LumenRadio CRMX 200-1901 Instruction Manual

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CONFIDENTIALITY NOTE
CONFIDENTIALITY NOTECONFIDENTIALITY NOTE
CONFIDENTIALITY NOTE
dŚŝƐĚŽĐƵŵĞŶƚŵĂLJŶŽƚďĞƌĞĚŝƐƚƌŝďƵƚĞĚǁŝƚŚŽƵƚƉƌŝŽƌǁƌŝƚƚĞŶƉĞƌŵŝƐƐŝŽŶĨƌŽŵ>ƵŵĞŶZĂĚŝŽ 
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KZŵŽĚƵůĞĚĞƐŝŐŶŐƵŝĚĞůŝŶĞƐ
ĂƌƚηϮϬϬͲϭϵϬϭ
Revision: PA6 – Jan 28, 2015

- 2 (18) -
Table of Contents
Table of ContentsTable of Contents
Table of Contents
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1 11
1 
ABSOLUTE MAXIMUM RATINGS
ABSOLUTE MAXIMUM RATINGSABSOLUTE MAXIMUM RATINGS
ABSOLUTE MAXIMUM RATINGS
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3 33
3 
Reco
RecoReco
Recommended operating conditions
mmended operating conditionsmmended operating conditions
mmended operating conditions
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3 33
3 
Electrical characteristics
Electrical characteristicsElectrical characteristics
Electrical characteristics................................
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3 33
3 
General characteristics
General characteristicsGeneral characteristics
General characteristics
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4 44
4 
RF characteristics
RF characteristicsRF characteristics
RF characteristics
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4 44
4 
ADC characteristics
ADC characteristicsADC characteristics
ADC characteristics
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4 44
4 
Control input AC characteristics
Control input AC characteristicsControl input AC characteristics
Control input AC characteristics................................
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5 55
5 
DC characteristics
DC characteristicsDC characteristics
DC characteristics
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5 55
5 
USB interface DC characteristics
USB interface DC characteristicsUSB interface DC characteristics
USB interface DC characteristics
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5 55
5 
Pin assignments and functions
Pin assignments and functionsPin assignments and functions
Pin assignments and functions
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6 66
6 
Application information
Application informationApplication information
Application information
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7 77
7 
Core module current ramps in TX (transmit) high power mode .............................................................................................................................................. 7 
Internal or External Antenna?.............................................................................................................................................................................................................10 
Internal Antenna..............................................................................................................................................................................................................................10 
Layout considerations for the main (Customer) board..............................................................................................................................................................10 
Layout Example.......................................................................................................................................................................................................................................11 
Internal antenna radiation pattern...................................................................................................................................................................................................12 
Mechanic
MechanicMechanic
Mechanical dimensions
al dimensionsal dimensions
al dimensions
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13 1313
13 
CORE reflow soldering specification
CORE reflow soldering specificationCORE reflow soldering specification
CORE reflow soldering specification
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14 1414
14 
Compliance information
Compliance informationCompliance information
Compliance information
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15 1515
15 
FCC information ......................................................................................................................................................................................................................................15 
FCC Information to User................................................................................................................................................................................................................15 
FCC Guidelines for Human Exposure........................................................................................................................................................................................15 
FCC Declaration of Conformity ...................................................................................................................................................................................................15 
FCC Radio Frequency Interference Warnings & Instructions............................................................................................................................................15 
CE..................................................................................................................................................................................................................................................................15 
Compliance Marking..............................................................................................................................................................................................................................15 
FCC & Industry Canada ..................................................................................................................................................................................................................15 
Other Compliances .........................................................................................................................................................................................................................16 
Revision history
Revision historyRevision history
Revision history
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... 17 1717
17 

- 3 (18) -
ABSOLUTE MAXIMUM RATINGS
ABSOLUTE MAXIMUM RATINGSABSOLUTE MAXIMUM RATINGS
ABSOLUTE MAXIMUM RATINGS
Parameter
ParameterParameter
Parameter
Symbol SymbolSymbol
Symbol
Minimum MinimumMinimum
Minimum
Maximum MaximumMaximum
Maximum
Units UnitsUnits
Units
Supply Voltage VCC -0.3 3.6 V
Peak current I
MAX
250 mA
Voltage on any digital pin V
IO
-0.3 VCC+0.3
<3.9
V
Storage temperature range T
STG
–40 125 °C
Input RF level P
IN
10 dBm
Electrostatic discharge voltage (human body
model)
model, JEDEC STD 22, method A114
V
ESD
1 kV
Recommended operating conditions
Recommended operating conditionsRecommended operating conditions
Recommended operating conditions
Pa
PaPa
Parameter
rameterrameter
rameter
Symbol SymbolSymbol
Symbol
Minimum MinimumMinimum
Minimum
Maximum MaximumMaximum
Maximum
Units UnitsUnits
Units
Operating Supply Voltage VCC 2.3 3.6 V
Operating ambient temperature range T
A
–40 80 °C
Electrical characteristics
Electrical characteristicsElectrical characteristics
Electrical characteristics
Measured at 3.3V, 25°C. Limits apply over entire frequency range 2405-2480MHz (Channel 11-26).
Parame
ParameParame
Parameter
terter
ter
Symbol SymbolSymbol
Symbol
MIN MINMIN
MIN
TYP TYPTYP
TYP
MAX MAXMAX
MAX
Unit UnitUnit
Unit
Peak current consumption, continuous transmission, 17dBm
output power, no peripherals active.
I
TX_PEAK
120 150 mA
Peak current consumption, continuous transmission,
-2.7dBm output power, no peripherals active
I
TX_PEAK
60 80 mA
Peak current consumption, battery mode
1
. +2.5dBm output
power, no peripherals active
I
TX_BATT_PEAK
60 80 mA
Peak current consumption in RX mode, -50dBm input
power, no peripherals active
I
RX
40 60 mA
Peak current consumption in RX battery mode, -50dBm
input power, no peripherals active
I
RX_BATT
35 55 mA
Average current consumption, high power mode, 17dBm
output power, no peripherals active
I
TX_MIN
45 50 mA
Average current consumption
2
, battery mode, +2.5dBm
output power, no peripherals active
I
TX_AVG
35 40 mA
SPI current consumption I
SPI
300
ȝA
I
2
C current consumption I
I2C
100
ȝA
UART current consumption I
UART
700
ȝA
USB current consumption I
USB
3.8
mA
ADC current consumption when converting I
ADC
1.2
mA
Flash erase I
FL_ER
12
mA
Flash burst-write peak current I
FL_W
8
mA
Deep sleep current consumption I
SLEEP
10.5 11.1
ȝA
1
Transmitting one burst on 16 frequencies
2
One burst transmission including CSMA-CA, TX, MAC ACK, duration 4.9ms

- 4 (18) -
General characteristics
General characteristicsGeneral characteristics
General characteristics
Measured at 3.3V, 25°C.
Parameter
ParameterParameter
Parameter
Symbol SymbolSymbol
Symbol
MIN MINMIN
MIN
TYP TYPTYP
TYP
MAX MAXMAX
MAX
Unit UnitUnit
Unit
Wake up time from deep sleep to active T
WAKE_UP
136
ȝs
Time from active to TX or RX 192
ȝs
RF frequency range 2405 2480
MHz
RF characteristics
RF characteristicsRF characteristics
RF characteristics
Measured at 3.3V, 25°C. Limits apply over entire frequency range 2405-2480MHz (Channel 11-26)
Parameter
ParameterParameter
Parameter
Symbol SymbolSymbol
Symbol
MIN MINMIN
MIN
TYP TYPTYP
TYP
MAX MAXMAX
MAX
Unit UnitUnit
Unit
Receiver sensitivity, PER = 1% RX
SENS
-101
dBm
Receiver sensitivity battery mode, PER = 1%
RX
SENS_BATT
-92
dBm
Receiver saturation (maximum input level) , PER = 1% RX
SAT
-5
dBm
Transmitter max output
power
VCC = 3.6V
VCC = 3.3V
VCC = 3.0V
VCC = 2.7V
VCC = 2.3V
16.5
15.8
14.6
13.2
10.3
17
16.3
15.1
13.7
10.8
17.5
16.8
15.6
14.2
11.3
dBm
dBm
dBm
dBm
dBm
dBm
Transmitter min output
power
VCC = 3.6V
VCC = 3.3V
VCC = 3.0V
VCC = 2.7V
VCC = 2.3V
-3.1
-3.5
-3.8
-5.6
-10.7
-2.6
-3
-3.3
-5.1
-9.2
-2.1
-2.5
-2.8
-4.6
-8.7
dBm
dBm
dBm
dBm
dBm
dBm
Output return loss at U.FL. antenna connector
S22 -10 -5
dB
ADC characteristics
ADC characteristicsADC characteristics
ADC characteristics
TA = 25°C and V
CC
= 3 V, unless otherwise noted.
Parameter
ParameterParameter
Parameter
MIN MINMIN
MIN
TYP TYPTYP
TYP
MAX MAXMAX
MAX
Unit UnitUnit
Unit
Input voltage 0 Vcc V
Input resistance, signal 197 kΩ
ENOB Effective number of bits 10.2 Bits
Useful power bandwidth 20 kHz
THD Total harmonic distortion -75.2 dB
Signal to non-harmonic ratio 78.8 dB
CMRR Common-mode rejection ratio 84 dB
Crosstalk -84 dB
Offset -3 mV
Gain Error 0.68 %
DNL Differential nonlinearity Mean 0.05 LSB
Maximum 0.9
INL Integral nonlinearity Mean 4.6 LSB
Maximum 13.3
SINAD
(–THD+N) Signal-to-noise-and-distortion Single-ended input 66.6 dB
Differential input 70.8
Conversion time TBD μs
Current consumption 1.2 mA
Internal reference temperature coefficient 0.4 mV/10°C

- 5 (18) -
Control input AC characteristics
Control input AC characteristicsControl input AC characteristics
Control input AC characteristics
TA = –40°C to 125°C, V
CC
= 2 V to 3.6 V, unless otherwise noted.
Parameter
ParameterParameter
Parameter
MIN MINMIN
MIN
TYP TYPTYP
TYP
MAX MAXMAX
MAX
Unit UnitUnit
Unit
nRESET low duration, shortest pulse recognized as reset
request
1 μs
DC characteristics
DC characteristicsDC characteristics
DC characteristics
T A = 25°C, V
CC
= 3 V
Parameter
ParameterParameter
Parameter
MIN MINMIN
MIN
TYP TYPTYP
TYP
MAX MAXMAX
MAX
Unit UnitUnit
Unit
Logic 0 input voltage 0.5 V
Logic 1 input voltage 2.5 V
Logic-0 input current -300 300 nA
Logic-1 input current
-300 300 nA
USB interfa
USB interfaUSB interfa
USB interface DC characteristics
ce DC characteristicsce DC characteristics
ce DC characteristics
T A = 25°C, unless otherwise noted.
Parameter
ParameterParameter
Parameter
MIN MINMIN
MIN
TYP TYPTYP
TYP
MAX MAXMAX
MAX
Unit UnitUnit
Unit
USB pad voltage output, high, V
CC
3.6 V, 4-mA load 3.4 V
USB pad voltage output, low, V
CC
3.6 V, 4-mA load 0.2 V

- 6 (18) -
Pin assignments and functions
Pin assignments and functionsPin assignments and functions
Pin assignments and functions
Figure
FigureFigure
Figure 1
11
1, Top view pin assignment
, Top view pin assignment, Top view pin assignment
, Top view pin assignment
PIN
PINPIN
PIN
PIN NAME PIN NAMEPIN NAME
PIN NAME
PIN TYPE PIN TYPEPIN TYPE
PIN TYPE
DESCRIPTION DESCRIPTIONDESCRIPTION
DESCRIPTION
1
11
1
Do not connect
2
22
2
Do not connect
3
33
3
Do not connect
4
44
4
Do not connect
5
55
5
PC7 Digital I/O UART RXD
6
66
6
PC6 Digital I/O UART TXD
7
77
7
PC5 Digital I/O I2C SDA
8
88
8
PC4 Digital I/O I2S SCA
9
99
9
PC3 Digital O High current pin, 20 mA sink/source capability
10
1010
10
PC2 Digital O High current pin, 20 mA sink/source capability
11
1111
11
PC1 Digital O High current pin, 20 mA sink/source capability
12
1212
12
PA0 Analog I ADC0
13
1313
13
PA1 Analog I ADC1
14
1414
14
PA2 Digital I/O SPI CLK
15
1515
15
PA3 Digital I /SPI SS
16
1616
16
PA4 Digital I/O SPI MOSI
17
1717
17
PA5 Digital I/O SSI MISO
18
1818
18
PA6 Analog I ADC2
19
1919
19
PA7 Analog I ADC3
20
2020
20
GND
21
2121
21
GND
22
2222
22
PB5 Digital O PWM A
23
2323
23
PB4 Digital O PWM B
24
2424
24
PB3 Digital I GPT A Trigger / Cycle measurement
25
2525
25
PB2 Digital I GPT B Trigger / Cycle measurement
26
2626
26
PB1 Digital I/O GPIO port B pin 1
27
2727
27
RESET Digital input Device reset, active-low
28
2828
28
USB_N USB I/O USB differential data minus (D–)
29
2929
29
USB_P USB I/O USB differential data plus (D+)
30
3030
30
GND
31
3131
31
VCC 2.3 - 3.6VDC power supply connection

- 7 (18) -
Application information
Application informationApplication information
Application information
Core module current ramps
Core module current rampsCore module current ramps
Core module current ramps
in TX (transmit) high power mode in TX (transmit) high power modein TX (transmit) high power mode
in TX (transmit) high power mode
All measurements done in high power mode, i.e. RF power amplifier enabled in transmit.
Current consumption can be calculated using the formula:
ܫൌܸ
௢௦௖
͵Ͳ
Figure
FigureFigure
Figure 2
22
2, current ramp from standby to TX (transmit) standby
, current ramp from standby to TX (transmit) standby, current ramp from standby to TX (transmit) standby
, current ramp from standby to TX (transmit) standby
ܫ
ௌ௧௔௡ௗ௕௬
ൌͲǤͶ͹ͷ
͵Ͳ ൎ ͳͷǤͺ݉ܣ
ܫ
்௫ௌ௧௔௡ௗ௕௬
ൌͳǤͳͲ
͵Ͳ ൎ ͵͸Ǥ͹݉ܣ
I
Standby
I
TxStandby

- 8 (18) -
Figure
FigureFigure
Figure 3
33
3, current ramp from
, current ramp from, current ramp from
, current ramp from T
TT
TX standby
X standbyX standby
X standby
to TX active to TX activeto TX active
to TX active
ܫ
்௫஺௖௧௜௩
ൌ͵Ǥ͸ʹͷ
͵Ͳ ൎ ͳʹͳ݉ܣ
Figure
FigureFigure
Figure 4
44
4, current ramp from
, current ramp from, current ramp from
, current ramp from TX active to T
TX active to TTX active to T
TX active to TX standby
X standbyX standby
X standby
I
TxStandby
I
TxActive
I
TxActive
I
TxStandby

- 9 (18) -
Figure
FigureFigure
Figure 5
55
5, current ramp from TX standby
, current ramp from TX standby, current ramp from TX standby
, current ramp from TX standby
to toto
to sta
stasta
standby
ndbyndby
ndby
I
TxStandby
I
Standby

- 10 (18) -
Internal or E
Internal or EInternal or E
Internal or External Antenna?
xternal Antenna?xternal Antenna?
xternal Antenna?
For short distances the internal antenna will perform well. But if the design is to be placed inside a metal
enclosure, or if there is a need to cover large distances, an external antenna is necessary. An external
antenna MUST at least be designed for operation between 2.4 – 2.48GHz
Always use external antennas with a 50
Always use external antennas with a 50Always use external antennas with a 50
Always use external antennas with a 50 ς
characteristic impedance characteristic impedancecharacteristic impedance
characteristic impedance.
...
Internal Antenna
Internal AntennaInternal Antenna
Internal Antenna
If the internal antenna is considered, the product case needs to be of a RF transparent plastic material. The
circuit board that will hold the CORE module needs to be designed so that the internal chip antenna radiates
efficiently. Avoid any ground planes near the antenna chip.
When placing the CORE module on a circuit board:
•Place the module as close to the (main) circuit board edge as possible with the antenna pointing
outward.
•Note the absence of ground plane near the chip antenna on the modules´ circuit board.
•Remove any copper from the main board as specified in section “Layout Example”
•Avoid using metal structures such as mounting hardware close to the antenna chip.
Layout considerations for the main
ations for the mainations for the main
ations for the main (Customer)
(Customer)(Customer)
(Customer) board.
board.board.
board.
The CORE module has been specifically designed in order to achieve good RF performance. In order to
maintain this, there are some guidelines that we would like to stress:
The use of ground planes also on the main board cannot be overemphasized. Good decoupling of any high
speed digital circuitry is a must. Many embedded type micro processors today has clock frequencies with
clocks or over tones that reaches well into the GHz range. It is perfectly possible for an embedded design to
pass any EMC certification and still cause disturbances that will block the RF reception of the CORE module.
The sensitivity of the CORE module receiver is better than -100dBm ___ therefore it is recommended to keep
disturbances below this level in the frequency range of operation.
A near field probe connected to a spectrum analyzer will show if there are any disturbances present on the
2.45 GHz band generated by the micro processor or any other device that is placed on the main board. Pay
special attention to readymade LAN-products "Server in a RJ connector". They pass EMC certifications, but
some of them radiates badly on 2.45 GHz. If disturbances can be seen on a spectrum analyzer - then the
CORE module will have impaired reception.
The CORE module has a supply voltage decoupling on the circuit board. The supply voltage still needs to be
adequately filtered. If any disturbance or intermittent communication failures occur, as one of the trouble
shooting steps - check the supply voltage for drop-outs, switch supply ripple etc.