Murata ZRA21MR61C226ME11 Series User manual

ZRA21MR61C226ME11_ (, X5R:EIA, 22uF, DC16V)
_: packaging code Reference Sheet
1.Scope
2.MURATA Part NO. System
(Ex.)
3. Type & Dimensions
(Unit:mm)
*Nominal value
4.Rated value
5.Package
Product specifications in this catalog are as of Apr.3,2018,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
(5) Nominal
Capacitance
mark
(4)
Rated
Voltage
Packaging Unit
DC 16 V
Temp. Range
(Ref.Temp.)
(8) Packaging
-15 to 15 %
-55 to 85 °C
(25 °C)
(3) Temperature Characteristics
(Public STD Code):X5R(EIA)
Only Reflow Soldering
L2*
2.0
W2*
1.25
This product specification is applied to Chip Multilayer Ceramic Capacitors on Interposer Board used for General Electronic equipment.
This product is applied for Only Reflow Soldering.
Chip Multilayer Ceramic Capacitors on Interposer Board for General Purpose
Specifications and Test
Methods
(Operating
Temp. Range)
Temp. coeff
or Cap. Change
±20 %
(6)
Capacitance
Tolerance
22 uF
-55 to 85 °C
(1)-1 L1
(1)-2 W1
(2) T
e
g
L
f180mm Reel
EMBOSSED W8P4
3000 pcs./Reel
2.4±0.1
1.65±0.1
1.15+0.05/-0.15
0.7±0.1
0.8±0.1
(1)L/W
Dimensions (2)T
Dimensions (3)Temperature
Characteristics (4)Rated
Voltage (5)Nominal
Capacitance (6)Capacitance
Tolerance (8)Packaging Code

Code
ZRA 21 MR6 1C 226 M E11 L
ZRA21MR61C226ME11-01 1

■Specifications and Test Methods
No
1 Rated Voltage Shown in Rated value. The rated voltage is defined as the maximum voltage which may be
applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage, VP-P or VO-P,
whichever is larger, should be maintained within the rated voltage
range.
2 Appearance No defects or abnormalities. Visual inspection.
3 Dimension Within the specified dimensions. Using Measuring instrument of dimension.
4 Voltage proof No defects or abnormalities.
Measurement Point :
Between the terminations
Test Voltage :
250% of the rated voltage
Applied Time :
1 to 5 s
Charge/discharge current :
50mA max.
To apply the test voltge through the Interposer board termination.
5 Insulation Resistance(I.R.)
∙F (Whichever is smaller) Measurement Point : Between the terminations
Measurement Voltage :
DC Rated Voltage
Charging Time :
1 min
Charge/discharge current :
50mA max.
Measurement Temperature :
Room Temperature
To apply the test voltge through the Interposer board termination.
6 Capacitance Shown in Rated value.
Measurement Temperature :
Room Temperature
7 Dissipation Factor (D.F.) 0.1 max.
To apply the test voltge through the Interposer board termination.
8
Temperature No bias B3 : Within +/-15% (-25°C to +85°C) The capacitance change should be measured after 5 min.
Characteristics R6 : Within +/-15% (-55°C to +85°C) at each specified temp. stage.
of Capacitance
R7 : Within +/-15% (-55°C to +125°C) Capacitance value as a reference is the value in step 3.
C7 : Within +/-22% (-55°C to +125°C)
C8 : Within +/-22% (-55°C to +105°C) · Measurement Voltage : Less than 1.0Vrms
(Refer to the individual data sheet)
To apply the test voltge through the Interposer board termination.
･Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
9 Adhesive Strength No removal of the terminations or other defect Solder the capacitor on the test substrate shown in Fig.3.
of Termination should occur.
Applied Force : 10N
Holding Time : 10+/-1s
Applied Direction : In parallel with the test substrate and vertical with the
capacitor side.
10 Vibration  Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Capacitance Within the specified initial value.
Kind of Vibration :
A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
Total amplitude :
1.5mm
D.F. Within the specified initial value. This motion should be applied for a period of 2h in each 3 mutually
perpendicular directions(total of 6h).
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Capacitance
Frequency
Voltage
C≦
(10V min.)
1.0+/-0.1kHz
1.0+/-0.2Vrms
C≦
(6.3V max.)
1.0+/-0.1kHz
0.5+/-0.1Vrms
C＞
120+/-24Hz
0.5+/-0.1Vrms
Step
Temperature(C)
Applying Voltage(VDC)
1
Reference Temp.+/-2
No bias
2
Min.Operating Temp. +/-3
3
Reference Temp. +/-2
4
Max.Operating Temp. +/-3
5
Reference Temp. +/-2
JEMCGS-05963 2

No
11 Substrate Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.1.
Bending test Pressurization method : Shown in Fig.2
Flexure : 1mm
Capacitance Within +/-10%
Holding Time :
5+/-1s
Change
Soldering Method :
Reflow soldering
12 Solderability of 95% of the terminations is to be soldered evenly and
Test Method :
Solder bath method
Interposer board termination continuously.
Flux :
Solution of rosin ethanol 25(mass)%
Preheat :
80℃to 120℃for 10s to 30s
Solder : Sn-3.0Ag-0.5Cu
Solder Temp. :
245+/-5℃
Immersion time
:
2+/-0.5s
13
Resistance Appearance No defects or abnormalities.
Test Conditions :
Reflow method
to Solder : Sn-3.0Ag-0.5Cu
Soldering Capacitance Within +/-7.5% Solder Temp. : 255+/-10℃[Peak Temperature]
Heat
Change Heat Time of over 200°C : 120s max.
Exposure Time : 24+/-2h
D.F. Within the specified initial value. Preheat :
150℃to 160℃for 2 min
I.R. Within the specified initial value. · Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
Voltage proof No defects. let sit for 24+/-2h at room temperature,then measure.
14
Temperature Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Sudden Change Perform the five cycles according to the four heat treatments
shown in the following table.
Capacitance Within +/-7.5%
Change
D.F. Within the specified initial value.
I.R. Within the specified initial value. Exposure Time : 24+/-2h
Voltage proof No defects. · Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
15 High Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Temperature
Test Temperature :
40+/-2℃
High
Test Humidity :
90%RH to 95%RH
Humidity Capacitance Within +/-12.5%
Test Time :
500+/-12h
(Steady) Change
Test Voltage :
DC Rated Voltage
Charge/discharge current : 50mA max.
D.F. 0.2 max. · Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
I.R.  let sit for 24+/-2h at room temperature,then measure.
· Measurement after test
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
16 Durability Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Test Temperature :
Max. Operating Temp. +/-3℃
Capacitance Within +/-12.5%
Test Time :
1000+/-12h
Change
Test Voltage :
100% of the rated voltage
Charge/discharge current : 50mA max.
D.F. 0.2 max. · Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
· Measurement after test
I.R.  Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Step
Temp.(C)
Time
(min)
1
Min.Operating Temp.+0/-3
30+/-3
2
Room Temp
2 to 3
3
Max.Operating Temp.+3/-0
30+/-3
4
Room Temp
2 to 3
JEMCGS-05963 3

Derating conditions on Voltage and Temperature (for Rated Voltage 100Vdc max.)
Test method : Substrate Bending test
・Test substrate
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm
Copper foil thickness : 0.035mm
: Solder resist
(Coat with heat resistant resin for solder)
Fig.1 (in mm)
・Kind of Solder : Sn-3.0Ag-0.5Cu
・Pressurization method
Fig.2 (in mm)
Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)
High Temperature High Humidity(Steady) , Durability
・Test substrate
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm
Copper foil thickness : 0.035mm
・Kind of Solder : Sn-3.0Ag-0.5Cu
・Land Dimensions
Fig.3
c
b
a
SolderResist
ChipCapacitor
Land
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
100
40
a
c
b
Land
f4.5
c
45
45
Flexure
Capacitance meter
Pressurization
speed
1.0mm/s
Support
Capacitor
Pressurize
45
45
R5
20
50 min.
Type
Dimension (mm)
a
b
c
ZRA21
1.2
4.0
1.65
Type
Dimension (mm)
a
b
c
ZRA21
1.2
4.0
1.65
Derated products*1 are suitable for use in circuits where continuous
applied voltage and temperature to the capacitor is derated (below
rated voltage and temperature).
A reliability assurance level equivalent to standard products*2 can be
secured by restricting the voltage and temperature according to the
derating conditions in the chart.
*1 Derated Products: The test voltage of these products is less than
150% of the rated voltage in the Durability / OperationalLife Test.
*2 Standard Products: The test voltage of these products is 150% of
the rated voltage and over in the Durability / OperationalLife Test.
JEMCGS-05963 4

There are only Plastic Tape for MLCC on Interposer.
1.Tape Carrier Packaging(Packaging Code:L/K)
1.1 Minimum Quantity(pcs./reel)

Plastic Tape
Code:K
ZRA21 M -
ZRA21 N8000
1.2 Dimensions of Tape
(in:mm)
L W T
M1.15+0.05/-0.15 1.7 max.
N1.35+0.05/-0.1 2.5 max.
ｔ
ZRA21
2.4±0.1
1.65±0.1
1.75±0.10
2.60±0.10
Type
Dimensions
A
B
3000
2000
Package
ZRA Type
Type

Plastic Tape
Code:L
8.0±0.3
4.0±0.1
3.5±0.05
1.75±0.1
Ａ
Ｂ
t
2.0±0.1
φ1.5
+0.1
-0
4.0±0.1
0.25±0.1
JEMCGP-01561H 5

Package
ZRA Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)

ｗ1
W
W
w1
ZRA21
16.5 max.
10±1.5
-3.0

 min.

2.0±0.5
ZRA
(in:mm)
Fig.1 Package Chips
Fig.2 Dimensions of Reel
Fig.3 Taping Diagram
Top Tape : Thickness 0.06
Feeding Hole :As specified in 1.2.
Hole for Chip : As specified in 1.2.
JEMCGP-01561H 6

1.3 Tapes for capacitors are wound clockwise shown in Fig.3.
(The sprocket holes are to the right as the tape is pulled toward the user.)
1.4 Part of the leader and part of the vacant section are attached as follows.
(in:mm)
1.5 Accumulate tolerance of sprocket holes pitch = ±0.3mm / 10 pitch
1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.
1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.
1.8 There are no jointing for top tape and bottom tape.
1.9 There are no fuzz in the cavity.
1.10 Break down force of top tape : 5N min.
1.11 Reel is made by resin and appeaser and dimension is shown in Fig 2. There are possibly
to change the material and dimension due to some impairment.
1.12 Peeling off force : 0.1 to 0.6N*in the direction as shown below.
1.13 Label that show the customer parts number, our parts number, our company name, inspection
number and quantity, will be put in outside of reel.
Package
ZRA Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
Tail vacant Section
Chip-mounting Unit
Leader vacant Section
Leader Unit
(Top Tape only)
Direction
of Feed
160 min.
190 min.
210 min.
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
165～180°
Top tape
JEMCGP-01561H 7

Caution
■Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment
⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment
⑧Disaster prevention / crime prevention equipment ⑨Data-processing equipment
⑩Application of similar complexity and/or reliability requirements to the applications listed in the above.
■Storage and Operation condition
1. The performance of chip MLCC on Interposer (ZR□series, henceforth just "capacitors") may be affected by the
storage conditions. Please use them promptly after delivery.
1-1. Maintain appropriate storage for the capacitors using the following conditions:
Room Temperature of +5℃to +40℃and a Relative Humidity of 20% to 70%.
High temperature and humidity conditions and/or prolonged storage may cause deterioration of the packaging
materials. If more than six months have elapsed since delivery, check packaging, mounting, etc. before use.
In addition, this may cause oxidation of the electrodes. If more than one year has elapsed since delivery,
also check the solderability before use.
1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result
in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,hydrogen
sulfide, sulfur dioxide, chlorine, ammonia gas etc.).
1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused
by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and
electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity
conditions
■Rating
1.Temperature Dependent Characteristics
1. The electrical characteristics of the capacitor can change with temperature.
1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature
changes. The following actions are recommended in order to ensure suitable capacitance values.
(1) Select a suitable capacitance for the operating temperature range.
(2) The capacitance may change within the rated temperature.
When you use a high dielectric constant type capacitor in a circuit that needs a tight (narrow) capacitance
tolerance (e.g., a time-constant circuit), please carefully consider the temperature characteristics, and
carefully confirm the various characteristics in actual use conditions and the actual system.
[Example of Temperature Caracteristics X7R(R7)] [Example of Temperature Characteristics X5R(R6)]

!
-20
-10
-15
-5
5
0
10
15
20
Temperature (C)
-75 -50 -25 025 50 75 100 125 150
Capacitance Change(%)
-20
-10
-15
-5
5
0
10
15
20
Temperature (C)
-75 -50 -25 025 50 75 100
Capacitance Change(%)
JEMCGC-01559G 8

2.Measurement of Capacitance
1. Measure capacitance with the voltage and frequency specified in the product specifications.
1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high.
Please confirm whether a prescribed measured voltage is impressed to the capacitor.
1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.
Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.
3.Applied Voltage
1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called out in the specifications.
1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.
(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage.
When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the rated DC voltage.
(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the rated DC voltage.
Typical Voltage Applied to the DC capacitor
DC Voltage DC Voltage+AC AC Voltage Pulse Voltage
(E：Maximum possible applied voltage.)
1-2. Influence of over voltage
Over voltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown
of the internal dielectric layers .
The time duration until breakdown depends on the applied voltage and the ambient temperature.
4.Type of Applied Voltage and Self-heating Temperature
1.Confirm the operating conditions to make sure that no large current is flowing into the capacitor due to the
continuous application of an AC voltage or pulse voltage.
When a DC rated voltage product is used in an AC voltage circuit or a pulse voltage circuit, the AC current
or pulse current will flow into the capacitor; therefore check the self-heating condition.
Please confirm the surface temperature of the capacitor so that the temperature remains within the upper limits
of the operating temperature, including the rise in temperature due to self-heating. When the capacitor is
used with a high-frequency voltage or pulse voltage, heat may be generated by dielectric loss.
<Applicable to Rated Voltage of less than 100VDC>
The load should be contained so that the self-heating
of the capacitor body remains below 20°C ,
whenmeasuring at an ambient temperature of 25°C.
Caution
!
10 1 2 3
Current (Ar.m.s.)
4 5 6
Temperature Rise (℃)
100kHz
10
100 Ripple Current
500kHz
1MHz
[Example of Temperature Rise (Heat Generation) in Chip
Multilayer Ceramic Capacitors in Contrast to Ripple Current]
Sample: R(R1) characteristics 10 Rated voltage: DC10V
E
E
E
E
0
0
0
0
JEMCGC-01559G 9

5. DC Voltage and AC Voltage Characteristic
1. The capacitance value of a high dielectric constant type
capacitor changes depending on the DC voltage applied.
Please consider the DC voltage characteristics when a
capacitor is selected for use in a DC circuit.
1-1. The capacitance of ceramic capacitors may change
sharply depending on the applied voltage. (See figure)
Please confirm the following in order to secure the
capacitance.
(1) Determine whether the capacitance change caused
by the applied voltage is within the allowed range .
(2) In the DC voltage characteristics, the rate of
capacitance change becomes larger as voltage
increases, even if the applied voltage is below
the rated voltage. When a high dielectric constant
type capacitor is used in a circuit that requires a
tight (narrow) capacitance tolerance (e.g., a time
constant circuit), please carefully consider the
voltage characteristics, and confirm the various
characteristics in the actual operating conditions
of the system.
2. The capacitance values of high dielectric
constant type capacitors changes depending
on the AC voltage applied.
Please consider the AC voltage characteristics
when selecting a capacitor to be used in a
AC circuit.
6. Capacitance Aging
[Example of Change Over Time (Aging characteristics) ]
1. The high dielectric constant type capacitors
have an Aging characteristic in which the capacitance
value decreases with the passage of time.
When you use a high dielectric constant type
capacitors in a circuit that needs a tight (narrow)
capacitance tolerance (e.g., a time-constant circuit),
please carefully consider the characteristics
of these capacitors, such as their aging, voltage,
and temperature characteristics. In addition,
check capacitors using your actual appliances
at the intended environment and operating conditions.
7.Vibration and Shock
1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance.
Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals.
2. Mechanical shock due to being dropped may cause damage or
a crack in the dielectric material of the capacitor.
Do not use a dropped capacitor because the quality and reliability
may be deteriorated.
3. When printed circuit boards are piled up or handled, the corner
of another printed circuit board
should not be allowed to hit the capacitor in order to avoid
a crack or other damage to the capacitor.
Caution
-100
-80
-60
-40
-20
0
20
010 20 30
DC Voltage (V) 40 50
[Example of DC Voltage Characteristics]
Sample: R(R1) Characteristics 
Capacitance Change (%)
00.5 1
AC Voltage (Vr.m.s.) 1.5 2
[Example of AC Voltage Characteristics]
Sample: X7R(R7) Characteristics 
Capacitance Change (%)
30
20
10
0
-10
-20
-30
-40
-50
-60
Floor
Crack
Mounting printed circuit board
Crack
!
20
10
0
-10
-20
-30
-40
10
100
1000
10000
Time(h)
Capacitance Change(%)
C0G(5C)
X7R(R7)
X5R(R6)
JEMCGC-01559G 10