Murata GCM1885G1H101JA16 Series User manual

GCM1885G1H101JA16_ (0603, X8G:EIA, 100pF, DC50V)
_: packaging code Reference Sheet
1.Scope
2.MURATA Part NO. System
(Ex.)
3. Type & Dimensions
(Unit:mm)
4.Rated value
5.Package
Product specifications in this catalog are as of Oct.7,2015,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
0.5 min.
(1)-1 L
1.6±0.1
(1)-2 W
0.8±0.1
e
Chip Monolithic Ceramic Capacitor for Automotive
mark
(4)
Rated
Voltage
Packaging Unit
DC 50 V
Temp. Range
(Ref.Temp.)
(8) Packaging
Temp. coeff
or Cap. Change
This product specification is applied to Chip Monolithic Ceramic Capacitor used for Automotive Electronic equipment.
(2) T
0.8±0.1
-55 to 150 °C
0±30 ppm/°C
25 to 150 °C
(25 °C)
(6)
Capacitance
Tolerance
100 pF
Specifications and Test
Methods
(Operating
Temp. Range)
±5 %
(3) Temperature Characteristics
(Public STD Code):X8G(EIA)
g
0.2 to 0.5
(5) Nominal
Capacitance
D
f180mm Reel
PAPER W8P4
4000 pcs./Reel
J
f330mm Reel
PAPER W8P4
10000 pcs./Reel
(1)L/W
Dimensions
(2)T
Dimensions
(3)Temperature
Characteristics
(4)Rated
Voltage
(5)Nominal
Capacitance
(6)Capacitance
Tolerance
(8)Packaging
Code

Control Code
GCM 18 85G 1H 101 J A16 D
GCM1885G1H101JA16-01 1

Temperature
Compensating Type High Dielectric Type
Pre-and Post-Stress 
Electrical Test
2High Temperature The measured and observed characteristics should satisfy the
Set the capacitor for 1000±12 hours at 150±3℃.
Exposure (Storage) specifications in the following table. Set for 24±2 hours at room temperature, then measure.
Appearance No marking defects
Capacitance Within ±2.5% or ±0.25pF R7/L8/R9 : Within ±10.0%
Change (Whichever is larger)
Q/D.F.
30pFmin. : Q≧1000 R7/L8 W.V.: 25Vmin. : 0.03 max.
30pFmax.: Q ≧400+20C W.V.: 16V/10V : 0.05 max.
C: Nominal Capacitance(pF) R9 : 0.075max.
I.R.
5C/5G/R7/L8 : More than 10,000Mor 500・F(Whichever is smaller)
・F(Whichever is smaller)
3 Temperature Cycling The measured and observed characteristics should satisfy the Fix the capacitor to the supporting jig in the same manner and under
specifications in the following table. the same conditions as (19). Perform cycle test according to the four
Appearance No marking defects heat treatments listed in the following table. Set for 24±2 hours at
Capacitance Within ±2.5% or ±0.25pF R7/L8/R9: Within ±10.0% room temperature, then measure
Change (Whichever is larger)
Q/D.F.
30pFmin. : Q≧1000 R7/L8 W.V.: 25Vmin. : 0.03 max. *
30pFmax.: Q ≧400+20C * GCM188R7 1E/1H 563 to 104:0.05 max.
C: Nominal Capacitance(pF) W.V.: 16V/10V : 0.05 max.
R9 : 0.05max.
I.R.
More than 10,000Mor 500・F
(Whichever is smaller)
・Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10 ℃for one hour and then set
for 24±2 hours at room temperature.
Perform the initial measurement.
4 Destructive No defects or abnormalities Per EIA-469.
Physical Analysis
5 Moisture Resistance The measured and observed characteristics should satisfy the
Apply the 24-hour heat (25 to 65℃) and humidity (80 to 98%)
specifications in the following table.
treatment shown below, 10 consecutive times.
Appearance No marking defects
Set for 24±2 hours at room temperature, then measure.
Capacitance Within ±3.0% or ±0.30pF R7/L8/R9 : Within ±12.5%
Change (Whichever is larger)
Q/D.F.
30pFmin. : Q≧350 R7/L8 : W.V.: 35Vmin.: 0.03 max.
10pF and over, 30pF and below: W.V.: 25Vmax. : 0.05 max.
Q≧275+5C/2 R9 : 0.075max.
10pFmax.: Q ≧200+10C
C: Nominal Capacitance(pF)
I.R.
5C/5G/R7/L8 : More than 10,000Mor 500・F(Whichever is smaller)
・F(Whichever is smaller)
6Biased Humidity The measured and observed characteristics should satisfy the

specifications in the following table.
at 85±3℃and 80 to 85% humidity for 1000±12 hours.
Appearance No marking defects
Remove and set for 24±2 hours at room temperature, then measure.
Capacitance Within ±3.0% or ±0.30pF R7/L8/R9: Within ±12.5%
The charge/discharge current is less than 50mA.
Change (Whichever is larger)
Q/D.F.
30pF and over: Q≧200 R7/L8 W.V.: 35Vmin.: 0.035 max.*
30pF and below: Q≧100+10C/3 * GCM188L81H221 to 103 : 0.05 max.
C: Nominal Capacitance(pF) W.V.: 25Vmax. : 0.05 max.
R9 : 0.075max.
I.R.
More than 1,000Mor 50・F
(Whichever is smaller)
■AEC-Q200 Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
AEC-Q200 Test Method
Specification.
1
-
Step
Time(min)
Cycles
1000(for ΔC/R7)
300(for 5G/L8/R9)
1
15±3
-55℃+0/-3
-55℃+0/-3
2
1
Room
Room
3
15±3
125℃+3/-0
150℃+3/-0
4
1
Room
Room
One cycle 24hours
Hours
Initial measuremt
+10
- 2 ℃
Humidity
90～98%
Humidity
80～98%
Humidity
80～98%
Humidity
90～98%
Humidity
90～98%
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
Temperature
70
65
60
55
50
45
40
35
30
25
20
15
10
5
0
-5
-10
(℃)
JEMCGS-0363T 2

Temperature
Compensating Type
High Dielectric Type
7 Operational Life The measured and observed characteristics should satisfy the
Apply 200% of the rated voltage for 1000±12 hours at 125±3℃
specifications in the following table.
℃(for 5G/L8/R9).
Appearance No marking defects Set for 24±2 hours at room temperature, then measure.
Capacitance Within ±3.0% or ±0.30pF R7/L8/R9: Within ±12.5% The charge/discharge current is less than 50mA.
Change (Whichever is larger)
Q/D.F.
30pFmin. : Q≧350 R7/L8 : W.V.: 35Vmin.: 0.035 max.* ・Initial measurement for high dielectric constant type.
10pF and over, 30pF and below: * GCM155R71H 562 to 223: 0.05 max. Apply 200% of the rated DC voltage for one hour at the maximum
Q≧275+5C/2 GCM188L81H221 to 103 : 0.04 max. operating temperature ±3℃. Remove and set for 24±2 hours at
10pFmax.: Q ≧200+10C W.V.: 25Vmax. : 0.05 max. room temperature. Perform initial measurement.
C: Nominal Capacitance(pF) R9 : 0.075max.
I.R.
・F
(Whichever is smaller)
8 External Visual No defects or abnormalities Visual inspection
9 Physical Dimension Within the specified dimensions Using calipers
10 Resistance to Appearance No marking defects
Per MIL-STD-202 Method 215
Solvents Capacitance Within the specified tolerance Solvent 1 : 1 part (by volume) of isopropyl alcohol
3 parts (by volume) of mineral spirits
Q/D.F.
30pFmin. : Q≧1000 R7/L8 : W.V.: 25Vmin.: 0.025 max. Solvent 2 : Terpene defluxer
30pFmax.: Q ≧400+20C W.V.: 16V/10V : 0.035 max. Solvent 3 : 42 parts (by volume) of water
C: Nominal Capacitance(pF) R9 : 0.05max.
1 part (by volume) of propylene glycol monomethyl ether
1 part (by volume) of monoethanolamine
I.R.
・F
(Whichever is smaller)
11 Mechanical Appearance No marking defects
Three shocks in each direction should be applied along 3 mutually
Shock Capacitance Within the specified tolerance
perpendicular axes of the test specimen (18 shocks).
The specified test pulse should be Half-sine and should have a
Q/D.F.
30pFmin. : Q≧1000 R7/L8 : W.V.: 25Vmin.: 0.025 max. duration :0.5ms, peak value:1500g and velocity change: 4.7m/s.
30pFmax.: Q ≧400+20C W.V.: 16V/10V : 0.035 max.
C: Nominal Capacitance(pF) R9 : 0.05max.
I.R.
・F
(Whichever is smaller)
12 Vibration Appearance No defects or abnormalities
Solder the capacitor to the test jig (glass epoxy board) in the same
Capacitance Within the specified tolerance
manner and under the same conditions as (19). The capacitor
should be subjected to a simple harmonic motion having a total
Q/D.F.
30pFmin. : Q≧1000 R7/L8 : W.V.: 25Vmin.: 0.025 max. amplitude of 1.5mm, the frequency being varied uniformly between
30pFmax.: Q ≧400+20C W.V.: 16V/10V : 0.035 max. the approximate limits of 10 and 2000Hz. The frequency range, from
C: Nominal Capacitance(pF) R9 : 0.05max. 10 to 2000Hz and return to 10Hz, should be traversed in
approximately 20 minutes. This motion should be applied for 12
I.R.
・Fitems in each 3 mutually perpendicular directions (total of 36 times).
(Whichever is smaller)
13 Resistance to The measured and observed characteristics should satisfy the
Immerse the capacitor in a eutectic solder solution at 260±5℃for
Soldering Heat specifications in the following table.
10±1 seconds. Set at room temperature for 24±2 hours, then
Appearance No marking defects
measure.
Capacitance Within the specified tolerance
・Initial measurement for high dielectric constant type
Q/D.F.
30pFmin. : Q≧1000 R7/L8 : W.V.: 25Vmin.: 0.025 max. Perform a heat treatment at 150+0/-10 ℃for one hour and then set
30pFmax.: Q ≧400+20C W.V.: 16V/10V : 0.035 max. for 24±2 hours at room temperature.
C: Nominal Capacitance(pF) R9 : 0.05max. Perform the initial measurement.
I.R. ・F
(Whichever is smaller)
■AEC-Q200 Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
AEC-Q200 Test Method
Specification.
JEMCGS-0363T 3

Temperature
Compensating Type High Dielectric Type
14 Thermal Shock The measured and observed characteristics should satisfy the
Fix the capacitor to the supporting jig in the same manner and under
specifications in the following table.
the same conditions as (19). Perform the 300 cycles according to
Appearance No marking defects
the two heat treatments listed in the following table(Maximum
Capacitance Within ±2.5% or ±0.25pF R7/L8/R9: Within ±10.0%
transfer time is 20 seconds). Set for 24±2 hours at room
Change (Whichever is larger)
temperature, then measure
Q/D.F.
30pFmin. : Q≧1000 R7/L8 : W.V.: 25Vmin.: 0.03 max.*
30pFmax.: Q ≧400+20C * GCM188R7 1E/1H 563 to 104:0.05 max.
C: Nominal Capacitance(pF) W.V.: 16V/10V : 0.05 max.
R9 : 0.075max
I.R.
・F
(Whichever is smaller)
・Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10 ℃ for one hour and then set
for 24±2 hours at room temperature.
Perform the initial measurement.
15 ESD Appearance No marking defects
Per AEC-Q200-002
Capacitance Within the specified tolerance
Q/D.F.
30pFmin. : Q≧1000 R7/L8 : W.V.: 25Vmin.: 0.025 max.
30pFmax.: Q ≧400+20C W.V.: 16V/10V :0.035 max.
C: Nominal Capacitance(pF) R9 : 0.05max.
I.R.
・F
(Whichever is smaller)
16 Solderability
(a) Preheat at 155℃for 4 hours. After preheating, immerse the
capacitor in a solution of ethanol(JIS-K-8101) and rosin (JIS-K-
5902) (25% rosin in weight proportion). Immerse in
eutectic solder solution for 5+0/-0.5 seconds at 235±5℃.
(b) should be placed into steam aging for 8 hours±15 minutes.
After preheating, immerse the capacitor in a solution of
ethanol(JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in weight
proportion). Immerse in eutectic solder solution for 5+0/-0.5
seconds at 235±5℃.
(c) should be placed into steam aging for 8 hours±15 minutes.
After preheating, immerse the capacitor in a solution of
ethanol(JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in weight
proportion). Immerse in eutectic solder solution for 120±5
seconds at 260±5℃.
17 Electrical Appearance No defects or abnormalities Visual inspection.
Chatacteri- Capacitance Within the specified tolerance
The capacitance/Q/D.F. should be measured at 25℃at the
zation
frequency and voltage shown in the table.
Q/D.F.
30pFmin. : Q≧1000 R7/L8 : W.V.: 25Vmin.: 0.025 max.
30pFmax.: Q ≧400+20C W.V.: 16V/10V : 0.035 max.
C: Nominal Capacitance(pF) R9 : 0.05max.
I.R. 25℃・F・FThe insulation resistance should be measured with a DC voltage not
(Whichever is smaller) (Whichever is smaller)
exceeding the rated voltage at 25℃and 125℃
150℃(for 5G/L8/R9) within 2 minutes of charging.
I.R. 125℃・F・F
(Whichever is smaller) (Whichever is smaller)
I.R. 150℃・F・F
(Whichever is smaller) (Whichever is smaller)
Dielectric No failure No failure should be observed when 250% of the rated voltage is
Strength applied between the terminations for 1 to 5 seconds, provided the
charge/ discharge current is less than 50mA.
95% of the terminations is to be soldered evenly and continuously.
■AEC-Q200 Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
AEC-Q200 Test Method
Specification.
Step
1
2
Temp.
(℃）
-55+0/-3
125+3/-0 
150+3/-0 (for 5G/L8/R9)
Time
(min.)
15±3
15±3
Char.
Item
ΔC,5G
(1000 pF and below)
ΔC,5G
(more than 1000pF)
R7,R9,L8
(C≦10μF)
Frequency
1±0.1MHz
1±0.1kHz
Voltage
0.5 to 5Vrms
1±0.2Vrms
JEMCGS-0363T 4

Temperature
Compensating Type
High Dielectric Type
18 Board Flex Appearance No marking defects
Solder the capacitor on the test jig (glass epoxy board) shown in
Fig1 using a eutectic solder. Then apply a force in the direction
Capacitance Within ±5.0% or ±0.5pF R7/L8/R9: Within ±10.0%
shown in Fig 2 for 5±1sec. The soldering should be done by the
Change (Whichever is larger)
reflow method and should be conducted with care so that the
Q/D.F.
30pFmin. : Q≧1000 R7/L8 : W.V.: 25Vmin.: 0.025 max. soldering is uniform and free of defects such as heat shock.
30pFmax.: Q ≧400+20C W.V.: 16V/10V : 0.035max.
C: Nominal Capacitance(pF) R9 : 0.05max.
I.R.
・F
(Whichever is smaller)
19 Terminal Appearance No marking defects Solder the capacitor to the test jig (glass epoxy board) shown in
Strength Fig.3 using a eutectic solder. Then apply *18N force in parallel with
Capacitance Within specified tolerance the test jig for 60sec.
The soldering should be done either with an iron or using the reflow
Q/D.F.
30pFmin. : Q≧1000 R7/L8 : W.V.: 25Vmin.: 0.025 max. method and should be conducted with care so that the soldering is
30pFmax.: Q ≧400+20C W.V.: 16V/10V : 0.035max. uniform and free of defects such as heat shock
C: Nominal Capacitance(pF) R9 : 0.05max.
I.R.
・F
(Whichever is smaller)
(in mm)
Fig.3
20 Beam Load Test Destruction value should be exceed following one. Place the capacitor in the beam load fixture as Fig 4.
< Chip L dimension : 2.5mm max. > Apply a force.
< Chip Length : 2.5mm max. >
< Chip L dimension : 3.2mm min. >
< Chip Length : 3.2mm min. >
Fig.4
Speed supplied the Stress Load : *0.5mm/s
*GCM03: 0.1mm/s
■AEC-Q200 Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
AEC-Q200 Test Method
Specification.
Chip thickness = 0.3mm rank : 5N
Chip thickness < 1.25mm rank : 15N
Chip thickness ≧1.25mm rank : 54.5N
Chip thickness < 0.3mm rank : 2.5N
Chip thickness > 0.5mm rank : 20N
Chip thickness = 0.5mm rank : 8N
t : 1.6mm
*2N(GCM03/15)
Type
a
b
c
GCM03
0.3
0.9
0.3
GCM15
0.5
1.5
0.6
GCM18
0.6
2.2
0.9
GCM21
0.8
3.0
1.3
GCM31
2.0
4.4
1.7
GCM32
2.0
4.4
2.6
(in mm)
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
100
40
a
c
b
f4.5
c
Fig.1
Type
a
b
c
GCM03
0.3
0.9
0.3
GCM15
0.4
1.5
0.5
GCM18
1.0
3.0
1.2
GCM21
1.2
4.0
1.65
GCM31
2.2
5.0
2.0
GCM32
2.2
5.0
2.9
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
a
a
c
b
ﾗﾝﾄﾞ
f4.5
c
Solder resist
Baked electrode or
Copper foil
b
t: 1.6mm
(GCM03/15: 0.8mm)
Iron Board
45
45
Flexure：≦2
(High Dielectric Type)
Capacitance meter
Pressurizing
speed:1.0mm/s
Pressurize
支持台
ｺﾝﾃﾞﾝｻ
45
45
Fig.2
Flexure：≦3
(Temperature
Compensating Type)
R4
20
114
L
0.6L
JEMCGS-0363T 5

Temperature
Compensating Type
High Dielectric Type
21 Capacitance Capacitance Within the specified tolerance. R7 : Within ±15% The capacitance change should be measured after 5 min. at
Temperature Change (Table A) (-55℃to +125℃)each specified temperature stage.
Characteristics L8 : Within ±15% (1)Temperature Compensating Type
(-55℃to +125℃)The temperature coefficient is determined using the capacitance
Within +15/-40% measured in step 3 as a reference. When cycling the temperature
(+125℃to +150℃)℃to +125℃,
R9 : Within ±15%
5G:+25℃to +150℃other temp. coeffcient.:+25℃to +85℃) the
(-55℃to +150℃) capacitance should be within the specified tolerance for the
temperature coefficient and capacitance change as Table A-1. The
capacitance drift is calculated by dividing the differences
between the maximum and minimum measured values in the step
Temperature Within the specified tolerance. 1,3 and 5 by the cap value in step 3.
Coefficient (Table A)
Capacitance Within ±0.2% or ±0.05 pF
Drift (Whichever is larger.)
(2) High Dielectric Constant Type
The ranges of capacitance change compared with the above 25℃
value over the temperature ranges shown in the table should be
within the specified ranges.
･Initial measurement for high dielectric constant type.
Perform a heat treatment at 150+0/-10℃for one hour
and then set for 24±2 hours at room temperature.
Perform the initial measurement.
■AEC-Q200 Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
AEC-Q200 Test Method
Specification.
Step
Temperature.(C)
1
25±2
2
-55±3
3
25±2
4
125±3（）, 150±3（for 5G/R9/L8）,85±3（for other TC）
5
25±2
Table A
Char.
Nominal Values
(ppm/C)
Capacitance Change from 25C (%)
-55
-30
-10
Max.
Min.
Max.
Min.
Max.
Min.
5C/5G
0± 30
0.58
-0.24
0.40
-0.17
0.25
-0.11
Note 1: Nominal values denote the temperature coefficient within a range of 25C to 125C(for C)/ 150C(for 5G).
JEMCGS-0363T 6

1.Tape Carrier Packaging(Packaging Code:D/E/W/F/L/J/K)
1.1 Minimum Quantity(pcs./reel)
 
Plastic Tape Paper Tape Plastic Tape
Code:D/E Code:W Code:L Code:J/ F Code:K
GCM03
15000(W8P2) 30000(W8P1) 50000(W8P2)
5 (Dimensions Tolerance:±0.05)
10000(W8P2) 20000(W8P1) 50000(W8P2)
5 (Dimensions Tolerance:±0.1min.)
10000(W8P2) 40000(W8P2)
GCM18
4000 10000
64000 10000
94000 10000
B3000 10000
64000 10000
94000 10000
M3000 10000
C2000 6000
94000 10000
M3000 10000
N2000 8000
R/D/E 1000 4000
M1000 5000
GCM43
N/R 1000 4000
E500 2000
M1000 5000
N/R 1000 4000
1.2 Dimensions of Tape
(1)GCM03/15 <Paper Tape W8P2 CODE:D/E/J/F> (in mm)
LW Dimensions
Tolerance(Chip)
GCM03 ±0.03 0.37 0.67 0.5 max.
±0.05 0.65 1.15
±0.1 0.70 1.20
±0.2 0.75 1.35
(2)GCM03/15 <Paper Tape W8P1 CODE:W> (in mm)
LW Dimensions
Tolerance(Chip)
GCM03 ±0.03 0.37 0.67 0.5以下
GCM15 ±0.05 0.65 1.15 0.8以下
GCM15
GCM55
Paper Tape
Type
GCM32
Package
GCM Type
GCM31
GCM21
Type
A *3
B *3
t
GCM15
0.8 max.
*3 Nominal value
Type
A *
B *
t
* Nominal value
Code GCM03 GCM15
A * 0.37 0.65
B * 0.67 1.15 * Nominal value
ｔ0.5 max. 0.8 max.
*1,2：2.0±0.05
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
4.0±0.1
*1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
t
*2
0.05 max.
1.0±0.05
4.0±0.1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
t
1.0±0.05
JEMCGP-01894F 7

(3)GCM18/21/31/32 <Paper Tape> (in mm)
LW Dimensions
T Dimensions
Tolerance(Chip) (Chip)
GCM18 8 ±0.1 0.8±0.1 1.05±0.10 1.85±0.10
6 ±0.15 0.6±0.1
9 ±0.15 0.85±0.1
GCM31 9 ±0.15 0.85±0.1 2.00±0.20 3.60±0.20
GCM32
9 L:±0.3/W:±0.2 0.85+0.15/-0.05 2.80±0.20 3.60±0.20
(4)GCM21/31/32 <Plastic Tape> (in mm)
LW Dimensions
T Dimensions
Tolerance(Chip) (Chip)
±0.15 1.25±0.15 1.45±0.20 2.25±0.20
±0.2 1.25±0.2 1.50±0.20 2.30±0.20
±0.15 1.15±0.1
±0.2 1.15±0.15
±0.2 1.6±0.2
±0.3 1.6±0.3 2.10±0.20 3.60±0.20
M 1.15±0.1 1.7 max.
N 1.35±0.15 2.5 max.
R 1.8±0.2
D 2.0±0.2
E 2.5±0.2 3.7 max.
(5)GCM43/55 <Plastic Tape> (in mm)
A *1 B *1
3.6 4.9
5.2 6.1 *1 Nominal value
t
1.1 max.
GCM21
2.30±0.15
A
B
Package
GCM Type
Type
A
B
t
GCM21
B
2.0 max.
1.55±0.15
Type
3.0 max.
Type
t
GCM31
M
1.90±0.20
3.50±0.20
1.7 max.
C
2.5 max.
GCM43
2.5 max.(T≦1.8mm)
3.7 max.(T : 2.5mm)
GCM55
GCM32
L:±0.3
W:±0.2
2.80±0.20
3.50±0.20
GC□21 GC□21 GC□31 GC□31 GC□32
Code (Dimensions Tolerance: (Dimensions Tolerance: (Dimensions Tolerance: (Dimensions Tolerance:
±0.15) ±0.2) ±0.2 within) ±0.3)
A 1.45±0.2 1.5±0.2 1.9±0.2 2.1±0.2 2.8±0.2
B 2.25±0.2 2.3±0.2 3.5±0.2 3.6±0.2 3.5±0.2
Code GC□18 GC□21 GC□31 GC□32
A 1.05±0.1 1.55±0.15 2.0±0.2 2.8±0.2
B 1.85±0.1 2.3±0.15 3.6±0.2 3.6±0.2
Code GC□43 GC□55
A *2 3.6 5.2 *2 Nominal value
B *2 4.9 6.1
4.0±0.1
4.0±0.1
2.0±0.1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
1.1 max.
Ａ
Ｂ
8.0±0.3
4.0±0.1
3.5±0.05
1.75±0.1
Ａ
Ｂ
＊
2.0±0.1
φ1.5
+0.1
-0
＊
1.7 max.(T≦1.25mm)
2.5 max. (T:1.35/1.6mm)
3.0 max. (T:1.8/2.0mm)
3.7 max. (T≧2.5mm)
4.0±0.1
0.25±0.1(T≦2.0mm)
0.3±0.1(T：2.5mm)
φ1.5
+0.1
-0
4.0±0.1
8.0±0.1
φ1.5
+0.2
-0
12.0±0.3
5.5±0.1
1.75±0.1
Ａ
*
Ｂ
t
*：2.0±0.1
0.3±0.1
4.0±0.1
4.0±0.1
2.0±0.1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
t
Ａ
Ｂ
8.0±0.3
4.0±0.1
3.5±0.05
1.75±0.1
Ａ
Ｂ
t
2.0±0.1
φ1.5
+0.1
-0
4.0±0.1
0.25±0.1(T≦2.0mm)
0.3±0.1 (T：2.5mm)
JEMCGP-01894F 8

Package
GCM Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)

ｗ1
W
Top Tape : Thickness 0.06
Feeding Hole :As specified in 1.2.
Hole for Chip : As specified in 1.2.
Base Tape : As specified in 1.2.
Bottom Tape :Thickness 0.05
(Only a bottom tape existence )
W
w1
GCM32 max.
16.5 max.
10±1.5
GCM43/55
20.5 max.
14±1.5
-3.0

 min.

2.0±0.5
Chip
(in mm)
Fig.1 Package Chips
Fig.2 Dimensions of Reel
Fig.3 Taping Diagram
JEMCGP-01894F 9

1.3 Tapes for capacitors are wound clockwise shown in Fig.3.
(The sprocket holes are to the right as the tape is pulled toward the user.)
1.4 Part of the leader and part of the vacant section are attached as follows.
(in mm)
1.5 Accumulate pitch : 10 of sprocket holes pitch = 40±0.3mm
1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.
1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.
1.8 There are no jointing for top tape and bottom tape.
1.9 There are no fuzz in the cavity.
1.10 Break down force of top tape : 5N min.
Break down force of bottom tape : 5N min. (Only a bottom tape existence )
1.11 Reel is made by resin and appearance and dimension is shown in Fig 2.
There are possibly to change the material and dimension due to some impairment.
1.12 Peeling off force : 0.1N to 0.6N*in the direction as shown below.
* GCM03:0.05N to 0.5N
1.13 Label that show the customer parts number, our parts number, our company name, inspection
number and quantity, will be put in outside of reel.
Package
GCM Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
Tail vacant Section
Chip-mounting Unit
Leader vacant Section
Leader Unit
(Top Tape only)
Direction
of Feed
160 min.
190 min.
210 min.
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
165～180°
Top tape
JEMCGP-01894F 10