Murata GRM188R61C105MA12 Series User manual

GRM188R61C105MA12_ (0603, X5R:EIA, 1uF, DC16V)
_: packaging code Reference Sheet
1.Scope
2.MURATA Part NO. System
(Ex.)
3. Type & Dimensions
(Unit:mm)
4.Rated value
5.Package
Product specifications in this catalog are as of May.17,2017,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
(3) Temperature Characteristics
(Public STD Code):X5R(EIA)
g
0.2 to 0.5
(5) Nominal
Capacitance
mark
(4)
Rated
Voltage
Packaging Unit
DC 16 V
Temp. Range
(Ref.Temp.)
(8) Packaging
-15 to 15 %
-55 to 85 °C
(25 °C)
0.5 min.
(1)-1 L
1.6±0.1
(1)-2 W
0.8±0.1
This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.
(2) T
e
Chip Monolithic Ceramic Capacitor for General
Specifications and Test
Methods
(Operating
Temp. Range)
Temp. coeff
or Cap. Change
±20 %
(6)
Capacitance
Tolerance
1 uF
0.8±0.1
-55 to 85 °C
D
f180mm Reel
PAPER W8P4
4000 pcs./Reel
J
f330mm Reel
PAPER W8P4
10000 pcs./Reel
(1)L/W
Dimensions (2)T
Dimensions (3)Temperature
Characteristics (4)Rated
Voltage (5)Nominal
Capacitance (6)Capacitance
Tolerance (8)Packaging Code

Code
GRM 18 8R6 1C 105 M A12 D
GRM188R61C105MA12-01 1

■Specifications and Test Methods
No
1 Rated Voltage Shown in Rated value. The rated voltage is defined as the maximum voltage which may be
applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage, VP-P or VO-P,
whichever is larger, should be maintained within the rated voltage
range.
2 Appearance No defects or abnormalities. Visual inspection.
3 Dimension Within the specified dimensions. Using calipers. (GRM02 size is based on Microscope)
4 Voltage proof No defects or abnormalities.
Measurement Point :
Between the terminations
Test Voltage :
250% of the rated voltage
Applied Time :
1 to 5 s
Charge/discharge current :
50mA max.
5 Insulation Resistance(I.R.) 
Measurement Point : Between the terminations
Measurement Voltage :
DC Rated Voltage
Charging Time :
1 min
Charge/discharge current :
50mA max.
Measurement Temperature :
Room Temperature
6 Capacitance Shown in Rated value.
Measurement Temperature :
Room Temperature
7 Dissipation Factor (D.F.) B1,R1,B3,R6,R7,C6,C7,C8,E7,D7 : 0.1 max.
D8,GRM31CR60J107 : 0.15 max
GRM31CR71E106 : 0.125 max
*1 For items listed in Table 1 on the left, the capacitance should
be measured using a voltage of 0.5+/-0.1Vrms instead of
1.0+/-0.2Vrms.
*2 For item GRM188R70J105, the capacitance should be measured
using a voltage of 1.0+/-0.2Vrms instead of 0.5+/-0.1Vrms.
8
Temperature No bias B1,B3 : Within +/-10% (-25°C to +85°C) The capacitance change should be measured after 5 min.
Characteristics R1,R7 : Within +/-15% (-55°C to +125°C) at each specified temp. stage.
of Capacitance R6 : Within +/-15% (-55°C to +85°C) In case of applying voltage, the capacitance change should be
C6 : Within +/-22% (-55°C to +85°C) measured after 1 min. with applying voltage in equilibration of
C7 : Within+/-22% (-55°C to +125°C) each temp. stage.
C8 : Within +/-22% (-55°C to +105°C) Capacitance value as a reference is the value in step 3.
E7 : Within +22/-56% (-55°C to +125°C)
D7 : Within +22/-33% (-55°C to +125°C) · Measurement Voltage
D8 : Within +22/-33% (-55°C to +105°C) GRM152 B3 0J 104/224, GRM155 B1 0J 124 to 334,
GRM155 B3 0J 394 to 824, GRM155 B3 1A 124 to 105,
GRM188B10G106, GRM21BB10J106 only : 0.20+/-0.05Vrms
GRM21B R7 1A/1C 475 K/M E51, GRM219 R7 1A/1C 225
50% of B1: Within +10/-30% only : 0.5+/-0.1Vrms
the rated R1: Within +15/-40% GRM188R61H474 only : 1.5+/-0.3Vrms
voltage
･Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
9 Adhesive Strength No removal of the terminations or other defect Solder the capacitor on the test substrate shown in Fig.3.
of Termination should occur.
Holding Time : 10+/-1s
Applied Direction : In parallel with the test substrate and vertical with the
capacitor side.
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Type Applied Force(N)
GRM02 1
GRM03 2
GRM15/GRM18 5
GRM21/GRM31/GRM32 10
Step
Temperature(C)
Applying Voltage(VDC)
1
Reference Temp.+/-2
No bias
2
Min.Operating Temp. +/-3
3
Reference Temp. +/-2
4
Max.Operating Temp. +/-3
5
Reference Temp. +/-2
50% of
the rated voltage
(For B1,R1)
6
Min.Operating Temp. +/-3
7
Reference Temp. +/-2
8
Max.Operating Temp.+/-3
*Table 1
GRM033 B3/R6 1A 123 to 823
GRM033 B3/R6 1A 104
GRM155 B3/R6 1A124 to 105
GRM185 B3/R6 1C/1A105
GRM185 C8/D7 1A 105
GRM188 B3/R6 1C/1A225
GRM188 R7/C8/D7 1A 225
GRM188 B3/R6 1A 335
GRM219 B3/R6 1C/1A475
GRM219 C8 1A 475
GRM219 B3/R6 1A 106
GRM21B B3/R6 1D/1C/1A 106
GRM21B R7/C8 1A 106
GRM319 B3/R6 1C/1A106
Capacitance
Frequency
Voltage
*1 C≦
(10V min.)
1.0+/-0.1kHz
1.0+/-0.2Vrms
*2 C≦
(6.3V max.)
1.0+/-0.1kHz
0.5+/-0.1Vrms
C＞
120+/-24Hz
0.5+/-0.1Vrms
JEMCGS-00019G 2

No
10 Vibration  Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Capacitance Within the specified initial value.
D.F. Within the specified initial value.
Kind of Vibration :
A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
Total amplitude :
1.5mm
This motion should be applied for a period of 2h in each 3 mutually
perpendicular directions(total of 6h).
11 Substrate Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.1.
Bending test
Capacitance Within +/-10% Pressurization method : Shown in Fig.2
Change Flexure : 1mm
Holding Time :
5+/-1s
Soldering Method :
Reflow soldering
12 Solderability 95% of the terminations is to be soldered evenly and
Test Method :
Solder bath method
continuously. Flux Solution of rosin ethanol 25(wt)%
Preheat :
80℃to 120℃for 10s to 30s
Solder : Sn-3.0Ag-0.5Cu
Solder Temp. :
245+/-5℃
Immersion time
:
2+/-0.5s
13
Resistance Appearance No defects or abnormalities. <GRM03 size min.>
to Test Method : Solder bath method
Soldering Solder : Sn-3.0Ag-0.5Cu
Heat Solder Temp. :
270+/-5℃
Immersion time
:
10+/-0.5s
Capacitance B1,R1,B3,R6,R7,C6,C7,C8,E7,D7,D8 : Within +/-7.5% Exposure Time : 24+/-2h
Change GRM188B30J106M : Within +/-12.5% Preheat : GRM31 size max.: 120℃to 150℃for 1 min
GRM32 size : 100℃to 120℃for 1 min
and 170℃to 200℃for 1 min
· Initial measurement
D.F. Within the specified initial value. Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
<GRM02 size only>
Test Method : Reflow soldering (hot plate)
I.R. Within the specified initial value. Solder : Sn-3.0Ag-0.5Cu
Solder Temp. :
270+/-5℃
Reflow Time : 10+/-0.5s
Test Substrate : Glass epoxy PCB
Voltage proof No defects. Exposure Time : 24+/-2h
Preheat :
120℃to 150℃for 1 min
· Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
14
Temperature Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Sudden Change Perform the five cycles according to the four heat treatments
shown in the following table.
Capacitance B1,R1,B3,R6,R7,C6,C7,C8,D7,D8 : Within +/-7.5%
Change E7 : Within +/-30%
D.F. Within the specified initial value.
I.R. Within the specified initial value. Exposure Time : 24+/-2h
· Initial measurement
Voltage proof No defects. Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
·GRM188B30J106M Measurement after test:
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
15 High Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Temperature
Test Temperature :
40+/-2℃
High
Test Humidity :
90%RH to 95%RH
Humidity Capacitance Within +/-12.5%
Test Time :
500+/-12h
(Steady) Change
Applied Voltage :
DC Rated Voltage
Charge/discharge current : 50mA max.
D.F. 0.2 max.
· Initial measurement
I.R.  Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
· Measurement after test
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Step
Temp.(C)
Time
(min)
1
Min.Operating Temp.+0/-3
30+/-3
2
Room Temp
2 to 3
3
Max.Operating Temp.+3/-0
30+/-3
4
Room Temp
2 to 3
JEMCGS-00019G 3

No
16 Durability Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Test Temperature :
Max. Operating Temp. +/-3℃
Capacitance Within +/-12.5%
Test Time :
1000+/-12h
Change
Applied Voltage :
125% of the rated voltage
Charge/discharge current : 50mA max.
D.F. 0.2 max. · Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
I.R.  · Measurement after test
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
Recommended derating conditions on voltage and temperature
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
These Part Numbers are designed for use in the circuits where
continuous applied voltage to the capacitor is derated than rated
voltage, and guarantee Durability Test with 125% × rated voltage
as testing voltage at the maximumoperating temperature.
The voltage and temperature derating conditions on the left are
recommended for use to ensure the same reliability level as
normal specification.
JEMCGS-00019G 4

Test method : Substrate Bending test
・Test substrate
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm (GRM02/GRM03/GRM15: t:0.8mm)
Copper foil thickness : 0.035mm
: Solder resist
(Coat with heat resistant resin for solder)
Fig.1 (in mm)
・Kind of Solder : Sn-3.0Ag-0.5Cu
・Pressurization method
Fig.2 (in mm)
Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)
High Temperature High Humidity(Steady) , Durability
・Test substrate
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm or 0.8mm
Copper foil thickness : 0.035mm
・Kind of Solder : Sn-3.0Ag-0.5Cu
・Land Dimensions
Fig.3
c
b
a
Solder Resist
Chip Capacitor
Land
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
100
40
a
c
b
Land
f4.5
c
Type
Dimension (mm)
a
b
c
GRM02
0.2
0.56
0.23
GRM03
0.3
0.9
0.3
GRM15
0.4
1.5
0.5
GRM18
1.0
3.0
1.2
GRM21
1.2
4.0
1.65
GRM31
2.2
5.0
2.0
GRM32
2.2
5.0
2.9
45
45
Flexure
Capacitance meter
Pressurization
speed
1.0mm/s
Support
Capacitor
Pressurize
45
45
R5
20
50 min.
Type
Dimension (mm)
a
b
c
GRM02
0.2
0.56
0.23
GRM03
0.3
0.9
0.3
GRM15
0.4
1.5
0.5
GRM18
1.0
3.0
1.2
GRM21
1.2
4.0
1.65
GRM31
2.2
5.0
2.0
GRM32
2.2
5.0
2.9
JEMCGS-00019G 5

1.Tape Carrier Packaging(Packaging Code:D/E/W/L/J/F/K)
1.1 Minimum Quantity(pcs./reel)
1.2 Dimensions of Tape
(1)GRM01/GRM02 (W4P1 CODE:L) (in mm)
Package
GRM Type
1
*3 Nominal value
0.2±0.05
0.2±0.05
0.26
0.46
0.4 max.
GRM02
2
0.4±0.02
0.2±0.02
0.2±0.02
0.23
0.43
0.5 max.
0.4±0.05
GRM01
0.25±0.013
0.125±0.013
0.125±0.013
0.145
0.27
Type
Dimensions(Chip)
A*3
B *3
t
L
W
T
t
2.0±0.04
＊2
＊1
φ0.8±0.04
0.9±0.05
4.0±0.05
1.8±0.02
＊1,2：1.0±0.02
0.05以下
Ａ
Ｂ
0.15～0.4
*1,2：1.0±0.02
2.0±0.04
*1
0.9±0.05
4.0±0.05
1.8±0.02
Ａ
Ｂ
t
*2
0.05 max.
φ0.8±0.04
0.15～0.25
3
5


Paper Tape
Plastic Tape
Paper Tape
Plastic Tape
Code:D/E
Code:W
Code:L
Code:J/ F
Code:K
GRM01
50000(W4P1)
GRM02
40000(W4P1)
15000(W8P2)
50000(W8P2)
GRM03
2
15000(W8P2)
50000(W8P2)
15000(W8P2)
30000(W8P1)
50000(W8P2)
50000(W8P2)
GRM15
2
20000(W8P2)
50000(W8P2)
3/X
10000(W8P2)
50000(W8P2)
50000(W8P2)
5(LWTDimensions Tolerance:±0.1min.)
10000(W8P2)
40000(W8P2)
5 (LW Dimensions Tolerance:±0.1min.
and TDimensions Tolerance:±0.05)
10000(W8P2)
50000(W8P2)
5(LW Dimensions Tolerance:±0.2
and TDimensions:0.5 +0/-0.1)
10000(W8P2)
40000(W8P2)
GRM18/GRMJN
4000
10000
GRM21
6
4000
10000
A/B
3000
9
4000
3000
10000
10000
10000
GRM31
6/9
4000
10000
B/M/X
3000
10000
C
2000
6000
GRM32
9
4000
10000
A/M
3000
10000
N
2000
8000
C
2000
6000
R/D/E
1000
4000
GRM43
M
1000
E
500
5000
N/R/D
1000
4000
500
2000
S
500
1500
4000
GRM55
M
1000
E
F
300
1500
50000(W8P2)
5000
N/R/D
1000
5(LWTDimensions Tolerance:±0.05)
GRMMD
Type
5(LWTDimensions Tolerance:±0.07)
10000(W8P2)
10000(W8P2)
20000(W8P1)
10000(W8P2)
JEMCGP-01796G 6

(2)GRMMD/GRM03/GRM15(W8P2 CODE:D/E/J/F) (in mm)
L W
T
GRMMD
X 0.5±0.025 0.25±0.025 0.25±0.025 0.32 0.58
0.6±0.03 0.3±0.03 0.2 +0.02/-0.04 0.37 0.67
0.6±0.09 0.3±0.09 0.2±0.02 0.42 0.72
0.6±0.03 0.3±0.03 0.3±0.03 0.37 0.67
0.6±0.05 0.3±0.05 0.3±0.05 0.39 0.69
0.3±0.09 0.6 max.
5 0.5±0.05
2 0.2 +0.02/-0.04
X 0.25±0.05
1.0±0.2 0.5±0.2 0.78 1.29
1.0±0.05 0.5±0.05 0.5±0.05
1.0±0.07 0.5±0.07 0.5±0.07
1.0±0.1 0.5±0.1 0.5±0.1 0.70 1.20
1.0±0.15 0.5±0.15 0.5±0.15 0.72 1.25
0.5 +0/-0.1
0.5±0.2
0.5±0.05 *3 Nominal value
(3)GRM033/GRM155(W8P1 CODE:W) (in mm)
L W
T
0.6±0.03 0.3±0.03 0.3±0.03 0.37 0.67
0.6±0.05 0.3±0.05 0.3±0.05 0.39 0.69
0.6±0.09 0.3±0.09 0.3±0.09 0.44 0.74 0.6 max.
GRM15 5 1.0±0.05 0.5±0.05 0.5±0.05 0.65 1.15 0.8 max.
*3 Nominal value
Type
Dimensions(Chip)
A *3
B *3
t
GRM03
3
0.5 max.
5
0.65
1.15
1.0±0.2
0.5±0.2
0.78
1.29
1.0±0.05
0.5±0.05
0.65
1.15
3
0.3±0.03
0.5 max.
GRM03
2
3
0.6±0.09
0.3±0.09
0.44
0.74
0.8 max.
GRM15
Package
GRM Type
Type
Dimensions(Chip)
A *3
B *3
t
1.0±0.05
4.0±0.1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
t
1.0±0.05
*1,2：2.0±0.05
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
4.0±0.1
*1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
t
*2
0.05 max.
JEMCGP-01796G 7

(4)GRM18/GRMJN/GRM21/GRM31/GRM32 (in mm)
<Paper Tape> <Plastic Tape>
L W
T
1.6±0.1 0.8±0.1 1.05±0.10 1.85±0.10
50.5±0.05
0.6 +0.05/-0.1
0.6 +0/-0.1
7 0.7±0.1
1.6±0.1 0.8±0.1 0.8±0.1
8 1.6±0.15 0.8±0.15 0.8±0.15
1.6±0.2 0.8±0.2 0.8±0.2 1.10±0.10 2.00±0.10
GRMJN 7 1.8±0.1 1.0±0.1 0.7±0.1 1.20±0.10 2.10±0.10
0.6±0.1
0.6 +0/-0.15
0.85±0.05
0.85±0.1
0.85 +0.15/-0.1
0.85 +0/-0.2
2.0±0.15 1.25±0.15
0.85 +0.15/-0.05 1.50±0.20 2.30±0.20
2.0±0.1 1.25±0.1 1.0 +0/-0.2 1.45±0.20 2.25±0.20
2.0±0.2 1.25±0.2 1.0±0.2 1.50±0.20 2.30±0.20
2.0±0.1 1.25±0.1 1.25±0.1 1.45±0.20 2.25±0.20
B 2.0±0.15 1.25±0.15 1.25±0.15
2.0±0.2 1.25±0.2 1.25±0.2
6 0.6±0.1
3.2±0.2 1.6±0.2
B 1.25±0.1
1.15±0.1
1.15±0.15
X 1.2±0.1
1.6±0.2
3.2±0.3 1.6±0.3 1.6±0.3 2.10±0.20 3.60±0.20
9 0.85 +0.15/-0.05 2.80±0.20 3.60±0.20 1.15 max.
Paper Tape
A 1.0 +0/-0.2
M 1.15±0.1
N 1.35±0.15
C 1.6±0.2
R 1.8±0.2
D 2.0±0.2
2.5±0.2
2.5±0.3 2.5±0.3
Plastic Tape
2.5 max.
3.0 max.
E
3.7 max.
GRM32
3.2±0.3
2.5±0.2
2.80±0.20
3.50±0.20
1.7 max.
Paper Tape
9
0.85±0.1
3.2±0.15
1.6±0.15
1.90±0.20
3.50±0.20
1.7 max.
Plastic Tape
M
GRM31
3.2±0.15
1.6±0.15
2.00±0.20
3.60±0.20
1.15 max.
3.2±0.2
1.6±0.2
C
2.5 max.
2.0±0.2
1.25±0.2
1.7 max.
Plastic Tape
A
2.0 max.
1.50±0.20
2.30±0.20
1.05±0.10
1.85±0.10
GRM21
6
2.0±0.1
1.25±0.1
1.55±0.15
2.30±0.15
9
0.85±0.1
GRM18
0.5 +0/-0.1
0.8 max.
Paper Tape
1.6±0.2
0.8±0.2
1.10±0.10
2.00±0.10
6
1.15 max.
Package
GRM Type
Type
Dimensions(Chip)
A
B
t
Dimensions
of Tape
4.0±0.1
4.0±0.1
2.0±0.1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
t
Ａ
Ｂ
8.0±0.3
4.0±0.1
3.5±0.05
1.75±0.1
Ａ
Ｂ
t
2.0±0.1
φ1.5
+0.1
-0
4.0±0.1
0.25±0.1(T≦2.0mm)
0.3±0.1(T：2.5mm)
JEMCGP-01796G 8

(5)GRM43/GRM55 (in mm)
L W
T
M 1.15±0.1
N 1.35±0.15
R 1.8±0.2
D 2.0±0.2
E 2.5±0.2
S 2.8±0.2 4.7 max.
M 1.15±0.1
N 1.35±0.15
R 1.8±0.2
D 2.0±0.2
E 2.5±0.2
F 3.2±0.2 4.7 max.
*1 Nominal value
GRM55
5.7±0.4
5.0±0.4
5.2
6.1
2.5 max.
3.7 max.
GRM43
4.5±0.4
3.2±0.3
3.6
4.9
2.5 max.
3.7 max.
Package
GRM Type
Type
Dimensions(Chip)
A *1
B *1
t
φ1.5
+0.1
-0
4.0±0.1
8.0±0.1
φ1.5
+0.2
-0
12.0±0.3
5.5±0.1
1.75±0.1
Ａ
*
2.0±0.1
4.0±0.1
Ｂ
t
*：2.0±0.1
0.3±0.1
JEMCGP-01796G 9

Package
GRM Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)

ｗ1
W
Top Tape : Thickness 0.06
Feeding Hole :As specified in 1.2.
Hole for Chip : As specified in 1.2.
Base Tape : As specified in 1.2.
Bottom Tape :Thickness 0.05
(Only a bottom tape existence )
W
w1
GRM01/GRM02
8.0 max.
5±1.5
GRMMD/GRM03/GRM15/
GRM18/GRMJN/GRM21/
GRM31/GRM32
16.5 max.
10±1.5
GRM43/GRM55
20.5 max.
14±1.5
-3.0

 min.

2.0±0.5
Chip
(in mm)
Fig.1 Package Chips
Fig.2 Dimensions of Reel
Fig.3 Taping Diagram
JEMCGP-01796G 10