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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Table Of Contents
1. INTRODUCTION..................................................................5
1.1 Purpose............................................................................................... 5
1.2 Regulatory Information ............................................................... 5
1.3 Abbreviations................................................................................... 7
2. PERFORMANCE...................................................................9
2.1 H/W Features.................................................................................... 9
2.2 Technical Specification...............................................................11
3. TECHNICAL BRIEF.............................................................16
3.1 Digital Main Processor................................................................16
3.2 Power Management....................................................................21
3.3 FEM with integrated Power Amplifier Module
(RF7161, U401)...............................................................................33
3.4 Crystal(26 MHz, X100).................................................................35
3.5 RF Subsystem of PMB8810 (U102).........................................36
3.6 MEMORY(PF38F5066M0Y3DE, U101)..................................41
3.7 WiFi module....................................................................................43
3.8 SIM Card Interface........................................................................45
3.9 LCD Interface..................................................................................46
3.10 Battery Charger Interface .......................................................49
3.11 Keypad Interface........................................................................50
3.12 Audio Interface ...........................................................................52
3.13 Camera Interface(2M Fixed Focus Camera).....................58
3.14 Touch Interface ...........................................................................60
3.15 Vibrator Interface .......................................................................61
4. TROUBLE SHOOTING .......................................................63
4.1 RF Component...............................................................................63
4.2 RX Trouble .......................................................................................64
4.3 TX Trouble........................................................................................68
4.4 Power On Trouble.........................................................................72
4.5 Charging Trouble..........................................................................75
4.6 Vibrator Trouble.............................................................................77
4.7 LCD Trouble.....................................................................................80
4.8 Camera Trouble.............................................................................84
4.9 Speaker / Receiver Trouble.......................................................88
4.10 Earphone Trouble ......................................................................91
4.11 Microphone Trouble.................................................................94
4.12 SIM Card Interface Trouble.....................................................96
4.13 Micro SD (uSD) Trouble............................................................98
4.14 Bluetooth Trouble................................................................... 100
4.15 FM Radio Trouble .................................................................... 103
4.16 Touch Trouble........................................................................... 106
5. DOWNLOAD................................................................... 109
6. BLOCK DIAGRAM........................................................... 122
7. CIRCUIT DIAGRAM ........................................................ 123
8. BGA PIN MAP ................................................................. 127
9. PCB LAYOUT................................................................... 129
10. ENGINEERING MODE .................................................. 131
11. STAND ALONE TEST .................................................... 132
11.1 Introduction.............................................................................. 132
11.2 Setting Method........................................................................132
11.3 Tx Test........................................................................................... 135
11.4 Rx Test.......................................................................................... 136
12. AUTO CALIBRATION.................................................... 137
12.1 Overview .................................................................................... 137
12.2 Configuration of HotKimchi ............................................... 137
12.3 Description of Basic File ....................................................... 138
12.4 Procedure................................................................................... 139
12.5 AGC............................................................................................... 142
12.6 APC ............................................................................................... 142
12.7 ADC............................................................................................... 142
12.8 Target Power ............................................................................. 142
13 EXPLODED VIEW & REPLACEMENT PART LIST .......... 143
13.1 EXPLODED VIEW...................................................................... 143
13.2 Replacement Parts.................................................................. 145
13.3 Accessory ................................................................................... 148
