
TIWI TRANSCEIVER MODULES
USER’S GUIDE
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LSEVK-WP-01-A2-UG Copyright © 2010 LS Research, LLC Page 2 of 35
Table of Contents
1Introduction .....................................................................................................................3
1.1Purpose & Scope.......................................................................................................................3
1.2Audience....................................................................................................................................3
1.3Applicable Documents...............................................................................................................3
1.4Revision History.........................................................................................................................3
2Quick Start.......................................................................................................................4
2.1Software.....................................................................................................................................4
2.2Hardware...................................................................................................................................8
2.3WLAN Test Software Operation..............................................................................................12
2.4Evaluation Board Schematics and Bill of Material...................................................................30
3EMC Compliance Application Guide...........................................................................31
3.1Introduction..............................................................................................................................31
3.2Module Integration Considerations – Antenna Systems.........................................................31
3.3Module Integration Considerations – Circuit Implementation..................................................31
3.4Module Integration Considerations - Top Assembly Considerations. .....................................32
3.5Module Integration Considerations – Firmware.......................................................................32
3.6Testing Requirements for End-Product...................................................................................32
3.7Marking Requirements for End-Product..................................................................................32
4Contacting LS Research...............................................................................................35