Murata GJM0335C1H3R1BB01 Series User manual

GJM0335C1H3R1BB01_ (0201, C0G:EIA, 3.1pF, DC50V)
_: packaging code Reference Sheet
1.Scope
2.MURATA Part NO. System
(Ex.)
3. Type & Dimensions
(Unit:mm)
4.Rated value
5.Package
Product specifications in this catalog are as of Mar.8,2017,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
(3) Temperature Characteristics
(Public STD Code):C0G(EIA)
g
0.1 to 0.2
(5) Nominal
Capacitance
mark
(4)
Rated
Voltage
Packaging Unit
DC 50 V
Temp. Range
(Ref.Temp.)
(8) Packaging
0±30 ppm/°C
25 to 125 °C
(25 °C)
Only Reflow Soldering
0.2 min.
(1)-1 L
0.6±0.03
(1)-2 W
0.3±0.03
This product specification is applied to Chip Monolithic Ceramic Capacitor High-Q Type used for General Electronic equipment.
This product is applied for Only Reflow Soldering.
(2) T
e
Chip Monolithic Ceramic Capacitor High-Q Type for General
Specifications and Test
Methods
(Operating
Temp. Range)
Temp. coeff
or Cap. Change
±0.1 pF
(6)
Capacitance
Tolerance
3.1 pF
0.3±0.03
-55 to 125 °C
J
f330mm Reel
PAPER W8P2
50000 pcs./Reel
D
f180mm Reel
PAPER W8P2
15000 pcs./Reel
W
f180mm Reel
PAPER W8P1
30000 pcs./Reel
(1)L/W
Dimensions (2)T
Dimensions (3)Temperature
Characteristics (4)Rated
Voltage (5)Nominal
Capacitance (6)Capacitance
Tolerance (8)Packaging Code

Code
GJM 03 35C 1H 3R1 B B01 D
GJM0335C1H3R1BB01-01 1

1 Rated Voltage Shown in Rated value. The rated voltage is defined as the maximum voltage
which may be applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage,
VP-P or VO-P, whichever is larger, should be maintained
within the rated voltage range.
2 Appearance No defects or abnormalities. Visual inspection.
3 Dimension Within the specified dimensions. Using Measuring instrument of dimension.
4 Voltage proof No defects or abnormalities. Measurement Point : Between the terminations
Test Voltage : 300% of the rated voltage
Applied Time : 1s to 5 s
Charge/discharge current : 50mA max.
5 Insulation Resistance(I.R.)
C≦ Measurement Point : Between the terminations
C＞ Measurement Voltage : DC Rated Voltage
C:Nominal Capacitance Charging Time : 2 min
Charge/discharge current : 50mA max.
Measurement Temperature : Room Temperature
6 Capacitance Shown in Rated value. Measurement Temperature : Room Temperature
7Q
30pF and over:Q≧1000
30pF and below:Q≧400+20C
C:Nominal Capacitance(pF)
8 Temperature Characteristics
Nominal values of the temperature coefficient is shown in Rated value.
The capacitance change should be measured after 5 minutes
of Capacitance
But,the Capacitance Change under 20℃is shown in Table A. at each specified temp. stage.
Capacitance value as a reference is the value in step 3.
Capacitance Drift
Within +/-0.2% or +/-0.05pF The capacitance drift is calculated by dividing the differences
(Whichever is larger.) between the maximum and minimum measured values in the
step 1,3 and 5 by the cap. value in step 3.
9 Adhesive Strength No removal of the terminations or other defect Solder the capacitor on the test substrate shown in Fig.3.
of Termination should occur.
Holding Time : 10+/-1s
Applied Direction : In parallel with the test substrate and vertical with
the capacitor side.
10 Vibration  Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Capacitance Within the specified initial value. Kind of Vibration : A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
Q Within the specified initial value. Total amplitude : 1.5mm
This motion should be applied for a period of 2h in each 3 mutually
perpendicular directions(total of 6h).
11 Substrate Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.1.
Bending test
Capacitance Within +/-5% or +/-0.5pF Pressurization method : Shown in Fig.2
Change (Whichever is larger) Flexure : 1mm
Holding Time : 5+/-1s
Soldering Method : Reflow soldering
12 Solderability 95% of the terminations is to be soldered evenly and continuously. Test Method : Solder bath method
Flux Solution of rosin ethanol 25(mass)%
Preheat :
80℃to 120℃for 10s to 30s
Solder : Sn-3.0Ag-0.5Cu
Solder Temp. :
245+/-5℃
Immersion time :
2+/-0.5s
■Specifications and Test Methods
No
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Type Applied Force(N)
GJM02 1
GJM03 2
GJM15 5
Step
Temperature(C)
1
Reference Temp.+/-2
2
Min. Operating Temp.+/-3
3
Reference Temp.+/-2
4
Max. Operating Temp.+/-3
5
Reference Temp.+/-2
Capacitance
Frequency
Voltage
C≦1000pF
1.0+/-0.1MHz
0.5 to 5.0Vrms
Step
Temperature(C)
1
Reference Temp.+/-2
2
Min. Operating Temp.+/-3
3
Reference Temp.+/-2
4
Max. Operating Temp.+/-3
5
Reference Temp.+/-2
JEMCGS-03120B 2

13
Resistance to Appearance No defects or abnormalities. <GJM02 size only>
Soldering Heat Test Method : Reflow soldering (hot plate)
Capacitance Within +/-2.5% or +/- 0.25pF Solder : Sn-3.0Ag-0.5Cu
Change (Whichever is larger) Solder Temp. : 270+/-5℃
Reflow Time : 10+/-0.5s
Q Within the specified initial value. Test Substrate : Glass epoxy PCB
Exposure Time : 24+/-2h
I.R. Within the specified initial value. Preheat :
120℃to 150℃for 1 min
Voltage proof No defects. <GJM03/GJM15 size>
Test Method : Solder bath method
Solder : Sn-3.0Ag-0.5Cu
Solder Temp. :
270+/-5℃
Immersion time :
10+/-0.5s
Exposure Time : 24+/-2h
Preheat :
120℃to 150℃for 1 min
14
Temperature Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Sudden Change
Capacitance Within +/-2.5% or +/- 0.25pF Perform the five cycles according to the four heat treatments
Change (Whichever is larger) shown in the following table.
Q Within the specified initial value.
I.R. Within the specified initial value.
Voltage proof No defects.
Exposure Time : 24+/-2h
15
High Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Temperature
High Humidity Capacitance Within +/-7.5% or +/-0.75pF
Test Temperature :
40+/-2℃
(Steady) Change (Whichever is larger)
Test Humidity :
90%RH to 95%RH
Test Time :
500+/-12h
Q
30pF and over : Q≧200 Applied Voltage : DC Rated Voltage
30pF and below : Q≧100+10C/3 Charge/discharge current : 50mA max.
Exposure Time :
24+/-2h
C:Nominal Capacitance(pF)
I.R. 
16 Durability Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Capacitance Within +/-3% or +/-0.3pF Test Temperature : Max. Operating Temp. +/-3℃
Change (Whichever is larger)
Test Time :
1000+/-12h
Applied Voltage : 100% of the rated voltage
Q
30pF and over : Q≧350 Charge/discharge current : 50mA max.
10pF and over , 30pF and below : Q≧275+5C/2 Exposure Time : 24+/-2h
10pF and below : Q≧200+10C
C:Nominal Capacitance (pF)
I.R. 
17 ESR
0.2pF ≦C ≦
Measurement Frequency :
1.0+/-0.1GHz
(GJM02)
1pF < C ≦ Measurement Temperature : Room Temp.
2pF < C ≦ Measurement Instrument : Equivalent to E4991A
5pF < C ≦
10pF < C ≦
C:Nominal Capacitance (pF)
ESR
0.1pF ≦C ≦
Measurement Frequency :
1.0+/-0.2GHz
(GJM03/GJM15)
1pF < C ≦ Measurement Temperature : Room Temp.
5pF < C ≦ Measurement Instrument : Equivalent to BOONTON Model 34A
C:Nominal Capacitance (pF)
10pF < C ≦
Measurement Frequency :
500+/-50MHz
Measurement Temperature : Room Temp.
Measurement Instrument : Equivalent to HP8753B
No
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Step
Temp.(C)
Time (min)
1
Min.Operating Temp.+0/-3
30+/-3
2
Room Temp.
2 to 3
3
Max.Operating Temp.+3/-0
30+/-3
4
Room Temp
2 to 3
JEMCGS-03120B 3

Recommended derating conditions on voltage and temperature
These Part Numbers are designed for use in the circuits where
continuous applied voltage to the capacitor is derated than rated
voltage, and guarantee Durability Test w ith 100% × rated voltage
as testing voltage at the maximumoperating temperature.
The voltage and temperature derating conditions on the left are
recommended for use to ensure the same reliability level as
normal specification.
Table A
Char.
Capacitance Change from Value at Reference temp. (%)
-55℃
-30
-25℃
-10℃
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Min.
1C
0.54
-0.23
-
-
0.33
-0.14
0.22
-0.09
2C
0.82
-0.45
-
-
0.49
-0.27
0.33
-0.18
3C
1.37
-0.90
-
-
0.82
-0.54
0.55
-0.36
4C
2.56
-1.88
-
-
1.54
-1.13
1.02
-0.75
5C
0.58
-0.24
0.40
-0.17
-
-
0.25
-0.11
6C
0.87
-0.48
0.59
-0.33
-
-
0.38
-0.21
JEMCGS-03120B 4

Substrate Bending test
・Test substrate
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness :0.8mm
: Solder resist
(Coat with heat resistant resin for solder)
for GJM02 for GJM03/15
Copper foil thickness : 0.018mm Copper foil thickness : 0.035mm
Fig.1 (in mm)
・Test substrate
Kind of Solder : Sn-3.0Ag-0.5Cu
・Test substrate
Pressurization method
Fig.2 (in mm)
Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)
High Temperature High Humidity(Steady) , Durability
・Test substrate
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm or 0.8mm
Copper foil thickness : 0.035mm
・Test substrate
Kind of Solder : Sn-3.0Ag-0.5Cu
・Test substrate
Land Dimensions
Fig.3
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
100
40
a
c
b
Land
f4.5
c
Type
Dimension (mm)
a
b
c
GJM02
0.2
0.56
0.23
GJM03
0.3
0.9
0.3
GJM15
0.4
1.5
0.5
c
b
a
Solder Resist
Chip Capacitor
Land
45
45
Flexure
Capacitance meter
Pressurization
speed
1.0mm/s
Support
Capacitor
Pressurize
45
45
R5
20
50 min.
Type
Dimension (mm)
a
b
c
GJM02
0.2
0.56
0.23
GJM03
0.3
0.9
0.3
GJM15
0.4
1.5
0.5
JEMCGS-03120B 5

1.Tape Carrier Packaging(Packaging Code:D/E/W/L/J/F)
1.1 Minimum Quantity(pcs./reel)

Plastic Tape Paper Tape
Code:D/E Code:W Code:L Code:J/F
GJM02
40000 (W4P1)
GJM03
15000(W8P2) 30000(W8P1) 50000(W8P2)
GJM15 10000(W8P2) 20000(W8P1) 50000(W8P2)
1.2 Dimensions of Tape (in mm)
(1)GJM02 <Plastic Tape W4P1 CODE:L>
L W T
GJM02 2 0.4±0.02 0.2±0.02 0.2±0.02 0.23 0.43 0.5 max.
*3 Nominal value
(2)GJM03/GJM15 <Paper Tape W8P2 CODE:D/E/J/F> (in mm)
L W T
GJM03 3 0.6±0.03 0.3±0.03 0.3±0.03 0.37 0.67 0.5 max.
GJM15 5 1.0±0.05 0.5±0.05 0.5±0.05 0.65 1.15 0.8 max.
*3 Nominal value
Type
Dimensions(Chip)
A *3
B *3
t
B *3
t
Type
Dimensions(Chip)
A *3
Package
GJM Type
Type

Paper Tape
*1,*2：1.0±0.02
2.0±0.04
*1
0.9±0.05
4.0±0.05
1.8±0.02
Ａ
Ｂ
t
*2
0.05 max.
φ0.8±0.04
0.15～0.25
*1,2：2.0±0.05
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
4.0±0.1
*1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
t
*2
0.05 max.
JEMCGP-01914B 6

(3)GJM03/GJM15 <Paper Tape W8P2 CODE:W> (in mm)
L W T
GJM03 3 0.6±0.03 0.3±0.03 0.3±0.03 0.37 0.67 0.5 max.
GJM15 5 1.0±0.05 0.5±0.05 0.5±0.05 0.65 1.15 0.8 max.
*3 Nominal value
Package
GJM Type
Type
Dimensions(Chip)
A *3
B *3
t
1.0±0.05
4.0±0.1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
t
1.0±0.05
JEMCGP-01914B 7

Package
GJM Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)

ｗ1
W
Top Tape : Thickness 0.06
Feeding Hole :As specified in 1.2.
Hole for Chip : As specified in 1.2.
Base Tape : As specified in 1.2.
Bottom Tape :Thickness 0.05
(Only a bottom tape existence )
W
w1
GJM02
8.0 max.
5±1.5
GJM03/GJM15
16.5 max.
10±1.5
-3.0

 min.

2.0±0.5
Chip
(in mm)
Fig.1 Package Chips
Fig.2 Dimensions of Reel
Fig.3 Taping Diagram
JEMCGP-01914B 8

1.3 Tapes for capacitors are wound clockwise shown in Fig.3.
(The sprocket holes are to the right as the tape is pulled toward the user.)
1.4 Part of the leader and part of the vacant section are attached as follows.
(in mm)
1.5 Accumulate tolerance of sprocket holes pitch = ±0.3mm / 10 pitch
1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.
1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.
1.8 There are no jointing for top tape and bottom tape.
1.9 There are no fuzz in the cavity.
1.10 Break down force of top tape : 5N min.
Break down force of bottom tape : 5N min. (Only a bottom tape existence )
1.11 Reel is made by resin and appeaser and dimension is shown in Fig 1.
There are possibly to change the material and dimension due to some impairment.
1.12 Peeling off force : 0.1N to 0.6N* in the direction as shown below.
* GJM02/GJM03:0.05N to 0.5N
1.13 Label that show the customer parts number, our parts number, our company name, inspection
number and quantity, will be put in outside of reel.
Package
GJM Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
Tail vacant Section
Chip-mounting Unit
Leader vacant Section
Leader Unit
(Top Tape only)
Direction
of Feed
160 min.
190 min.
210 min.
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
165～180°
Top tape
JEMCGP-01914B 9

Caution
■Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment
⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment
⑧Disaster prevention / crime prevention equipment ⑨Data-processing equipment
⑩Application of similar complexity and/or reliability requirements to the applications listed in the above.
■Storage and Operation condition
1. The performance of chip monolithic ceramic capacitors may be affected by the storage conditions.
1-1. Store the capacitors in the following conditions:
Room Temperature of +5℃to +40℃and a Relative Humidity of 20% to 70%.
(1) Sunlight, dust, rapid temperature changes, corrosive gas atmosphere, or high temperature and humidity
conditions during storage may affect solderability and packaging performance.
Therefore, please maintain the storage temperature and humidity. Use the product within six months after receipt ,
as prolonged storage may cause oxidation of the terminations (outer electrodes).
(2) Please confirm solderability before using after six months.
Store the capacitors without opening the original bag.
Even if the storage period is short, do not exceed the specified atmospheric conditions.
1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result
in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,hydrogen
sulfide, sulfur dioxide, chlorine, ammonia gas etc.).
1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused
by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and
electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity
conditions
■Rating
1.Temperature Dependent Characteristics
1. The electrical characteristics of the capacitor can change with temperature.
1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature
changes. The following actions are recommended in order to ensure suitable capacitance values.
(1) Select a suitable capacitance for the operating temperature range.
(2) The capacitance may change within the rated temperature.
When you use a high dielectric constant type capacitor in a circuit that needs a tight (narrow) capacitance
tolerance (e.g., a time-constant circuit), please carefully consider the temperature characteristics, and
carefully confirm the various characteristics in actual use conditions and the actual system.
[Example of Temperature Caracteristics X7R(R7)] [Example of Temperature Characteristics X5R(R6)]

!
-20
-10
-15
-5
5
0
10
15
20
Temperature (C)
-75 -50 -25 025 50 75 100 125 150
Capacitance Change(%)
-20
-10
-15
-5
5
0
10
15
20
Temperature (C)
-75 -50 -25 025 50 75 100
Capacitance Change(%)
JEMCGC-2703M 10