LG KG210 User manual

Date: April, 2006 / Issue 1.0
Service Manual Model : KG210
Service Manual
KG210

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1. INTRODUCTION ...............................5
1.1 Purpose .................................................. 5
1.2 Regulatory Information............................ 5
1.3 Abbreviations .......................................... 7
2. PERFORMANCE...............................9
2.1 H/W Features...........................................9
2.2 Technical Specification ..........................10
3. TECHNICAL BRIEF ........................15
3.1 Power Transceiver .................................15
3.2 FEM for Triband .....................................17
3.3 26 MHz Clock.........................................18
3.4 Baseband Processor..............................19
3.5 Battery Charging Block ..........................24
3.6 Display and Interface .............................26
3.7 Keypad Switches and Scanning ............28
3.8 Microphone ............................................29
3.9 Main Speaker.........................................30
3.10 Headset Interface.................................31
3.11 Key Back-light Illumination...................32
3.12 LCD Back-light Illumination..................33
3.13 VIBRATOR...........................................34
4. TROUBLE SHOOTING ...................35
4.1 RF Component.......................................35
4.2 RX Trouble.............................................36
4.3 TX Trouble .............................................42
4.4 Power On Trouble..................................49
4.5 Charging Trouble ...................................51
4.6 Vibrator Trouble .....................................53
4.7 LCD Trouble...........................................55
4.8 Speaker Trouble ....................................57
4.9 SIM Card Interface Trouble....................59
4.10 Earphone Trouble ................................61
4.11 KEY backlight Trouble .........................63
4.12 Receiver Trouble..................................65
4.13 Microphone Trouble .............................67
4.14 RTC Trouble ........................................69
4.15 Indication LED Trouble ........................71
4.16 Folder on/off Trouble............................73
5. DOWNLOAD.......................................75
5.1 Download ...............................................75
6. BLOCK DIAGRAM ..........................81
7. Circuit Diagram ..............................83
8. pcb layout .......................................89
9. ENGINEERING MODE ....................91
9.1 BB Test [MENU 1]..................................92
9.2 RF Test [MENU 2]..................................94
9.3 MF mode [MENU 3] ...............................94
9.4 Trace option [MENU 4] ..........................95
9.5 Call timer [MENU 5] ...............................95
9.6 Fact. Reset [MENU 6] ............................95
9.7 S/W version............................................95
10. STAND ALONE TEST ...................96
10.1 Introduction ..........................................96
10.2 Setting Method.....................................96
10.3 Means of Test ......................................97
11. AUTO CALIBRATION....................99
11.1 Overview ..............................................99
11.2 Equipment List .....................................99
11.3 Test Jig Operation..............................100
11.4 Procedure ..........................................101
11.5 AGC ...................................................104
11.6 APC....................................................104
11.7 ADC ...................................................104
12. EXPLODED VIEW &
REPLACEMENT PART LIST ..... 105
12.1 Exploded View .................................. 105
12.2 Replacement Parts ............................107
12.3 Accessory ......................................... 121
Table Of Contents

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1. INTRODUCTION
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1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud
associated with your telecommunications system. System users are responsible for programming and
configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this
product is immune from the above case but will prevent unauthorized use of common-carrier
telecommunication service of facilities accessed through or connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the this phone or compatibility with the
network, the telephone company is required to give advanced written notice to the user, allowing the
user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.
1. INTRODUCTION

1. INTRODUCTION
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E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.
Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as
described.

1. INTRODUCTION
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1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
APC Automatic Power Control
BB Baseband
BER Bit Error Ratio
CC-CV Constant Current - Constant Voltage
DAC Digital to Analog Converter
DCS Digital Communication System
dBm dB relative to 1 milli watt
DSP Digital Signal Processing
EEPROM Electrical Erasable Programmable Read-Only Memory
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output
LED Light Emitting Diode
OPLL Offset Phase Locked Loop

1. INTRODUCTION
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PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loop
PSTN Public Switched Telephone Network
RF Radio Frequency
RLR Receiving Loudness Rating
RMS Root Mean Square
RTC Real Time Clock
SAW Surface Acoustic Wave
SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
PSRAM Pseudo SRAM
STMR Side Tone Masking Rating
TA Travel Adapter
TDD Time Division Duplex
TDMA Time Division Multiple Access
UART Universal Asynchronous Receiver/Transmitter
VCO Voltage Controlled Oscillator
VCTCXO Voltage Control Temperature Compensated Crystal Oscillator
WAP Wireless Application Protocol

2. PERFORMANCE
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2.1 H/W Features
2. PERFORMANCE
Item Feature Comment
Standard Battery Li-ion, 830mAh
Stand by TIME Up to 200 hrs : Paging Period 9, RSSI 85dBm
Talk time Up to 200min : GSM Tx Level 7
Stand by time Up to 200 hours (Paging Period: 9, RSSI: -85 dBm)
Charging time Approx. 3 hours
RX Sensitivity GSM, EGSM: -109dBm, DCS: -109dBm
TX output power GSM, EGSM: 32.5dBm(Level 5),
DCS , PCS: 29.5dBm(Level 0)
GPRS compatibility Class 10
SIM card type 3V Small
Display LCD : CSTN 128 × 128 pixel 65K Color
Hard icons. Key Pad
0 ~ 9, #, *, Up/Down Navigation Key
Status Indicator Menu Key, Clear Key
Send Key, END/PWR Key
Soft Key(Left/Right)
ANT Internal
EAR Phone Jack Yes (mono)
PC Synchronization Yes
Speech coding EFR/FR/HR
Data and Fax Yes
Vibrator Yes
Loud Speaker Yes
Voice Recoding Yes
Microphone Yes
Speaker/Receiver One way speaker
Travel Adapter Yes
MIDI 40 Poly (Mono SPK)

2. PERFORMANCE
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2.2 Technical Specification
Item Description Specification
GSM
TX: 890 + n x 0.2 MHz
RX: 935 + n x 0.2 MHz (n=1~124)
EGSM
1Frequency Band TX: 890 + (n-1024) x 0.2 MHz
RX: 935 + (n-1024) x 0.2 MHz (n=975~1024)
DCS
TX: 1710 + (n-512) x 0.2 MHz
RX: 1805 + (n-512) x 0.2 MHz (n=512~885)
2Phase Error RMS < 5 degrees
Peak < 20 degrees
3Frequency Error < 0.1 ppm
GSM, EGSM
Level Power Toler. Level Power Toler.
533 dBm 2dB 13 17 dBm 3dB
631 dBm 3dB 14 15 dBm 3dB
729 dBm 3dB 15 13 dBm 3dB
827 dBm 3dB 16 11 dBm 5dB
925 dBm 3dB 17 9 dBm 5dB
10 23 dBm 3dB 18 7 dBm 5dB
11 21 dBm 3dB 19 5 dBm 5dB
4Power Level 12 19 dBm 3dB
DCS
Level Power Toler. Level Power Toler.
030 dBm 2dB 8 14 dBm 3dB
128 dBm 3dB 9 12 dBm 4dB
226 dBm 3dB 10 10 dBm 4dB
324 dBm 3dB 11 8 dBm 4dB
422 dBm 3dB 12 6 dBm 4dB
520 dBm 3dB 13 4 dBm 4dB
618 dBm 3dB 14 2 dBm 5dB
716 dBm 3dB 15 0 dBm 5dB

2. PERFORMANCE
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Item Description Specification
GSM, EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -63
3,000~ <6,000 -65
5Output RF Spectrum 6,000 -71
(due to modulation) DCS
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -65
3,000~ <6,000 -65
6,000 -73
GSM, EGSM
Offset from Carrier (kHz) Max. (dBm)
Output RF Spectrum 400 -19
6(due to switching transient) 600 -21
1,200 -21
1,800 -24

2. PERFORMANCE
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Item Description Specification
DCS
Offset from Carrier (kHz). Max. (dBm)
Output RF Spectrum 400 -22
6(due to switching transient) 600 -24
1,200 -24
1,800 -27
7Spurious Emissions Conduction, Emission Status
GSM, EGSM
8Bit Error Ratio BER (Class II) < 2.439% @-102 dBm
DCS
BER (Class II) < 2.439% @-100 dBm
9RX Level Report Accuracy 3 dB
10 SLR 8 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 0 -12
11 Sending Response 1,000 0 -6
2,000 4 -6
3,000 4 -6
3,400 4 -9
4,000 0 -
12 RLR 2 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 2 -7
500 *-5
13 Receiving Response 1,000 0 -5
3,000 2 -5
3,400 2 -10
4,000 2
*Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.

2. PERFORMANCE
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Item Description Specification
14 STMR 13 5 dB
15 Stability Margin > 6 dB
dB to ARL (dB) Level Ratio (dB)
-35 17.5
-30 22.5
-20 30.7
16 Distortion -10 33.3
033.7
731.7
10 25.5
17 Side Tone Distortion Three stage distortion < 10%
18 System frequency 2.5ppm
(13 MHz) tolerance
19 32.768KHz tolerance 30ppm
At least 65 dBspl under below conditions:
20 Ringer Volume 1. Ringer set as ringer.
2. Test distance set as 50 cm
21 Charge Current Fast Charge : < 430 mA
Slow Charge : < 160 mA
Antenna Bar Number Power
5-85 dBm ~
4-90 dBm ~ -86 dBm
22 Antenna Display 3 -95 dBm ~ -91 dBm
2-100 dBm ~ -96 dBm
1-105 dBm ~ -101 dBm
0~-105 dBm
Battery Bar Number Voltage
03.48 ~ 3.63 V
23 Battery Indicator 1 3.63 ~ 3.70 V
23.70 ~ 3.76 V
33.76 ~ 3.89 V
43.89 V ~
24 Low Voltage Warning 3.63 0.03V (Call) every 1 minutes
3.48 0.03V (Standby)

2. PERFORMANCE
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Item Description Specification
25 Forced shut down Voltage 3.33 0.03 V
1 Li-ion Battery
26 Battery Type Standard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 830mAh
Switching-mode charger
27 Travel Charger Input: 100 ~ 240 V, 50/60 Hz
Output: 5.2 V, 800 mA

3. TECHNICAL BRIEF
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3.1 Power Transceiver (SKY77328, U500)
The SKY77328 Power Amplifier Module (PAM) is designed in a low profile (1.2 mm), compact form
factor for quad-band cellular handsets comprising GSM850/900, DCS1800, and PCS1900 operation.
The PAM also supports Class 12 General Packet Radio Service (GPRS) multi-slot operation. The
module consists of separate GSM850/900 PA and DCS1800/PCS1900 PA blocks,
impedancematching circuitry for 50 Ω input and output impedances, and a Power Amplifier Control
(PAC) block with an internal current-sense resistor. The custom BiCMOS integrated circuit provides
the internal PAC function and interface circuitry. Fabricated onto a single Gallium Arsenide (GaAs) die,
one Heterojunction Bipolar Transistor (HBT) PA block supports the GSM850/900 bands and the other
supports the DCS1800 and PCS1900 bands. Both PA blocks share common power supply pins to
distribute current. The GaAs die, the Silicon (Si) die, and the passive components are mounted on a
multi-layer laminate substrate. The assembly is encapsulated with plastic overmold. RF input and
output ports of the SKY77328 are internally matched to a 50 Ω load to reduce the number of external
components for a quad-band design. Extremely low leakage current (2.5 µA, typical) of the dual PA
module maximizes handset standby time. The SKY77328 also contains band-select switching circuitry
to select GSM (logic 0) or DCS/PCS (logic 1) as determined from the Band Select (BS) signal. In
Figure 1 below, the BS pin selects the PA output (DCS/PCS OUT or GSM850/900 OUT) and the
Analog Power Control (VAPC) controls the level of output power. The VBATT pin connects to an
internal current-sense resistor and interfaces to an integrated power amplifier control (iPAC™)
function, which is insensitive to variations in temperature, power supply, process, and input power.
The ENABLE input allows initial turn-on of PAM circuitry to minimize battery drain. Figure 1. Functional
Block Diagram
3. TECHNICAL BRIEF
Figure1. Functional Block Diagram

3. TECHNICAL BRIEF
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SKY77328 PAM Pin Configuration-20-Pin
Leadless (Top View)
Figure 6. Typical Case Makings
Table 4. SKY77328 Pin Names and Signal Descriptions
Pin Mame Description
1BSBand Select
2VCC1A VCC (to GSM 1st stage, DCS/PCS 1st stages, BiCMOS PAC)
3DCS/PCS IN RF input 1710-1910 MHz (DCS1800, PCS1900)
4GND IN RF input 824-915 MHz (GSM850/900)
5GND RF and DC Ground
6VCC1B RF and DC Ground
7GND RF and DC Ground
8GND RF and DC Ground
9GND RF and DC Ground
10 GND RF and DC Ground
11 GSM OUT RF Output 824-915 MHz (GSM850/900)
12 GND RF and DC Ground
13 GND RF and DC Ground
14 GND RF and DC Ground
15 DCS/PCS OUT RF Output 1710-1910 MHz (DCS 1800, PCS1900)
17 VBATT Battery input to high side of intemal sense resistor
18 ENABLE BiCMOS Enable
19 RSVD(GND) RF and DC Ground
20 VAPC Power Control Bias Voltage
GMD PAD(21) GND Ground Pad, bottom

3. TECHNICAL BRIEF
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3.2 FEM for Triband
Table 3-1 Band SW Logic Table
Figure 3- 2 FEM CIRCUIT DIAGRAM
270p
C540 C541
270p
R518 0
GND11
22
23
GND12
GND13
24
GND2
4
GND3
6
7
GND4
GND5
16
17
GND6
GND7
18
19
GND8
GND9
20
PCS_RX1
14
15
PCS_RX2
3
VC_DCSPCS
9
VC_EGSM
HWXQ511
FL500
1
ANT
5
DCSPCS_TX
DCS_RX1
12
13
DCS_RX2
EGSM_RX1
10
11
EGSM_RX2
EGSM_TX
8
GND1
2
21
GND10
R516 0
ANT_SW2
ANT_SW1
Select Mode Vc(EGSM) Vc(DCS/PCS)
EGSM-Rx Low Low
EGSM-Tx High Low
DCS-Rx Low Low
PCS-Rx Low Low
DCS/PCS Low High

3. TECHNICAL BRIEF
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3.3 26 MHz Clock (VCTCXO, X500)
The 26 MHz clock(X500) consists of a TCXO(Temperature Compensated Crystal Oscillator) which
oscillates at a frequency of 26 MHz. It is used within the SKY77328, base band
processor(AD6720,U101), Midi(U203, YMU762C-QZ).
2.2u
C544
2
GND
3OUT
VCC
4
VCONT 1
26MHz
X500
C543
1000p
R521
15K
2V75_VVCXO
AFC
Figure 3-3. VCTCXO CIRCUIT DIAGRAM

3. TECHNICAL BRIEF
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3.4 Baseband Processor (AD6720 , U101)
• AD6720 is an ADI designed processor
• AD6720 consists of
1. Control Processor Subsystem including:
• 32-bit MCU ARM7TDMI® Control Processor
• 39 MHz operation at 1.8V
• 1Mb of on-chip System SRAM Memory
2.DSP Subsystem including:
• 16-bit Fixed Point DSP Processor
• 91 MIPS[1] at 1.8V
• Data and Program SRAM
• Program Instruction Cache
• Full Rate, Enhanced Full Rate and Half Rate
• Speech Encoding/Decoding
• Capable of Supporting AMR & PDC Speech Algorithms
3.Peripheral Functions
• Parallel and Serial Display Interface
• Keypad Interface
• Flash Memory Interface
• Page-Mode Flash Support
• 1.8V and 3.0V, 64 kbps SIM Interface
• Universal System Connector Interface
• Data Services Interface
• Battery Interface (e.g. Dallas)
4. Other
• Supports 13 MHz and 26 MHz Input Clocks
• 1.8V Typical Core Operating Voltages
• 289-Ball Package (12x12mm) , 0.65mm Ball pitch
5. The AD6720 baseband transmit section supports the following
• mobile station GMSK modulation power classes:
• GSM 900/850 power classes 4 and 5,
• DCS 1800 power classes 1 and 2, and
• PCS 1900 power classes 1 and 2

3. TECHNICAL BRIEF
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Figure 3-4 SYSTEM INTERCONECTION OF AD6720 EXTERNAL INTERFACE

3. TECHNICAL BRIEF
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3.4.1 Interconnection with external devices
A. RTC block interface
Countered by external X-TAL
The X-TAL oscillates 32.768KHz
The backlight of LCD module is controlled by AD6720 via AAT3157 , U404. The control signals related
to Backlight LED are given bellow.
Signals Description
MLED Current source for backlight LED
LCD_DIM_CTL Control LCD backlight level in 16 steps
MLED[1:2] This pins are returned-paths for backlight LED current source (MLED)
Table 3-3. DESCRIPTION OF LCD BACKLIGHT LED CONTROL