LG RZ-37LZ55 User manual

LCD TV
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : ML-051B
MODEL : RZ/RT-37LZ55
website:http://biz.LGservice.com
e-mail:http://www.LGEservice.com/techsup.html

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CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ..................................................................................3
SPECIFICATION........................................................................................6
ADJUSTMENT INSTRUCTION................................................................11
TROUBLE SHOOTING............................................................................15
BLOCK DIAGRAM...................................................................................18
WIRING DIAGRAM..................................................................................19
EXPLODED VIEW .................................................................................. 20
REPLACEMENT PARTS LIST ............................................................... 23
SVC. SHEET ...............................................................................................

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SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Replacement Parts List.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock.
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc.
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩand 5.2MΩ.
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure)
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
IMPORTANT SAFETY NOTICE
0.15uF

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CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 F to 600 F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 F to 600 F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 F to 600 F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS

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IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

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SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement .
1.General Specification(TV)
No Item Specification Remark
1. Video input applicable system PAL-D/K, B/G, I, NTSC-M, SECAM
NTSC 4.43
2. Receivable Broadcasting System 1) PAL/SECAM BG (ZE/TE)
2) PAL/SECAM DK EU/Non-EU
3) PAL I/I (PAL Market)
4) SECAM L/L' 4) Only RZ
5) PAL-N/M 6),7) South America Market
6) NTSC M
7) Except South America NTSC Market (RM)
3. RF Input Channel VHF : E2 ~ E12 PAL
UHF : E21 ~ E69
CATV : S1 ~ S20
HYPER : S21~ S47
L' : B, C, D FRANCE
VHF : 2~13 NTSC
UHF : 14~69
CATV : 1~125
VHF Low : 1 ~ M10 JAPAN
VHF High : 4~S22
UHF : S23~62
4. Input Voltage AC 100 ~ 240 V/50Hz, 60Hz
5. Market Worldwide
6. Picture Size 940.3mm 37.02 inch
7. Tuning System FVS 100 program PAL, 200 PR.(Option)
FS NTSC
8. Operating Environment 1) Temp : 0 ~ 40 deg
2) Humidity : 10~90 %
9. Storage Environment 3) Temp : -20 ~ 50 deg
4) Humidity : 10~90 %
10. Display LCD Module LPL

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2. General Specification
No Item Specification Unit Remark
1 Panel 37" TFT WXGA LCD
2 Frequency range H : 31 ~ 61Khz PC Input
V : 56 ~ 75Hz
3 Control Function 1) Contrast/Brightness
2) H-Position / V-Position
3) Tracking : Clock / Phase
4) Auto Configure
5) Reset
4 Component Jack 1 : Y Middle east
3 : Pb / NTSC Area
5 : Pr
7 : Line1 Ready
9 : LINE2
11: LINE3
13: Line3 Ready
D4 Jack 2 : Y GND JAPAN Only
(525i,525p,750p,1125i) 4 : Pb GND
6 : Pr GND
8 : LINE1
10:Line2 Ready
12:SWITCH GND
14: SWITCH
5 H/V-Sync Video Power consumption LED
Power ON ON/ON Active
≤ max 180W W Green
Stand by OFF/ON OFF
≤ 3.0W W Red
DPMS Mode ON/OFF OFF
≤ typ. 30W W Green
Power off - - - W *
6 LCD Module Type Size LPL 877.0 x 516.8 x 55.5 mm (H) x (V) x (D)
Pixel Pitch LPL 0.200 x 0.600 x RGB
Pixel Format 1366 horiz. By 768 vert. Pixels
RGB strip arrangement
Coating Hard coating(3H), Anti-glare
treatment of the front polarizer,
Back Light LPL 16CCFL

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3.Optical Feature(LCD Module)
Item RemarkSpecification
Viewing Angle<CR 10>
Luminance
Contrast Ratio
CIE Color Coordinates
Typical
MAX/MIN
ALL white/All back
LPL
R/L, U/D
Luminance(cd/ )
Variation
CR
CRD(With Al)
Typ
176, 176
500
600
1200
0.285
0.293
0.640
0.341
0.287
0.610
0.146
0.069
WHITE
RED
GREEN
BLUE
Wx
Wy
R
Ry
Gx
Gy
Bx
By
Typ.
Typ.
Typ.
Typ.
Typ.
Typ.
Typ.
Typ.
No.
1
2
3
4
4.Component Video Input (Y, PB, PR)
No Specification Proposed
Resolution H-freq(kHz) V-freq(Hz)
1. 640x480 15.73 60 SDTV, DVD 480i
2. 640x480 15.63 59.94 SDTV, DVD 480i
3. 704x480 31.47 59.94 EDTV 480p
4. 720x576 15.625 50.00 SDTV, DVD 625 Line
5. 720x576 31.25 50.00 HDTV 576p
6. 1280x720 45.00 60.00 HDTV 720p
7. 1280x720 44.96 59.94 HDTV 720p
8. 1920x1080 31.25 50.00
HDTV 1080i 50Hz (AU Ver.)
9. 1920x1080 33.75 60.00
HDTV 1080i 60Hz (ATSC)
10. 1920x1080 33.72 59.94 HDTV 1080i 59.94Hz
5. PC INPUT Mode Table
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
Analog RGB, Digital RGB
1 720x400 31.468 70.8 28.321
2 640x480 31.469 59.94 25.17 VESA
37.684 75.00 31.5 VESA
3 800x600 37.879 60.31 40.00 VESA
46.875 75 49.5 VESA
4 832x624 49.725 74.55 57.283
5 1024x768 48.363 60.00 65.00 VESA(XGA)
56.47 70.00 75.00 VESA(XGA)
60.123 75.029 78.75 VESA(XGA)
6 1280x768 47.776 59.870 79.50 VESA(WXGA)
7 1360x768 47.720 59.799 84.75 VESA(WXGA)
8 1366x768 47.720 59.799 84.75 Supported
Min
400
800
Typ.
-0.03
Max
1.3
Typ.
+0.03

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8. HDMI INPUT Mode Table
9. Mechanical specification
<Table 1> Scart Arrangement 1.(Full Scart)
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed
Analog RGB, Digital RGB
1 720x400 31.468 70.8 28.321
2 640x480 31.469 59.94 25.17 VESA
37.684 75.00 31.5 VESA
3 800x600 37.879 60.31 40.00 VESA
46.875 75 49.5 VESA
4 832x624 49.725 74.55 57.283
5 1024x768 48.363 60.00 65.00 VESA(XGA)
56.47 70.00 75.00 VESA(XGA)
60.123 75.029 78.75 VESA(XGA)
6 1280x768 47.776 59.870 79.50 VESA(WXGA)
7 1360x768 47.720 59.799 84.75 VESA(WXGA)
8 1366x768 47.720 59.799 84.75 Supported
9 1920x1080 33.75 60.00 86.375 HDCP DVI Digital 1080i
10 1280x720 45.00 60.00 74.375 HDCP DVI Digital 720p
Pin Signal Signal Level Impedance
1 Audio Output B (right) 0.5 Vrms < 1
2 Audio Input B (right) 0.5 Vrms > 10
3 Audio Output A (left) 0.5 Vrms < 1
4 Ground (audio) - -
5 Ground (blue) - -
6 Audio input A (left) 0.5 Vrms > 10
7 Blue input 0.7 V 75
8 Function Select (AV control) High (9.5 - 12V) - AV Mode
Mid (5 - 8V) - Wide Screen > 10
Low (0 - 2V) - TV Mode
9 Ground (Green) - -
10 Comms Data 2
11 Green input 0.7 V 75
12 Comms Data 1
13 Ground (Red) - -
14 Ground (Blanking) - -
15 Red input 0.7 V 75
16 RGB Switching Control High (1 - 3V) - RGB
Low (0 - 0.4V) - Composite 75
17 Ground (Video input & Output) - -
18 Ground (RGB Switching Control) - -
19 Video output (Composite) 1V including sync 75
20 Video input (Composite) 1V including sync 75
21 Common ground (Shield) - -

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<Table 2> Scart Arrangement 2.(Half Scart)
Pin Signal Signal Level Impedance
1 Audio Output B (right) 0.5 Vrms < 1
2 Audio Input B (right) 0.5 Vrms > 10
3 Audio Output A (left) 0.5 Vrms < 1
4 Ground (audio) - -
5 Ground (blue) - -
6 Audio input A (left) 0.5 Vrms > 10
7- - -
8 Function Select (AV control) High (9.5 - 12V) - AV Mode
Mid (5 - 8V) - Wide Screen > 10
Low (0 - 2V) - TV Mode
9 Ground (Green) - -
10 Comms Data 2
11 - - -
12 Comms Data 1
13 Ground (Red) - -
14 Ground (Blanking) - -
15 Red input
16 - - -
17 Ground (Video input & Output) - -
18 - - -
19 Video output (Composite) 1V including sync 75
20 Video input (Composite) 1V including sync 75
21 Common ground (Shield) - -
No, Item Content Remark
1 Product Dimenson Width(W) Length(D) Height(H)
Before Packing 1061 675 269 With Stand
After Packing 1160 800 348
2 Product Weight Only SET 28.9Kg With Stand
With Box 33.8kg

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ADJUSTMENT INSTRUCTION
1. Application Range
This spec. sheet is applied to all of the ML-051B chassis
(TORNADO) manufactured at LG TV Plant
2. Specification.
2.1 Because this is not a hot chassis, it is not necessary to
use an isolation transformer. However, the use of
isolation transformer will help to protect test
instruments.
2.2 Adjustment must be done in the correct sequence.
2.3 The adjustment must be performed at 25±5°C
temperature and 65±10% relative humidity if there is
no specified designation.
2.4 The input voltage of the receiver must be kept between
100~220V, 50/60Hz.
2.5 Before adjustment, execute Heat-Run for 30 minutes
at RF no signal.
3. EDID
* Caution
- Use the proper signal cable for EDID Download
Analog EDID: Pin3 exists
Caution: - Never connect HDMI & DVI-D & DVI-A Cable
at the same time.
- Use the proper cables below for EDID Writing
3.1 Data
3.1.1 ANALOG(128Bytes)
3.2.2 DIGITAL(128Bytes)
3.2.3 EDID FOR HDMI(256Bytes)
=> Detail EDID Options are below(a, b, c, d, e)
a. Product ID
b. Serial No : Controlled on production line
c. Month, Year : Controlled on production line
d. Model Name(Hex) :
e. Checksum: ChangeSable by total EDID data
00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F
00 00 FF FF FF FF FF FF 00 1E 6D
10 01 03 80 46 27 78 EA D9 B0 A3 57 49 9C 25
20 11 49 4B A5 6E 80 31 40 01 01 01 01 45 40 01 01
30 61 40 01 01 01 01 1B 21 50 A0 51 00 1E 30 48 88
40 35 00 BC 88 21 00 00 1C 4E 1F 00 80 51 00 1E 30
50 40 80 37 00 BC 88 21 00 00 18 00 00 00 FC 00 52
60 0A 20 20 20 00 00 00 FD
70 00 38 4B 1F 3D 09 00 0A 20 20 20 20 20 20 01
00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F
00 02 03 21 D1 46 85 04 02 01 03 00 23 09 07 07 23
10 09 07 07 23 09 07 07 83 01 00 00 65 03 0C 00 10
20 00 01 1D 00 80 51 D0 1C 20 40 80 35 00 BC 88 21
30 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10 3E 96 00 13
40 8E 21 00 00 18 2A 12 00 10 41 43 17 20 28 60 35
50 00 00 00 32 00 00 1C 01 1D 80 18 71 1C 16 20 58
60 2C 25 00 C4 8E 21 00 00 00 9E 00 00 00 00 00 00
70 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 DB
00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F
00 00 FF FF FF FF FF FF 00 1E 6D
10 01 03 01 46 27 78 EA D9 B0 A3 57 49 9C 25
20 11 49 4B A5 6E 80 31 40 01 01 01 01 45 40 01 01
30 61 40 01 01 01 01 1B 21 50 A0 51 00 1E 30 48 88
40 35 00 BC 88 21 00 00 1C 4E 1F 00 80 51 00 1E 30
50 40 80 37 00 BC 88 21 00 00 18 00 00 00 FD 00 38
60 4B 1F 3D 09 00 0A 20 20 20 20 20 20 00 00 00 FC
70 0A 20 20 20 00
No Item Content Hexadecimal
1 Manufacturer ID GSM 1E6D
2 Version Digital 1 01
3 Revision Digital 3 03
a
e
e
c
c
d
d
b
a b
Model name Product ID Product ID
Dec Hex
EDID Table
RZ-37LZ55 30045(A) 30045(A) 755D 5D75
30046(A) 30046(D) 755E 5E75
RT-37LZ55 30051(A) 30051(A) 7563 6375
30052(D) 30052(D) 7564 6475
RM-37LZ55 30053(A) 30053(A) 7565 6575
30054D) 30054(D) 7566 6675
Model Name Model Name(HEX)
RZ-37LZ55 525A2D33374C5A3535
RT-37LZ55 52542D33374C5A3535
RM-37LZ55 524D2D33374C5A3535

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4. ADC Calibration
4.1 Adjustment of RF/AV/SAV
* Test Equipment
- Remote controller for adjustment
- MSPG-925F Pattern Generator->Model: 202 / Pattern: 32
4.1.1 Method of Auto RF/AV/S-VIDEO Color Balance.
1) Input the Video Signal: 75% Color Bar signal into AV3
(RZ), AV1(RT), VIDEO1(RM)
2) Set the PSM to Standard mode in the Picture menu.
3) Press ADJ key on R/C for adjustment.
4) Press the (Vol. +) key to operate the set, then it
becomes automatically.
5) Auto-RGB OK means the adjustment is completed.
4.2 Adjustment of Component.
* Required Equipments
- Remote controller for adjustment
- MSPG-925F Pattern Generator->Model: 215 / Pattern: 33
4.2.1Method of Auto Component Color Balance
1) Input the Component 720p 100% Color Bar(MSPG-
925F model:215, pattern:33) signal into Component.
(RZ : component , RT/RM : component 1 or 2)
2) Set the PSM to Standard mode in the Picture menu.
3) Press the ADJ key on R/C for adjustment.
4) Press the (Vol. +) key to operate the set , then it
becomes automatically.
5) Auto-RGB OK means the adjustment is completed.
4.3 Adjustment of RGB
* Required Equipments
- Remote controller for adjustment
- MSPG-925F Pattern Generator
4.3.1Method of Auto RGB Color Balance
1) Input the PC 1024x768@75Hz 1/2 Black & White
Pattern(MSPG-925F model:39, pattern:18) into RGB.
(using D-sub to DVI-I cable)
2) Set the PSM to Standard mode in Picture menu.
3) Press the ADJ key on R/C for adjustment.
4) Press the (Vol. +) key operate To set , then it
becomes automatically.
5) Auto-RGB OK means adjustment is completed.
=> Before White-Balance, the AV ADC should be
done.
(RZ : AV, RT : AV1, RM : VIDEO1)
Notice : Before White-Balance, change input mode
- Move to AV3(RZ) or AV(RT) or VIDEO(RM) by using
Remote controller.
5. white Balance
5.1 Manual white Balance (AV)
1) Execute CA-110 Zero Calibration.
2) Execute the SET Heat Run for 30minutes
3) Push the ADJ Button then you can see the OSD
4) Push the ADJ Button again for White Balance mode
5) Adjust High light with R/B Gain/Offset(G Gain fix, G
Offset fix)
5.2 Auto White Balance(AV)
Command1 Command2 Set ID Data Default Value
Min Max 26 32 37 42
Input Select XB B 00 00h 90h
R-Gain J A 00 00h E0h CE D6 B8 D0
G-Gain J B 00 00h E0h BD BD B1 BD
B-Gain J C 00 00h E0h B1 C5 BA B4
R-Offset J D 00 00h 90h 81 81 80 80
G-Offset J E 00 00h 90h 80 80 80 80
B-Offset J F 00 00h 90h 7F 7F 7F 7E

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6. Shipping Conditions
No Item Condition Remark
1 Power Off
2 Volume Level 30
3 Main Picture Input TV
4 Main Last Channel Pr 01
5 Mute Off
6 ARC 16 : 9
7 Station Auto Program
Manual Program
Program Edit
Favorite Program None
8 Picture PSM Dynamic
Dynamic Contrast 100
Brightness 45
Colour 50
Sharpness 50
CSM Normal(Cool) RZ(RT)
XD On
ACM Fleshtone : 1
Greentone : 1
Bluetone : 1
9 Sound SSM Flat
SRS WOW Off
AVL Off
Balance 0
Treble 50
Bass 50
TV Speaker On
10 Time Clock -- : -- User control
Off time Off
On time Off
Auto sleep Off
11 Special Input TV
Language English
Area Management
Child Lock Off
Set ID 1
XD Demo To Start
12 Screen Auto config
Manual config
XGA Mode
ARC
Zoom +/- Variable by each mode
Position
Cinema
NR
Reset

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SVC REMOCON
1 POWER
2 POWER ON
3 MUTE
4 P-CHECK
5 S-CHECK
6 ARC
7 CAPTION
8 TXT
9 TV/AV
10 TURBO SOUND
11 TURBO PICTURE
12 IN-START
13 ADJ
14 MPX
15 EXIT
16 APC(PSM)
17 ASC(SSM)
18 MULTIMIDIA
19 FRONT-AV
20 CH
21 VOL
22 ENTER
23 PIP CH-(OP1)
24 PIP CH+(OP2)
25 PIP SWAP(OP3)
26 PIP INPUT(OP4)
27 EYE
28 MENU
29 IN-STOP
30 STILL
31 TIME
32 SIZE
33 MULTI PIP
34 POSITION
35 MODE
36 PIP
37 TILT
38 0~9
To turn the TV on or off
To turn the TV on automatically if the power is supplied to the TV. (Use the
POWER key to deactivate): It should be deactivated when delivered.
To activate the mute function.
To check TV screen image easily.
To check TV screen sound easily
To select size of the main screen (Normal, Spectacle, Wide or Zoom)
Switch to closed caption broadcasting
To toggle on/off the teletext mode
To select an external input for the TV screen
To start turbo sound
To start turbo picture
To enter adjustment mode when manufacturing the TV sets.
To adjust the screen voltage (automatic):
In-start mute Adjust AV(Enter into W/B adjustment mode)
W/B adjustment (automatic):
After adjusting the screen W/B adjustment Exit two times (Adjustment completed)
To enter into the adjustment mode. To adjust horizontal line and sub-brightness.
To select the multiple sound mode (Mono, Stereo or Foreign language)
To release the adjustment mode
To easily adjust the screen according to surrounding brightness
To easily adjust sound according to the program type
To check component input
To check the front AV
To move channel up/down or to select a function displayed on the screen.
To adjust the volume or accurately control a specific function.
To set a specific function or complete setting.
To move the channel down in the PIP screen.
To use as a red key in the teletext mode
To move the channel in the PIP screen
To use as a green key in the teletext mode
To switch between the main and sub screens
To use as a yellow key in the teletext mode
To select the input status in the PIP screen
To use as a blue key in the teletext mode
To set a function that will automatically adjust screen status to match
the surrounding brightness so natural color can be displayed.
To select the functions such as video, voice, function or channel.
To set the delivery condition status after manufacturing the TV set.
To halt the main screen in the normal mode, or the sub screen at the PIP screen.
Used as a hold key in the teletext mode (Page updating is stopped.)
Displays the teletext time in the normal mode
Enables to select the sub code in the teletext mode
Used as the size key in the PIP screen in the normal mode
Used as the size key in the teletext mode
Used as the index key in the teletext mode (Top index will be
displayed if it is the top text.)
To select the position of the PIP screen in the normal mode
Used as the update key in the teletext mode (Text will be
displayed if the current page is updated.)
Used as Mode in the teletext mode
To select the simultaneous screen
To adjust screen tilt
To manually select the channel.
Shortcut keys
Shortcut keys
Shortcut keys
Use the AV
key to enter
the screen
W/B
adjustment
mode.
Shortcut keys
Shortcut keys
Shortcut keys

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TROUBLESHOOTING
NO POWER
(POWER INDICATOR OFF)
REPLACE POWER BOARD
CHECK POWER BOARD
CHECK CN804
VOLTAGE (P-ST_5V) No
CHECK CRYSTAL X800
CHECK CRYCTAL
X800(19.6608MHZ) No
Yes
CHECK IC806
CHECK IC806 VOLTAGE (5V) No
Yes
CHECK Q1001
CHECK Power on/off
(5V) No
Yes
Yes

- 16 -
NO VIDEO
REPLACE LCD MODULE
CHECK THE PERIPHERAL
IC800
CHECK LVDS Output
P3(PIN 21, PIN 22) No
CHECK THE PERIPHERAL
IC1
DOWN LOAD ISP DATA
or REPLACE MAIN BOARD
Check L2
(12V) No
Yes
CHECK L1022
(24V) CHECK R898 (3.3V)
No
Yes
Yes Yes No

- 17 -
NO SOUND
REPLACE JACK BOARD
INSERT CABLES WELL
IS THE SPK CABLE
CONNECTED WELL? No
CHECK IC302 OR CHANGE
DOES IC302 OPERATE? No
Yes
CHECK IC301 OR CHANGE
DOES IC301 OPERATE? No
Yes
CHECK X300 OR CHANGE
DOES IC300 OPERATE?
DOES IC400 OPERATE?
No
Yes
Yes
Yes
CHECK X400 OR CHANGE
No

BLOCK DIAGRAM
- 18 -

- 19 -
6631T11020Z-30P
6631T20039B-15P
6631T25026C-4P
6631T20034S-4P
6631T20029S-5P
6631T25024M-3P
6631T20032G-12P
WIRING DIAGRAM

- 20 -
EXPLODED VIEW
010 020
101
100
060
090
060
080
070
110 120
130
140
150
050
040
030