LG L705ix User manual
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1. INTRODUCTION .............................. 5
1.1 Purpose................................................... 5
1.2 Regulatory Information............................ 5
2. PERFORMANCE...............................7
2.1 System Overview .....................................7
2.2 Usable environment .................................8
2.3 Radio Performance ..................................9
2.4 Current Consumption.............................12
2.5 Antenna BAR .........................................12
2.6 Battery BAR ...........................................13
2.7 Sound Pressure Level............................14
2.8 Charging ................................................14
3. TECHNICAL BRIEF ........................15
3.1 General Description ...............................17
3.2 GSM Mode.............................................19
3.3 LO Phase-locked Loop ..........................20
3.4 Off-chip RF Components .......................22
3.5 ISDB-T (1 Seg Receiver) .......................28
3.6 Digital Baseband(DBB/MSM6280).........29
3.7 Block Diagram (MSM 6280)...................30
3.8 Subsystem(MSM6280) ..........................31
3.9 Power Block ...........................................38
3.10 External memory interface ...................43
3.11 H/W Sub System..................................44
3.12 Main Features ......................................57
4. TROUBLE SHOOTING ...................63
4.1 RF Component.......................................63
4.2 Checking TCXO Block ...........................65
4.3 Checking UMTS Block ...........................67
4.4 1- SEG Tuner.........................................76
4.5 Power ON ..............................................79
4.6 Charger ..................................................82
4.7 USB........................................................85
4.8 SIM Detect .............................................87
4.9 Camera ..................................................89
4.10 Keypad Backlight .................................93
4.11 FOLDER Close / Open ........................94
4.12 Main LCD .............................................95
4.13 Audio....................................................96
4.14 Headset path........................................98
4.15 Speaker phone path...........................100
4.16 Main microphone ...............................102
4.17 Headset microphone..........................104
4.18 Vibrator ..............................................106
5. DOWNLOAD .................................107
5.1 Introduction ..........................................107
5.2 Downloading Procedure.......................107
5.3 Troubleshooting download errors ........121
5.4 Caution.................................................127
6. BLOCK DIAGRAM ........................128
6.1 UMTS and 1seg RF Block diagram .....128
6.2 Interface Diagram ................................130
7. Circuit Diagram ............................133
8. BGM Pin Map................................145
9. PCB LAYOUT................................147
10. Calibration & RF Auto Test
Program (Hot Kimchi)................155
10.1 Configuration of HOT KIMCHI ...........155
10.2 How to use HOT KIMCHI...................156
11. EXPLODED VIEW &
REPLACEMENT PART LIST ..... 159
11.1 EXPLODED VIEW ............................ 159
11.2 Replacement Parts
<Mechanic component>.................... 161
<Main component> ........................... 165
11.3 Accessory ......................................... 185
Table Of Contents
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1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud
associated with your telecommunications system. System users are responsible for programming and
configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this
product is immune from the above case but will prevent unauthorized use of commoncarrier
telecommunication service of facilities accessed through or connected to it. The manufacturer will not
be responsible for any charges that resultfrom such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the phones or compatibility with the net
work, the telephone company is required to give advanced written notice to the user, allowing the user
to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the manufacturer or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.
1. INTRODUCTION
1. INTRODUCTION
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E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.
Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as
described.
1. INTRODUCTION
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2. PERFORMANCE
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2.1 System Overview
2. PERFORMANCE
Item Specification
Dimension 99.8 x 50.8 x 15.6mm
Weight 126g under(with standard battery)
Power 860mAh Li-Polymer
Talk Time Over 140 Min(WCDMA Voice, 10 dBm)
Stand-by Time Over 350 hours(WCDMA DRX 2.56s)
Antenna Intennal Antenna
LCD(Main) 2.2" QVGA(320x240 Dot), 262K TFT Color LCD
Back Light Yes
Back Light color White
Camera 2 Mega Pixel(CMOS)
Vibrator Yes
Speaker Yes
C-MIC Yes
Receiver Yes
Earphone Jack Yes/ RC-5240
SIM Socket Yes(SIM Block Type) : 3.0V & 1.8V
Volume Key Push Type(+,-)
Voice Key Push Type
I/O Connect 10 Pin(RC-5238)
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2.2 Usable environment
1) Environment
2) Environment (Accessory)
* CLA : 12~24V(DC).
2. PERFORMANCE
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Item Specification
Voltage 3.7V (Typ) ( Shut Down: 3.20)
Operation Temp -20 ~ +60°C
Storage Temp -30 ~ +85°C
Humidity 85% (Max)
Reference Spec. Min Typ. Max Unit
TA Power Available power 100 220 240 Vac
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2. PERFORMANCE
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2.3 Radio Performance
1) Transmitter-GSM Mode
No Item Specification
1Maximum Output Power Class3: +24 dBm (+1/-3dB)
Class4: +21dBm(±2dB)
2Frequency Error ±0.1ppm↓
3Open Loop Power control in uplink ±9dB↓@normal, ±12dB @extreme
Adjust output(TPC command)
cmd 1dB 2dB 3dB
+1 +0.5/1.5 +1/3 +1.5/4
4Inner Loop Power control in uplink 0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5
-1 -0.5/-1.5 -1/-3 -1.5/-4
group(10equal command group)
+1 +8/+12 +16/+24
5Minimum Output Power -50 dBm↓(3.84MHz)
Qin/Qout:DPCCH quality levels
6Out-of-synchronization handling of output power Toff@ DPCCH/Ior:-22->-28dB
Ton@ DPCCH/Ior:-24->-18dB
7Transmit OFF Power -56 dBm↓(3.84M)
8Transmit ON/OFF Time Mask
±25us
PRACH,CPCH, uplink compressed mode
±25us
9Change of TFC
power varies according to the data rate
DTX: DPCH off
(minise interference between UE)
10 Power setting in uplink compressed ±3dB↓(after14slots transmission gap)
11 Occupied Bandwidth(OBW) 5 MHz↓(99% )
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2. PERFORMANCE
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No Item Specification
-35-15*(∆f-2.5) dBc @∆f=2.5~3.5MHz, 30k
12 Spectrum emission Mask
-35-1*(∆f-3.5) dBc @∆f=3.5~7.5MHz,1M
-39 10*(∆f-7.5) dBc @∆f=7.5~8.5MHz,1M
-49 dBc @∆f=8.5~12.5MHz,1M
13 Adjacent Channel Leakage Ratio(ACLR)
33dB↑ @5MHz, ACP>-50dBm
43dB↑ @10MHz, ACP>-50dBm
-36 dBm @f=9~150KHz, 1k BW
WCDMA -36 dBm @f=150KHz~30MHz, 10k
2100, 800 -36 dBm @f=30~1000MHz, 100k
-30 dBm @f=1~12.75GHz, 1M
-41 dBm* @1893.5~1919.6MHz, 300k
14 Spurious Emission WCDMA -67 dBm* @925~935MHz, 100k
(*: additional requirement) 2100 -79 dBm* @935~960MHz, 100k
-71 dBm* @1805~1880MHz, 100k
WCDMA -60 dBm* @869~894MHz, 3.84M
800 -60 dBm* @1930~1990MHz, 3.84M
-60 dBm* @2110~2155MHz, 3.84M
15 Transmit Intermodulation
-31 dBc @5MHz,Interferer -40dBc
-41 dBc @10MHz,Interferer -40dBc
16 Error Vector Magnitude(EVM)
17.5 %↓(>-20dBm)
(@12.2k, 1DPDCH+1DPCCH)
17 Peak code domain error
-15 dB↓@SF=4, 768kbps, multi-code
transmission
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2. PERFORMANCE
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2)Receiver- WCDMA Mode
No Item Specification
1Reference Sensivitivity Level -106.7dBm↓ (3.84M)
-25 dBm↑ (3.84 MHz)
2Maximum Input Level -44dBm/3.84MHz(DPCH_Ec)
UE@+20dBm output power(class3)
3Adjacent Channel Selectivity(ACS)
33dB↑
UE@+20dBm output power(class3)
-56 dBm/3.84MHz @10MHz
4In-band Blocking UE@+20dBm output power(class3)
-44 dBm/3.84MHz @15MHz
UE@+20dBm output power(class3)
-44 dBm/3.84MHz @f=2050~2095 &
2185~2230 MHz, band a)
UE@ =20dBm output power(class3)
-30 dBm/3.84MHz @f=2025~2050 &
5Out-band Blocking 2230~2255 MHz, band a)
UE@+20dBm output power(class3)
-15 dBm/3.84MHz @f=1~2025 &
2255~12500 MHz, band a)
UE@+20dBm output power(class3)
6Spurious Response
-44dBm CW
UE@+20dBm output power(class3)
-46 dBm CW@10MHz &
7Intermodulation Characteristic -46dBm/3.84MHz @20MHz
UE@+20dBm output power(class3)
WCDMA -57 dBm @f=9KHz~1GHz, 100k BW
2100, 800 -47 dBm @f=1~12.75GHz, 1M
8Spurious Emissions WCDMA -60 dBm @f=1920~1980MHz, 3.84MHz
2100 -60 dBm @f=2110~2170MHz, 3.84MHz
WCDMA -60 dBm @f=824~849MHz, 3.84MHz
800 -60 dBm @f=869~894MHz, 3.84MHz
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2. PERFORMANCE
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2.4 Current Consumption
(Stand by and Voice Call Test Condition: LCD backlight Off)
(VT Test Condition: Speaker off, LCD backlight On)
2.5 Antenna BAR
Static Stand-by Voice Call VT
WCDMA
350 Hours (2.4mA) 150 Mins (320mA) 90 Mins (550mA)
(DRX=2.56) (Tx=10dBm) (Tx=10dBm)
Antenna Bar WCDMA
BAR 3
RSCP>= -105 dBm
and Ec/Io >= -12 dBm
BAR 2
-110 <= RSCP < -105 dBm
or -14 <= Ec/Io < -12 dBm
BAR 1
-113 <= RSCP < -110 dBm
or -17 <= Ec/Io < -14 dBm
BAR 0
RSCP < -113 dBm
or Ec/Io < -17 dBm
Network Notification
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2.6 Battery BAR
2. PERFORMANCE
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Indication Voltage
During Idle state During Call state
BAR 3 -> 2 3.75 3.70
(call maintenance over 40min)
BAR 2 -> 1 3.63 3.58
(call maintenance over 10min)
BAR 1 -> 0 3.25 3.25
(Icon Blinking)
Low battery message BAR 1 -> 0
Low battery pop-up BAR 2 -> 1, display one time
Power OFF during call - 80s after Low battery message
Power OFF at stand-by 60s after Low battery message -
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2. PERFORMANCE
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2.7 Sound Pressure Level
2.8 Charging
• Charging Method: CC & CV (Constant Current and Constant Voltage
• Maximum Charging Voltage: 4.2 V
• Normal Charging Current: 600 mA
• Normal Battery Capacity: 860 mAh
• Charging Time: Max 3 hours (except for trickle charging time)
• Full charging indication current (charging icon stop current): 140 mA
• Cut-off voltage:
Stand-by: 3.25 V
Talk: 3.25 V
low temperature (under -10deg.): 3.00V
No Test Item Specification
1Sending Loudness Rating (SLR) NOM 8±3dB
MAX
2Sending Frequency Response (SFR) MAX MASK IN
3Receiving Loudness Rating (RLR) NOM -2±3dB
MAX -10±3dB
4Receiving Frequency Response (RFR) MAX MASK IN
5Side Tone Masking Rating (STMR) NOM 17dB
MAX
6Echo Loss (EL) NOM 46dB
MAX
7Idle Noise-Sending (INS) NOM -64dBm0p
MAX
8Idle Noise-Receiving (INR) NOM Under -57dBPA
MAX Under -54dBPA
9Sending Loudness Rating (SLR) NOM 8±3dB
MAX
10 Receiving Loudness Rating (RLR) NOM -1±3dB
MAX -12±3dB
11 Side Tone Masking Rating (STMR) NOM 25dB
MAX
12 Echo Loss (EL) NOM 40dB
MAX
13 Idle Noise-Sending (INS) NOM Under -55dBm0p
MAX
14 Idle Noise-Receiving (INR) NOM Under -45dBPA
MAX Under -40dBPA
MS
Headset
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3. TECHNICAL BRIEF
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3.1 General Description
The L705iX supports UMTS-800, UMTS-2100. All receivers and the UMTS transmitter use the
radioOne1Zero-IF architecture to eliminate intermediate frequencies, directly converting signals
between RF and baseband.
A generic, high-level functional block diagram of L705iX is shown in Figure 3.1-1. One antenna
collects base station forward link signals and radiates handset reverse link signals. The antenna
connects with receive and transmit paths through a Diplexer.
The UMTS receive paths each include an LNA, an RF band-pass filter, and a downconverter
1QUALCOMM’s branded chipset that implements a Zero-IF radio architecture.
3. TECHNICAL BRIEF
Fig 3.1 Block diagram of RF part
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that translate the signal directly from RF-to-baseband using radioOne ZIF techniques. The high-band
UMTS receive path and low-band path are accommodated in the RTR6275 IC. The RFIC.s Rx analog
baseband outputs, for the receive chains, connect to the MSM IC.
For the transmit chains, the RTR6275 IC directly translates the Tx baseband signals (from theMSM
device) to an RF signal using an internal LO generated by integrated on-chip PLL and VCO. The
RTR6275 IC outputs deliver fairly high-level RF signals that are first filtered by Tx SAWs and then
amplified by their respective UMTS PAs. The high- and low-band UMTS RF transmit signals emerge
from the RTR6275 transceiver.
ISDB-T 1seg receive path include an LNA, Mixer, IF Part and OFDM demodulator which are
accommodated in ENT34606 IC.
L705iX power supply voltages are managed and regulated by the PM6650 Power Management IC.
This versatile device integrates all wireless handset power management, general housekeeping, and
user interface support functions into a single mixed signal IC. It monitors and controls the external
power source and coordinates battery recharging while maintaining the handset supply voltages using
low dropout, programmable regulators.
The device’s general housekeeping functions include an ADC and analog multiplexer circuit for
monitoring on-chip voltage sources, charging status, and current flow, as well as user-defined off-chip
variables such as temperature, RF output power, and battery ID. Various oscillator, clock, and counter
circuits support IC and higher-level handset functions. Key parameters such as under-voltage lockout
and crystal oscillator signal presence are monitored to protect against detrimental conditions.
3. TECHNICAL BRIEF
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3. TECHNICAL BRIEF
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3.2 UMTS Mode
3.2.1 Receiver
The UMTS duplexer receiver outputs are routed to LNA circuits within the RFR6275 and RTR6275
device.
UMTS LNA circuits(one for low-band UMTS and one for high-band UMTS path) are separated from all
other receive functions contained within the RFR6275 and RTR6275 receiver ICs to improve mixer LO
to RF isolation- a critical parameter in the ZIF architecture. Isolation is further improved using high-
reverse isolation circuits in the LNA designs.
The LNA gains are stepped via API control. The IC operating mode and LNA bias currents are
automatically adjusted via software to minimize DC power consumption.
WCDWCDMA_800_RA_800_RX
WCDMA_2100_RX
Figure 3.2-1 RFR6275 IC functional block diagram
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The inputs use differential configurations to improve second-order intermodulation and common-mode
rejection performance. The differential input gain stage implements MSM ICcontrolled gain adjustments
to extend receiver dynamic range.
The outputs of the differential amplifiers drive the RF port of the quadrature RF-to-baseband down-
converters. The down-converters are routed to low-pass filters (one I and one Q) whose pass-band and
stop-band characteristics supplement MSM device processing. These filter circuits allow for DC offset
correction and the differential I/Q outputs are buffered to interface with the MSM IC.
Numerous secondary functions also are integrated on-chip: the Rx LO generation and distribution
circuits and various interface, control, and status circuits. An on-chip UMTS VCO is phase locked to the
external VC-TCXO signal and processed, by the LO generation and distribution circuits, to create the
UMTS Rx LO signals for the quadrature down-converter. The LO signal, applied to its mixer, is at
frequencies different to that of the VCO, which is an important consideration for ZIF processing. The
QUALCOMM MSM device provides status and control signaling, employing power reduction features
(such as selective circuit power-down, gain control, and bias control) to extend handset standby time.
3. TECHNICAL BRIEF
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Figure 3.2-2 RTR6275 IC functional block diagram
WCDMA_800_RX
WCDWCDMA_2100_RXA_2100_RX
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3. TECHNICAL BRIEF
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3.2.2 Transmitter
The UMTS Tx path begins with differential baseband signals (I and Q) from the MSM device. These
analog input signals are amplified, filtered, and applied to the quadrature up-converter mixers. The up-
converter output is amplified by multiple variable gain stages that provide transmit AGC control. The
AGC output is filtered and applied to the driver amplifier; this output stage includes an integrated
matching inductor that simplifies the external matching network to a single series capacitor to achieve
the desired 50-Ω interface.
The RTR6275 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly
high-level signals that are filtered and applied to the PA. Transmit power is delivered from the duplexer
to the antenna through the switch module. The transceiver LO synthesizer is contained within the
RTR6275 IC with the exception of the off-chip loop filter components and the VC-TCXO. This provides
a simplified design for multimode applications. The PLL circuits include a reference divider, phase
detector, charge pump, feedback divider, and digital logic generator.
UMTS Tx. Using only PLL1, the LO generation and distribution circuits create the necessary LO signals
for nine different frequency converters. the UMTS transmitter also employs the ZIF architecture to
translate the signal directly from baseband to RF. This requires FLO to equal FRF, and the RTR6275 IC
design achieves this without allowing FVCO to equal FRF. The RTR6275 IC is able to support UMTS
2100/1900 and UMTS 800 mode transmitting. This design guideline shows only UMTS 2100/1900 and
UMTS 800 applications.
WCDWCDMA_2100_TXA_2100_TX
WCD
WCDMA_800_TA_800_TX
Fig.3.2-3 RTR6275 IC
functional block
diagram
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3.3 LO Phase-locked Loop
All LO functions are fully integrated on-chip and do not require user any adjustment. QUALCOMM has
established and implemented frequency plans and LO generation schemes that support the radioOne
Platform B-series chipset. Only one area requires handset designer attention: the loop filters relating to
each PLL. These are addressed in this chapter. All the UMTS Rx, GSM Rx, and GPS PLL circuits are
included within the RFICs: reference dividers, phase detectors, charge pumps, feedback dividers, and
digital logic. There are four integrated VCOs and PLLs within the Platform B (RFCMOS) chipset as
shown in Figure 3.3-1 and Figure 3.3-2
■ Figure 3.3-1
1. PLL1, within the RTR6275 IC, produces the LO for up- and down-conversion of GSM Tx/Rx, band
UMTS Tx.
2. PLL2, within RTR6275 IC, produces the Rx LO for one of the (high band) UMTS receive Paths..
■ Figure 3.3-2
3. PLL3, within the RFR6275 IC, produces the Rx LO for the remaining UMTS receive paths.
4. PLL4, within the RFR6275 IC, produces the Rx LO for the GPS receive path.
Within the RFICs, a buffered 19.2 MHz TCXO signal provides the synthesizer input (REF), the
frequency reference to which the PLL is phase- and frequency-locked. The reference is divided by the
R-Counters to create a fixed frequency input to the phase detector, FR. The other phase detector input
(FV) varies as the loop acquires lock, and is generated by dividing the VCO frequency using the
feedback path N-Counter. The closed loop will force FV to equal FR when locked. If the loop is not
locked, the error between FV and FR will create an error signal at the output of the charge pump. This
error signal is filtered by the loop filter components and applied to the VCO, tuning the output
frequency so that the error is decreased. Ultimately, the loop forces the error to approach zero and the
PLL is phase- and frequency-locked.
3. TECHNICAL BRIEF
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Fig.3.3-1 RTR6275 / Figure 3.3-2 RFR6275 PLL’ s functional block diagram
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3. TECHNICAL BRIEF
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3.3.1 UMTS Rx PLL (PLL2)
QUALCOMM provides a baseline PLL2 design for UMTS Rx. Loop filter component reference
designators are shown in Figure 3.3-1.
Notes: 1. The performance values listed in this table are based on simulation results and are provided
as a starting point for handset designers. Synthesizer performance is stillbeing evaluated
and optimized during this document release. Loop parameter, settling time, and filter
component values are all expected to change when the optimization effort is completed.
Future revisions will include expected performance based on measured data.
2. For L705iX, C1_2.2nF C2_150pF R1_10k
3. Loop parameter acronyms are: Kvco VCO tuning sensitivity CP_I Charge pump current
(controlled by API software) PM Phase margin L_BW Loop bandwidth
4. The listed VCO tuning sensitivity is based on QUALCOMM internal Rx VCO.
5. The listed settling times are for switching between channels at opposite ends of the active
band and settling to within 250 Hz of the final frequency.
6. Test and evaluation efforts were ongoing at the time of this document release.
Check future versions for design recommendations based on our test results.
3.3.2 Transceiver PLL (PLL1)
The PLL1 within the RTR6275 IC creates the Rx LO for all the GSM receive bands and GSM transmit
bands as well as the UMTS transmit bands. The PLL1 of RTR6275 IC (with on-chip VCO) creates the
transceiver LO that supports the quad-band GSM receivers and the GSM transmitters as well as the
tri-band UMTS transmit outputs. All LO functional blocks are integrated into the RTR6275 IC except for
some loop filter capacitors (Figure 3.3-1). On- chip circuits include reference divider, phase detector,
charge pump, VCO, feedback divider, and digital logic status.
The off-chip loop filter capacitors allow minimal optimization of PLL performance characteristics
(stability, transitory response, settling time, and phase noise) for different applications.
Table 3.3-1 Baseline PLL2 design for UMTS Rx
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