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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Table Of Contents
1. INTRODUCTION .........................................................5
1.1 Purpose....................................................................................5
1.2 Regulatory Information .....................................................5
1.3 Abbreviation..........................................................................7
2. PERFORMANC ............................................................9
2.1 H/W Features .........................................................................9
2.2 Technical Specification.....................................................11
3. TECHNICAL BRIEF.....................................................16
3.1 Functional Block Diagram...............................................16
3.2 Digital Main Processor (PMB8810, U101/U401)......17
3.3 Power Management..........................................................22
3.4 FEM with integrated Power Amplifier Module
(SKY77547, U301, U302) ..................................................34
3.5 Crystal(26 MHz, X100, X400) ..........................................36
3.6 RF Subsystem of PMB8810 (U101, U401) ..................37
3.7 MEMORY................................................................................42
3.8 Bluetooth module..............................................................48
3.9 Dual SIM Card Interface ...................................................50
3.10 LCD Interface.....................................................................51
3.11 Battery Charger Interface .............................................54
3.12 Keypad Interface..............................................................55
3.13 Audio Front-End...............................................................56
3.14 Camera Interface(1.3M Fixed Focus Camera)........62
3.15 Vibrator Interface.............................................................64
4. TROUBLE SHOOTING ...............................................65
4.1 Trouble shooting test setup ...........................................65
4.2 RF Component....................................................................66
4.3 RX Trouble.............................................................................68
4.4 TX Trouble.............................................................................74
4.5 Power On Trouble ..............................................................80
4.6 Charging Trouble................................................................83
4.7 Vibrator Trouble..................................................................85
4.8 LCD Trouble..........................................................................87
4.9 Camera Trouble...................................................................91
4.10 Speaker Trouble ...............................................................98
4.11 Earphone Trouble.........................................................100
4.12 Receiver Trouble............................................................103
4.13 Microphone Trouble................................................... 106
4.14 SIM Card Interface Trouble........................................108
4.15 Micro SD Trouble...........................................................110
4.16 Bluetooth Trouble......................................................... 112
4.18 FM Radio Trouble.......................................................... 114
5. DOWNLOAD............................................................116
6. BLOCK DIAGRAM ...................................................129
7. CIRCUIT DIAGRAM .................................................131
8. BGA Pin Map...........................................................137
9. PCB LAYOUT ...........................................................143
10. STAND ALONE TEST .............................................147
10.1 Introduction ...................................................................147
10.2 Setting Method .............................................................147
10.3 Tx Test................................................................................149
10.4 Rx Test.............................................................................. 150
11. AUTO CALIBRATION.............................................151
11.1 Overview..........................................................................151
11.2 Configuration of HotKimchi......................................151
11.3 Description of Basic File .............................................152
11.4 Auto Calibration setup................................................153
11.5 Procedure ........................................................................154
11.6 AGC....................................................................................156
11.7 APC ....................................................................................156
11.8 ADC.................................................................................... 156
11.9 Target Power................................................................... 156
12. EXPLODED VIEW & REPLACEMENT
PART LIST..............................................................157
12.1 EXPLODED VIEW........................................................... 157
12.2 Replacement Parts .......................................................159
12.3 Accessory.........................................................................173
