Mitsubishi 00JCPU User manual

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SAFETY PRECAUTIONS
(Read these precautions before using this product.)
Before using this product, please read this manual and the relevant manuals carefully and pay full attention
to safety to handle the product correctly.
In this manual, the safety precautions are classified into two levels: " WARNING" and " CAUTION".
Under some circumstances, failure to observe the precautions given under " CAUTION" may lead to
serious consequences.
Observe the precautions of both levels because they are important for personal and system safety.
Make sure that the end users read this manual and then keep the manual in a safe place for future
reference.
WARNING
CAUTION
Indicates that incorrect handling may cause hazardous conditions,
resulting in death or severe injury.
Indicates that incorrect handling may cause hazardous conditions,
resulting in minor or moderate injury or property damage.

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[Design Precautions]
WARNING
Configure safety circuits external to the programmable controller to ensure that the entire system
operates safely even when a fault occurs in the external power supply or the programmable
controller. Failure to do so may result in an accident due to an incorrect output or malfunction.
(1) Configure external safety circuits, such as an emergency stop circuit, protection circuit, and
protective interlock circuit for forward/reverse operation or upper/lower limit positioning.
(2) The programmable controller stops its operation upon detection of the following status, and the
output status of the system will be as shown below.
All outputs may turn on when an error occurs in the part, such as I/O control part, where the CPU
module cannot detect any error. To ensure safety operation in such a case, provide a safety
mechanism or a fail-safe circuit external to the programmable controller. For a fail-safe circuit
example, refer to Appendix 8 General Safety Requirements in the QCPU User's Manual
(Hardware Design, Maintenance and Inspection).
(3) Outputs may remain on or off due to a failure of an output module relay or transistor. Configure
an external circuit for monitoring output signals that could cause a serious accident.
In an output module, when a load current exceeding the rated current or an overcurrent caused by a
load short-circuit flows for a long time, it may cause smoke and fire. To prevent this, configure an
external safety circuit, such as a fuse.
Configure a circuit so that the programmable controller is turned on first and then the external power
supply.
If the external power supply is turned on first, an accident may occur due to an incorrect output or
malfunction.
For the operating status of each station after a communication failure, refer to relevant manuals for
the network.
Incorrect output or malfunction due to a communication failure may result in an accident.
Q series model AnS/A series model
All outputs are turned off. All outputs are turned off.
All outputs are held or turned
off according to the parameter
setting.
Overcurrent or overvoltage protection of the
power supply module is activated.
The CPU module detects an error such as a
watchdog timer error by the self-diagnostic
function.
All outputs are turned off.
Status

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[Design Precautions]
[Design Precautions]
WARNING
When changing data of the running programmable controller from a peripheral connected to the
CPU module or from a personal computer connected to an intelligent function module, configure an
interlock circuit in the sequence program to ensure that the entire system will always operate safely.
For program modification and operating status change, read relevant manuals carefully and ensure
the safety before operation.
Especially, in the case of a control from an external device to a remote programmable controller,
immediate action cannot be taken for a problem on the programmable controller due to a
communication failure.
To prevent this, configure an interlock circuit in the sequence program, and determine corrective
actions to be taken between the external device and CPU module in case of a communication
failure.
CAUTION
Do not install the control lines or communication cables together with the main circuit lines or power
cables.
Keep a distance of 100mm (3.94 inches) or more between them.
Failure to do so may result in malfunction due to noise.
When a device such as a lamp, heater, or solenoid valve is controlled through an output module, a
large current (approximately ten times greater than normal) may flow when the output is turned from
off to on.
Take measures such as replacing the module with one having a sufficient current rating.
After the CPU module is powered on or is reset, the time taken to enter the RUN status varies
depending on the system configuration, parameter settings, and/or program size.
Design circuits so that the entire system will always operate safely, regardless of the time.

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[Installation Precautions]
CAUTION
Use the programmable controller in an environment that meets the general specifications in the
QCPU User's Manual (Hardware Design, Maintenance and Inspection).
Failure to do so may result in electric shock, fire, malfunction, or damage to or deterioration of the
product.
To mount the module, while pressing the module mounting lever located in the lower part of the
module, fully insert the module fixing projection(s) into the hole(s) in the base unit and press the
module until it snaps into place.
Incorrect mounting may cause malfunction, failure or drop of the module.
When using the programmable controller in an environment of frequent vibrations, fix the module
with a screw.
Tighten the screw within the specified torque range.
Undertightening can cause drop of the screw, short circuit or malfunction.
Overtightening can damage the screw and/or module, resulting in drop, short circuit, or malfunction.
When using an extension cable, connect it to the extension cable connector of the base unit
securely.
Check the connection for looseness.
Poor contact may cause incorrect input or output.
When using a memory card, fully insert it into the memory card slot.
Check that it is inserted completely.
Poor contact may cause malfunction.
Shut off the external power supply for the system in all phases before mounting or removing the
module. Failure to do so may result in damage to the product.
A module can be replaced online (while power is on) on any MELSECNET/H remote I/O station or in
the system where a CPU module supporting the online module change function is used.
Note that there are restrictions on the modules that can be replaced online, and each module has its
predetermined replacement procedure.
For details, refer to the relevant sections in the QCPU User's Manual (Hardware Design,
Maintenance and Inspection) and in the manual for the corresponding module.
Do not directly touch any conductive parts and electronic components of the module.
Doing so can cause malfunction or failure of the module.
When using a Motion CPU module and modules designed for motion control, check that the
combinations of these modules are correct before applying power.
The modules may be damaged if the combination is incorrect.
For details, refer to the user's manual for the Motion CPU module.

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[Wiring Precautions]
[Wiring Precautions]
WARNING
Shut off the external power supply (all phases) used in the system before installation and wiring.
Failure to do so may result in electric shock or damage to the product.
After wiring, attach the included terminal cover to the module before turning it on for operation.
Failure to do so may result in electric shock.
CAUTION
Ground the FG and LG terminals to the protective ground conductor dedicated to the programmable
controller.
Failure to do so may result in electric shock or malfunction.
Use applicable solderless terminals and tighten them within the specified torque range. If any spade
solderless terminal is used, it may be disconnected when the terminal screw comes loose, resulting
in failure.
Check the rated voltage and terminal layout before wiring to the module, and connect the cables
correctly.
Connecting a power supply with a different voltage rating or incorrect wiring may cause a fire or
failure.
Connectors for external connection must be crimped or pressed with the tool specified by the
manufacturer, or must be correctly soldered.
Incomplete connections could result in short circuit, fire, or malfunction.
Do not install the control lines or communication cables together with the main circuit lines or power
cables.
Failure to do so may result in malfunction due to noise.
Tighten the terminal screw within the specified torque range.
Undertightening can cause short circuit, fire, or malfunction.
Overtightening can damage the screw and/or module, resulting in drop, short circuit, or malfunction.
Prevent foreign matter such as dust or wire chips from entering the module.
Such foreign matter can cause a fire, failure, or malfunction.

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[Wiring Precautions]
[Startup and Maintenance Precautions]
CAUTION
A protective film is attached to the top of the module to prevent foreign matter, such as wire chips,
from entering the module during wiring.
Do not remove the film during wiring.
Remove it for heat dissipation before system operation.
Mitsubishi programmable controllers must be installed in control panels.
Connect the main power supply to the power supply module in the control panel through a relay
terminal block.
Wiring and replacement of a power supply module must be performed by maintenance personnel
who is familiar with protection against electric shock. (For wiring methods, refer to the QCPU User's
Manual (Hardware Design, Maintenance and Inspection)).
WARNING
Do not touch any terminal while power is on.
Doing so will cause electric shock or malfunction.
Correctly connect the battery connector.
Do not charge, disassemble, heat, short-circuit, solder, or throw the battery into the fire.
Doing so will cause the battery to produce heat, explode, or ignite, resulting in injury and fire.
Shut off the external power supply (all phases) used in the system before cleaning the module or
retightening the terminal screws, connector screws, or module fixing screws.
Failure to do so may result in electric shock or cause the module to fail or malfunction.
Undertightening can cause drop of the screw, short circuit or malfunction.
Overtightening can damage the screw and/or module, resulting in drop, short circuit, or malfunction.

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[Startup and Maintenance Precautions]
CAUTION
Before performing online operations (especially, program modification, forced output, and operation
status change) for the running CPU module from the peripheral connected, read relevant manuals
carefully and ensure the safety.
Improper operation may damage machines or cause accidents.
Do not disassemble or modify the modules.
Doing so may cause failure, malfunction, injury, or a fire.
Use any radio communication device such as a cellular phone or PHS (Personal Handy-phone
System) more than 25cm (9.85 inches) away in all directions from the programmable controller.
Failure to do so may cause malfunction.
Shut off the external power supply for the system in all phases before mounting or removing the
module. Failure to do so may cause the module to fail or malfunction.
A module can be replaced online (while power is on) on any MELSECNET/H remote I/O station or in
the system where a CPU module supporting the online module change function is used.
Note that there are restrictions on the modules that can be replaced online, and each module has its
predetermined replacement procedure.
For details, refer to the relevant sections in the QCPU User's Manual (Hardware Design,
Maintenance and Inspection) and in the manual for the corresponding module.
After the first use of the product, do not mount/remove the module to/from the base unit, and the
terminal block to/from the module more than 50 times (IEC 61131-2 compliant) respectively.
Exceeding the limit of 50 times may cause malfunction.
Do not drop or apply shock to the battery to be installed in the module.
Doing so may damage the battery, causing the battery fluid to leak inside the battery.
If the battery is dropped or any shock is applied to it, dispose of it without using.
Before handling the module, touch a grounded metal object to discharge the static electricity from
the human body.
Failure to do so may cause the module to fail or malfunction.

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[Disposal Precautions]
[Transportation Precautions]
CAUTION
When disposing of this product, treat it as industrial waste.
When disposing of batteries, separate them from other wastes according to the local regulations.
(For details of the battery directive in EU member states, refer to the QCPU User's Manual
(Hardware Design, Maintenance and Inspection).)
CAUTION
When transporting lithium batteries, follow the transportation regulations.
(For details of the regulated models, refer to the QCPU User's Manual (Hardware Design,
Maintenance and Inspection).)

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CONDITIONS OF USE FOR THE PRODUCT
(1) Mitsubishi programmable controller ("the PRODUCT") shall be used in conditions;
i) where any problem, fault or failure occurring in the PRODUCT, if any, shall not lead to any major
or serious accident; and
ii) where the backup and fail-safe function are systematically or automatically provided outside of
the PRODUCT for the case of any problem, fault or failure occurring in the PRODUCT.
(2) The PRODUCT has been designed and manufactured for the purpose of being used in general
industries.
MITSUBISHI SHALL HAVE NO RESPONSIBILITY OR LIABILITY (INCLUDING, BUT NOT
LIMITED TO ANY AND ALL RESPONSIBILITY OR LIABILITY BASED ON CONTRACT,
WARRANTY, TORT, PRODUCT LIABILITY) FOR ANY INJURY OR DEATH TO PERSONS OR
LOSS OR DAMAGE TO PROPERTY CAUSED BY the PRODUCT THAT ARE OPERATED OR
USED IN APPLICATION NOT INTENDED OR EXCLUDED BY INSTRUCTIONS, PRECAUTIONS,
OR WARNING CONTAINED IN MITSUBISHI'S USER, INSTRUCTION AND/OR SAFETY
MANUALS, TECHNICAL BULLETINS AND GUIDELINES FOR the PRODUCT.
("Prohibited Application")
Prohibited Applications include, but not limited to, the use of the PRODUCT in;
• Nuclear Power Plants and any other power plants operated by Power companies, and/or any
other cases in which the public could be affected if any problem or fault occurs in the PRODUCT.
• Railway companies or Public service purposes, and/or any other cases in which establishment of
a special quality assurance system is required by the Purchaser or End User.
• Aircraft or Aerospace, Medical applications, Train equipment, transport equipment such as
Elevator and Escalator, Incineration and Fuel devices, Vehicles, Manned transportation,
Equipment for Recreation and Amusement, and Safety devices, handling of Nuclear or
Hazardous Materials or Chemicals, Mining and Drilling, and/or other applications where there is a
significant risk of injury to the public or property.
Notwithstanding the above, restrictions Mitsubishi may in its sole discretion, authorize use of the
PRODUCT in one or more of the Prohibited Applications, provided that the usage of the PRODUCT
is limited only for the specific applications agreed to by Mitsubishi and provided further that no
special quality assurance or fail-safe, redundant or other safety features which exceed the general
specifications of the PRODUCTs are required. For details, please contact the Mitsubishi
representative in your region.

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REVISIONS
*The manual number is given on the bottom left of the back cover.
Japanese manual version SH-080803-K
© 2008 MITSUBISHI ELECTRIC CORPORATION
Print date Manual number Revision
Dec., 2008 SH(NA)-080808ENG-A First edition
Mar., 2009 SH(NA)-080808ENG-B Partial correction
SAFETY PRECAUTIONS, INTRODUCTION, MANUALS, MANUAL PAGE
ORGANIZATION, Section 1.3, 1.6, 2.2.2, 2.2.3, 2.3, 2.3.4, 2.3.5, 3.3, 3.7,
3.8.1, 3.8.2, 4.1.1, 4.1.2, 4.2.2, 4.2.3, 5.1.1, 5.2.1, 5.2.5, 5.2.6, 5.2.8, 6.1,
6.3, 6.5, 6.6.1, 6.6.5, 6.11.3, 6.12.2, 6.13.3, 6.14, 6.15.2, 6.20, 6.22.2, 6.22.4,
CHAPTER 7, Section 7.1.2, 7.2, 8.2, 9.1, 9.2, 9.2.11, 9.3.3, 9.5.2, 9.7.4, 9.10,
10.1.1, 10.1.2, Appendix 1, Appendix 3
Nov., 2009 SH(NA)-080808ENG-C Partial correction
SAFETY PRECAUTIONS, Section 4.2.2, 9.2.10, 9.7.4
Addition
CONDITIONS OF USE FOR THE PRODUCT
May, 2010 SH(NA)-080808ENG-D Partial correction
SAFETY PRECAUTIONS, MANUALS, Section 1.5.1, 1.5.2, 2.1, 2.2.1, 2.2.3,
2.4, 3.7, 4.2.2, 5.1.1, 5.1.4, 5.2.9, 6.2, 6.5, 6.6.2, 6.6.3, 6.6.4, 6.11.2, 6.12.2,
6.13.1, 6.14, 6.17.1, 6.22, 6.24, 7.1.3, 8.1.1, 9.2.9, 9.2.10, 9.3.1, 9.5.1, 9.7,
9.8, 9.9, 9.10.1, 9.11.1, 9.11.2, 9.12.3, 9.13.2, 10.1.2, Appendix 2.1, Appen-
dix 2.2, Appendix 2.3, Appendix 2.4
May, 2011 SH(NA)-080808ENG-E Partial correction
SAFETY PRECAUTIONS, GENERIC TERMS AND ABBREVIATIONS,
Section 3.1, 3.4, 3.6, 3.8.1, 3.8.2, 5.1.1, 5.1.2, 5.1.5, 5.2.1, 5.2.8, 5.2.9, 6.5,
6.25, 7.2, CHAPTER 8, Section 9.2, 9.2.4, 9.2.10, 9.3.2, 9.3.3, 9.10, 10.1.3
Deletion
CHAPTER 12
Sep., 2011 SH(NA)-080808ENG-F Partial correction
SAFETY PRECAUTIONS, INTRODUCTION, MANUAL PAGE ORGANIZA-
TION, Section 2.4.5, 5.2.6, 6.24, 9.2, 9.2.10, 9.12.4
Oct., 2011 SH(NA)-080808ENG-G Partial correction
GENERIC TERMS AND ABBREVIATIONS, Section 1.5.2, 3.8, 4.2.2, 6.22.2,
6.22.4, 10.1.2
May, 2012 SH(NA)-080808ENG-H Partial correction
Section 5.2.8, 6.2, 6.12.3, 8.1.1, 8.1.2, 9.1, 9.2.13, 9.3.2, 9.3.3, 9.7, 9.7.4,
Appendix 1
Jan., 2014 SH(NA)-080808ENG-I Partial correction
GENERIC TERMS AND ABBREVIATIONS, Section 4.2.1, 5.2.1, 5.2.5,
5.2.10, 6.12.3, 9.1, 9.7.2, 9.7.6, 10.1.3, Appendix 2.2, 2.3
Jul. 2014 SH(NA)-080808ENG-J Partial correction
GENERIC TERMS AND ABBREVIATIONS, Section 1.5.2, 3.8, 4.2.2, 6.22.2,
6.22.4, 10.1.2
This manual confers no industrial property rights or any rights of any other kind, nor does it confer any patent licenses. Mit-
subishi Electric Corporation cannot be held responsible for any problems involving industrial property rights which may occur
as a result of using the contents noted in this manual.

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INTRODUCTION
This manual describes the memory maps, functions, programs, I/O number assignment, and devices of the Q series CPU
module.
Before using this product, please read this manual and the relevant manuals carefully and develop familiarity with the
functions and performance of the Q series programmable controller to handle the product correctly.
When applying the program examples introduced in this manual to the actual system, ensure the applicability and confirm that
it will not cause system control problems.
Relevant CPU module
Remark
This manual does not describe the specifications of the power supply modules, base units, extension cables, memory
cards, and batteries.
For details, refer to the following.
QCPU User's Manual (Hardware Design, Maintenance and Inspection)
For multiple CPU systems, refer to the following.
QCPU User's Manual (Multiple CPU System)
For redundant systems, refer to the following.
QnPRHCPU User's Manual (Redundant System)
CPU module Model
Basic model QCPU Q00JCPU, Q00CPU, Q01CPU
High Performance model QCPU Q02CPU, Q02HCPU, Q06HCPU, Q12HCPU, Q25HCPU
Process CPU Q02PHCPU, Q06PHCPU, Q12PHCPU, Q25PHCPU
Redundant CPU Q12PRHCPU, Q25PRHCPU

CONTENTS
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CONTENTS
SAFETY PRECAUTIONS......................................................................................................................A - 1
CONDITIONS OF USE FOR THE PRODUCT ......................................................................................A - 9
REVISIONS ........................................................................................................................................... A - 10
INTRODUCTION ...................................................................................................................................A - 11
MANUALS .............................................................................................................................................A - 18
MANUAL PAGE ORGANIZATION......................................................................................................... A - 20
GENERIC TERMS AND ABBREVIATIONS ..........................................................................................A - 22
CHAPTER1 OVERVIEW 1-1 to 1-20
1.1 Processing Order in the CPU Module....................................................................................1 - 1
1.2 Storing and Executing Programs ........................................................................................... 1 - 2
1.3 Structured Programming ........................................................................................................ 1 - 3
1.4 Devices and Instructions Useful for Programming................................................................. 1 - 6
1.5 Features................................................................................................................................. 1 - 11
1.5.1 Features of the Basic model QCPU ..................................................................................1 - 11
1.5.2 Features of the High Performance model QCPU..............................................................1 - 13
1.5.3 Features of the Process CPU ...........................................................................................1 - 15
1.5.4 Features of the Redundant CPU.......................................................................................1 - 17
1.6 Checking Serial Number and Function Version ..................................................................... 1 - 19
CHAPTER2 SEQUENCE PROGRAMS 2-1 to 2-51
2.1 Sequence Program Overview ................................................................................................ 2 - 1
2.2 Sequence Program Configuration.......................................................................................... 2 - 3
2.2.1 Main routine program ........................................................................................................2 - 4
2.2.2 Subroutine program ..........................................................................................................2 - 5
2.2.3 Interrupt program ..............................................................................................................2 - 6
2.3 Settings When Program is Divided .......................................................................................2 - 14
2.3.1 Initial execution type program ...........................................................................................2 - 19
2.3.2 Scan execution type program ...........................................................................................2 - 22
2.3.3 Low-speed execution type program ..................................................................................2 - 23
2.3.4 Stand-by type program ......................................................................................................2 - 31
2.3.5 Fixed scan execution type program ..................................................................................2 - 36
2.3.6 Changing the program execution type ..............................................................................2 - 40
2.4 Data Used in Sequence Programs ........................................................................................ 2 - 42
2.4.1 BIN (Binary Code) .............................................................................................................2 - 45
2.4.2 HEX (Hexadecimal)...........................................................................................................2 - 46
2.4.3 BCD (Binary-coded Decimal) ............................................................................................2 - 47
2.4.4 Real number (Floating-point data).....................................................................................2 - 48
2.4.5 Character string data.........................................................................................................2 - 51
CHAPTER3 CPU MODULE OPERATION 3-1 to 3-16
3.1 Initial Processing.................................................................................................................... 3 - 1
3.2 I/O Refresh (Refresh Processing with Input/Output Modules) ............................................... 3 - 2

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3.3 Program Operation ................................................................................................................ 3 - 2
3.4 END Processing..................................................................................................................... 3 - 3
3.5 Operation Processing in the RUN, STOP, or PAUSE Status ................................................. 3 - 4
3.6 Operation Processing during Momentary Power Failure ....................................................... 3 - 6
3.7 Data Clear Processing ........................................................................................................... 3 - 7
3.8 I/O Processing and Response Delay.....................................................................................3 - 9
3.8.1 Refresh mode....................................................................................................................3 - 10
3.8.2 Direct mode.......................................................................................................................3 - 14
CHAPTER4 ASSIGNMENT OF BASE UNIT AND I/O NUMBER 4-1 to 4-17
4.1 Base Unit Assignment............................................................................................................ 4 - 1
4.1.1 Base mode ........................................................................................................................4 - 1
4.1.2 Base unit assignment setting ............................................................................................4 - 2
4.2 I/O Number Assignment......................................................................................................... 4 - 4
4.2.1 Concept of I/O number assignment ..................................................................................4 - 5
4.2.2 Setting I/O numbers ..........................................................................................................4 - 8
4.2.3 I/O number setting example ..............................................................................................4 - 14
4.2.4 Checking I/O numbers ......................................................................................................4 - 17
CHAPTER5 MEMORIES AND FILES USED FOR CPU MODULE 5-1 to 5-51
5.1 Memories Used for Basic Model QCPU................................................................................. 5 - 1
5.1.1 Memory composition and storable data ............................................................................5 - 1
5.1.2 Program memory ..............................................................................................................5 - 3
5.1.3 Standard ROM ..................................................................................................................5 - 6
5.1.4 Standard RAM ...................................................................................................................5 - 7
5.1.5 Operating and writing programs in the standard ROM (boot operation) ...........................5 - 9
5.2 Memories Used for High Performance model QCPU, Process CPU, and Redundant CPU.. 5 - 13
5.2.1 Memory composition and storable data ............................................................................5 - 13
5.2.2 Program memory ..............................................................................................................5 - 16
5.2.3 Standard ROM ..................................................................................................................5 - 19
5.2.4 Standard RAM ...................................................................................................................5 - 20
5.2.5 Memory card .....................................................................................................................5 - 22
5.2.6 Writing to the standard ROM and Flash card by GX Developer........................................5 - 26
5.2.7 Automatic all data write from memory card to standard ROM...........................................5 - 31
5.2.8 Operating the program in the standard ROM and memory card (boot operation).............5 - 34
5.2.9 Details of written files ........................................................................................................5 - 39
5.2.10 Specifying valid parameters (parameter-valid drive setting)..............................................5 - 40
5.3 Program File Structure ........................................................................................................... 5 - 41
5.4 File Operations by GX Developer and Handling Precautions................................................5 - 43
5.4.1 File operations...................................................................................................................5 - 43
5.4.2 Precautions for handling files ............................................................................................5 - 44
5.4.3 File size .............................................................................................................................5 - 45
5.4.4 Units of file sizes ...............................................................................................................5 - 48

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CHAPTER6 FUNCTIONS 6-1 to 6-151
6.1 Function List........................................................................................................................... 6 - 1
6.2 Constant Scan ....................................................................................................................... 6 - 4
6.3 Latch Function ....................................................................................................................... 6 - 8
6.4 Output Mode at Operating Status Change (STOP to RUN)...................................................6 - 11
6.5 Clock Function ....................................................................................................................... 6 - 14
6.6 Remote Operation.................................................................................................................. 6 - 19
6.6.1 Remote RUN/STOP ..........................................................................................................6 - 19
6.6.2 Remote PAUSE.................................................................................................................6 - 22
6.6.3 Remote RESET.................................................................................................................6 - 25
6.6.4 Remote latch clear ............................................................................................................6 - 29
6.6.5 Relationship between remote operation and RUN/STOP status of the CPU module .......6 - 31
6.7 Q Series-compatible Module Input Response Time Selection (I/O Response Time) ............ 6 - 32
6.8 Error Time Output Mode Setting ............................................................................................6 - 34
6.9 H/W Error Time PLC Operation Mode Setting ....................................................................... 6 - 35
6.10 Intelligent Function Module Switch Setting ............................................................................ 6 - 36
6.11 Monitor Function .................................................................................................................... 6 - 38
6.11.1 Monitor condition setting ...................................................................................................6 - 39
6.11.2 Local device monitor/test ..................................................................................................6 - 45
6.11.3 External input/output forced on/off ...................................................................................6 - 48
6.12 Writing Programs While CPU Module is in RUN Status......................................................... 6 - 54
6.12.1 Online change (ladder mode)............................................................................................6 - 54
6.12.2 Online change (files) ........................................................................................................6 - 58
6.12.3 Precautions for online change...........................................................................................6 - 60
6.13 Execution Time Measurement ............................................................................................... 6 - 65
6.13.1 Program monitor list ..........................................................................................................6 - 65
6.13.2 Interrupt program monitor list ............................................................................................6 - 69
6.13.3 Scan time measurement ..................................................................................................6 - 70
6.14 Sampling Trace Function ....................................................................................................... 6 - 74
6.15 Debug Function from Multiple GX Developers....................................................................... 6 - 87
6.15.1 Simultaneous monitoring from multiple GX Developers function ......................................6 - 87
6.15.2 Online change function from multiple GX Developers .....................................................6 - 89
6.16 Watchdog Timer (WDT) ......................................................................................................... 6 - 91
6.17 Self-diagnostic Function......................................................................................................... 6 - 93
6.17.1 Interrupt caused by an error..............................................................................................6 - 102
6.17.2 LEDs indicating errors.......................................................................................................6 - 103
6.17.3 Error clear .........................................................................................................................6 - 104
6.18 Error History........................................................................................................................... 6 - 105
6.18.1 Basic model QCPU ...........................................................................................................6 - 105
6.18.2 High Performance model QCPU, Process CPU, and Redundant CPU ............................6 - 106
6.19 System Protection.................................................................................................................. 6 - 107
6.19.1 Password registration........................................................................................................6 - 108
6.19.2 Remote password ............................................................................................................6 - 110
6.20 System Display of CPU Module with GX Developer.............................................................. 6 - 115
6.21 LED Display ........................................................................................................................... 6 - 120

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6.21.1 Methods for turning off the LEDs.......................................................................................6 - 121
6.21.2 LED indication priority .......................................................................................................6 - 122
6.22 High Speed Interrupt Function ...............................................................................................6 - 125
6.22.1 High speed interrupt program execution function .............................................................6 - 126
6.22.2 High speed I/O refresh and high speed buffer transfer functions......................................6 - 127
6.22.3 Processing time.................................................................................................................6 - 129
6.22.4 Restrictions .......................................................................................................................6 - 131
6.23 Interrupt from Intelligent Function Module .............................................................................6 - 134
6.24 Serial Communication Function ............................................................................................. 6 - 135
6.25 Service Processing ................................................................................................................ 6 - 143
6.25.1 Module service interval time read .....................................................................................6 - 143
6.26 Initial Device Value................................................................................................................. 6 - 144
6.27 Memory Check Function ........................................................................................................ 6 - 149
CHAPTER7 COMMUNICATIONS WITH INTELLIGENT FUNCTION MODULE
7-1 to 7-10
7.1 Communications between CPU Module and Intelligent Function Module ............................. 7 - 1
7.1.1 Initial setting and auto refresh setting by GX Configurator................................................7 - 2
7.1.2 Initial setting by initial device value ...................................................................................7 - 5
7.1.3 Communications with the FROM and TO instructions ......................................................7 - 5
7.1.4 Communications using the intelligent function module device ..........................................7 - 6
7.1.5 Communications using the intelligent function module dedicated instruction ...................7 - 8
7.2 Access to the AnS/A Series Special Function Modules ......................................................... 7 - 10
CHAPTER8 PARAMETERS 8-1 to 8-34
8.1 PLC Parameters .................................................................................................................... 8 - 2
8.1.1 Basic model QCPU ...........................................................................................................8 - 2
8.1.2 High Performance model QCPU, Process CPU, and Redundant CPU ............................8 - 14
8.2 Redundant Parameters ......................................................................................................... 8 - 27
8.3 Network Parameters .............................................................................................................. 8 - 29
8.4 Remote Password.................................................................................................................. 8 - 34
CHAPTER9 DEVICES 9-1 to 9-109
9.1 Device List ............................................................................................................................. 9 - 1
9.2 Internal User Devices............................................................................................................. 9 - 5
9.2.1 Input (X) ............................................................................................................................9 - 8
9.2.2 Output (Y)..........................................................................................................................9 - 10
9.2.3 Internal relay (M) ...............................................................................................................9 - 11
9.2.4 Latch relay (L) ...................................................................................................................9 - 12
9.2.5 Annunciator (F) .................................................................................................................9 - 14
9.2.6 Edge relay (V) ...................................................................................................................9 - 20
9.2.7 Link relay (B) .....................................................................................................................9 - 21

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9.2.8 Link special relay (SB) ......................................................................................................9 - 23
9.2.9 Step relay (S) ....................................................................................................................9 - 24
9.2.10 Timer (T)............................................................................................................................9 - 25
9.2.11 Counter (C) .......................................................................................................................9 - 34
9.2.12 Data register (D)................................................................................................................9 - 40
9.2.13 Link register (W)................................................................................................................9 - 41
9.2.14 Link special register (SW) .................................................................................................9 - 43
9.3 Internal System Devices ........................................................................................................ 9 - 44
9.3.1 Function devices (FX, FY, FD) ..........................................................................................9 - 44
9.3.2 Special relay (SM).............................................................................................................9 - 47
9.3.3 Special register (SD) .........................................................................................................9 - 48
9.4 Link Direct Device .................................................................................................................. 9 - 49
9.5 Module Access Devices......................................................................................................... 9 - 53
9.5.1 Intelligent function module device .....................................................................................9 - 53
9.5.2 Cyclic transmission area device ........................................................................................9 - 56
9.6 Index Register (Z) .................................................................................................................. 9 - 57
9.6.1 Index register (Z)...............................................................................................................9 - 57
9.6.2 Switching between the scan execution type and low-speed execution type programs.....9 - 59
9.6.3 Switching from the scan execution type/low-speed execution type program to the
interrupt/fixed scan execution type program .......................................................... 9 - 60
9.7 File Register (R)..................................................................................................................... 9 - 64
9.7.1 File register data storage location .....................................................................................9 - 65
9.7.2 File register size ................................................................................................................9 - 65
9.7.3 Differences in available accesses by storage memory .....................................................9 - 66
9.7.4 Registration procedure for the file register ........................................................................9 - 67
9.7.5 Specification methods of the file register...........................................................................9 - 73
9.7.6 Precautions for using the file register ................................................................................9 - 74
9.8 Nesting (N)............................................................................................................................. 9 - 77
9.9 Pointer (P).............................................................................................................................. 9 - 78
9.9.1 Local pointer.....................................................................................................................9 - 79
9.9.2 Common pointer................................................................................................................9 - 81
9.10 Interrupt Pointer (I)................................................................................................................. 9 - 84
9.10.1 List of interrupt pointer numbers and interrupt factors ......................................................9 - 86
9.11 Other Devices ........................................................................................................................ 9 - 93
9.11.1 SFC block device (BL) ......................................................................................................9 - 93
9.11.2 SFC transition device (TR)................................................................................................9 - 93
9.11.3 Network No. specification device (J) .................................................................................9 - 93
9.11.4 I/O No. specification device (U).........................................................................................9 - 94
9.11.5 Macro instruction argument device (VD)...........................................................................9 - 95
9.12 Constants............................................................................................................................... 9 - 96
9.12.1 Decimal constant (K).........................................................................................................9 - 96
9.12.2 Hexadecimal constant (H).................................................................................................9 - 96
9.12.3 Real number (E)................................................................................................................9 - 97
9.12.4 Character string (" ")..........................................................................................................9 - 98
9.13 Convenient Usage of Devices................................................................................................ 9 - 99
9.13.1 Global device ....................................................................................................................9 - 99
9.13.2 Local device ......................................................................................................................9 - 100

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CHAPTER10 CPU MODULE PROCESSING TIME 10-1 to 10-22
10.1 Scan Time.............................................................................................................................. 10 - 1
10.1.1 Scan time structure ...........................................................................................................10 - 1
10.1.2 Time required for each processing included in scan time .................................................10 - 6
10.1.3 Factors that increase the scan time ..................................................................................10 - 15
10.1.4 Factors that shorten the scan time....................................................................................10 - 20
CHAPTER11 PROCEDURES FOR WRITING PROGRAM TO CPU MODULE
11-1 to 11-15
11.1 Basic Model QCPU ................................................................................................................ 11 - 1
11.1.1 Items to be Considered for Creating Programs.................................................................11 - 1
11.1.2 Hardware Check ...............................................................................................................11 - 2
11.1.3 Procedure for writing a program........................................................................................11 - 4
11.1.4 Procedure for Boot Operation ...........................................................................................11 - 6
11.2 High Performance Model QCPU, Process CPU, and Redundant CPU ................................. 11 - 7
11.2.1 Items to be Considered for Creating Programs.................................................................11 - 7
11.2.2 Hardware Check ...............................................................................................................11 - 8
11.2.3 Procedure for Writing One Program..................................................................................11 - 10
11.2.4 Procedure for Writing Multiple Programs ..........................................................................11 - 12
11.2.5 Procedure for Boot Operation ...........................................................................................11 - 15
APPENDICES APPX-1 to APPX-13
Appendix 1 List of Parameter Numbers ......................................................................................... APPX- 1
Appendix 2 Upgrade by Function Addition..................................................................................... APPX- 5
Appendix 2.1 Upgrade of the Basic model QCPU............................................................... APPX- 5
Appendix 2.2 Upgrade of the High Performance model QCPU.............................................. APPX- 8
Appendix 2.3 Upgrade of the Process CPU....................................................................... APPX- 10
Appendix 2.4 Upgrade of the Redundant CPU................................................................... APPX- 11
Appendix 3 Device Point Assignment Sheet.................................................................................. APPX- 12
INDEX INDEX-1 to INDEX-4

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MANUALS
To understand the main specifications, functions, and usage of the CPU module, refer to the basic manuals.
Read other manuals as well when using a different type of CPU module and its functions.
Order each manual as needed, referring to the following list.
: Basic manual, : Other CPU module manuals
Number (in the list below) CPU module
1) Basic model QCPU
2) High Performance model QCPU
3) Process CPU
4) Redundant CPU
Manual name
< Manual number (model code) > Description Manual type
1) 2) 3) 4)
User's manual
QCPU User's Manual (Hardware Design,
Maintenance and Inspection)
< SH-080483ENG (13JR73) >
Specifications of the hardware (CPU modules, power
supply modules, base units, extension cables, and
memory cards), system maintenance and inspection,
troubleshooting, and error codes
Qn(H)/QnPH/QnPRHCPUCPU Users Manual
(Function Explanation, Program Fundamentals)
< SH-080807ENG (13JZ27) >
Functions, methods, and devices for programming
QCPU User's Manual (Multiple CPU System)
< SH-080485ENG (13JR75) >
Information for configuring a multiple CPU system
(system configuration, I/O numbers, communication
between CPU modules, and communication with the
input/output modules and intelligent function modules)
QnPRHCPU User's Manual (Redundant System)
< SH-080486ENG (13JR768) >
Information on redundant system configuration
(system configuration, functions, communication with
external devices, and troubleshooting)
Programming manual
MELSEC-Q/L Programming Manual (Common
Instruction)
< SH-080809ENG (13JW10) >
How to use sequence instructions, basic instructions,
and application instructions
MELSEC-Q/L/QnA Programming Manual (SFC)
< SH-080041 (13JF60) >
System configuration, performance specifications,
functions, programming, debugging, and error codes
for SFC (MELSAP3) programs
MELSEC-Q/L Programming Manual (MELSAP-L)
< SH-080076 (13JF61) >
Programming methods, specifications, and functions
for SFC (MELSAP-L) programs
MELSEC-Q/L Programming Manual (Structured
Tex t )
< SH-080366E (13JF68) >
Programming methods using structured languages
MELSEC-Q/L/QnA Programming Manual (PID
Control Instructions)
< SH-080040 (13JF59) >
Dedicated instructions for PID control
MELSEC-Q Programming/Structured Programming
Manual (Process Control Instructions)
< SH-080316E (13JF67) >
Dedicated instructions for process control