LG Secret KF750 User manual

Date: May, 2008 / Issue 1.0
Service Manual Model : KF750/KF755c
Service Manual
KF750/KF755c
Internal Use Only

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1. INTRODUCTION .............................. 5
1.1 Purpose................................................... 5
1.2 Regulatory Information............................ 5
2. PERFORMANCE...............................7
2.1 System Overview .....................................7
2.2 Usable environment .................................8
2.3 Radio Performance ..................................9
2.4 Current Consumption.............................18
2.5 RSSI.......................................................18
2.6 Battery Bar .............................................18
2.7 Sound Pressure Level............................19
2.8 Charging ................................................20
3. TECHNICAL BRIEF ........................21
3.1 Digital Baseband(DBB) & Multimedia
Processor...............................................21
3.2 GAM Hardware Subsystem ...................45
3.3 Audio Part ..............................................57
3.4 GPADC(General Purpose ADC) and
AUTOADC2 ...........................................65
3.5 Charger control ......................................66
3.6 Voltage Regulation.................................72
3.7 RF Technical Description.......................73
4. TROUBLE SHOOTING ...................84
4.1 Power ON Trouble .................................84
4.2 USB Trouble ..........................................85
4.3 SIM Detect Trouble ................................86
4.4 MicroSD card Trouble ............................87
4.5 Keypad, Touch Button and
Touch Screen Trouble ...........................88
4.6 Multi EL lighting Trouble ........................93
4.7 Camera Trouble .....................................97
4.8 Main LCD Trouble................................103
4.9 Keypad Backlight Trouble ....................105
4.10 Folder ON/OFF Trouble .....................107
4.11 Audio Trouble Shooting .....................109
4.12 Charger Trouble Shooting..................128
4.13 Checking Bluetooth Block ..................131
4.14 RF Component...................................138
4.15 Procedure to check ............................139
4.16 Checking Common Power
Source Block......................................140
4.17 Checking VCXO Block .......................145
4.18 Checking Front End Module Block.....150
4.19 Checking Front End Module
Block input logic .................................151
4.20 Checking WCDMA Block ...................154
4.21 Checking GSM Block .........................169
5. DOWNLOAD .................................184
5.1 LGDP2 .................................................184
5.2 Download .............................................186
6. BLOCK DIAGRAM ........................188
7. Circuit Diagram ............................191
8. BGM Pin Map................................203
9. PCB LAYOUT................................209
10. Calibration & RF Auto Test
Program (Hot Kimchi)................219
10.1 General Description ...........................219
10.2 XCALMON Environment ....................219
10.3 Calibration Environment.....................220
10.4 Program Operation ............................221
11. Stand-alone Test ........................226
11.1 General Description ...........................226
11.2 Program Operation ............................227
11.3 Stand-alone Test................................230
12. EXPLODED VIEW &
REPLACEMENT PART LIST ......233
12.1 EXPLODED VIEW .............................233
12.2 Replacement Parts ............................235
12.3 Accessory ..........................................258
Table Of Contents
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes

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LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes

LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
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1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system.
There are may be risks of toll fraud associated with your telecommunications system. System users
are responsible for programming and configuring the equipment to prevent unauthorized use. The
manufacturer does not warrant that this product is immune from the above case but will prevent
unauthorized use of commoncarrier telecommunication service of facilities accessed through or
connected to it. The manufacturer will not be responsible for any charges that result from such
unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the phones or compatibility with the net
work, the telephone company is required to give advanced written notice to the user, allowing the user
to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the manufacturer or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.
1. INTRODUCTION
1. INTRODUCTION

LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.
Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as
described.
1. INTRODUCTION
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LGE Internal Use Only
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Only for training and service purposes
2. PERFORMANCE
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2.1 System Overview
2. PERFORMANCE
Item Specification
Shape GSM900/1800/1900 & WCDMA Slide type - Dual Mode Handset
Size 50.8X102.8X11.8 mm
Weight 116g (with standard battery)
Power 800mAh Li-Ion
Talk Time Over 170 Min (WCDMA, Tx=12 dBm, Voice)
Over 190 Min (GSM, Tx=Max, Voice)
Standby Time Over 220 hrs (WCDMA, DRX=2.56)
Over 220 hrs (GSM, Paging period=5)
Antenna Intenna type
Main LCD 2.4"(320x240), 260K TFT Color LCDs
Main LCD BL White LED Backlight
Vibrator Yes (Coin Type)
Speaker Yes
MIC Yes (SMD Type)
Receiver Yes
Earphone Jack Yes
SIM Socket Yes(SIM Block Type) : 3.0V & 1.8V
Volume Key Push Type ( + , - )
Voice Key Push Type
External Memory T - Flash Socket
I/O Connect 18 Pin

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2.2 Usable environment
1) Environment
2) Environment (Accessory)
* CLA : 12~24V(DC).
2. PERFORMANCE
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Item Specification Unit
Voltage 3.7 (Typ), 3.4 (Min), (Shut Down: 3.23) V
Operation Temp -20 ~ + 60 °C
Storage Temp -30 ~ + 85 °C
Humidity max. 85 %
Item Spec. Min Typ. Max Unit
Power Available power 100 220 240 Vac

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2. PERFORMANCE
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2.3 Radio Performance
1) Transmitter-GSM Mode
No Item GSM DCS/PCS
1Conducted MS allocated 100k~1GHz -39dBm 9k~1GHz -39dBm
Spurious Channel 1G~1710MHz -33dBm
Emission 1G~12.75GHz -33dBm 1710M~1785MHz -39dBm
1785M~12.75GHz -33dBm
Idle Mode 100k~880MHz -60dBm 100k~880MHz -60dBm
880M~915MHz -62dBm 880M~915MHz -62dBm
915M~1000Mz -60dBm 915M~1000MHz -60dBm
1G~1.71GHz -50dBm 1G~1.71GHz -50dBm
1.71G~1.785GHz -56dBm 1.71G~1.785GHz -56dBm
1.785G~12.75GHz -50dBm 1.785G~12.75GHz -50dBm
Radiated MS allocated 30M~1GHz -36dBm 30M~1GHz -36dBm
Spurious Channel 1G~1710MHz -30dBm
Emission 1G~4GHz -30dBm 1710M~1785MHz -36dBm
1785M~4GHz -30dBm
Idle Mode 30M ~ 880MHz -57dBm 30M~880MHz -57dBm
880M ~ 915MHz -59dBm 880M~915MHz -59dBm
915M~1GHz -57dBm 915M~1GHz -57dBm
1G~1.71GHz -47dBm 1G 1.71GHz -47dBm
1.71G~1.785GHz -53dBm 1.71G~1.785GHz -53dBm
1.785G~4GHz -47dBm 1.785G~4GHz -47dBm

LGE Internal Use Only
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2. PERFORMANCE
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No Item GSM DCS/PCS
2Frequency Error ± 0.1ppm ± 0.1ppm
3Phase Error ± 5(RMS) ± 5(RMS)
±20(PEAK) ± 20(PEAK)
4Frequency Error 3dB below reference sensitivity 3dB below reference sensitivity
Under Multipath and RA250 : ± 200Hz RA250: ± 250Hz
Interference Condition HT100 : ± 100Hz HT100: ± 250Hz
TU50 : ± 100Hz TU50: ± 150Hz
TU3 : ± 150Hz TU1.5: ± 200Hz
5Output RF Due to 0 ~ 100kHz +0.5dB 0 ~ 100kHz +0.5dB
Spectrum modulation 200kHz -30dB 200kHz -30dB
250kHz -33dB 250kHz -33dB
400kHz -60dB 400kHz -60dB
600 ~ 1800kHz -66dB 600 ~ 1800kHz -60dB
1800 ~ 3000kHz -69dB 1800 ~ 6000kHz -65dB
3000 ~ 6000kHz -71dB ≥ 6000kHz -73dB
≥6000kHz -77dB
Due to 400kHz -19dB 400kHz -22dB
Switching 600kHz -21dB 600kHz -24dB
transient 1200kHz -21dB 1200kHz -24dB
1800kHz -24dB 1800kHz -27dB
7Intermodulation attenuation - Frequency offset 800kHz
Intermodulation product should
be Less than 55dB below the
level of Wanted signal

No Item GSM DCS/PCS
8Transmitter Output Power Level Power Toler. Level Power Toler.
533 ±3030 ±3
631 ±3128 ±3
729 ±3226 ±3
827 ±3324 ±3
925 ±3422 ±3
10 23 ±3 5 20 ±3
11 21 ±3 6 18 ±3
12 19 ±3 7 16 ±3
13 17 ±3 8 14 ±3
14 15 ±3 9 12 ±4
15 13 ±3 10 10 ±4
16 11 ±5 11 8 ±4
17 9 ±5 12 6 ±4
18 7 ±5 13 4 ±4
19 5 ±5 14 2 ±5
15 0 ±5
9Burst timing Mask IN Mask IN
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2. PERFORMANCE
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LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
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2) Transmitter-WCDMA Mode
No Item Specification
1Maximum Output Power Class 3 : +24dBm(+1/-3dB)
Class4: +21dBm(±2dB)
2Frequency Error ± 0.1ppm
3Open Loop Power control in uplink ± 9dB@normal, ± 12dB@extreme
4Inner Loop Power control in uplink Adjust output(TPC command)
cmd 1dB 2dB 3dB
+1 +0.5/1.5 +1/3 +1.5/4.5
0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5
-1 -0.5/-1.5 -1/-3 -1.5/-4.5
Group (10 equel command group)
+1 +8/+12 +
5Minimum Output Power -50dBm(3.84MHz)
6Out-of-synchronization handling of output power Qin/Qout : PCCH quality levels
Toff@DPCCH/Ior : -22 -> -28dB
Ton@DPCCH/Ior : -24 -> -18dB
7Transmit OFF Power -56dBm(3.84MHz)
8Transmit ON/OFF Time Mask ± 25us
PRACH,CPCH,uplinlk compressed mode
9Change of TFC ± 25us
Power varies according to the data rate DTX :
DPCH off (minimize interference between UE)
10 Power setting in uplink compressed ± 3dB(after 14slots transmission gap)
11 Occupied Bandwidth(OBW) 5MHz(99%)
12 Spectrum emission Mask -35-15*(∆f-2.5)dBc@∆f=2.5~3.5MHz,30k
-35-1*(∆f-3.5)dBc@∆f=3.5~7.5MHz,1M -39-
10*(∆f-7.5)dBc@∆f=7.5~8.5MHz,1M
-49dBc@∆f=8.5~12.5MHz,1M
13 Adjacent Channel Leakage Ratio(ACLR) 33dB@5MHz, ACP>-50dBm
43dB@10MHz, ACP>-50dBm

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2. PERFORMANCE
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No Item Specification
14 Spurious Emissions (*: additional requirement) -36dBm@f=9~150KHz, 1K BW -
-36dBm@f=150KHz~30MHz, 10k
-36dBm@f=30~1000MHz, 100k
-30dBm@f=1~12.75GHz, 1M
-41dBm*@1893.5~1919.6MHz, 300k
-67dBm*@925~935MHz, 100k
-79dBm*@935~960MHz, 100k
-71dBm*@1805~1880MHz, 100k
15 Transmit Intermodulation -31dBc@5MHz, Interferer -40dBc
-41dBc@10MHz, Interferer -40dBc
16 Error Vector Magnitude (EVM) 17.5%(>-20dBm)
(@12.2K, 1DPDCH+1DPCCH)
17 Transmit OFF Power -15dB@SF=4, 768kbps,
multi-code transmission

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2. PERFORMANCE
3)Receiver-GSM Mode
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Copyright © 2008 LG Electronics. Inc. All right reserved.
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No Item GSM850/900 DCS & PCS
1Sensitivity (TCH/FS Class II) -105dBm -105dBm
2Co-Channel Rejection (TCH/FS C/Ic=7dB C/Ic=7dB
Class II, RBER, TU high/FH)
3Adjacent 200kHz C/Ia1=-12dB C/Ia1=-12dB
Channel
Rejection 400kHz C/Ia2=-44dB C/Ia2=-44dB
4Intermodulation Rejection Wanted Signal: -98dBm Wanted Signal :-96dBm 1st
1’st interferer: -44dBm 1’st interferer: -44dBm
2’st interferer: -45dBm 2’st interferer: -44dBm
5Blocking Response Wanted Signal: -101dBm Wanted Signal: -101dBm
(TCH/FS Class II, RBER) Unwanted Signal: Unwanted Signal:
Depend on freq. Depend on freq.

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2. PERFORMANCE
4) Receiver-WCDMA Mode
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
No Item Specification
1Reference Sensitivity Level -106.7dBm(3.84M)
2Maximum Input Level -25dBm(3.84MHz)
-44dBm/3.84MHz(DPCH_Ec)
UE@+20dBm output power(class3)
3Adjacent Channel Selectivity (ACS) 33dB
UE@+20dBm output power(class3)
4In-band Blocking -56dBm/3.84MHz@10MHz
UE@+20dBm output power(class3)
-44dBm/3.84MHz@15MHz
UE@+20dBm output power(class3)
5Out-band Blocking -44dBm/3.84MHz@f=2050~2095 &
2185~2230MHz, band a)
UE@+20dBm output power(class3)
-30dBm/3.84MHz@f=2025~2050 &
2230~2255MHz, band a)
UE@+20dBm output power(class3)
-15dBm/3.84MHz@f=1~2025 &
2255~12500MHz, band a)
UE@+20dBm output power(class3)
6Spurious Response -44dBm CW
UE@+20dBm output power(class3)
7Intermodulation Characteristic -46dBm CW@10MHz &
-46dBm/3.84MHz@20MHz
UE@+20dBm output power(class3)
-57dBm@f=9KHz~1GHz, 100k BW
8Spurious Emissions -47dBm@f=1~12.75GHz, 1M
-60dBm@f=1920~1980MHz, 3.84MHz
-60dBm@f=2110~2170MHz, 3.84MHz

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2. PERFORMANCE
5) Transmitter
5.1 Transmitter
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Copyright © 2008 LG Electronics. Inc. All right reserved.
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No Item Specification
1Out Power Class 2 : -6~4dBm
2Power Density Power density < 20dBm per 100kHz EIRP
3Power Control Option
2dB ≤step size ≤8dB
4TX Output Spectrum -Frequency range fmax & fmin @ below the level of -30dBm
(100khz BW) within 2.4GHz~2.4835GHz
5TX Output Spectrum -20dB Bandwidth ≤1MHz
6Tx Output Spectrum -Adjacent channel Po ≤-20dBm @ C/I = 2MHz
≤-40dBm @ C/I ≥ 3MHz
7Modulation Characteristics 140kHz ≤delta f1 avg ≤ 175kHz
delta f2max ≥ 115kHz at least 99.9% of all
deltaf2max delta f2avg/deata f1avg ≥ 0.8
8Init. Carrier Freq. Tolerance ≤±75KHz
9Carrier Frequency Drift 1 slot : ≤±25kHz
3 slot : ≤±40kHz
5 slot : ≤±40kHz
Maximum drift rate ≤20KHz/50usec
10 Out of Band Spurious Emissions Freq.Range Operating Standby
30MHz~1GHz -36dBm -57dBm
Above 1GHz~ -30dBm -47dBm
12.75GHz
1.8~1.9GHz -47dBm -47dBm
5.15~5.3GHz -47dBm -47dBm

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2. PERFORMANCE
5.2 Transmitter
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
No Item Specification
1Sensitivity single slot packets BER ≤ 0.1%@-70dBm
2Sensitivity multi slot packets BER ≤ 0.1%@-70dBm
3C/I performance BER ≤0.1%@ (Low,Mid,High Frequency)
2405MHz, 2441MHz, 2477MHz
Interference Ratio
Co-Channel interference, C/I co-channel 11dB
Adjacent(1MHz)interference, C/I 1MHz 0dB
Adjacent(2MHz)interference, C/I 2MHz -30dB
Adjacent( ≥ 3MHz)interference, C/I ≥ 3MHz -40dB
Adjacent( ≥ 3MHz)interference to in band -9dB
mirror frequency, C/I image ±1MHz -20dB
4Blocking Characteristic BER ≤0.1%@wanted signal -67dBm
interfering Signal Frequency PowerLevel
30MHz~2000MHz -10dBm
2000MHz~2400MHz -27dBm
2500MHz~3000MHz -27dBm
3000MHz~12.75GHz -10dBm
5Intermodluation Performance BER ≤0.1%@wanted signal -64dBm
static sinwave signal at f1=-39dBm
a BT modulated signal f2=-39dBm(payload PRBS15)
6Maximum Input Level BER ≤0.1%@-20dBm

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2. PERFORMANCE
2.4 Current Consumption
(VT test : Speaker off, LCD backlight On)
2.5 RSSI
2.6 Battery Bar
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Stand by Voice Call VT
WCDMA Only 220 Hours = 3.6 mA 170 Min = 280 mA 125 Min= 380 mA
(DRX=2.56) (Tx=12dBm) (Tx=12dBm)
GSM 220 Hours = 3.6 mA 190 Min = 250 mA
(paging=5period) (Tx=Max)
No WCDMA GSM
1BAR 7 →5-93 (+/- 2dB) -90 (+/- 2dB)
2BAR 5 →4 -98 (+/- 2dB) -104 (+/- 2dB)
3BAR 4 → 2 -101 (+/- 2dB) -108 (+/- 2dB)
4BAR 2 →1 -104 (+/- 2dB) -110 (+/- 2dB)
5BAR 1 →0 -106 (+/- 2dB) -112 (+/- 2dB)
Indication Standby
Bar 3 →23.69 ± 0.05V
Bar 2 →13.53 ± 0.05V
Bar 1 →Icon Blinking 3.40 ± 0.05V
Low voltage, warning message 3.40 ± 0.05V
Power OFF 3.26 ± 0.05V

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2. PERFORMANCE
2.7 Sound Pressure Level
LGE Internal Use Only
Copyright © 2008 LG Electronics. Inc. All right reserved.
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No Test Item Specification
1Sending Loudness Rating (SLR) NOM 8 ± 3 dB
MAX
2Receiving Loudness Rating (RLR) NOM -1 ± 3dB
MAX -15 ± 3dB
3Side Tone Masking Rating (STMR) NOM 17dB over
MAX
4Echo Loss (EL) NOM 40dB over
MAX
5Sending Distortion (SD) refer to TABLE 30.3
6Receiving Distortion (RD) refer to TABLE 30.4
7Idle Noise-Sending (INS) NOM -64dBm0p under
MAX
8Idle Noise-Receiving (INR) NOM -47dBPA under
MAX -36dBPA under
9Sending Loudness Rating (SLR) NOM 8 ± 3dB
MAX
10 Receiving Loudness Rating (RLR) NOM -1 ± 3dB
MAX -12 ± 3dB
11 Side Tone Masking Rating (STMR) NOM 25dB over
MAX
12 Echo Loss (EL) NOM 40dB over
MAX
13 Sending Distortion (SD) refer to TABLE 30.3
14 Receiving Distortion (RD) refer to TABLE 30.4
15 Idle Noise-Sending (INS) NOM -55dBm0p under
MAX
16 Idle Noise-Receiving (INR) NOM -45dBPA under
MAX -40dBPA under
MS
HEAD SET

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2. PERFORMANCE
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2.8 Charging
• Normal mode: Complete Voltage: 4.2V
Charging Current: 500mA
• Await mode: In case of During a Call, should be kept 3.9V
(GSM: It should be kept 3.9V in all power level
WCDMA: It will not be kept 3.9V in some power level)
• Extend await mode: At Charging prohibited temperature(0°C under or 45°C over)
(GSM: It should be kept 3.7V in all power level
WCDMA: It will not be kept 3.7V in some power level)
No Test Item Specification
TDMA NOISE GSM SEND
GSM: Power Level: 5 REV.
DCS: Power Level: 0 DCS SEND
17 (Cell Power: -90 ~ -105dBm) REV.
Acoustic(Max Vol.) GSM SEND
MS/HEADSET SLR: 8 ± 3dB REV.
MS/HEADSET RLR: -13 ± 1dB/-15dB DCS SEND
(SLR/RLR: mid-Value Setting) REV.
MS
Headset
-62dBm
under

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3. TECHNICAL BRIEF
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3.1 Digital Baseband(DBB) & Multimedia Processor
3.1.1 General Description
• Access subsystem
- Access Central Processing Unit (CPU) subsystem - ARM926, Joint Test Action Group (JTAG),
Embedded Trace Module (ETM), Instruction and Data (I&D)-cache, and I&D-TCM
- Access peripheral subsystems - Subscriber Identity Module (SIM) interface, IrDA®, Universal
Serial Bus (USB), Universal Asynchronous Receiver/Transmitter (UART), and so on
- Digital Signal Processor (DSP) subsystem - CEVA-X1620, JTAG, Static Random Access Memory
(SRAM), and Program Data Read Only Memory (PDROM)
- EDGE/GSM/GPRS (EGG) subsystem - EGG hardware accelerators
- WCDMA subsystem - WCDMA hardware accelerators
• Application subsystem
- Application CPU subsystem - containing ARM926, JTAG, ETM, I&D-cache, and I&D-TCM
- Application peripheral subsystems - I2C¢‚, keypad, UART, and so on
- Graphics subsystem - XGAM subsystem
- Audio Processing Execution (APEX) and video encoder subsystems In addition to the two
subsystems above, there is also a test block, chip control block, and a pad multiplexing block
residing at the top level
• DSP
- The Digital Signal Processor Subsystem (DSPSUB) includes a DSP megacell, which contains the
DSP CPU together with a tightly coupled memory. The DSP is the Ceva-X 1620 core with a 64 kB
instruction RAM and a 64 kB data RAM. It also contains debug logic and interfaces. In addition to
the megacell, the DSPSUB includes external memories, peripheral units, and interfaces. The DSP
megacell is clocked at 208 MHz.
- The DSPSUB includes an AHB master and an AHB slave interface. The AHB master provides a
direct access to the Internal Random Access Memory (IRAM) in the EGG core through the AHB.
The AHB slave interface allows the CPU and the DMA to access in the program and data RAM
residing in the DSPSUB.
3. TECHNICAL BRIEF
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