Murata GRM21BR71E475KA73 Series User manual

GRM21BR71E475KA73_ (0805, X7R:EIA, 4.7uF, DC25V)
_: packaging code Reference Sheet
1.Scope
2.MURATA Part NO. System
(Ex.)
3. Type & Dimensions
(Unit:mm)
4.Rated value
5.Package
Product specifications in this catalog are as of Mar.5,2016,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
(3) Temperature Characteristics
(Public STD Code):X7R(EIA)
g
0.2 to 0.7
(5) Nominal
Capacitance
mark
(4)
Rated
Voltage
Packaging Unit
DC 25 V
Temp. Range
(Ref.Temp.)
(8) Packaging
-15 to 15 %
-55 to 125 °C
(25 °C)
0.7 min.
(1)-1 L
2.0±0.15
(1)-2 W
1.25±0.15
This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.
(2) T
e
Chip Monolithic Ceramic Capacitor for General
Specifications and Test
Methods
(Operating
Temp. Range)
Temp. coeff
or Cap. Change
±10 %
(6)
Capacitance
Tolerance
4.7 uF
1.25±0.15
-55 to 125 °C
L
f180mm Reel
EMBOSSED W8P4
3000 pcs./Reel
K
f330mm Reel
EMBOSSED W8P4
10000 pcs./Reel
(1)L/W
Dimensions
(2)T
Dimensions
(3)Temperature
Characteristics
(4)Rated
Voltage
(5)Nominal
Capacitance
(6)Capacitance
Tolerance
(8)Packaging
Code

Control Code
GRM 21 BR7 1E 475 K A73 L
GRM21BR71E475KA73-01 1

■Specifications and Test Methods
No
1 Rated Voltage Shown in Rated value. The rated voltage is defined as the maximum voltage which may be
applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage, VP-P or VO-P,
whichever is larger, should be maintained within the rated voltage
range.
2 Appearance No defects or abnormalities. Visual inspection.
3 Dimension Within the specified dimensions. Using calipers. (GRM02 size is based on Microscope)
4 Voltage proof No defects or abnormalities.
Measurement Point :
Between the terminations
Test Voltage :
250% of the rated voltage
Applied Time :
1 to 5 s
Charge/discharge current :
50mA max.
5 Insulation Resistance(I.R.) 
Measurement Point : Between the terminations
Measurement Voltage :
DC Rated Voltage
Charging Time :
1 min
Charge/discharge current :
50mA max.
Measurement Temperature :
Room Temperature
6 Capacitance Shown in Rated value.
Measurement Temperature :
Room Temperature
7 Dissipation Factor (D.F.) B1,R1,B3,R6,R7,C6,C7,C8,E7,D7 : 0.125 max.
D8,GRM31CR60J107 : 0.15 max
*1 For items listed in Table 1 on the left, the capacitance should
be measured using a voltage of 0.5+/-0.1Vrms instead of
1.0+/-0.2Vrms.
*2 For item GRM188R70J105, the capacitance should be measured
using a voltage of 1.0+/-0.2Vrms instead of 0.5+/-0.1Vrms.
8
Temperature No bias B1,B3 : Within +/-10% (-25°C to +85°C) The capacitance change should be measured after 5 min.
Characteristics R1,R7 : Within +/-15% (-55°C to +125°C) at each specified temp. stage.
of Capacitance R6 : Within +/-15% (-55°C to +85°C) In case of applying voltage, the capacitance change should be
C6 : Within +/-22% (-55°C to +85°C) measured after 1 min. with applying voltage in equilibration of
C7 : Within+/-22% (-55°C to +125°C) each temp. stage.
C8 : Within +/-22% (-55°C to +105°C) Capacitance value as a reference is the value in step 3.
E7 : Within +22/-56% (-55°C to +125°C)
D7 : Within +22/-33% (-55°C to +125°C)
D8 : Within +22/-33% (-55°C to +105°C)
50% of B1: Within +10/-30%
the rated R1: Within +15/-40%
voltage
･Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
9 Adhesive Strength No removal of the terminations or other defect Solder the capacitor on the test substrate shown in Fig.3.
of Termination should occur.
Holding Time : 10+/-1s
Applied Direction : In parallel with the test substrate and vertical with the
capacitor side.
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Type Applied Force(N)
GRM02 1
GRM03 2
GRM15/GRM18 5
GRM21/GRM31/GRM32 10
c
b
a
Solder Resist
Chip Capacitor
Land
These Part Numbers are designed for use in the circuits where
continuous applied voltage to the capacitor is derated than rated
voltage, and guarantee Durability Test w ith 100% × rated voltage
as testing voltage at the maximumoperating temperature.
The voltage and temperature derating conditions on the left are
recommended for use to ensure the same reliability level as
normal specification.
Step
Temperature(C)
Applying Voltage(VDC)
1
Reference Temp.+/-2
No bias
2
Min.Operating Temp. +/-3
3
Reference Temp. +/-2
4
Max.Operating Temp. +/-3
5
Reference Temp. +/-2
50% of
the rated voltage
(For B1,R1)
6
Min.Operating Temp. +/-3
7
Reference Temp. +/-2
8
Max.Operating Temp.+/-3
*Table 1
GRM033 B3/R6 1A 123 to 823
GRM033 B3/R6 1A 104
GRM155 B3/R6 1A124 to 105
GRM185 B3/R6 1C/1A105
GRM185 C8/D7 1A 105
GRM188 B3/R6 1C/1A225
GRM188 R7/C8/D7 1A 225
GRM188 B3/R6 1A 335
GRM219 B3/R6 1C/1A475
GRM219 C8 1A 475
GRM219 B3/R6 1A 106
GRM21B B3/R6 1C/1A 106
GRM21B R7/C8 1A 106
GRM319 B3/R6 1C/1A106
Capacitance
Frequency
Voltage
*1 C≦
(10V min.)
1.0+/-0.1kHz
1.0+/-0.2Vrms
*2 C≦
(6.3V max.)
1.0+/-0.1kHz
0.5+/-0.1Vrms
C＞
120+/-24Hz
0.5+/-0.1Vrms
JEMCGS-00494D 2

No
10 Vibration  Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Capacitance Within the specified initial value.
Kind of Vibration :
A simple harmonic motion
D.F. Within the specified initial value. 10Hz to 55Hz to 10Hz (1min)
Total amplitude :
1.5mm
This motion should be applied for a period of 2h in each 3 mutually
perpendicular directions(total of 6h).
11 Substrate Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.1.
Bending test
Capacitance Within +/-10% Pressurization method : Shown in Fig.2
Change Flexure : 1mm
Holding Time :
5+/-1s
Soldering Method :
Reflow soldering
12 Solderability 95% of the terminations is to be soldered evenly and
Test Method :
Solder bath method
continuously. Flux Solution of rojin ethanol 25(wt)%
Preheat :
80℃to 120℃for 10s to 30s
Solder : Sn-3.0Ag-0.5Cu
Solder Temp. :
245+/-5℃
Immersion time
:
2+/-0.5s
13
Resistance Appearance No defects or abnormalities. <GRM03 size min.>
to Test Method : Solder bath method
Soldering Solder : Sn-3.0Ag-0.5Cu
Heat Solder Temp. :
270+/-5℃
Immersion time
:
10+/-0.5s
Capacitance B1,R1,B3,R6,R7,C6,C7,C8,E7,D7,D8 : Within +/-7.5% Exposure Time : 24+/-2h
Change GRM188B30J106M : Within +/-12.5% Preheat : GRM31 size max.: 120℃to 150℃for 1 min
GRM32 size : 100℃to 120℃for 1 min
and 170℃to 200℃for 1 min
· Initial measurement
D.F. Within the specified initial value. Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
<GRM02 size only>
Test Method : Reflow soldering (hot plate)
I.R. Within the specified initial value. Solder : Sn-3.0Ag-0.5Cu
Solder Temp. :
270+/-5℃
Reflow Time : 10+/-0.5s
Test Substrate : Glass epoxy PCB
Voltage proof No defects. Exposure Time : 24+/-2h
Preheat :
120℃to 150℃for 1 min
· Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
14
Temperature Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Sudden Change Perform the five cycles according to the four heat treatments
shown in the following table.
Capacitance B1,R1,B3,R6,R7,C6,C7,C8,D7,D8 : Within +/-7.5%
Change E7 : Within +/-30%
D.F. Within the specified initial value.
I.R. Within the specified initial value. Exposure Time : 24+/-2h
· Initial measurement
Voltage proof No defects. Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
·GRM188B30J106M Measurement after test:
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
15 High Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Temperature
Test Temperature :
40+/-2℃
High
Test Humidity :
90%RH to 95%RH
Humidity Capacitance Within +/-12.5%
Test Time :
500+/-12h
(Steady) Change
Applied Voltage :
DC Rated Voltage
Charge/discharge current : 50mA max.
D.F. 0.2 max.
Exposure Time :
24+/-2h
· Initial measurement
I.R.
∙F Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
· Measurement after test
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Type Applied Force(N)
GRM02 1
GRM03 2
GRM15/GRM18 5
GRM21/GRM31/GRM32 10
c
b
a
Solder Resist
Chip Capacitor
Land
These Part Numbers are designed for use in the circuits where
continuous applied voltage to the capacitor is derated than rated
voltage, and guarantee Durability Test w ith 100% × rated voltage
as testing voltage at the maximumoperating temperature.
The voltage and temperature derating conditions on the left are
recommended for use to ensure the same reliability level as
normal specification.
Step
Temp.(C)
Time
(min)
1
Min.Operating Temp.+0/-3
30+/-3
2
Room Temp
2 to 3
3
Max.Operating Temp.+3/-0
30+/-3
4
Room Temp
2 to 3
JEMCGS-00494D 3

No
16 Durability Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Test Temperature :
Max. Operating Temp. +/-3℃
Capacitance Within +/-12.5%
Test Time :
1000+/-12h
Change
Applied Voltage :
100% of the rated voltage
Charge/discharge current : 50mA max.
Exposure Time :
24+/-2h
D.F. 0.2 max. · Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
I.R.  · Measurement after test
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
Recommended derating conditions on voltage and temperature
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Type Applied Force(N)
GRM02 1
GRM03 2
GRM15/GRM18 5
GRM21/GRM31/GRM32 10
c
b
a
Solder Resist
Chip Capacitor
Land
These Part Numbers are designed for use in the circuits where
continuous applied voltage to the capacitor is derated than rated
voltage, and guarantee Durability Test w ith 100% × rated voltage
as testing voltage at the maximumoperating temperature.
The voltage and temperature derating conditions on the left are
recommended for use to ensure the same reliability level as
normal specification.
JEMCGS-00494D 4

Test method : Substrate Bending test
・Test substrate
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm (GRM02/GRM03/GRM15: t:0.8mm)
Copper foil thickness : 0.035mm
: Solder resist
(Coat with heat resistant resin for solder)
Fig.1 (in mm)
・Kind of Solder : Sn-3.0Ag-0.5Cu
・Pressurization method
Fig.2 (in mm)
Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)
High Temperature High Humidity(Steady) , Durability
・Test substrate
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm or 0.8mm
Copper foil thickness : 0.035mm
・Kind of Solder : Sn-3.0Ag-0.5Cu
・Land Dimensions
Fig.3
Type Applied Force(N)
GRM02 1
GRM03 2
GRM15/GRM18 5
GRM21/GRM31/GRM32 10
c
b
a
Solder Resist
Chip Capacitor
Land
These Part Numbers are designed for use in the circuits where
continuous applied voltage to the capacitor is derated than rated
voltage, and guarantee Durability Test w ith 100% × rated voltage
as testing voltage at the maximumoperating temperature.
The voltage and temperature derating conditions on the left are
recommended for use to ensure the same reliability level as
normal specification.
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
100
40
a
c
b
Land
f4.5
c
Type
Dimension (mm)
a
b
c
GRM02
0.2
0.56
0.23
GRM03
0.3
0.9
0.3
GRM15
0.4
1.5
0.5
GRM18
1.0
3.0
1.2
GRM21
1.2
4.0
1.65
GRM31
2.2
5.0
2.0
GRM32
2.2
5.0
2.9
45
45
Flexure
Capacitance meter
Pressurization
speed
1.0mm/s
Support
Capacitor
Pressurize
45
45
R5
20
50 min.
Type
Dimension (mm)
a
b
c
GRM02
0.2
0.56
0.23
GRM03
0.3
0.9
0.3
GRM15
0.4
1.5
0.5
GRM18
1.0
3.0
1.2
GRM21
1.2
4.0
1.65
GRM31
2.2
5.0
2.0
GRM32
2.2
5.0
2.9
JEMCGS-00494D 5

1.Tape Carrier Packaging(Packaging Code:D/E/W/L/J/F/K)
1.1 Minimum Quantity(pcs./reel)
3
5
1.2 Dimensions of Tape
(1)GRM01/02 (W4P1 CODE:L) (in:mm)
1
*3 Nominal value
10000(W8P2)
50000(W8P2)
4000
4000
GRM55
GRM43
F
E
S
M
GRM32
GRM31
GRM21
GRM15
5(LW Dimensions Tolerance:±0.2
and T Dimensions:0.5 +0/-0.1)
5(LWT Dimensions Tolerance:±0.1min.)
5(LWT Dimensions Tolerance:±0.05)
N
C
R/D/E
GRM01
GRM02
2
3/X
5 (LW Dimensions Tolerance:±0.1min.
and T Dimensions Tolerance:±0.05)
GRM03
2
GRM18
6
9
A/B
6/9
M/X
10000(W8P2)
10000(W8P2)
10000(W8P2)
4000
M
N/R/D
4000
50000(W4P1)
E
N/C/R/D
C
9
A/M
Package
GRM Type
15000(W8P2)
20000(W8P2)
10000(W8P2)
10000(W8P2)
Paper Tape
Plastic Tape
Paper Tape
Plastic Tape
4000
30000(W8P1)
20000(W8P1)
40000(W4P1)
3000
2000
3000
3000
300
50000(W8P2)
50000(W8P2)
50000(W8P2)
50000(W8P2)
2000
2000
1000
1000
10000
10000
500
1000
1000
500
1000
500
3000
10000
10000
40000(W8P2)
50000(W8P2)
10000
10000
1500
Code:D/E
Code:W
Code:L
Code:J/ F
Code:K
8000
6000
4000
10000
10000
6000
10000
L


Type
1500
5000
4000
5000
4000
2000
W
T
t
0.145
0.27
0.4 max.
0.2±0.02
0.2±0.02
0.23
0.43
0.125±0.013
0.125±0.013
0.4±0.05
0.25±0.013
Type
0.2±0.05
0.2±0.05
0.26
GRM02
GRM01
2
0.4±0.02
15000(W8P2)
50000(W8P2)
0.5 max.
0.46
Dimensions(Chip)
A *3
B *3
t
2.0±0.04
＊2
＊1
φ0.8±0.04
0.9±0.05
4.0±0.05
1.8±0.02
＊1,2：1.0±0.02
0.05以下
Ａ
Ｂ
0.15～0.4
*1,2：1.0±0.02
2.0±0.04
*1
0.9±0.05
4.0±0.05
1.8±0.02
Ａ
Ｂ
t
*2
0.05 max.
φ0.8±0.04
0.15～0.25
JEMCGP-01796E 6

(2)GRM03/15(W8P2 CODE:D/E/J/F)
(in:mm)
L W
T
2 0.2 +0.02/-0.04
0.3±0.03 0.5 max.
0.6±0.05 0.3±0.05 0.3±0.05 0.39 0.69
0.3±0.09 0.6 max.
5 0.5±0.05
2 0.2 +0.02/-0.04
X 0.25±0.05
1.0±0.2 0.5±0.2 0.78 1.29
1.0±0.05 0.5±0.05 0.5±0.05
1.0±0.07 0.5±0.07 0.5±0.07
1.0±0.1 0.5±0.1 0.5±0.1 0.70 1.20
1.0±0.15 0.5±0.15 0.5±0.15 0.72 1.25
0.5 +0/-0.1
0.5±0.2
0.5±0.05 *3 Nominal value
(3)GRM033/155(W8P1 CODE:W) (in:mm)
L W
T
0.6±0.03 0.3±0.03 0.3±0.03 0.37 0.67
0.6±0.05 0.3±0.05 0.3±0.05 0.39 0.69
0.6±0.09 0.3±0.09 0.3±0.09 0.44 0.74 0.6 max.
GRM15 5 1.0±0.05 0.5±0.05 0.5±0.05 0.65 1.15 0.8 max.
*3 Nominal value
0.5 max.
Dimensions(Chip)
A *3
B *3
t
1.0±0.2
0.5±0.2
0.65
0.78
1.15
1.29
0.74
0.8 max.
0.5±0.05
0.3±0.03
0.65
1.15
Type
Dimensions(Chip)
0.6±0.03
GRM03
3
0.6±0.09
0.3±0.03
0.3±0.09
Package
GRM Type
A *3
B *3
t
0.37
5
0.67
GRM03
3
GRM15
3
1.0±0.05
Type
0.44
*1,2：2.0±0.05
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
4.0±0.1
*1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
t
*2
0.05 max.
1.0±0.05
4.0±0.1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
t
1.0±0.05
JEMCGP-01796E 7

(4)GRM18/21/31/32 (in:mm)
<Paper Tape> <Plastic Tape>
L W
T
1.6±0.1 0.8±0.1 1.05±0.10 1.85±0.10
50.5±0.05
6 0.6 +0/-0.1
7 0.7±0.1
1.6±0.1 0.8±0.1 0.8±0.1
8 1.6±0.15 0.8±0.15 0.8±0.15
1.6±0.2 0.8±0.2 0.8±0.2 1.10±0.10 2.00±0.10
0.6±0.1
0.6 +0/-0.15
0.85±0.05
0.85±0.1
0.85 +0.15/-0.1
0.85 +0/-0.2
2.0±0.15 1.25±0.15
0.85 +0.15/-0.05 1.50±0.20 2.30±0.20
2.0±0.1 1.25±0.1 1.0 +0/-0.2 1.45±0.20 2.25±0.20
2.0±0.2 1.25±0.2 1.0±0.2 1.50±0.20 2.30±0.20
2.0±0.1 1.25±0.1 1.25±0.1 1.45±0.20 2.25±0.20
B 2.0±0.15 1.25±0.15 1.25±0.15
2.0±0.2 1.25±0.2 1.25±0.2
6 0.6±0.1
3.2±0.2 1.6±0.2
B 1.25±0.1
1.15±0.1
1.15±0.15
X 1.2±0.1
1.6±0.2
3.2±0.3 1.6±0.3 1.6±0.3 2.10±0.20 3.60±0.20
9 0.85 +0.15/-0.05 2.80±0.20 3.60±0.20 1.15 max.
Paper Tape
A 1.0 +0/-0.2
M 1.15±0.1
N 1.35±0.15
C 1.6±0.2
R 1.8±0.2
D 2.0±0.2
E 2.5±0.2 3.7 max.
Dimensions
of Tape
Package
GRM Type
1.15 max.
2.0±0.1
2.0±0.2
1.25±0.1
0.85±0.1
1.7 max.
Plastic Tape
A
Type
Dimensions(Chip)
A
B
t
1.6±0.2
Plastic Tape
2.5 max.
3.0 max.
M
C
2.5 max.
3.2±0.3
1.6±0.15
1.6±0.2
2.5±0.2
GRM32
2.80±0.20
3.50±0.20
1.7 max.
GRM31
2.00±0.20
3.60±0.20
1.15 max.
0.85±0.1
1.6±0.15
Paper Tape
9
1.90±0.20
3.50±0.20
1.7 max.
Plastic Tape
2.0 max.
1.50±0.20
2.30±0.20
3.2±0.15
3.2±0.15
3.2±0.2
GRM21
6
1.55±0.15
2.30±0.15
9
Paper Tape
1.05±0.10
1.85±0.10
1.25±0.2
0.8±0.2
0.8 max.
0.5 +0/-0.1
GRM18
1.10±0.10
2.00±0.10
4.0±0.1
4.0±0.1
2.0±0.1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
t
Ａ
Ｂ
8.0±0.3
4.0±0.1
3.5±0.05
1.75±0.1
Ａ
Ｂ
t
2.0±0.1
φ1.5
+0.1
-0
4.0±0.1
0.25±0.1(T≦2.0mm)
0.3±0.1(T：2.5mm)
JEMCGP-01796E 8

(5)GRM43/55 (in:mm)
L W
T
M 1.15±0.1
N 1.35±0.15
R 1.8±0.2
D 2.0±0.2
E 2.5±0.2
S 2.8±0.2 4.7 max.
M 1.15±0.1
N 1.35±0.15
C 1.6±0.2
R 1.8±0.2
D 2.0±0.2
E 2.5±0.2
F 3.2±0.2 4.7 max.
*1 Nominal value
t
3.7 max.
4.5±0.4
3.2±0.3
5.7±0.4
5.0±0.4
GRM55
5.2
6.1
2.5 max.
3.7 max.
Package
GRM Type
GRM43
3.6
4.9
2.5 max.
Type
Dimensions(Chip)
A *1
B *1
φ1.5
+0.1
-0
4.0±0.1
8.0±0.1
φ1.5
+0.2
-0
12.0±0.3
5.5±0.1
1.75±0.1
Ａ
*
2.0±0.1
4.0±0.1
Ｂ
t
*：2.0±0.1
0.3±0.1
JEMCGP-01796E 9

Package
GRM Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)

ｗ1
W
Top Tape : Thickness 0.06
Feeding Hole :As specified in 1.2.
Hole for Chip : As specified in 1.2.
Base Tape : As specified in 1.2.
Bottom Tape :Thickness 0.05
(Only a bottom tape existence )
W
w1
GRM01/02
8.0 max.
5±1.5
GRM03/15/18/21/31/32
16.5 max.
10±1.5
GRM43/55
20.5 max.
14±1.5
-3.0

 min.

2.0±0.5
Chip
(in:mm)
Fig.1 Package Chips
Fig.2 Dimensions of Reel
Fig.3 Taping Diagram
JEMCGP-01796E 10