LG GB210 User manual

Service Manual Model : GB210
Internal Use Only
Service Manual
GB210
Date: January, 2009 / Issue 1.0

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Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Table Of Contents
1. INTRODUCTION............................................... 5
1.1 Purpose...................................................................... 5
1.2 Regulatory Information................................................. 5
1.3 Abbreviations .............................................................. 7
2. PERFORMANCE............................................... 9
2.1 H/W Features.............................................................. 9
2.2 Technical Specification (GB210).................................. 11
3. TECHNICAL BRIEF......................................... 15
3.1 SKY77518 TX–RX iPAC™ FEM for Dual-Band
GSM/GPRS (SKY77518, U500) ..................................15
3.2 Transceiver (AD6548, U501) ...................................... 17
3.3 26 MHz Clock (Crystal, X500)..................................... 19
3.4 BT Module with integrated FM tuner(BC5-FM, U200)... 20
3.5 Baseband Processor (AD6726, U103)......................... 21
3.6 Display and Interface ................................................. 27
3.7 Camera Interface(AIT716 , U400) ............................... 29
3.8 Keypad Switches and Scanning.................................. 32
3.9 Microphone............................................................... 33
3.10 Main Speaker.......................................................... 34
3.11 Headset Interface .................................................... 35
3.12 Key Back-light Illumination....................................... 36
3.13 LCD Back-light Illumination ...................................... 37
3.14 VIBRATOR ............................................................... 38
3.15 Battery Charging ..................................................... 39
4. TROUBLE SHOOTING..................................... 40
4.1 RF Component .......................................................... 40
4.2 RX Trouble ................................................................ 41
4.3 TX Trouble................................................................. 46
4.4 Bluetooth + FM Radio................................................ 52
4.5 Power On Trouble ...................................................... 55
4.6 Charging Trouble ....................................................... 57
4.7 Vibrator Trouble ......................................................... 60
4.8 LCD Trouble .............................................................. 62
4.9 Camera Trouble......................................................... 65
4.10 Speaker Trouble ...................................................... 68
4.11 SIM Card Interface Trouble ....................................... 70
4.12 Earphone Trouble..................................................... 72
4.13 KEY backlight Trouble .............................................. 74
4.14 Receiver Trouble...................................................... 76
4.15 Microphone Trouble ................................................. 78
4.16 RTC Trouble ............................................................ 80
4.17 Micro SD Trouble..................................................... 82
5. Download ..................................................... 84
5.1 Download.................................................................. 84
6. BLOCK DIAGRAM.......................................... 90
7. CIRCUIT DIAGRAM........................................ 91
8. BGA Pin Map ................................................ 97
9. PCB LAYOUT ............................................... 101
10. STAND ALONE TEST.................................. 103
10.1 Introduction........................................................... 103
10.2 Setting Method...................................................... 103
10.3 Means of Test........................................................ 104
11. AUTO CALIBRATION.................................. 106
11.1 Overview............................................................... 106
11.2 Equipment List ...................................................... 106
11.3 Test Jig Operation.................................................. 107
11.4 Procedure............................................................. 108
11.5 AGC...................................................................... 110
11.6 APC...................................................................... 110
11.7 ADC...................................................................... 110
12. EXPLODED VIEW & REPLACEMENT
PART LIST ................................................. 111
12.1 EXPLODED VIEW ................................................... 111
12.2 Replacement Parts ................................................ 113
12.3 Accessory ............................................................. 129

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LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes

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Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features of
this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons
other than your company’s employees, agents, subcontractors, or person working on your company’s behalf)
can result in substantial additional charges for your telecommunications services. System users are responsible
for the security of own system. There are may be risks of toll fraud associated with your telecommunications
system. System users are responsible for programming and configuring the equipment to prevent unauthorized
use. The manufacturer does not warrant that this product is immune from the above case but will prevent
unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to
it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing
harm or interruption in service to the telephone network, it should disconnect telephone service until repair can
be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes
could reasonably be expected to affect the use of the this phone or compatibility with the network, the
telephone company is required to give advanced written notice to the user, allowing the user to take
appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent.
The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note
that unauthorized alternations or repair may affect the regulatory status of the system and may void any
remaining warranty.

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LGE Internal Use Only Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory
agencies. In accordance with these agencies, you may be required to provide information such as the following to
the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from unsuppressed
engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated
by the sign. Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system
boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat
which is also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective
package as described.

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Copyright © 2009 LG Electronics. Inc. All right reserved.
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LGE Internal Use Only
1. INTRODUCTION
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
Offset Phase Locked LoopOPLL
Light Emitting DiodeLED
Low Drop OutputLDO
Liquid Crystal DisplayLCD
Intermediate FrequencyIF
International Portable User IdentityIPUI
Global System for Mobile CommunicationsGSM
General Purpose Interface BusGPIB
Gaussian Minimum Shift KeyingGMSK
Flexible Printed Circuit BoardFPCB
Electrostatic DischargeESD
Electrical Erasable Programmable Read-Only MemoryEEPROM
Digital Signal ProcessingDSP
dB relative to 1 milli wattdBm
Digital Communication SystemDCS
Digital to Analog ConverterDAC
Constant Current – Constant VoltageCC-CV
Bit Error RatioBER
BasebandBB
Automatic Power ControlAPC

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1. INTRODUCTION
Wireless Application Protocol
WAP
Voltage Control Temperature Compensated Crystal OscillatorVCTCXO
Voltage Controlled OscillatorVCO
Universal Asynchronous Receiver/TransmitterUART
Time Division Multiple AccessTDMA
Time Division DuplexTDD
Travel AdapterTA
Side Tone Masking RatingSTMR
Pseudo SRAMPSRAM
Static Random Access MemorySRAM
Sending Loudness RatingSLR
Subscriber Identity ModuleSIM
Surface Acoustic WaveSAW
Real Time ClockRTC
Root Mean SquareRMS
Receiving Loudness RatingRLR
Radio FrequencyRF
Public Switched Telephone NetworkPSTN
Phase Locked LoopPLL
Programmable Gain AmplifierPGA
Printed Circuit BoardPCB
Power Amplifier ModulePAM

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Copyright © 2009 LG Electronics. Inc. All right reserved.
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LGE Internal Use Only
2. PERFORMANCE
2. PERFORMANCE
2.1 H/W Features
Item Feature Comment
Standard Battery Li-ion, 3.7V 1100mAh
Talk time Up to 240min : GSM Tx Level 7
Stand by time Up to 350 hours (Paging Period: 5, RSSI: -85 dBm)
Charging time Approx. 3 hours
RX Sensitivity -102dBm
TX output power GSM900 : 32.5dBm(Level 5),
DCS : 29.5dBm(Level 0)
SIM card type 3V
Display MAIN : TFT 128 ×160 pixel 262K Color
Status Indicator
Hard icons. Key Pad
0 ~ 9, #, *, Up/Down/Left/Right/Ok Navigation Key
Menu Key, Clear Key, Confirm Key, Send Key , PWR Key,
ANT Internal
EAR Phone Jack Yes (Stereo)
PC Synchronization Yes
Speech coding EFR/FR/HR
Data Yes
GPRS compatibility Class 10
Vibrator Yes
Loud Speaker Yes
Voice Recoding Yes
Microphone Yes

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2. PERFORMANCE
Travel Adapter Yes
Speaker/Receiver Receiver 11X 07, Speaker : 16*16
MIDI 32poly SW MIDI
Item Feature Comment
Camera 1.3M

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Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
Not support
EDGE
Max. Power
5
±5dB0 dBm15±3dB16 dBm7
±5dB2 dBm14±3dB18 dBm6
±4dB4 dBm13±3dB20 dBm5
±4dB6 dBm12±3dB22 dBm4
±4dB8 dBm11±3dB24 dBm3
±4dB10 dBm10±3dB26 dBm2
±4dB12 dBm9±3dB28 dBm1
±3dB14 dBm8±2dB30 dBm0
Toler.PowerLevelToler.PowerLevel
DCS1800/PCS1900
±3dB19 dBm12
±5dB5 dBm19±3dB21 dBm11
±5dB7 dBm18±3dB23 dBm10
±5dB9 dBm17±3dB
25 dBm9
±5dB11 dBm16±3dB27 dBm8
±3dB13 dBm15±3dB29 dBm7
±3dB15 dBm14±3dB31 dBm6
±3dB17 dBm13±2dB33 dBm5
Toler.PowerLevelToler.PowerLevel
GSM850/EGSM900
Power Level4
< 0.1ppmFrequency Error3
Peak < 20 degrees
RMS < 5 degrees
Phase Error2
Frequency Band1
SpecificationDescriptionItem
Not support
EDGE
Modulation Accuracy
6
▶GSM850
TX: 824 + 0.2 x (n-127) MHz
RX: 869 + 0.2 x (n-127) MHz ( n = 128 ~ 251 )
▶GSM900
(EGSM)
TX: 890 + (n-1024) ×0.2 MHz
RX: 935 + (n-1024) ×0.2 MHz (n=975~1024)
(PGSM)
TX: 890 + (n-1024) ×0.2 MHz
RX: 935 + (n-1024) ×0.2 MHz (n=1~124)
▶DCS1800
TX: 1710 + (n-512) ×0.2 MHz
RX: 1805 + (n-512) ×0.2 MHz (n=512~885)
▶PCS1900
TX: 1810 + (n-512) ×0.2 MHz
RX: 1905 + (n-512) ×0.2 MHz (n=512~885)
2.2 Technical Specification (GB210)

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2. PERFORMANCE
Radiation, Emission Status
Conduction, Emission Status
Spurious Emissions9
-271,800
-241,200
-24600
-22400
Max. [dBm]Offset from Carrier (kHz)
DCS1800/PCS1900
-241,800
-211,200
-21600
-19400
Max. [dBm]Offset from Carrier (kHz)
GSM850/EGSM900
Output RF Spectrum
(Due to Switching)
8
-736,000
-653,000 ~ 6,000
-651,800 ~ 3,000
-601,200 ~ 1,800
-60600 ~ 1,200
-60400
-33250
-30200
0.5100
Max. [dBc]Offset from Carrier (kHz).
DCS1800/PCS1900
-716,000
-653,000 ~ 6,000
-631,800 ~ 3,000
-601,200 ~ 1,800
-60600 ~ 1,200
-60400
-33250
-30200
0.5100
Max. [dBc]Offset from Carrier (kHz).
GSM850/EGSM900
Output RF Spectrum
(Due to Modulation)
7
SpecificationDescriptionItem

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Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
Normal Power Off : < 5uA
Emergency Power Off : < 15uA
Backup Battery (Without Main Battery)
FM radio
Bluetooth
< 2.7mA @PP9
< 3.3mA @PP5
< 5.5mA @PP2
Standby
< 230mA @PCS, PL=0
< 300mA @GSM850, PL=5
Max. power
Power consumption20
< -36 dBm0pIdle Noise Receiving19
< -64 dBm0pIdle Noise Sending18
> 40 dBEcho Loss17
> 17 dBSTMR16
-24,000
-1223,400
-721,000
-92300
/2200
/-6100
Min.(dB)Max.(dB)Frequency (Hz)
Receiving
Response
(Type 3.2)
15
-4±3 dB
RLR(Normal volume)
14
-04,000
-943,400
-643,000
-642,000
-601,000
-120300
-0200
--12100
Min.(dB)Max.(dB)Frequency (Hz)
Sending Response13
8 ±3 dBSLR12
2 ±3 dBRx Level Report accuracy11
BER (Class II) < 2.439% @-102dBm
DCS1800/PCS1900
BER (Class II) < 2.439% @-102dBm
GSM850/EGSM900
Bit Error Ratio10
SpecificationDescriptionItem
< 5.0mA @ Bluetooth on (Standby)
< 300mA @ Bluetooth connected (Call)
< 40mA @ FM Radio Operation (AVG)

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2. PERFORMANCE
Output: 5.1V, 700mA
Input: 100 ~ 240 V, 50/60Hz
Travel Charger31
Back-up Battery : Lithium, 1mAh
Main Battery : Li-ion, 1100mAh, Inner Pack
Battery Type30
3.33 ±0.05VForced shut down Voltage29
3.42 ±0.05 V (Standby)
3.42 ±0.05 V (Call)
Low Voltage Warning(TBD)28
4.2V3
3.7V ±0.05 V3 →2
3.55V ±0.05 V2 →1
3.42V ±0.05V1 →0
VoltageBattery Bar Number
Battery Indicator27
~ –105 dBm0
-105 dBm ~ –104 dBm1
-103 dBm ~ –101 dBm2
skip3
-100 dBm ~ –93 dBm4
-92 dBm ~5
PowerAntenna Bar Number
Antenna Display26
Under 3 hr.Charging Time25
Slow Charge: < 110 mA
Fast Charge : < 550 mA
Charge Current24
2. Test distance set as 1 m.
1. Ringer set as ringer.
At least 55 dB under below conditions:
Ringer Volume(TBD)23
- Full charge, no receive/send and keep GSM in idle mode.
Broadcast set off. Signal strength display set at 3 levelabove.
Backlight of phone set off.
350 hr., Min.@PP5
400 hr., Min.@PP9
Standby Time22
7 hr., Min.@DCS/PCS, PL=10
4.5 hr., Min.@DCS/PCS, PL=0
6 hr., Min.@GSM850/EGSM900, PL=12
4 hr., Min.@GSM850/ESGSM900, PL=5
Talk Time21
SpecificationDescriptionItem

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Copyright © 2009 LG Electronics. Inc. All right reserved.
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3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
The SKY77518 is a transmit and receive front-end module (FEM) with Integrated PowerAmplifier Control
(iPAC™) for dual-band cellular handsets comprising GSM900 and DCS1800 operation. Designed in a low
profile, compact form factor, the SKY77518 offers a complete Transmit VCO-to-Antenna and Antenna-to-
Receive SAW filter solution. The FEM also supports Class 12 General Packet Radio Service (GPRS) multi-slot
operation. The module consists of a GSM900 PA block and a DCS1800 PA block, impedance-matching
circuitry for 50 Ωinput and output impedances, TX harmonics filtering, high linearity and low insertion loss
PHEMT RF switches, diplexer and a Power Amplifier Control (PAC) block with internal current sense resistor. A
custom BiCMOS integrated circuit provides the internal PAC function and decoder circuitry to control the RF
switches. The two Heterojunction Bipolar Transistor (HBT) PA blocks are fabricated onto a single Gallium
Arsenide (GaAs) die. One PA block supports the GSM900 band and the other PA block supports the DCS1800
band. Both PA blocks share common power supply pads to distribute current. The output of each PA block
and the outputs to the two receive pads are connected to the antenna pad through PHEMT RF switches and a
diplexer. The GaAs die, PHEMT die, Silicon (Si) die and passive components are mounted on a multi-layer
laminate substrate. The assembly is encapsulated with plastic overmold. Band selection and control of
transmit and receive modes are performed using two external control pads. Refer to the functional block
diagram in Figure 1 below. The band select pad (BS) selects between GSM and DCS modes of operation. The
transmit enable (TX_EN) pad controls receive or transmit mode of the respective RF switch (TX = logic 1).
Proper timing between transmit enable (TX_EN) and Analog Power Control (VRAMP) allows for high isolation
between the antenna and TX-VCO while the VCO is being tuned prior to the transmit burst. The SKY77518 is
compatible with logic levels from 1.2 V to VCC for BS and TX_EN pads, depending on the level applied to the
VLOGIC pad. This feature provides additional flexibility for the designer in the selection of FEM interface
control logic.
3.1 SKY77518 TX–RX iPAC™ FEM for Dual-Band GSM/GPRS
(SKY77518, U500)

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3. TECHNICAL BRIEF
Table 5 Pad description
Table 3 Mode Control logic

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Copyright © 2009 LG Electronics. Inc. All right reserved.
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LGE Internal Use Only
3. TECHNICAL BRIEF
The AD6548 provides a highly integrated direct conversion radio solution that combines, on a single chip,
all radio and power management functions necessary to build the most com-pact GSM radio solution
possible. The only external components required for a complete radio design are the Rx SAWs, PA,
Switchplexer and a few passives enabling an extremely small cost effective GSM Radio solution. The
AD6548 uses the industry proven direct conversion receiver architecture of the OthelloTM family. For Quad
band applications the front end features four fully integrated programmable gain differential LNAs. The RF
is then down converted by quad-rature mixers and then fed to the baseband programmable-gain
amplifiers and active filters for channel selection. The Receiver output pins can be directly connected to the
baseband analog processor. The Receive path features automatic calibration and tracking to remove DC
offsets. The transmitter features a translation-loop architecture for directly modulating baseband signals
onto the integrated TX VCO. The translation-loop modulator and TX VCO are extremely low noise removing
the need for external SAW filters prior to the PA. The AD6548 uses a single integrated LO VCO for both the
receive and the transmit circuits. The synthesizer lock times are optimized for GPRS applications up to and
including class 12.
AD6548 incorporates a complete reference crystal calibration system. This allows the external VCTCXO to
be replaced with a low cost crystal. No other external components are required. The AD6548 uses the
traditional VCTCXO reference source. The AD6548 also contains on-chip low dropout voltage regulators
(LDOs) to deliver regulated supply voltages to the functions on chip, with a battery input voltage of
between 2.9V and 5.5V. Comprehensive power down options are included to minimize power
consumption in normal use. A standard 3 wire serial interface is used to program the IC. The interface
features low-voltage digital interface buffers compatible with logic levels from 1.6V to 2.9V.
3.2 Transceiver (AD6548, U501)
Antenna Switch Module
DC Offset
Correction
DC Offset
Correction
PFD
/2
LDO
Reg 3 LDO Reg 2 LDO Reg 1
Frac-N Synth
RX LO
Generator
TX LO
Generator
Xtal Osc
+ Tuning
Serial
Interface
/4
SEN
SCLK
SDATA
RX1900B
RX1900
RX1800B
RX1800
RX900B
RX900
RX850B
RX850
TXOP_HI
TXOP_LO
VDD VBAT VLDO3 VLDO2 VLDO1
LO VCO
Supply
REF_OP
REFIN
REFINB
VAFC
VCC_REF
Q
QB
I
IB
VCC_BBI
VCC_BBQ
LNA Gain
Reduction
TX_LO2
TX_LO1
TX_LO2
TX_LO1
General
Supply
TX circuits
supply
CLK
RXQB
RXQ
TXQB
TXQ
RXIB
RXI
TXI
TXIB
AFC
REF_OP
Band
Control
TX Loop
Filter
GSM1800/1900
GSM850/900
PA Module
AD6548
VCC_FE
VCC_TXVCO
Ref
Supply
VCC_
TXVCO
Figure 3.3 AD6548 Block Diagram

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3. TECHNICAL BRIEF

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3. TECHNICAL BRIEF
The 26 MHz clock (X401) consists of a XO (Crystal Oscillator) which oscillates at a frequency of 26 MHz. The
AD6548 requires only an external low cost crystal as the frequency reference. The circuitry to oscillate the
crystal and tune its frequency is fully integrated. The Oscillator is a balanced implementation requiring the
crystal to be connected across 2 pins. There is a programmable capacitor array included for coarse tuning of
fixed offsets (e.g. crystal manufacturing tolerance), and an integrated varactor for dynamic control. The
oscillator is designed for use with a 26MHz crystal. Dedicated control software ensures excellent frequency
stability under all circumstances.
Figure 3.4 CRYSTAL CIRCUIT DIAGRAM
3.3 26 MHz Clock (Crystal, X500)
4
DSX321G-26M
X500
26MHz
12
3

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3. TECHNICAL BRIEF
The BlueCore5-FM BGA is a single-chip radio and baseband IC for Bluetooth 2.4GHz systems
including enhanced data rates (EDR) to 3Mbits/s. It includes an integrated FM receiver with
stereo audio output stage and an RDS demodulator.
With the on-chip CSR Bluetooth software stack, it provides a fully compliant Bluetooth system
to v2.1 + EDR of the specification for data and voice communications.
3.4 BT Module with integrated FM tuner(BC5-FM, U200)

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3. TECHNICAL BRIEF
3.Peripheral Functions
Parallel and Serial Display Interface
USB 2.0 Full Speed device Interface
Keypad Interface
Support for Burst and Page Mode Flash
1.8V and 3.0V, 64 kbps SIM Interface
Universal System Connector Interface
Data Services Interface
SD/Multimedia Card Interface
4. Other
Supports 13 MHz and 26 MHz Input Clocks
1.8V Typical Core Operating Voltages
361-Ball Package (13x13mm) , 0.65mm Ball pitch
5. The AD6726 baseband transmit section supports the following
mobile station GMSK modulation power classes:
GSM 900/850 power classes 4 and 5,
DCS 1800 power classes 1 and 2, and
PCS 1900 power classes 1 and 2
• AD6726 is an ADI designed processor
•AD6726 consists of
1. Control Processor Subsystem including:
32-bit MCU ARM7TDMI® Control Processor
78 MHz operation at 1.8V
2Mb of on-chip System SRAM Memory
2.DSP Subsystem including:
16-bit Fixed Point DSP Processor
91 MIPS[1] at 1.8V
Data and Program SRAM
Program Instruction Cache
Full Rate, Enhanced Full Rate and Half Rate
Speech Encoding/Decoding
Capable of Supporting AMR & PDC Speech Algorithms
3.5 Baseband Processor (AD6726 , U103)