the equipment to a
controlled amount of stress, vibration and temperature variation to see if the fault occurs.
Care should be taken not to apply excessive stress or vibration or extreme temperature variations as
further faults may develop.
Soldering and Disordering:
The solder used is only Pb-free.
Fast, accurate and high quality soldering is required to minimise the risk of heat damage to the
electronic components. It is necessary to adjust the temperature of soldering tip to 330 degrees or
less. The soldering tip should not be in contact with components or PCB tracks for longer than 4
seconds (average). This time depends on temperature conditions of parts.
Heat the pad on the PCB and the lead, quickly apply solder, remove heat and cool. After soldering is
complete, ensure that all solder joints are of good quality - no dry joints, solder bridges, cracks or
excess solder. The majority of chip components are machine mounted using solder paste. Removal of
the solder is not sufficient for chip component removal. Each solder point must be heated
simultaneously and quickly (to prevent component and PCB damage). When the solder has melted,
remove the component with tweezers.
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 10 -
2. Precautions for Repair Work
Short Circuits:
Care must be taken to avoid short circuits. Soldering, solder dust, screws, metal clippings, metal wrist
watches etc. can cause short circuits on PCBs which may result in component damage.
Test Equipment Calibration:
Your test equipment should be calibrated before use. Frequent calibration is essential to ensure high
quality and reliable repairs.
Cleaning:
Before cleaning ensure that the telephone is switched off and disconnected from the power source.
Cleaning should be done using a soft dry cloth. If the equipment is heavily soiled a soft cloth soaked in
a mild synthetic detergent diluted in water may be used.
Never use benzene or any other chemicals to clean the equipment.
RF Shielding:
It is advisable to carry out detailed measurements and repair (in particular RX) in a shielded area to
minimise RF interference.
AC Adapter and Battery Charger:
The AC adapter and battery chargers are for indoor use only. Ensure that the devices are not exposed
to rain or moisture.
Electrical Safety:
Electrical equipment is hazardous if misused. Any repairs must be carried out with care and only by
authorised personnel.
Ensure all power sources are switched off and power cords removed before undertaking any repairs.
Hazardous Waste:
The battery pack, if incorrectly disposed of, is an environmental hazard. It must be disposed of in
accordance with the regulations of the country concerned. Never dispose of the battery pack in fire or
water.
Confidentiality:
The circuitry within this equipment contains several components that are regarded as company
confidential. Only use NEC specified parts as replacements.
RF Injury:
To avoid RF injury, direct exposure to radio frequency energy should be avoided. In particular,
exposed parts of your body (especially the eyes and face) should not come into contact with the
antenna while the equipment is transmitting.
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 11 -
2. Precautions for Repair Work
Storage Conditions:
It is recommended that the following storage conditions should be avoided to prevent damage to the
equipment: -
Dusty.
Humid.
Near to magnetic equipment
In direct sunlight
Ventilation:
Repair areas should be well ventilated and fume extraction systems should be installed where
necessary. Potential hazardous substances are solder fumes, flux, alcohol etc.
PCB Handling:
It is recommend that cotton gloves are worn during repair work. This is to protect your hands from
chemical contamination and to protect the PCBs from fingerprints and humidity.
SIM Card:
• Do not bend.
• Clean by using a soft dry cloth.
AUDIO Parts:
• Be careful for alien substance/oils and fats, etc. not to adhere to the terminal contact part of MIC, the
receiver, the speaker.
• Be careful to handle AUDIO parts with electrostatics measures at the worker/in the working place.
• Be careful not to spend a stress on the MIC side part to the utmost.
• Be careful not to pressurize the coil joint (protection Bond part) of the receiver and speaker because
they are easy of broken.
• Be careful for alien substance to approach to sound hole part of the speaker.
• Be careful sufficiently so as not to blow air with the process into the receiver, speaker/MIC sound
hole. It causes sounds being small by the diaphragm transformation or vibration.
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes

- 12 -
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
SECTION 3
Unit Specifications

- 13 -
3. UNIT SPECIFICATION
3. UNIT SPECIFICATION
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Solution MT6226 Media Tek
Type Bar type
Antenna Type Internal (tri-Band)
Main Display 1.77”, 128x160
GPRS Class 10
MMS Yes, 1.1
Camera 0.3M (OV7670)
Battery 750mAh BYD cell
Audio player Yes (support MP3 and AAC playback)
FM Receiver Yes, US/Europe band(87.5~108MHz)
MPEG4/H.263 Yes (support 3GP)
H.264 No(no support)
AAC+ No
FM as alarm Yes
Scheduled FM recording Yes
MP4 for incoming call/
power on off animation Yes
and screen saver
Loud Speaker Yes
Audio player--real resuming Yes, for MP3 only
Video recording Yes
Memory Size 128Mb NOR Flash + 32Mb
PSRAM + 512Mb NAND
Internal NAND 512Mb NAND
Memory Card T-flash
Bluetooth Yes, version 1.2
USB Yes, slave 1.1
IrMC No
WAP Yes, 2.0
PRODUCT FEATURES AND SPECIFICATION

- 14 -
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. UNIT SPECIFICATION
Java Yes
PoC No
EMAIL No
Status LED Yes
DRM No
Dictionary No
MPEG4 caller ID Yes
Finger handwriting No
Touch Panel No
Caption No
OTA Yes
AB repeat No
Music Equalizer Yes
Image Editing No
In flight mode Yes

- 15 -
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. UNIT SPECIFICATION
Category Requirement Description Parameter Support
Shall support multiple radio bands/power
- 850 MHz/class 4 (2W) N
Frequency - 900 MHz/class 4 (2W) Y
- 1800 MHz/class 1 (1W) Y
- 1900 MHz/class 1 (1W) Y
Antenna Shall support [Internal/External] antenna Internal Y
Shall support GPRS bearer
- release [R#] R98 Y
GPRS - multi-slot class [class #] 10 Y
- Service class [Class #] Class B Y
- Coding scheme [CSn] CS1,CS2, CS3, CS4 Y
Shall support following data transaction mode
and services.
- Fax N
- Data N
Data Service - WAP [rel #] 2.0 Y
- SMS Y
- EMS [rel #] Code 5.0 Y
- MMS [rel #] 1.1 Y
Java Support JAVA MIDP [ver #] 2.0 Y
Support JAVA CLDC [ver #] 1.0 Y
Shall support multiple voice codec Y
- FR Y
- EFR Y
Voice codec - HR Y
Audio - AMR NB (air link) N
decoder Shall support multiple audio decoders
- MP3 Y
- AAC Y
- AAC+ N
The physical dimension is [Length x Width x 103.5*46.3*12.4mm Y
Thickness mm]
Physical The overall volume is [# cc] 59 Y
The weight is [# g] TBC Y

- 16 -
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. UNIT SPECIFICATION
Category Requirement Description Parameter Support
Shall support main display with following Y
characteristics:
- Size 1.77” Y
Display - Type TFT, Transmissive Y
- Color depth 262K Y
- Pixel resolution [width x height] 128x160 Y
- Active area [W x H mm] 28.032(W)x 35.04(H) mm Y
Shall support high resolution camera with Y
following characteristics:
Camera - Active pixel array up to resolution [ X x Y pixels] 640x480 Y
- Sensor type [CMOS or CCD] CMOS Y
Shall support FM radio bands
FM radio - US/Europe band 87.5~108MHz Y
- Japan band 76~90MHz N
Battery Shall support Li-Ion battery with minimum 750mAh Y
capacity of [mAh].
Shall support following device to connect
external devices.
- USB [ver, host or slave or OTG] 1.1, slave Y
- Bluetooth [ver, power class] 1.2, class 2 Y
GAP
SDAP
Connectivity DUN
SPP
- Bluetooth profiles HSP Y
HFP
OPP
FTP
A2DP
Shall support mass data storage for different Y
multimedia content.
- Build-in NAND [MB]. Used as mobile disk. Y
Storage (Notes : Designed footprint shall be
possible to support multiple memory capacity)
- Micro SD Y

- 17 -
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. UNIT SPECIFICATION
Category Requirement Description Parameter Support
Indication Shall support LED for status indication. 1 Yellow Green LED Y
Shall support LED for charger-in status indication. 1 Orange LED Y
Vibrator Shall support in built vibration alert Y
SIM Card Shall support SIM card both 1.8V and 3V. Y
Shall support Y
- 12 alphanumeric/number keys (0-9,#,*)
Keypad - 4 function keys (on hook, off hook, left
softkey, right softkey)
- 4 way navigation keys (up, down, left, right)
- 3 side keys(one on the right and two on the left)
Shall support illumination color [color] for 10 LED Blue Y
keypad backlight.
Shall design in a nub on or around key Y
number 5.
Shall support AWB (Automatic White Balance) Y
Camera Shall support automatic flicker reduction N
Shall support gamma correction Y
* Battery life is Network dependent; variations may occur.
The KG195 HHP works closely with the network and the standby and talk times achieved depend
upon this. In particular the location of the HHP within the network, the type of SIM, reception of area
messages, the use of AMR, Full Rate speech, Half Rate speech or Enhanced Full Rate speech and
other factors will affect both standby and talk times.

- 18 -
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. UNIT SPECIFICATION
Transmitting Frequency Range: EGSM : 880 - 915MHz
DCS1800 : 1710 - 1785MHz
PCS1900 : 1850 - 1910MHz
Receiving Frequency Range: EGSM : 925 - 960MHz
DCS1800 : 1805 - 1880MHz
PCS1900 : 1930 - 1990MHz
TX - RX Duplex Spacing: EGSM : 45MHz
DCS1800 : 95MHz
PCS1900 : 80MHz
Channel Spacing: EGSM : 200KHz
DCS1800 : 200KHz
PCS1900 : 200KHz
Number of Channels (ARFCN): GSM : 124 (Numbered 1 to 124) std.
EGSM : 50 (Numbered 975 to 1023 & 0)
DCS1800 : 374 (Numbered 512 to 885)
PCS1900 : 299 (Numbered 512 to 810)
Power Class: EGSM : Class 4 MTS (33 +/- 2dBm)
DCS1800 : Class 1 MTS (30 +/- 2dBm)
PCS1900 : Class 1 MTS (30 +/- 2dBm)
Tx Peak Current: 2500mA
GPRS Class: Class 10; Operation class B
GPRS Coding Scheme: CS1/CS2/CS3/CS4
Data Rates (Packet): EGSM/DCS1800/PCS1900 :
Uplink : Up to 21.4Kbps (1 slot)
Downlink : Up to 85.6Kbps (4 slots)
Data Rates (Circuit Switch): EGSM/DCS1800/PCS1900 : Up to 9600Kbps

RF Power Output
TX Frequency Output
Phase and Frequency Error
- 19 -
LGE Internal Use Only Copyright © 2007 LG Electronics. Inc. All right reserved.
Only for training and service purposes
3. UNIT SPECIFICATION
Low Channel (Ch 975) 880.2 MHz
Mid Channel (Ch 62) 902.4 MHz
High Channel (Ch 124) 914.8 MHz
TX Frequency Calculation (Ftx)MHz 890 + (ARFCN x 0.2)MHz
(0 - 124) 890 + 0.2x(ARFCN - 1024)MHz
(975 - 1023)
Power Levels 15 decrements in 2dB steps
Power Control Level 5 33dBm +/-2dB
Power Control Level 6 31dBm +/-3dB
Power Control Level 7 29dBm +/-3dB
Power Control Level 8 27dBm +/-3dB
Power Control Level 9 25dBm +/-3dB
Power Control Level 10 23dBm +/-3dB
Power Control Level 11 21dBm +/-3dB
Power Control Level 12 19dBm +/-3dB
Power Control Level 13 17dBm +/-3dB
Power Control Level 14 15dBm +/-3dB
Power Control Level 15 13dBm +/-3dB
Power Control Level 16 11dBm +/-5dB
Power Control Level 17 9dBm +/-5dB
Power Control Level 18 7dBm +/-5dB
Power Control Level 19 5dBm +/-5dB
Peak Phase Error < 20 degrees
RMS Phase Error < 5 degrees
Frequency Stability < +/- 90Hz
TRANSMITTER (EGSM)